JPH0726803Y2 - Network resistor - Google Patents
Network resistorInfo
- Publication number
- JPH0726803Y2 JPH0726803Y2 JP12893489U JP12893489U JPH0726803Y2 JP H0726803 Y2 JPH0726803 Y2 JP H0726803Y2 JP 12893489 U JP12893489 U JP 12893489U JP 12893489 U JP12893489 U JP 12893489U JP H0726803 Y2 JPH0726803 Y2 JP H0726803Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- substrate
- terminal
- insulating substrate
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Details Of Resistors (AREA)
Description
【考案の詳細な説明】 ［産業上の利用分野］ この考案は、独立又は相互に接続された複数個の抵抗素
子が一つのパッケージ内に入っているとともに、端子が
並列に延出したデュアルインラインパッケージ（以下DI
Pと称す）型のネットワーク抵抗器に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The invention is a dual in-line in which a plurality of independent or mutually connected resistance elements are contained in one package and terminals are extended in parallel. Package (hereinafter DI
(Referred to as P) type network resistor.
［従来の技術］ 従来のネットワーク抵抗器は、単体の抵抗素子を複数個
並べて樹脂で固めて形成したものや、絶縁基板上に厚膜
抵抗等を形成し、この基板の両端に端子をハンダ付けし
たものがある。[Prior Art] A conventional network resistor is one in which a plurality of single resistance elements are arranged and fixed by resin, or a thick film resistor is formed on an insulating substrate, and terminals are soldered to both ends of this substrate. There is something I did.
また、実開昭64−11548号公報に開示されているよう
に、絶縁基板の一端縁部のみに基板を挟んで両側にリー
ドフレームを互いに対向されて設けたハイブリッドICも
知られている。Also, as disclosed in Japanese Utility Model Laid-Open No. 64-11548, a hybrid IC in which lead frames are provided on both sides of the insulating substrate so as to face each other with the substrate sandwiched, is also known.
［考案が解決しようとする課題］ 上記従来の技術の単体の抵抗器を並べたものの場合、端
子間隔が広く高密度実装ができないという欠点がある。[Problems to be Solved by the Invention] In the case of arranging the single resistors of the above-mentioned conventional technique, there is a drawback that the terminal spacing is wide and high-density mounting cannot be performed.
また、絶縁基板に抵抗体を形成したものでも、端子が２
列のいわゆるDIP型の場合、端子の基板端縁部の両端部
に一本づつハンダ付けしなければならず、端子と抵抗体
を接続するための導体パターンや金属フレームをさらに
設けなければならないという問題があり、コストが高く
なるという欠点があった。Even if the resistor is formed on the insulating substrate, the
In the case of the so-called DIP type of row, it is necessary to solder one at each end of the terminal edge of the board of the terminal, and it is necessary to further provide a conductor pattern and a metal frame for connecting the terminal and the resistor There was a problem that there was a problem that the cost was high.
さらに、実開昭64−11548号公報に開示されたものの場
合、互いに対向する端子同士が電気的に接続しているも
のではなく、これを接続させようとすると、基板にスル
ーホールを形成するか、基板表面に導体を設け、端子と
反対側の基板端縁に導体を接続するためのリードフレー
ム等を設けなくてはならず、構造が複雑になり製造コス
トが高くなるという欠点がある。Further, in the case disclosed in Japanese Utility Model Laid-Open No. 64-11548, the terminals facing each other are not electrically connected to each other, and if they are connected, a through hole is formed in the substrate. In addition, it is necessary to provide a conductor on the surface of the substrate and to provide a lead frame or the like for connecting the conductor to the edge of the substrate opposite to the terminal, which has a drawback that the structure becomes complicated and the manufacturing cost becomes high.
この考案は、上記従来の技術に鑑みてなされたもので、
高密度実装が可能で、コストもかからないDIP型のネッ
トワーク抵抗器を提供することを目的とする。This invention was made in view of the above-mentioned conventional technology,
It is an object of the present invention to provide a DIP type network resistor that enables high-density mounting and is inexpensive.
［課題を解決するための手段］ この考案は、リードフレームにより形成され絶縁基板の
一端縁部にのみ設けられる端子と、この端子を基板に取
り付けるコ字形の取り付け部とを有し、端子とその取り
付け部とが所定ピッチ並行にずれて形成され、抵抗体が
形成された絶縁基板の一端縁に、上記端子が互いに対向
するとともに上記取り付け部が互いに軸対称に向き合う
ように取り付けられて成るDIP型ネットワーク抵抗器で
ある。[Means for Solving the Problem] The present invention has a terminal formed by a lead frame and provided only at one edge of an insulating substrate, and a U-shaped mounting portion for mounting the terminal on the substrate. A DIP type in which the mounting portion and the mounting portion are formed so as to be displaced in parallel with each other by a predetermined pitch, and the terminals are opposed to each other and the mounting portions are axially symmetrical to each other at one end edge of the insulating substrate on which the resistor is formed. It is a network resistor.
さらに、この考案は、絶縁基板の一方の面にのみ抵抗体
が形成された上記DIP型のネットワーク抵抗器である。Further, the present invention is the above DIP type network resistor in which the resistor is formed only on one surface of the insulating substrate.
［作用］ この考案のネットワーク抵抗器は、取り付け部が端子か
らわずかに並行にずれたリードフレームを、互いに軸対
象に対向させて基板の端縁に位置させ、コ字形の取り付
け部を基板の端縁に差し込むだけで端子と基盤上の導体
との接続が可能なものである。[Operation] In the network resistor of the present invention, the lead frames whose mounting portions are slightly parallel to the terminals are positioned at the edges of the board so as to be axially opposed to each other. The terminal and conductor on the board can be connected simply by inserting it into the edge.
［実施例］ 以下この考案の実施例について図面に基づいて説明す
る。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図ないし第３図はこの考案の第一実施例を示すもの
で、セラミックス等の絶縁基板１の一方の面に、複数の
抵抗体２が一定間隔で印刷形成されている。そして、こ
の抵抗体２の両端部から基板１の一方の端縁部にかけて
にそれぞれ導体３が印刷され、各抵抗体は、独立の抵抗
として作用するように設けられている。さらに、抵抗体
２およびその両端部近傍の導体３は、絶縁皮膜４で覆わ
れ、導体３の先端部には、リードフレーム５により形成
された取り付け部６が接続している。この取り付け部６
は、コ字形に形成され、端子７とは並行に所定間隔だけ
ずれて位置している。導体３に接触している取り付け部
６の先端部は、ハンダ８で固定されている。そして、基
板１および取り付け部６を覆って外装樹脂９が設けら
れ、端子７がこの外装樹脂から延出している。1 to 3 show a first embodiment of the present invention, in which a plurality of resistors 2 are printed and formed at regular intervals on one surface of an insulating substrate 1 made of ceramics or the like. Then, conductors 3 are printed from both ends of the resistor 2 to one edge of the substrate 1, and each resistor is provided so as to act as an independent resistor. Further, the resistor 2 and the conductor 3 in the vicinity of both ends thereof are covered with an insulating film 4, and a mounting portion 6 formed by a lead frame 5 is connected to the tip end of the conductor 3. This attachment part 6
Are formed in a U-shape, and are positioned in parallel with the terminal 7 by a predetermined distance. The tip of the mounting portion 6 that is in contact with the conductor 3 is fixed with solder 8. An exterior resin 9 is provided so as to cover the substrate 1 and the mounting portion 6, and the terminals 7 extend from the exterior resin.
この実施例のリードフレーム５は、周知の通り図示しな
い連結部で連結された状態で基板１に取り付けられるも
のであり、取り付けの際、所定本ずつの端子７を有した
状態の一対のリードフレーム５を、互いに軸対称になる
ように対向させて取り付ける。すなわち、第２図に示す
ように、取り付け部６同士が軸対称に向かい合い、端子
７が対向して設けられる。これにより取り付け部６は、
導体３の端部に接続し、対向する端子７同士が、一つの
独立した抵抗体２の両端にそれぞれ接続される。この取
り付けは、リードフレームの連結部に端子７が付いた状
態で、自動機により基板１を取り付け部６に差し込めば
良い。この後ハンダ付け等の作業を行ない、連結部から
端子７を切断する。As is well known, the lead frame 5 of this embodiment is attached to the substrate 1 in a state of being connected by a connecting portion (not shown), and at the time of attachment, a pair of lead frames having a predetermined number of terminals 7 are attached. 5 are attached so as to be axially symmetrical to each other. That is, as shown in FIG. 2, the mounting portions 6 are provided axially symmetrically, and the terminals 7 are provided so as to face each other. As a result, the mounting portion 6
Terminals 7 that are connected to the ends of the conductor 3 and that face each other are connected to both ends of one independent resistor 2. This mounting may be performed by inserting the substrate 1 into the mounting portion 6 by an automatic machine with the terminal 7 attached to the connecting portion of the lead frame. Thereafter, work such as soldering is performed to cut the terminal 7 from the connecting portion.
この実施例によれば、基板１の一方の面にのみ抵抗体２
が形成されていても、DIP型のネットワーク抵抗器を、
少ない工数で簡単に製造することができるとともに、対
向する端子間の幅および端子間隔を小さくすることがで
き、高密度実装を可能にするものである。さらに、互い
に対向する端子７同士がおのおの独立の抵抗体として作
用する、小型のDIP型ネットワーク抵抗器を、簡単に製
造することができる。According to this embodiment, the resistor 2 is provided only on one surface of the substrate 1.
Even if is formed, a DIP type network resistor,
It is possible to easily manufacture the device with a small number of steps, and to reduce the width between the opposing terminals and the terminal interval, which enables high-density mounting. Further, it is possible to easily manufacture a small DIP type network resistor in which the terminals 7 facing each other act as independent resistors.
次にこの考案の第二実施例について第４図ないし第６図
に基づいて説明する。ここで第一実施例と同様の部材に
ついては同一符号を付して説明を省略する。Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
この実施例のネットワーク抵抗器は、表面実装用のもの
で、端子10の先端部が、取り付けられる基板表面と並行
となるように、基板１の表面と直角に且つ相反する方向
に折り曲げられて設けられている。The network resistor of this embodiment is for surface mounting, and is provided by bending the terminals 10 at right angles to the surface of the substrate 1 and in opposite directions so that the tip portions of the terminals 10 are parallel to the surface of the substrate to be mounted. Has been.
この端子10は、連続したリードフレームの状態で折り曲
げられたものでも良く、基板１に取り付けた後折り曲げ
ても良い。The terminal 10 may be bent in the state of a continuous lead frame, or may be bent after being attached to the substrate 1.
この考案のネットワーク抵抗器は、基板の裏面にも導体
を形成して、取り付け部をハンダ付けしても良く、これ
により強度を高くすることができる。さらに、抵抗体を
基板の表裏二面に並列に設け、大電力用等のものにして
も良い。さらに、基板と放熱板とを取り付け部に挟んで
も良く、二枚の基板の間に放熱板を挟んでも良い。これ
により小型で高密度実装可能な大電力用のネットワーク
抵抗器を、安価に提供することができる。In the network resistor of the present invention, a conductor may be formed also on the back surface of the substrate and the mounting portion may be soldered, whereby the strength can be increased. Further, resistors may be provided in parallel on the front and back surfaces of the substrate to be used for high power. Further, the substrate and the heat sink may be sandwiched between the mounting portions, or the heat sink may be sandwiched between the two substrates. As a result, a small-sized, high-power network resistor for high power can be provided at low cost.
また、この考案のネットワーク抵抗器は、コ字形の端子
の取り付け部が所定ピッチだけ端子よりずれて設けられ
たものを、互いに軸対称に配設したものであれば良く、
端子や取り付け部の形状は問わない。Further, the network resistor of the present invention may be one in which the mounting portions of the U-shaped terminals are provided with a predetermined pitch offset from the terminals, and are arranged symmetrically with respect to each other.
The shape of the terminal and the mounting part does not matter.
［考案の効果］ この考案のネットワーク抵抗器は、コ字形の取り付け部
を有し、この取り付け部を基板の端面部に差し込むだけ
で端子の接続ができるとともに、取り付け部と端子が所
定量だけずれて形成されているので、これを互いに軸対
称に対向させて設けて基板に差し込むことにより、基板
の平面方向に形成された抵抗体の両端に接続した端子
を、基板の厚み方向に対向した構造にすることができ、
小型のDIP型のネットワーク抵抗器を簡単に製造するこ
とができる。[Advantage of the Invention] The network resistor of the present invention has a U-shaped mounting portion, and the terminal can be connected by simply inserting the mounting portion into the end face portion of the substrate, and the mounting portion and the terminal are displaced by a predetermined amount. Since they are formed so as to be axially symmetrical to each other and are inserted into the substrate, the terminals connected to both ends of the resistor formed in the plane direction of the substrate are opposed to each other in the thickness direction of the substrate. Can be
A small DIP type network resistor can be easily manufactured.
したがって、SIPと比べパッケージの小さいDIP型のネッ
トワーク抵抗器を、容易に製造することができ、基板の
高密度実装に大きく寄与する。Therefore, a DIP type network resistor, which has a smaller package than SIP, can be easily manufactured, which greatly contributes to high-density mounting on a substrate.
第１図はこの考案の第一実施例の部分破断斜視図、第２
図はこの実施例の部分破断正面図、第３図はこの実施例
のリードフレームを基板端縁部に取り付けた状態の側面
図、第４図はこの考案の第二実施例の部分破断斜視図、
第５図はこの実施例の部分破断正面図、第６図はこの実
施例のリードフレームを基板端縁部に取り付けた状態の
側面図である。 １……基板、２……抵抗体、３……導体、５……リード
フレーム、６……取り付け部、7,10……端子FIG. 1 is a partially cutaway perspective view of the first embodiment of the present invention, and FIG.
FIG. 4 is a partially cutaway front view of this embodiment, FIG. 3 is a side view of the lead frame of this embodiment attached to an edge portion of a substrate, and FIG. 4 is a partially cutaway perspective view of a second embodiment of the present invention. ,
FIG. 5 is a partially cutaway front view of this embodiment, and FIG. 6 is a side view of the lead frame of this embodiment attached to the edge of the substrate. 1 ... Board, 2 ... Resistor, 3 ... Conductor, 5 ... Lead frame, 6 ... Mounting part, 7,10 ... Terminal
Claims (2)
が、一つのパッケージ内に収容されて設けられているDI
P型ネットワーク抵抗器において、リードフレームによ
り形成され上記絶縁基板の一端縁部にのみ設けられる端
子と、この端子と一体に上記リードフレームにより形成
され端子を基板に取り付けるコ字形の取り付け部とを有
し、端子とその取り付け部とが所定ピッチだけ並行にず
れて形成され、抵抗体が形成された絶縁基板の一端縁
に、上記端子が互いに基板を挟んで対向するとともに上
記取り付け部が互いに軸対称に向かい合って取り付けら
れ、上記抵抗体の両端部に各々接続した各導体に上記取
り付け部が各々接続して成ることを特徴とするネットワ
ーク抵抗器。1. A DI in which a plurality of resistance elements formed on an insulating substrate are housed and provided in one package.
The P-type network resistor has a terminal formed by a lead frame and provided only at one end edge of the insulating substrate, and a U-shaped mounting portion integrally formed with the terminal by the lead frame for attaching the terminal to the substrate. Then, the terminals and their mounting portions are formed in parallel with each other by a predetermined pitch, and the terminals face each other with the substrate sandwiched therebetween, and the mounting portions are axially symmetric with respect to one edge of the insulating substrate on which the resistor is formed. A network resistor, characterized in that the above-mentioned mounting portions are connected to respective conductors which are mounted so as to face each other and which are respectively connected to both ends of the resistor.
収容されて設けられているDIP型ネットワーク抵抗器に
おいて、絶縁基板の片面にのみ抵抗体が形成され、この
抵抗体の両端部にそれぞれ上記基板の一端縁部に導かれ
た導体が接続し、リードフレームにより形成され上記絶
縁基板の一端縁部にのみ設けられる端子と、この端子と
一体に上記リードフレームにより形成され端子を基板に
取り付けるコ字形の取り付け部とが設けられ、端子とそ
の取り付け部とが所定ピッチだけ並行にずれて形成さ
れ、抵抗体が形成された絶縁基板の一端縁に、上記端子
が互いに基板を挟んで対向するとともに上記取り付け部
が互いに軸対称に向かい合って取り付けられ、上記導体
に上記取り付け部が各々接続して成ることを特徴とする
ネットワーク抵抗器。2. A DIP type network resistor having a plurality of resistance elements housed in one package, wherein a resistor is formed only on one surface of an insulating substrate, and both ends of the resistor are respectively formed. A terminal connected to a conductor led to one end edge of the substrate and formed by a lead frame and provided only on one end edge of the insulating substrate; and a terminal formed integrally with the terminal by the lead frame and attached to the substrate A U-shaped mounting portion is provided, the terminal and the mounting portion are formed in parallel with each other by a predetermined pitch, and the terminal faces the one end edge of the insulating substrate on which the resistor is formed with the substrate sandwiched therebetween. At the same time, the mounting portions are mounted so as to be axially symmetrical to each other, and the mounting portions are connected to the conductor, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12893489U JPH0726803Y2 (en) | 1989-11-02 | 1989-11-02 | Network resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12893489U JPH0726803Y2 (en) | 1989-11-02 | 1989-11-02 | Network resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0367402U JPH0367402U (en) | 1991-07-01 |
| JPH0726803Y2 true JPH0726803Y2 (en) | 1995-06-14 |
Family
ID=31676605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12893489U Expired - Fee Related JPH0726803Y2 (en) | 1989-11-02 | 1989-11-02 | Network resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726803Y2 (en) |
-
1989
- 1989-11-02 JP JP12893489U patent/JPH0726803Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0367402U (en) | 1991-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |