JPH06111869A - Surface mount terminal - Google Patents

Abstract

PURPOSE:To facilitate high density mounting and mounting work for a mother printed board by performing surface mount on a bottom surface at the desired position by reflow soldering without being protruding out from the side edge of a module circuit board. CONSTITUTION:This terminal is constituted of narrow conductor substances 22 parallelly provided at an equal pitch from the upper surface to the bottom surface through the side surface of a strip-like insulator 21. The plane part in the upper part of the conductor substance 22 is mounted on a pad 6 parallelly provided in the bottom surface of a module circuit board 5 by reflow soldering. Also, the plane part in the lower part of the conductor substance 22 is mounted on a pad 2 parallelly provided in the surface of a mother printed board 1 by reflow soldering. Thereby, when the surface mounting of other mounting parts 7 is performed on the module circuit print board 5 and also when the surface mount of a module 50 is performed on the mother printed board 1, the reflow soldering for this terminal can be simultaneously performed, so that the simplification and the high efficiency of the work can be achieved. Also, since the surface mount is performed without protruding out from the side edge of the module circuit board 5, the high density mounting of the mother printed board 1 can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting terminal used when mounting a module on a mother printed board.

In response to the demand for miniaturization and high performance of electronic devices, in recent years, the surface mounting of components on printed wiring boards, the modularization of mounted components, the multilayering of printed wiring boards, etc. High-density mounting is performed.

[0003]

2. Description of the Related Art FIG. 5 is a sectional view of a conventional example in which a module is mounted on a mother printed board. In FIG. 5, 50
Is a module in which mounting components 7 are surface-mounted as desired on both surfaces of a small module circuit board 5.

Reference numeral 1 denotes a mother printed board on which a module 50 is mounted. On the mother printed board 1, in addition to the module 50, mounting components 4 are surface-mounted on both surfaces.
To mount the module 50 on the mother printed board 1,
Pads 6 are formed on the lower surface of the side edge portion of the module circuit board 5 at an equal pitch, and on the surface of the mother printed board 1,
Pads 2 are formed in an array corresponding to the pads 6.

Reference numeral 11 is a lead terminal which is substantially Z-shaped in a side view. The lead terminal 11 is mounted on the module 50 in advance by reflow soldering the upper seating portion to the pad 6 of the module circuit board 5.

The module 50 on which the lead terminals 11 are mounted in this manner is placed on the mother printed board 1, and the lower seat portions of the respective lead terminals 11 are reflow-soldered to the pads 2 and surface-mounted on the mother printed board 1. ing.

FIG. 6 is a cross-sectional view of the essential parts of another conventional example.
In FIG. 6, reference numeral 12 is an axial lead terminal 12 having a pair of sandwiching pieces for sandwiching the side edge portions of the module circuit board 5 on the upper portion.

The lead terminals 12 are pre-mounted on the module circuit board 5 by soldering with the sandwiching pieces sandwiched between the pair of pads 6 formed on the upper and lower surfaces of the side edges of the module circuit board 5. ing.

Therefore, the shaft portion of the lead terminal 12 vertically projects downward from the module circuit board 5. And
The module 50 is mounted on the mother printed board 1 by inserting and soldering the leading end portions of the lead terminals 12 into the through holes 3 of the mother printed board 1.

[0010]

By the way, the former, that is, Z
The letter-shaped lead terminal has a lower seat portion that extends outward from the side edge of the module circuit board. Therefore, there is a problem that high density mounting of the mother printed board is hindered.

The latter, that is, the axial type lead terminal is inserted and soldered into the through hole of the mother printed board, and the mounting area on the rear surface of the mother printed board is reduced. There was a problem that was blocked.

Further, there is a problem that the module cannot be surface-mounted on the mother printed board together with other mounting components. On the other hand, any of the lead terminals described above projects below the module circuit board, so the lead terminals will bend unless special care is taken in handling the module. Therefore, after correcting this bend, the module is mounted on the mother printed board, and there is a problem that the mounting work is troublesome.

The present invention was created in view of the above points, and promotes high-density mounting of mother printed boards,
Moreover, it is an object of the present invention to provide a surface mounting terminal that can be reflow-soldered together with other mounting components and can be easily mounted.

[0014]

In order to achieve the above object, the present invention is to mount a module, in which mounting components are surface-mounted on a module circuit board, on a mother printed board, as illustrated in FIG. Which is a terminal used for, and has an equal pitch over the upper surface, the side surface, and the lower surface of the strip-shaped insulator 21.
A conductor material 22 having a narrow width is wound and formed in a U shape or a rectangular shape, and an upper flat surface portion of the conductor material 22 is reflow-soldered to the pads 6 arranged in parallel on the lower surface of the module circuit board 5. The lower plane portion of the substance 22 is reflow-soldered to the pads 2 arranged in parallel on the surface of the mother printed board 1.

Alternatively, as shown in FIG. 4, a pair of strip-shaped upper insulating plates 31-1 and lower insulating plates 31-2 and a plurality of narrow width S-shaped conductor plates 35 are provided at equal pitches. The upper part of each of the arranged S-shaped conductor plates is in close contact with the upper side surface of the upper insulating plate 31-1, and the lower part is in close contact with the lower surface of the lower insulating plate 31-2.
A pair of upper insulating plate 31-1 and lower insulating plate 31-2 are held in parallel at a predetermined interval, and the upper flat surface portion of the S-shaped conductor plate 35 is arranged in parallel with the lower surface of the module circuit board 5. The pad 6 is reflow-soldered, and the lower plane portion of the S-shaped conductor plate 35 is reflow-soldered to the pad 2 arranged in parallel with the surface of the mother printed board 1.

[0016]

In any of the surface mounting terminals of the present invention, the conductor material or the upper flat portion of the S-shaped conductor plate is reflow soldered to the lower surface of the module circuit board at the same time as other mounting components. In addition, the module mounting the surface mounting terminals is such that the conductor material of the surface mounting terminals or the lower flat surface portion of the S-shaped conductor plate is reflow soldered to the mother printed board at the same time as other mounting components. is there.

That is, the surface-mounting terminal is easy to mount. Further, since the surface mounting terminals are surface mounted at a desired position on the lower surface without protruding from the side edges of the module circuit board, high density mounting of the mother printed board is promoted.

In general, when the mother printed board and the module circuit board are made of different materials, their thermal expansion coefficients are different. In such a case, when the environmental temperature changes, stress is applied to the terminal connecting the mother printed board and the module circuit board, so that the reflow soldered pad portion may peel off.

However, in the surface mounting terminal according to the second aspect of the invention, since the S-shaped conductor plate has a spring function, this stress is absorbed by the S-shaped conductor plate, and therefore the pad does not peel off.

[0020]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a diagram of an embodiment of the invention of claim 1,
(A) is a perspective view, (B) is a sectional view showing a mounted state, FIG. 2 is a perspective view of another embodiment of the invention of claim 1, and FIG. 3 is a further embodiment of the invention of claim 1. FIG. 4 is a perspective view, FIG. 4 is a diagram of the invention of claim 2, (A) is a perspective view, and (B) is a sectional view showing a mounted state.

In FIG. 1, the module 50 is constructed by mounting the mounting components 7 on the upper surface and the lower surface of the small-sized module circuit board 5 as desired. Then, the pads 6 are arranged on the lower surface of the side edge portion of the module circuit board 5 at an equal pitch.

On the mother printed board 1 on which the module 50 is mounted, pads 2 are arranged and formed at positions corresponding to the pads 6 of the module circuit board 5. In addition to the module 50, the mother printed board 1 has mounted components 4 on both sides.
Is surface mounted.

Reference numeral 21 is a strip-shaped insulator formed by molding. Reference numeral 22 denotes a conductor material wound in parallel in a U shape at equal pitches on the upper surface, the side surface, and the lower surface of the insulator 21.

The conductor material 22 is, for example, a copper-based metal plate having a narrow width slightly smaller than the width of the pad.
Is insert-molded into the insulator 21. The surface mounting terminal 20 is configured by forming the conductor material 22 as described above on the insulator 21.

The surface mounting terminals 20 are made of various conductor materials.
The upper flat surface portion of 22 (the conductor portion in close contact with the upper surface of the insulator 21) is pre-mounted on the module 50 by reflow soldering to the pad 6 of the corresponding module circuit board 5.

The reflow soldering is carried out at the same time as the reflow soldering of the mounting component 7 surface-mounted on the lower surface of the module circuit board 5. The module 50 equipped with the surface mounting terminals 20 as described above is
As shown in (B), the lower flat surface portions of the respective conductor substances 22 (conductor portions in contact with the lower surface of the insulator 21) are placed on the mother printed board 1 and reflow soldered to the corresponding pads 2. It is surface-mounted on the mother printed board 1.

The reflow soldering of this module 50 is
This is performed at the same time as the reflow soldering of the mounting component 4 which is surface-mounted on the upper surface of the mother printed board 1. Therefore, the surface mounting terminal 20 as described above is easy to mount and does not stick out from the side edge of the module circuit board, which promotes high density mounting of the mother printed board.

The material of the insulator 24 of the surface mounting terminal 20 shown in FIG. 2 is a strip of a copper clad laminated board.
Further, the conductor material wound around the insulator 24 in a U-shape at an equal pitch is the conductor pattern 25 formed on the upper surface and the lower surface of the insulator 24.
-1 and the via half 25-2 that connects the upper and lower conductor patterns 25-1
It consists of and.

The surface mounting terminal 20 using the insulator 24 obtained by cutting the copper clad laminated board into a strip shape as described above is applied to the case where the mother printed board and the module circuit board are both copper clad laminated boards, Since the expansion coefficients are the same, there is an advantage that the pad does not peel even if the environmental temperature changes.

The material of the insulator 26 of the surface mounting terminal 20 shown in FIG. 3 is ceramics. In addition, the conductor material that is wound around the insulator 26 in a square shape at an equal pitch is a thin metal film 27 in which gold, copper, or the like is deposited.

In FIG. 4, 31-1 is a strip-shaped upper insulating plate formed by molding. 31-2 is the upper insulating plate 31
The lower insulating plate 31-2 has the same shape as -1. Reference numeral 35 is an S-shaped conductor plate obtained by pressing a copper-based metal whose width is slightly smaller than the width of the pad into a substantially S-shape.

The S-shaped conductor plates 35 are arranged at the same pitch as the pads between the upper insulating plate 31-1 and the lower insulating plate 31-2 which are parallel to each other in the vertical direction. And the lower surface thereof is wound around the side surface and the lower surface of the lower insulating plate 31-2.

If the upper insulating plate 31-1 and the lower insulating plate 31-2 are molded and the S-shaped conductor plate 35 is molded as an inserter, the S-shaped conductor plate 35 can be easily wound. In addition, the pitch is also highly accurate.

The upper plane portion of each S-shaped conductor plate 35 (the conductor portion that is in close contact with the upper surface of the upper insulating plate 31-1) is reflow-soldered to the pad 6 of the corresponding module circuit board 5 so that the surface Mounting terminal 30 is module 50 in advance
Implemented in.

The reflow soldering is carried out at the same time as the reflow soldering of the mounting component 7 surface-mounted on the lower surface of the module circuit board 5. The module 50 equipped with the surface mounting terminals 30 as described above is
As shown in (B), the lower flat surface portions of the S-shaped conductor plates 35 (conductor portions in contact with the lower surface of the lower insulating plate 31-2) placed on the mother printed board 1 correspond to the corresponding pads 2 And is surface-mounted on the mother printed board 1.

Even when the mother printed board 1 and the module circuit board 5 are made of different materials, in the surface mounting terminal 30 described above, the S-shaped conductor plate 35 has a spring function.
It absorbs the stress caused by the difference in thermal expansion (or contraction) dimension due to the change in environmental temperature.

Therefore, the reflow soldered pad portion is not peeled off.

[0039]

As described above, the surface mounting terminal of the present invention can be mounted by reflow soldering at the same time when other mounting components are surface mounted on the module circuit board. At the same time as the surface mounting on the mother printed board, the module can be reflow-soldered and surface mounted on the mother printed board 1, which is an excellent practical effect.

Further, the surface mounting terminals are surface mounted at desired positions on the lower surface without protruding from the side edges of the module circuit board, which promotes high density mounting of the mother printed board. Have an effect.

Furthermore, the surface-mounting terminal using the S-shaped conductor plate is applied when the mother printed board and the module circuit board are made of different materials, and has an effect that the pad does not peel off.

[Brief description of drawings]

FIG. 1 is a diagram of an embodiment of the invention of claim 1, (A) is a perspective view, and (B) is a sectional view showing a mounted state.

FIG. 2 is a perspective view of another embodiment of the invention of claim 1;

FIG. 3 is a perspective view of still another embodiment of the invention of claim 1;

FIG. 4 is a perspective view of the invention of claim 2; FIG. 4B is a sectional view showing a mounting state.

FIG. 5 is a sectional view of a conventional example.

FIG. 6 is a sectional view of a key part of another conventional example.

[Explanation of symbols]

1 mother printed board 2,6
Pad 3 Through hole 4,7
Mounted parts 11,12 Lead terminal 20,30
Surface-mounting terminals 21,24,26 Insulator 22 Conductor material 25-1 Conductor pattern 25-2 Beer half 27 Metal film 31-1 Upper insulating plate 31-2 Lower insulating plate 35 S-shaped conductor plate 50 Module 5 Module circuit substrate

Claims (2)

[Claims] 1. A terminal used when mounting a module, the mounting component of which is surface-mounted on a module circuit board, to a mother printed board, wherein the strip-shaped insulator (21) has an equal pitch over the upper surface, the side surface, and the lower surface. A narrow conductor material (22) is wound in a U-shape or a rectangular shape and arranged in parallel, and the upper flat portion of the conductor material (22) is formed by a pad (5) arranged in parallel on the lower surface of the module circuit board (5). 6) to be reflow-soldered, and the lower plane portion of the conductor material (22) is the mother printed board.
A terminal for surface mounting, which is to be reflow-soldered to a pad (2) arranged in parallel with the surface of (1). 2. A pair of strip-shaped upper insulating plates (31-1) and lower insulating plates which are terminals used when mounting a module, the mounting components of which are surface-mounted on a module circuit board, to a mother printed board. (31-2)
And a plurality of narrow S-shaped conductor plates (35), and the upper portions of the S-shaped conductor plates (35) arranged at equal pitches are on the upper side surface of the upper insulating plate (31-1). The lower insulating plate (31-2) and the lower insulating plate (31-2) are in close contact with each other, so that the pair of upper insulating plate (31-1) and lower insulating plate (31-2) are separated by a predetermined distance. The S-shaped conductor plate (35) is held in parallel, and the upper plane portion of the S-shaped conductor plate (35) is reflow-soldered to the pad (6) juxtaposed to the lower surface of the module circuit board (5). A surface-mounting terminal, wherein a lower plane portion of the conductor plate (35) is reflow-soldered to a pad (2) juxtaposed to a surface of the mother printed board (1).