JPH0244376U - - Google Patents
Info
- Publication number
- JPH0244376U JPH0244376U JP12386088U JP12386088U JPH0244376U JP H0244376 U JPH0244376 U JP H0244376U JP 12386088 U JP12386088 U JP 12386088U JP 12386088 U JP12386088 U JP 12386088U JP H0244376 U JPH0244376 U JP H0244376U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- chip
- soldered
- conductors
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 229920006015 heat resistant resin Polymers 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案によるチツプ部品支持具の一実
施例を示す斜視図、第2図は該支持具を用いたチ
ツプ部品実装構造の一例を示す斜視図、第3図は
本考案によるチツプ部品支持具の他の実施例を示
す斜視図、第4図は該支持具を用いたチツプ部品
の実装構造の一例を示す斜視図、第5図は従来の
平型チツプ部品を示す斜視図である。
FIG. 1 is a perspective view showing an example of a chip component support according to the present invention, FIG. 2 is a perspective view showing an example of a chip component mounting structure using the support, and FIG. 3 is a perspective view showing an example of a chip component mounting structure using the support. FIG. 4 is a perspective view showing an example of a chip component mounting structure using the support device; FIG. 5 is a perspective view showing a conventional flat chip component. .
Claims (1)
にチツプ部品を装着する複数の溝を設けてなるこ
とを特徴とするチツプ部品支持具。 2 請求項1に記載のチツプ部品支持具の各溝に
それぞれ平型チツプ部品の狭幅部分を嵌合し、各
チツプ部品の両端の端子を基板上の導体に半田付
けしたことを特徴とするチツプ部品の実装構造。 3 請求項1に記載のチツプ部品支持具の各溝に
それぞれ円柱型のチツプ部品を嵌合し、各チツプ
部品の両端の端子を基板上の導体に半田付けした
ことを特徴とするチツプ部品の実装構造。[Claims for Utility Model Registration] 1. A chip component support made of an electrically insulating and heat resistant resin and having a plurality of grooves on one side for mounting chip components. 2. A narrow portion of a flat chip component is fitted into each groove of the chip component support according to claim 1, and terminals at both ends of each chip component are soldered to conductors on a board. Chip component mounting structure. 3. A chip component characterized in that a cylindrical chip component is fitted into each groove of the chip component support according to claim 1, and terminals at both ends of each chip component are soldered to conductors on a board. Implementation structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12386088U JPH0244376U (en) | 1988-09-20 | 1988-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12386088U JPH0244376U (en) | 1988-09-20 | 1988-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0244376U true JPH0244376U (en) | 1990-03-27 |
Family
ID=31373097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12386088U Pending JPH0244376U (en) | 1988-09-20 | 1988-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0244376U (en) |
-
1988
- 1988-09-20 JP JP12386088U patent/JPH0244376U/ja active Pending
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