JPS6418751U - - Google Patents
Info
- Publication number
- JPS6418751U JPS6418751U JP11341687U JP11341687U JPS6418751U JP S6418751 U JPS6418751 U JP S6418751U JP 11341687 U JP11341687 U JP 11341687U JP 11341687 U JP11341687 U JP 11341687U JP S6418751 U JPS6418751 U JP S6418751U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- integrated circuit
- lead
- hybrid integrated
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図乃至第４図は本考案の一実施例を説明す
るための図、第５図乃至第８図は本考案の他の一
実施例を説明するための図、第９図及び第１０図
は従来の混成集積回路用リードを説明するための
図である。
１……混成集積回路用リード、２……端子ピン
、３……連結部、４……固定部、５……金属基板
、６……絶縁皮膜、７……電子部品、８……混成
集積回路、９……端子部。
Figures 1 to 4 are diagrams for explaining one embodiment of the present invention, Figures 5 to 8 are diagrams for explaining another embodiment of the present invention, and Figures 9 and 10 are diagrams for explaining another embodiment of the present invention. The figure is a diagram for explaining a conventional lead for a hybrid integrated circuit. DESCRIPTION OF SYMBOLS 1... Lead for hybrid integrated circuit, 2... Terminal pin, 3... Connecting part, 4... Fixing part, 5... Metal substrate, 6... Insulating film, 7... Electronic component, 8... Hybrid integration Circuit, 9... terminal section.
Claims (1)
続される混成集積回路用リードにおいて、上記金
属基板の両面を挟持するように構成されているこ
とを特徴とする混成集積回路用リード。 1. A hybrid integrated circuit lead connected to a metal substrate having an insulating film formed on one surface thereof, the lead being configured to sandwich both surfaces of the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341687U JPH0440283Y2 (en) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341687U JPH0440283Y2 (en) | 1987-07-24 | 1987-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418751U true JPS6418751U (en) | 1989-01-30 |
| JPH0440283Y2 JPH0440283Y2 (en) | 1992-09-21 |
Family
ID=31353231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11341687U Expired JPH0440283Y2 (en) | 1987-07-24 | 1987-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440283Y2 (en) |
-
1987
- 1987-07-24 JP JP11341687U patent/JPH0440283Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440283Y2 (en) | 1992-09-21 |
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