JPH0415812U - - Google Patents
Info
- Publication number
- JPH0415812U JPH0415812U JP5776590U JP5776590U JPH0415812U JP H0415812 U JPH0415812 U JP H0415812U JP 5776590 U JP5776590 U JP 5776590U JP 5776590 U JP5776590 U JP 5776590U JP H0415812 U JPH0415812 U JP H0415812U
- Authority
- JP
- Japan
- Prior art keywords
- lead member
- circuit
- insulating substrate
- composite component
- serves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の複合部品の一実施例を示す平
面図、第２図はリード部材を取りつけた絶縁基板
の斜視図、第３図は回路図、第４図は他の実施例
を示す部分斜視図である。
１〜４……リード部材、８……絶縁基板。
Fig. 1 is a plan view showing one embodiment of the composite component of the present invention, Fig. 2 is a perspective view of an insulating board with lead members attached, Fig. 3 is a circuit diagram, and Fig. 4 shows another embodiment. FIG. 1 to 4...Lead member, 8...Insulating substrate.
Claims (1)
らなるリード部材を固着し、リード部材上に面接
続用電極を有する回路素子を配置して該リード部
材に接続することにより、回路素子間リード部材
で接続する回路を構成してあることを特徴とする
複合部品。 A lead member made of a plate-shaped metal that also serves as a terminal is fixed to the main surface of the insulating substrate, and a circuit element having a surface connection electrode is placed on the lead member and connected to the lead member, thereby making it possible to connect the circuit elements. A composite component characterized by comprising a circuit connected by a lead member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057765U JPH082977Y2 (en) | 1990-05-31 | 1990-05-31 | Composite parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990057765U JPH082977Y2 (en) | 1990-05-31 | 1990-05-31 | Composite parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415812U true JPH0415812U (en) | 1992-02-07 |
| JPH082977Y2 JPH082977Y2 (en) | 1996-01-29 |
Family
ID=31582774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990057765U Expired - Fee Related JPH082977Y2 (en) | 1990-05-31 | 1990-05-31 | Composite parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH082977Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604289A (en) * | 1983-06-23 | 1985-01-10 | 株式会社日立製作所 | Circuit board |
| JPS6157512U (en) * | 1984-09-20 | 1986-04-17 |
-
1990
- 1990-05-31 JP JP1990057765U patent/JPH082977Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604289A (en) * | 1983-06-23 | 1985-01-10 | 株式会社日立製作所 | Circuit board |
| JPS6157512U (en) * | 1984-09-20 | 1986-04-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH082977Y2 (en) | 1996-01-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |