JPH0528917B2 - - Google Patents
Info
- Publication number
- JPH0528917B2 JPH0528917B2 JP61022270A JP2227086A JPH0528917B2 JP H0528917 B2 JPH0528917 B2 JP H0528917B2 JP 61022270 A JP61022270 A JP 61022270A JP 2227086 A JP2227086 A JP 2227086A JP H0528917 B2 JPH0528917 B2 JP H0528917B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electric circuit
- wiring pattern
- terminal
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- -1 for example Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はICチツプなどの電子部品を搭載する
電気回路配線板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electric circuit wiring board on which electronic components such as IC chips are mounted.
従来、電子回路パツケージを構成するために銅
積層板によるプリント配線板が多用されている
が、近年射出成形技術を利用して、プラスチツク
配線板を製作する方法が開発されつつある。この
ような配線板の部品端子取付部は通常、従来のプ
リント配線板と同様に貫通穴にスルーホールめつ
きをしたり、導電性プラスチツクによる貫通孔と
その切口を座とするランドを設けた2重成形で作
られ、貫通孔に部品端子を圧入する(無はんだプ
レスフイツト接続)方法や、挿入後半田付けを行
なう方法で接続が行なわれている。
Conventionally, printed wiring boards made of copper laminates have been widely used to construct electronic circuit packages, but in recent years, methods of manufacturing plastic wiring boards using injection molding technology have been developed. The component terminal mounting portion of such a wiring board is usually made by plating through-holes in the same manner as conventional printed wiring boards, or by providing a through-hole made of conductive plastic and a land using the cut end of the through-hole as a seat. They are made by heavy molding, and connections are made by press-fitting component terminals into through-holes (solderless press-fit connection) or by soldering after insertion.
通常電子装置を高速で駆動する場合には電気長
を短かくするために高密度・小形化が必須条件と
なる。しかしながらプリント板にICチツプを搭
載する場合にはICケース、ICソケツトを経由し
て実装しているのが実情であり、ICチツプとIC
ケース間はワイヤボンデイングで接続され、IC
ケースとICソケツト間は圧接接続で、ICソケツ
トとPWBはハンダ付で接続されていた。このよ
うな搭載構造は電子装置の駆動スピードを遅延さ
せ、また作業工程を増やすため性能、品質、コス
トの面で大きな問題点を有していた。
Normally, when electronic devices are driven at high speed, high density and miniaturization are essential conditions in order to shorten the electrical length. However, when mounting an IC chip on a printed circuit board, the actual situation is that it is mounted via an IC case and an IC socket.
The cases are connected by wire bonding, and the IC
The case and IC socket were connected by pressure welding, and the IC socket and PWB were connected by soldering. Such a mounting structure delays the drive speed of the electronic device and increases the number of work steps, resulting in major problems in terms of performance, quality, and cost.
本発明の目的は上記の問題点を除去し、電気回
路配線板の導体層の一部を片持梁状に形成し直接
にチツプ状部品端子を接続することにより、着装
工数を削減し、かつ信頼性の高い接続が行なえる
電気回路配線板を提供することにある。 The purpose of the present invention is to eliminate the above-mentioned problems, reduce the number of installation steps by forming a part of the conductor layer of an electric circuit wiring board into a cantilever shape, and directly connecting chip-shaped component terminals. An object of the present invention is to provide an electric circuit wiring board that allows highly reliable connections.
本発明の電気回路配線板は、絶縁体より構成さ
れる基板体と、電気回路パターンを構成する導電
性の配線パターンと、前記基板体上に突出されか
つ前記配線パターンから連続し搭載する電子部品
の端子と接続する電気接続部を含む梁状部とを備
えたことを特徴とする。
The electric circuit wiring board of the present invention includes a substrate made of an insulator, a conductive wiring pattern constituting an electric circuit pattern, and an electronic component that is projected onto the substrate and is mounted continuously from the wiring pattern. and a beam-shaped portion including an electrical connection portion to be connected to the terminal.
次に、本発明について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第1図および第2図を参照すると本発明の第1
実施例に電子部品が着装された状態が示されてい
る。第1図と第2図とで同一の構成要件は同一の
参照符号で示されている。絶縁性プラスチツクよ
りなる基板体1と、導電性プラスチツク例えば金
属粉含有プラスチツクよりなる配線パターン3
と、この配線パターン3に接続され前記基板体1
の面上に片持梁状に突出した接続端子2とを有し
ている。前記基板体1と前記配線パターン3とは
二重成型により形成されている。複数の前記接続
端子2の上にチツプ状の電子部品10が搭載さ
れ、前記基板体1から鉤状に突出したクランプ4
が有する弾性と接続端子2が有する弾性により、
この電子部品10の各端子11とそれぞれに対応
する接続端子2とが密着している。 Referring to FIGS. 1 and 2, the first embodiment of the present invention
The example is shown with electronic components attached. Components that are the same in FIG. 1 and FIG. 2 are designated by the same reference numerals. A substrate body 1 made of insulating plastic, and a wiring pattern 3 made of conductive plastic, for example, plastic containing metal powder.
and the substrate body 1 connected to this wiring pattern 3.
It has a connecting terminal 2 projecting in a cantilever shape on the surface thereof. The substrate body 1 and the wiring pattern 3 are formed by double molding. A chip-shaped electronic component 10 is mounted on the plurality of connection terminals 2, and a clamp 4 protrudes from the substrate body 1 in a hook shape.
Due to the elasticity of the connecting terminal 2 and the elasticity of the connecting terminal 2,
Each terminal 11 of this electronic component 10 and the corresponding connection terminal 2 are in close contact with each other.
第3図および第4図を参照すると本発明の第2
の実施例は絶縁性プラスチツクよりなる基板体1
と、絶縁性プラスチツク例えば炭素粉含有プラス
チツクよりなる配線パターン3と、この配線パタ
ーン3に接続され前記基板体1面上に片持梁状に
突出した接続端子2とを有している。前記基板体
1と前記配線パターン3とは二重成型されてい
る。2列に並んだ複数の接続端子2の間にチツプ
状の電子部品20が挾着され、梁状に突出した接
続端子2の弾性により、電子部品20の端子とそ
れぞれに対応する接続端子2とが密着している。
なお接続端子2の先端部をメツキ等により半田に
なじみ良い金属薄膜で覆い、前記電子部品10お
よび20の端子11および21間とを半田により
固着してもよい。 Referring to FIGS. 3 and 4, the second embodiment of the present invention
In this embodiment, the substrate body 1 is made of insulating plastic.
, a wiring pattern 3 made of insulating plastic, for example, carbon powder-containing plastic, and a connecting terminal 2 connected to the wiring pattern 3 and protruding in the form of a cantilever on the surface of the substrate 1. The substrate body 1 and the wiring pattern 3 are double molded. A chip-shaped electronic component 20 is clamped between a plurality of connecting terminals 2 arranged in two rows, and the elasticity of the connecting terminals 2 protruding like a beam allows the terminals of the electronic component 20 to connect with the corresponding connecting terminals 2. are in close contact.
Note that the tip of the connecting terminal 2 may be covered with a metal thin film that is compatible with solder by plating or the like, and the terminals 11 and 21 of the electronic components 10 and 20 may be fixed with solder.
また、第5図および第6図を参照すると本発明
の第3および第4の実施例においては、前記基板
体1上に突出した絶縁性プラスチツクの梁状部5
と、前記配線パターン3からこの梁状部5の電子
部品30および40の端子31および41に対応
する位置まで伸ばされた導体層6および7による
接続端子とを有している。この導体層6は印刷に
より形成されている。したがつて絶縁性プラスチ
ツクに限定されない。導体層7は二重成形により
形成されている。 Further, referring to FIGS. 5 and 6, in the third and fourth embodiments of the present invention, a beam-like portion 5 of insulating plastic protrudes above the substrate body 1.
and connection terminals formed by conductor layers 6 and 7 extending from the wiring pattern 3 to positions corresponding to the terminals 31 and 41 of the electronic components 30 and 40 of the beam-shaped portion 5. This conductor layer 6 is formed by printing. Therefore, it is not limited to insulating plastics. The conductor layer 7 is formed by double molding.
以上の実施例において前記基板体1は絶縁性プ
ラスチツクに限定されるものではない。しかしな
がらプラスチツクにより構成することによつてそ
の弾性により温度変化等による電気回路配線板自
体の変形や搭載電子部品の変形を吸収するので、
高い接続信頼性が得られる。また第1図に示す前
記クランプ4も一体に形成できるので前記基板体
1を絶縁性プラスチツクにより構成する効果は大
きい。 In the above embodiments, the substrate 1 is not limited to insulating plastic. However, since it is made of plastic, its elasticity absorbs the deformation of the electric circuit wiring board itself and the mounted electronic components due to temperature changes, etc.
High connection reliability can be obtained. Furthermore, since the clamp 4 shown in FIG. 1 can also be formed integrally, the effect of constructing the substrate 1 from insulating plastic is great.
以上説明したように、本発明は絶縁体の基板体
と導電体の配線パターンとの組み合せによる電気
回路配線板において、前記基板体上に突出した接
続端子を含む梁状部を設けることにより、チツプ
状の電子部品を容易にかつ直接搭載することがで
き、接続工数の減少や高い接続信頼性を達成でき
る。
As explained above, the present invention provides an electric circuit wiring board that combines an insulating substrate and a conductive wiring pattern, by providing a beam-shaped portion including a protruding connection terminal on the substrate. It is possible to easily and directly mount various types of electronic components, reducing the number of connection steps and achieving high connection reliability.
第1図および第2図はそれぞれ本発明の第1実
施例を示す斜視図および平断面図、第3図および
第4図はそれぞれ本発明の第2実施例を示す斜視
図および平断面図、第5図および第6図はそれぞ
れ本発明の第3および第4実施例を示す平断面図
である。
1……基板体、2……接続端子、3……配線端
子、4……クランプ、5……梁状部、6,7……
導体層、10,20,30,40……電子部品、
11,21,31,41……端子。
1 and 2 are a perspective view and a plan sectional view, respectively, showing a first embodiment of the present invention, and FIGS. 3 and 4 are a perspective view and a plan sectional view, respectively, showing a second embodiment of the invention, FIGS. 5 and 6 are plan sectional views showing third and fourth embodiments of the present invention, respectively. DESCRIPTION OF SYMBOLS 1... Board body, 2... Connection terminal, 3... Wiring terminal, 4... Clamp, 5... Beam-like part, 6, 7...
Conductor layer, 10, 20, 30, 40...electronic component,
11, 21, 31, 41... terminal.
Claims (1)
ターンを構成する導電性の配線パターンとからな
る電気回路配線板において、基板体と配線パター
ンとの少なくとも一方がプラスチツクにより構成
され、このプラスチツクによる構成体が基板体上
に片持梁状に突出して、基板体上に搭載する電子
部品の端子と弾性接続する接続端子部を形成する
ことを特徴とする電気回路配線板。1. In an electric circuit wiring board consisting of a substrate made of an insulator and a conductive wiring pattern constituting an electric circuit pattern, at least one of the substrate and the wiring pattern is made of plastic; An electric circuit wiring board characterized in that a body protrudes in a cantilever shape above a substrate body to form a connecting terminal portion that is elastically connected to a terminal of an electronic component mounted on the substrate body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2227086A JPS62179794A (en) | 1986-02-03 | 1986-02-03 | Electric circuit wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2227086A JPS62179794A (en) | 1986-02-03 | 1986-02-03 | Electric circuit wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62179794A JPS62179794A (en) | 1987-08-06 |
JPH0528917B2 true JPH0528917B2 (en) | 1993-04-27 |
Family
ID=12078071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2227086A Granted JPS62179794A (en) | 1986-02-03 | 1986-02-03 | Electric circuit wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62179794A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7830331B2 (en) | 2007-11-29 | 2010-11-09 | Kabushiki Kaisha Toshiba | Electronic device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013214612A (en) * | 2012-04-02 | 2013-10-17 | Denso Corp | Wiring device |
JP7233067B1 (en) * | 2022-04-22 | 2023-03-06 | エレファンテック株式会社 | Mounting component positioning and fixing structure and manufacturing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54106871A (en) * | 1978-02-09 | 1979-08-22 | Matsushita Electric Works Ltd | Method of producing embedded terminal for circuit board |
JPS5544728A (en) * | 1978-09-27 | 1980-03-29 | Yazaki Corp | Circuit board |
JPS57154886A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
-
1986
- 1986-02-03 JP JP2227086A patent/JPS62179794A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54106871A (en) * | 1978-02-09 | 1979-08-22 | Matsushita Electric Works Ltd | Method of producing embedded terminal for circuit board |
JPS5544728A (en) * | 1978-09-27 | 1980-03-29 | Yazaki Corp | Circuit board |
JPS57154886A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7830331B2 (en) | 2007-11-29 | 2010-11-09 | Kabushiki Kaisha Toshiba | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPS62179794A (en) | 1987-08-06 |
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