JPH0197578U - - Google Patents
Info
- Publication number
- JPH0197578U JPH0197578U JP19383087U JP19383087U JPH0197578U JP H0197578 U JPH0197578 U JP H0197578U JP 19383087 U JP19383087 U JP 19383087U JP 19383087 U JP19383087 U JP 19383087U JP H0197578 U JPH0197578 U JP H0197578U
- Authority
- JP
- Japan
- Prior art keywords
- lead pins
- lands
- holes
- back side
- same number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示す図で
あつて、同図ａは上面図、同図ｂは底面図、第２
図は第１図の印刷配線板の実装状態を説明するた
めの説明図、第３図は従来の実装状態を説明する
ための説明図、第４図ａ，ｂ，ｃはプラグインパ
ツケージの構造を説明するための説明図であつて
、同図ａは上面図、同図ｂは側面図、同図ｃは底
面図である。
図において１は印刷配線板、２は穴、３はラン
ド、４は導体パターン、５はプラグインパツケー
ジ、６はリードピン、７，９，１３，１５ははん
だ、８は導体リード、１０は母体となる印刷配線
板、１１は穴、１２は導体ランド、１４はスルー
ホールである。なお、各図中同一符号は同一また
は相当部分を示す。
Figures 1a and 1b show one embodiment of this invention, in which figure a is a top view, figure b is a bottom view, and figure 1b is a bottom view.
The figure is an explanatory diagram for explaining the mounted state of the printed wiring board in Fig. 1, Fig. 3 is an explanatory diagram for explaining the conventional mounting state, and Figs. 4 a, b, and c are the structure of the plug-in package. FIG. 2 is an explanatory diagram for explaining the above, in which FIG. 1A is a top view, FIG. 1B is a side view, and FIG. In the figure, 1 is a printed wiring board, 2 is a hole, 3 is a land, 4 is a conductor pattern, 5 is a plug-in package, 6 is a lead pin, 7, 9, 13, 15 is solder, 8 is a conductor lead, and 10 is a base body. 11 is a hole, 12 is a conductor land, and 14 is a through hole. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
されるリードピンと同数の穴と、裏面において上
記穴の周囲に設けられたリードピンとはんだ付け
可能なランドと、裏面において上記ランドと接続
され上記リードピンと同数の導体リードをそれぞ
れ端面においてはんだ付け可能な導体パターンを
設けたことを特徴とする印刷配線板。 The plug-in package has the same number of holes as the lead pins penetrated by the lead pins, lands that can be soldered to the lead pins provided around the holes on the back side, and conductor leads that are connected to the lands and have the same number as the lead pins on the back side. A printed wiring board characterized in that each end face is provided with a solderable conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19383087U JPH0197578U (en) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19383087U JPH0197578U (en) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197578U true JPH0197578U (en) | 1989-06-29 |
Family
ID=31484602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19383087U Pending JPH0197578U (en) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197578U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140866U (en) * | 1989-04-27 | 1990-11-26 |
-
1987
- 1987-12-21 JP JP19383087U patent/JPH0197578U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140866U (en) * | 1989-04-27 | 1990-11-26 |