JPH0440283Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead for a hybrid integrated circuit that is connected to a metal substrate having an insulating film formed on one side thereof.

[Conventional technology]

FIGS. 9 and 10 are diagrams for explaining conventional leads for hybrid integrated circuits. In these figures, 1 is a comb-shaped lead for a hybrid integrated circuit, in which a plurality of terminal pins 2 are arranged in one direction at a predetermined interval, and each is connected at one end via a connecting part 3. There is. Further, the other ends of the terminal pins 2 are each bent approximately at right angles in the same direction from a predetermined length to form a fixing portion 4. 5 is a metal substrate, one side of which has a thickness of
A conductive pattern is formed through a 10 μm insulating film 6, and a hybrid integrated circuit 8 is configured by mounting a plurality of electronic components 7 such as surface mount components and leaded components. Terminal section 9 of this hybrid integrated circuit 8
The fixing portions 4 of each of the terminal pins 2 are soldered to the terminal pins 2 as shown in FIG.

[Problem that the invention attempts to solve]

However, with this hybrid integrated circuit lead, it is difficult to position the fixed part of each terminal pin and the terminal part of the hybrid integrated circuit, and the lead for the hybrid integrated circuit is fixed to the hybrid integrated circuit before soldering. Therefore, it is not possible to solder the electronic parts together with the electronic parts by reflow, and the workability is extremely poor and uneconomical.

[Means and actions to solve the problem]

In order to eliminate the above-mentioned drawbacks, the present invention has a plurality of terminal pins arranged in one direction, one end of which is connected via a connecting part, and the other end of which is approximately perpendicular to a predetermined length. A comb-shaped lead for a hybrid integrated circuit which is bent in the same direction to form a fixing part, and the fixing part is fixed by soldering to the insulating film-formed surface of a metal substrate having an insulating film formed on one surface. In order for the terminal pins to be fixed to the metal substrate before soldering, a plurality of terminal pins are attached to the connecting portion, the lengths of which differ from the connecting portion to the fixing portion by approximately the thickness of the metal substrate. The two terminal pins are arranged so as to be connected to each other, and both sides of the metal substrate are sandwiched between the two terminal pins.

〔Example〕

1 to 4 are diagrams for explaining one embodiment of the present invention. In these figures, a plurality of terminal pins 2 are arranged in one direction at predetermined intervals.
The lengths up to the terminal pins are alternately long and short, and the lengths of the long terminal pins are longer than the lengths of the short terminal pins by approximately the thickness of the metal substrate 5. Therefore, the second
As shown in the figure and FIG. 3, each fixing part 4 and the terminal part 9 are aligned, and the end of the hybrid integrated circuit 8 is inserted between the fixing parts 4 of the hybrid integrated circuit lead until it stops. The fixing part 4 and the terminal part 9 of the hybrid integrated circuit can be positioned, and at the same time, the lead 1 for the hybrid integrated circuit can be fixed to the end of the hybrid integrated circuit 8. In this state, the long terminal pins 2 are removed from the hybrid integrated circuit 8 by soldering the terminal pins 2 together with the electronic components 7 by reflow, and then cutting and removing the connecting portions 3, as shown in FIG. Short terminal pin 2, which is the original terminal pin, as shown
Only the leads remain as leads for hybrid integrated circuits.

FIGS. 5 to 8 are diagrams for explaining another embodiment of the present invention. In these figures,
This embodiment differs from the previous embodiment in that each of the longer terminal pins 2 among the plurality of terminal pins 2 is bent in the vicinity of the connecting part 3 so as to be shifted by a predetermined distance in the opposite direction to the fixing part 4. Therefore, as shown in FIGS. 6 and 7, the end of the hybrid integrated circuit 8 is fixed to the fixing part 4 of the lead for hybrid integrated circuit by aligning each fixing part 4 with the terminal part 9. By inserting the short terminal pin 2 to the end of the hybrid integrated circuit 8, the fixing part 4 and the terminal part 9 of the hybrid integrated circuit can be positioned, and at the same time, the short terminal pin 2 can be fixed at a position a predetermined distance from the end of the hybrid integrated circuit 8. can. In this state, after soldering the terminal pins 2 together with the electronic components 7 by reflow, the connecting portions 3 are cut and removed.
The long terminal pins 2 are removed from the hybrid integrated circuit, and only the short terminal pins 2, which are the original terminal pins, remain as leads for the hybrid integrated circuit, as shown in FIG.
In this case, since the terminal pin 2 of the hybrid integrated circuit lead 1 is connected at a position a predetermined distance away from the end of the hybrid integrated circuit 8, the creepage distance with the metal substrate 5 can be increased. It is advantageous in terms of pressure resistance. Further, since the hybrid integrated circuit lead 1 is located inside the hybrid integrated circuit, the hybrid integrated circuit 8 can be housed in close contact with the case, and the size can be reduced.

In addition, in the above embodiment, a case was explained in which adjacent terminal pins alternately sandwich both sides of the metal substrate, but the invention is not limited to the above embodiment as long as the shape is such that it can sandwich both sides of the metal substrate. It can be carried out without being affected.

[Effect of idea]

As described above, in the present invention, a plurality of terminal pins are arranged in one direction, one end of the terminal pins is connected via a continuous part, and the other end is arranged in the same direction at a substantially right angle from a predetermined length. A comb-shaped lead for a hybrid integrated circuit, which is bent to form a fixing part, and the fixing part is fixed by soldering to the insulating film-formed surface of a metal substrate having an insulating film formed on one surface, A plurality of terminal pins whose lengths from the connecting part to the fixing part differ by approximately the thickness of the metal board are connected by the connecting part so that the terminal pins are fixed to the metal board before soldering. The lead for a hybrid integrated circuit is characterized in that the lead is provided so that the metal substrate is held between the two terminal pins, and is configured such that both terminal pins sandwich both sides of the metal substrate. Since the present invention has such features, it is possible to easily position the lead for a hybrid integrated circuit and the metal substrate. In addition, since the hybrid integrated circuit leads are fixed to the metal substrate, they can be soldered together with electronic components, reducing man-hours.
It is economical and reliability is improved.

[Brief explanation of the drawing]

Figures 1 to 4 are diagrams for explaining one embodiment of the present invention, Figures 5 to 8 are diagrams for explaining another embodiment of the present invention, and Figures 9 and 10 are diagrams for explaining another embodiment of the present invention. The figure is a diagram for explaining a conventional lead for a hybrid integrated circuit. DESCRIPTION OF SYMBOLS 1... Lead for hybrid integrated circuit, 2... Terminal pin, 3... Connecting part, 4... Fixed part, 5... Metal substrate, 6... Insulating film, 7... Electronic component, 8... Hybrid integration. Circuit, 9... terminal section.

Claims (1)

[Claims for Utility Model Registration] A plurality of terminal pins are arranged in one direction, one end of the terminal pins is connected via a connecting part, and the other end is bent in the same direction at a substantially right angle from a predetermined length. A comb-shaped lead for a hybrid integrated circuit, in which a fixing part is formed, and the fixing part is fixed by soldering to a surface on which an insulating film is formed of a metal substrate having an insulating film formed on one surface, the above-mentioned terminal. A plurality of terminal pins whose lengths from the connecting portion to the fixing portion differ by approximately the thickness of the metal substrate are connected by the connecting portion so that the pins are fixed to the metal substrate before soldering. 1. A lead for a hybrid integrated circuit, characterized in that the lead is provided as shown in FIG.