JPH02148569U - - Google Patents

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Publication number
JPH02148569U
JPH02148569U JP1989057780U JP5778089U JPH02148569U JP H02148569 U JPH02148569 U JP H02148569U JP 1989057780 U JP1989057780 U JP 1989057780U JP 5778089 U JP5778089 U JP 5778089U JP H02148569 U JPH02148569 U JP H02148569U
Authority
JP
Japan
Prior art keywords
lead terminal
terminal mounting
integrated circuit
mounting structure
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989057780U
Other languages
Japanese (ja)
Other versions
JPH0635382Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989057780U priority Critical patent/JPH0635382Y2/en
Publication of JPH02148569U publication Critical patent/JPH02148569U/ja
Application granted granted Critical
Publication of JPH0635382Y2 publication Critical patent/JPH0635382Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はそれぞれ異なる本考案実施例
の要部断面図、第３図は従来における混成集積回
路の端子取付構造を示す要部断面図である。図に
おいて、 １……金属絶縁基板、１ａ……金属板、１ｂ…
…絶縁層、２……端子取付ランド、４……はんだ
接合部、５……クリツプ型リード端子、６……絶
縁シート。 1 and 2 are sectional views of main parts of different embodiments of the present invention, and FIG. 3 is a sectional view of main parts showing a conventional terminal mounting structure of a hybrid integrated circuit. In the figure, 1...Metal insulating substrate, 1a...Metal plate, 1b...
...Insulating layer, 2...Terminal mounting land, 4...Solder joint, 5...Clip type lead terminal, 6...Insulating sheet.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属絶縁基板を採用した混成集積回路に対する
リード端子取付構造であつて、金属絶縁基板の金
属面との間に絶縁シートを介在してクリツプ型リ
ード端子を基板の周縁に装着し、該リード端子と
回路側の端子取付ランドとの間をはんだ接合した
ことを特徴とする混成集積回路のリード端子取付
構造。 This is a lead terminal mounting structure for a hybrid integrated circuit employing a metal insulating substrate, in which a clip-type lead terminal is attached to the periphery of the substrate with an insulating sheet interposed between the metal surface of the metal insulating substrate, and the lead terminal and A lead terminal mounting structure for a hybrid integrated circuit characterized by soldering between terminal mounting lands on the circuit side.
JP1989057780U 1989-05-19 1989-05-19 Lead terminal mounting structure for hybrid integrated circuit Expired - Fee Related JPH0635382Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989057780U JPH0635382Y2 (en) 1989-05-19 1989-05-19 Lead terminal mounting structure for hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989057780U JPH0635382Y2 (en) 1989-05-19 1989-05-19 Lead terminal mounting structure for hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPH02148569U true JPH02148569U (en) 1990-12-18
JPH0635382Y2 JPH0635382Y2 (en) 1994-09-14

Family

ID=31582799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989057780U Expired - Fee Related JPH0635382Y2 (en) 1989-05-19 1989-05-19 Lead terminal mounting structure for hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0635382Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996010490A1 (en) * 1994-10-03 1996-04-11 Rohm Co., Ltd. Thermal printing head, and clip type terminal lead and cover used for the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016042804A1 (en) * 2014-09-18 2016-03-24 オリンパス株式会社 Image pickup unit and electronic endoscope provided with image pickup unit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853175U (en) * 1981-10-05 1983-04-11 日本電気株式会社 Hybrid integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853175U (en) * 1981-10-05 1983-04-11 日本電気株式会社 Hybrid integrated circuit device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996010490A1 (en) * 1994-10-03 1996-04-11 Rohm Co., Ltd. Thermal printing head, and clip type terminal lead and cover used for the same
US5739837A (en) * 1994-10-03 1998-04-14 Rohm Co. Ltd. Thermal printhead, and clip-type terminal lead and cover member used therefor
EP0978385B1 (en) * 1994-10-03 2002-03-13 Rohm Co., Ltd. Electrical connection structure

Also Published As

Publication number Publication date
JPH0635382Y2 (en) 1994-09-14

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Legal Events

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