JPH0685425A - Board for mounting electronic part thereon - Google Patents

Abstract

PURPOSE:To provide an electronic part mounting board on which an electronic part can be detachably mounted easily. CONSTITUTION:A conductor plate 5, which is connected to the wiring 3 of a board 4, is provided in such a manner that it is extended to the through hole 2 perforated on the board 4 for insertion of an electronic part. As a result, when the terminal 1 of the electronic part is inserted into the through hole 2, both of them are brought into contact with each other completely by press- bending the conductor plate 5 by the terminal of the electronic part. As a result, the terminal 1 of the electronic part and the wiring on the board can be electrically connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting substrate, and more particularly to an electronic component mounting substrate having a conductor member for contacting a terminal of an electronic component in a through hole portion.

[0002]

2. Description of the Related Art Conventional electronic component mounting boards are either mounted directly on the board or mounted on the board with a socket on which the electronic parts can be mounted.

When electronic components are directly mounted on a substrate, a conventional electronic component mounting substrate has a through hole 2 for inserting a terminal 1 of the electronic component 8 and an electronic component 8 as shown in FIG. 4 (a). Wiring 3 for connecting the terminals 1 to each other is provided. The terminal 1 of the electronic component 8 inserted in the through hole 2 is fixed and mounted by the solder 9 and electrically connected to the wiring 3 on the substrate.

Further, when mounting a socket on which electronic components can be mounted on a substrate, a conventional electronic component mounting substrate, as shown in FIG. 4B, has a socket 10 for mounting an electronic component 8 and this socket 10. A through hole 2 for inserting the terminal 5 of 10 and a wiring 3 for connecting the terminals 5 are provided. The socket 10 is mounted by fixing its terminal 5 into the through hole 2 of the substrate 4 and then fixing it with solder 9.
Then, by mounting the electronic component 8 in the socket 10, the electronic component 8 is electrically connected to the wiring 3 on the substrate.

The round pin socket 11 shown in FIG. 4C is fitted in each through hole 2 of the board 4 and fixed to the board 4 by the solder 9. Then, the terminal 1 of the electronic component 8 is inserted into the round pin socket 11 and is brought into contact with and engaged by the terminal 5.

[0006]

[Problems to be Solved by the Invention] However, in the past,
As shown in FIG. 4A, when mounting an electronic component directly on a substrate, a soldering process is required. In addition, after mounting the electronic component on the substrate once and then mounting it on another substrate, it is necessary to melt the solder and remove the electronic component from the substrate, but in the case of a multi-pin electronic component, the extraction is difficult. .

Sockets 10 and 11 on which electronic parts can be mounted
When mounting the board on the board 4, the step of soldering the socket is required. Further, as shown in FIG. 4 (b), when a socket is used in which a conductor for contacting each terminal of an electronic component is integrated with plastic, soldering to a substrate is easy, but the socket 10 Is thick,
When a plurality of substrates are laminated, the volume becomes too high, which causes a volume problem.

Further, as shown in FIG. 4C, when a connecting jig such as the round pin socket 11 is soldered for each terminal, the height can be reduced, but the round pin socket 1
It is difficult to solder 1 to the substrate vertically, and if the round pin socket 11 is inclined, it becomes difficult to mount the electronic component 8.

The present invention has been made in view of the above problems, and an electronic component can be mounted on a substrate and electrically connected without soldering, and the electronic component can be attached and detached. It is an object of the present invention to provide an electronic component mounting board that can avoid an increase in size.

[0010]

An electronic component mounting board according to the present invention is an electronic component mounting board in which an electronic component is mounted and terminals of the electronic component are electrically connected by board wiring. It is characterized in that it has a conductor member for contacting an electronic component terminal, which has a shape extending to the insertion through-hole portion and is connected to the board wiring.

[0011]

In the present invention, by inserting the terminal of the electronic component into the through hole, the terminal and the conductor member come into contact with each other in the through hole, and the terminal and the board wiring are electrically connected through this conductor member. To be done.

[0012]

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is an external view showing an electronic component mounting board according to an embodiment of the present invention. The wiring 3 is formed on the surface of the substrate 4.
And a through hole 2 for mounting an electronic component is formed. The wiring 3 of the substrate 4 has its tip portion extended into the through hole 2, and this extended portion serves as the contact conductor plate 5.

Therefore, when the terminal 1 of the electronic component is inserted into the through hole 2, the contact conductor plate 5 is pressed by the terminal 1 and pushed into the through hole 2, and the elasticity of the constituent material of the contact conductor plate 5 is increased. The force surely contacts the terminal 1 and the wiring 3. As a result, the electronic component is mounted on the board 4 and is electrically connected to the wiring 3.

Next, a method of manufacturing this substrate will be described. 2A to 2F are sectional views showing this manufacturing method in the order of steps. First, the substrate 4 shown in FIG.
As shown in (b), a through hole 2 for inserting the terminal 1 of the electronic component is bored, and as shown in FIG. 2 (c),
The through hole 2 is filled with a filling material 6 that is soluble in an organic solvent.

Thereafter, as shown in FIG. 2 (d), a copper plate as a wiring material is deposited on the entire surface in the same manner as in the ordinary substrate forming process, and as shown in FIG. 2 (e), the photolithography technique is applied. The wiring 3 is formed by using the pattern. At this time, a portion to be the contact conductor plate 5 is formed in the through hole portion 2 together with the wiring 3. Thereafter, as shown in FIG. 2F, the embedding material 6 is melted with an organic solvent to form the through hole 2 and the contact conductor plate 5 extending into the through hole 2.

According to this embodiment, without using the socket,
Further, the terminal 1 of the electronic component and the wiring 3 on the substrate 4 can be electrically connected without performing the soldering step. Further, since the contact conductor plate 5 can be formed at the same time as the formation of the board wiring 3, there is an advantage that the manufacture thereof is easy.

FIG. 3 is an external view of the through hole 2 portion in the electronic component mounting board of the second embodiment of the present invention.
In the present embodiment, the contact conductor plates 5 are provided on a plurality of layers of the multilayer substrate 4. The contact conductor plate 5 and the wiring of each layer are electrically connected by the wiring connecting through hole 7 between the multiple layers.

The conductor plate 5 is formed by changing the direction of each layer. As a result, the contact with the terminal of the electronic component becomes even more reliable.

[0020]

As described above, according to the present invention, since the contact conductor member is provided in the through hole of the electronic component mounting substrate, the electronic component can be directly soldered to the substrate or the socket can be soldered to the substrate. The wiring on the substrate and the terminal of the electronic component can be electrically connected without attaching them. Therefore, the electronic component can be easily mounted, and the electronic component can be easily taken out as in the case of remounting the electronic component on another substrate.

[Brief description of drawings]

FIG. 1 is an external view showing an electronic component mounting board according to a first embodiment of the present invention.

2A to 2D are cross-sectional views showing a method of manufacturing the substrate shown in FIG.

FIG. 3 is an external view showing an electronic component mounting board according to a second embodiment of the present invention.

4A to 4C are cross-sectional views showing a conventional electronic component mounting substrate.

[Explanation of symbols]

 1; terminal of electronic component 2; through hole of substrate 3; wiring on substrate 4; substrate 5; conductor plate for contact 6; embedding material for through hole 7; through hole for connecting wiring of multilayer substrate 8; electronic component 9; solder 10; Socket 11; Round pin socket

Claims (1)

[Claims] 1. An electronic component mounting board, on which electronic parts are mounted and terminals of the electronic parts are electrically connected by wiring of the board, having a shape extending to a through hole portion for inserting an electronic part terminal, An electronic component mounting board having a conductor member for contacting an electronic component terminal connected to a wiring.