JPH0685425A - Board for mounting electronic part thereon - Google Patents

Board for mounting electronic part thereon

Info

Publication number
JPH0685425A
JPH0685425A JP4231661A JP23166192A JPH0685425A JP H0685425 A JPH0685425 A JP H0685425A JP 4231661 A JP4231661 A JP 4231661A JP 23166192 A JP23166192 A JP 23166192A JP H0685425 A JPH0685425 A JP H0685425A
Authority
JP
Japan
Prior art keywords
electronic component
substrate
terminal
wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4231661A
Other languages
Japanese (ja)
Inventor
Arimitsu Kato
有光 加藤
Original Assignee
Nec Corp
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp, 日本電気株式会社 filed Critical Nec Corp
Priority to JP4231661A priority Critical patent/JPH0685425A/en
Publication of JPH0685425A publication Critical patent/JPH0685425A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Abstract

PURPOSE:To provide an electronic part mounting board on which an electronic part can be detachably mounted easily. CONSTITUTION:A conductor plate 5, which is connected to the wiring 3 of a board 4, is provided in such a manner that it is extended to the through hole 2 perforated on the board 4 for insertion of an electronic part. As a result, when the terminal 1 of the electronic part is inserted into the through hole 2, both of them are brought into contact with each other completely by press- bending the conductor plate 5 by the terminal of the electronic part. As a result, the terminal 1 of the electronic part and the wiring on the board can be electrically connected.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は電子部品搭載用基板に関し、特に、電子部品の端子との接触用導体部材をスルーホール部に有する電子部品搭載用基板に関する。 The present invention relates to a substrate for an electronic component mounting BACKGROUND OF THE, in particular, it relates to an electronic component mounting board having a contact conductor member with the electronic component of the terminal into the through-hole portion.

【0002】 [0002]

【従来の技術】従来の電子部品搭載用基板は、電子部品を直接基板に実装する場合と、電子部品を搭載できるソケットを基板に実装する場合とがある。 Conventional electronic component mounting board, the case of directly mounted on the substrate an electronic component, and a case of mounting a socket capable of mounting electronic components on a substrate.

【0003】電子部品を基板に直接実装する場合、従来の電子部品搭載用基板は、図4(a)に示すように、電子部品8の端子1を挿入するスルーホール2と、電子部品8の端子1同士を接続する配線3とが設けられている。 [0003] When directly mounting electronic components on a substrate, the conventional electronic component mounting board, as shown in FIG. 4 (a), a through hole 2 for inserting the terminal 1 of the electronic component 8, the electronic component 8 wiring 3 that connects the terminal 1 to each other are provided. スルーホール2に挿入された電子部品8の端子1は半田9により固定されて実装され、基板上の配線3と電気的に接続される。 Terminal 1 of the electronic component 8 is inserted into the through-hole 2 is mounted to be fixed by solder 9 is electrically connected to the wiring 3 on the substrate.

【0004】また、電子部品を搭載できるソケットを基板に実装する場合、従来の電子部品搭載用基板には、図4(b)に示すように、電子部品8を搭載するソケット10と、このソケット10の端子5を挿入するスルーホール2と、端子5同士を接続する配線3とが設けられている。 Further, when implementing a socket capable of mounting electronic components on a substrate, the conventional electronic component mounting board, as shown in FIG. 4 (b), a socket 10 for mounting the electronic component 8, the socket a through hole 2 for inserting a terminal 5 of 10, it is provided and wiring 3 connecting terminals 5 to each other. ソケット10はその端子5を基板4のスルーホール2に挿入した後、半田9により固定して実装される。 After the socket 10 by inserting the pin 5 into the through-hole 2 of the substrate 4 is mounted and fixed by solder 9.
そして、電子部品8をこのソケット10に搭載することにより、電子部品8は基板上の配線3と電気的に接続される。 By mounting the electronic component 8 to the socket 10, the electronic component 8 is connected the wiring on the substrate 3 and electrically.

【0005】図4(c)に示す丸ピンソケット11は基板4の各スルーホール2に嵌入され、半田9により基板4に固定されている。 [0005] round pin socket 11 shown in FIG. 4 (c) is fitted in each through-hole 2 of the substrate 4 is fixed to the substrate 4 by solder 9. そして、電子部品8の端子1は丸ピンソケット11内に挿入され、その端子5により接触して係合される。 Then, the terminal 1 of the electronic component 8 is inserted into the round pin socket 11 are engaged in contact with the terminal 5.

【0006】 [0006]

【発明が解決しようとする課題】しかしながら、従来、 The object of the invention is to be Solved However, the conventional,
図4(a)に示すように、電子部品を基板に直接実装する場合は、半田付けの工程が必要である。 As shown in FIG. 4 (a), the case of directly mounting an electronic component on a substrate, it is necessary soldering process. また、電子部品を一旦基板に実装した後、別の基板に実装したい場合は、半田を溶かして電子部品を基板から抜きとる必要があるが、多ピンの電子部品の場合は抜き取りが困難である。 In addition, after once mounted on the substrate electronic components, if you want to implement to another substrate, it is necessary to extract the electronic components from the substrate by dissolving the solder, it is difficult to withdrawal in the case of the electronic components of the multi-pin .

【0007】電子部品を搭載できるソケット10,11 [0007] The socket 10 and 11 can be mounted electronic components
を基板4に実装する場合も、ソケットを半田付けする工程が必要である。 The case to be mounted on the substrate 4, it is necessary step for soldering the socket. また、ソケットとして、図4(b)に示すように、電子部品の各端子との接触用導体をプラスチックで一体化したものを使用した場合、基板への半田付けは容易であるが、ソケット10に厚みがあるため、 Further, as a socket, as shown in FIG. 4 (b), if the contact conductor for each terminal of the electronic component were used as integrated with plastic, soldering to the substrate it is easy, the socket 10 because there is a thickness,
複数枚の基板を積層した場合、高くなり過ぎるため、体積的に問題がある。 Case of laminating a plurality of substrates, for too high, there is a problem with the volumetric.

【0008】更に、図4(c)に示すように、1端子毎に丸ピンソケット11等の接続治具を半田付けした場合は、高さを低くすることはできるが、丸ピンソケット1 Furthermore, as shown in FIG. 4 (c), although the connection jig such as a round pin socket 11 in each terminal when soldered, to reduce the height can, round pin socket 1
1を基板に垂直に半田付けする作業が困難であり、丸ピンソケット11が傾斜していると、電子部品8の搭載がしにくくなる。 Work of soldering perpendicularly one to the substrate is difficult, if round pin socket 11 is inclined, it is difficult to be mounted in the electronic component 8.

【0009】本発明はかかる問題点に鑑みてなされたものであって、半田付けすることなく電子部品を基板に搭載して電気的に接続することができ、電子部品の脱着が可能であると共に大型化を回避できる電子部品搭載用基板を提供することを目的とする。 The present invention was made in view of the above problems, it is possible to electrically connect an electronic component is mounted on a substrate without soldering, as well as a possible desorption of electronic components and to provide an electronic component mounting board can be avoided size.

【0010】 [0010]

【課題を解決するための手段】本発明に係る電子部品搭載用基板は、電子部品が搭載され、基板配線により電子部品の端子が電気的に接続される電子部品搭載用基板において、電子部品端子挿入用スルーホール部に延出した形状をなし、前記基板配線に接続された電子部品端子接触用の導体部材を有することを特徴とする。 Electronic component carrier according to the present invention According to an aspect of an electronic component is mounted, the electronic component mounting board terminal of the electronic component are electrically connected to the substrate wiring, electronic component terminal None extending in the through-hole portion for insertion shape, and having a conductive member for connection to contact an electronic component terminals on the board wiring.

【0011】 [0011]

【作用】本発明においては、電子部品の端子をスルーホールに挿入することにより、スルーホール内で端子と導体部材とが接触し、この導体部材を介して端子と基板配線とが電気的に接続される。 According to the present invention, by inserting the terminals of the electronic component into the through hole, and the terminal and the conductor member in contact with the through-hole, the terminal and the substrate wiring through the conductive member is electrically connected It is.

【0012】 [0012]

【実施例】次に、本発明の実施例について添付の図面を参照して説明する。 EXAMPLES now be described with reference to the accompanying drawings embodiments of the present invention.

【0013】図1は本発明の実施例に係る電子部品搭載用基板を示す外観図である。 [0013] Figure 1 is an external view showing an electronic component mounting board according to an embodiment of the present invention. 基板4の表面には、配線3 On the surface of the substrate 4, a wiring 3
が設けられており、電子部品を搭載するためのスルーホール2が穿設されている。 It is provided, through-holes 2 for mounting electronic components is bored. そして、基板4の配線3はその先端部がこのスルーホール2内に延出し、この延出部分が接触用導体板5となっている。 Then, the wiring 3 of the substrate 4 that tip extending the through-hole 2, the extending portion is in the contact conductor plate 5.

【0014】このため、電子部品の端子1をスルーホール2内に挿入すると、接触用導体板5が端子1に押圧されてスルーホール2内に押し込まれ、接触用導体板5の構成材料の弾性力により端子1と配線3とが確実に接触する。 [0014] Therefore, when inserting the terminal 1 of the electronic component in the through holes 2, is pushed into the through-hole 2 contact conductor plate 5 is pressed to the terminal 1, the elasticity of the material of the contact conductor plate 5 and the terminal 1 and the wiring 3 to reliably contacted by the force. これにより、電子部品が基板4に搭載されると共に、その配線3と電気的に接続される。 Thus, the electronic components are mounted on the substrate 4, is the wire 3 and the electrical connection.

【0015】次に、この基板の製造方法について説明する。 [0015] Next, a method for manufacturing this substrate. 図2(a)〜(f)はこの製造方法を工程順に示す断面図である。 Figure 2 (a) ~ (f) are sectional views showing a manufacturing method in process order. 図2(a)に示す基板4に、先ず、図2 The substrate 4 shown in FIG. 2 (a), first, FIG. 2
(b)に示すように、電子部品の端子1を挿入するためのスルーホール2を穿設し、図2(c)に示すように、 (B), the drilled through holes 2 for inserting the terminal 1 of the electronic component, as shown in FIG. 2 (c),
有機溶剤に溶ける埋込材料6によりスルーホール2を埋め込む。 Embedding through hole 2 by embedding material 6 soluble in organic solvents.

【0016】その後、図2(d)に示すように、通常の基板作成工程と同様にして、配線材料となる銅板を全面に被着し、図2(e)に示すように、ホトリソ技術を用いて配線3をパターン形成する。 [0016] Thereafter, as shown in FIG. 2 (d), similarly to the normal of the substrate forming step, deposited a copper plate serving as a wiring material on the entire surface, as shown in FIG. 2 (e), a photolithography technique wiring 3 patterned using. この際、スルーホール部2に接触用導体板5となる部分を配線3と共に形成する。 In this case, to form a portion to be a contact conductor plate 5 to the through hole 2 with the wiring 3. その後、図2(f)に示すように、埋込材料6を有機溶剤により溶かすことにより、スルーホール2と、このスルーホール2内に延出する接触用導体板5が形成される。 Thereafter, as shown in FIG. 2 (f), by dissolving the embedding material 6 with an organic solvent, and the through-hole 2, the contact conductor plate 5 which extends the through-hole 2 is formed.

【0017】本実施例によれば、ソケットを使用せず、 [0017] According to this embodiment, without the use of a socket,
また半田付工程を行わなくても、電子部品の端子1と基板4上の配線3とを電気的に接続することができる。 Moreover even without soldering process, it is possible to electrically connect the terminal 1 and the wiring 3 on the substrate 4 of the electronic component. また、接触用導体板5を基板配線3の形成と同時に形成できるため、その製造も容易であるいう利点がある。 Further, since the contact conductor plate 5 can be formed simultaneously with the formation of the substrate wirings 3, there is an advantage that the manufacturing is easy.

【0018】図3は本発明の第2の実施例の電子部品搭載用基板におけるスルーホール2部分の外観図である。 [0018] FIG. 3 is an external view of the through hole 2 parts in the electronic component mounting board of a second embodiment of the present invention.
本実施例では多層基板4において、複数の層に接触用導体板5を設けてある。 In the present embodiment in a multilayer board 4 is provided with a contact conductor plate 5 into a plurality of layers. そして、各層の接触用導体板5及び配線は、多層間の配線接続用スルーホール7により電気的に接続されている。 Then, the contact conductor plate 5 and the wiring layers are electrically connected by wire connection through holes 7 between the layers.

【0019】また、導体板5は各層でその向きを変えて形成してある。 [0019] The conductive plate 5 is formed by changing its direction in each layer. これより、電子部品の端子との接触が更に一層確実になる。 Than this, further made more reliable contact with the terminal of the electronic component.

【0020】 [0020]

【発明の効果】以上説明したように本発明によれば、電子部品搭載用基板のスルーホールに接触用導体部材を設けたので、電子部品を基板に直接半田付けしたり、ソケットを基板に半田付けしたりすることなしに基板上の配線と電子部品の端子とを電気的に接続することができる。 According to the present invention described above, according to the present invention, since there is provided the electronic component mounting contact conductor member in the through hole of the substrate, or directly soldered electronic components on a substrate, solder socket substrate with or on the substrate without wiring and the terminal of the electronic component can be electrically connected to. このため、電子部品の実装が容易であると共に、電子部品を別の基板に実装し直す等の場合のように電子部品の取り出しが容易である。 Therefore, the it is easy to mount the electronic component, it is easy removal of the electronic component as in the case of a re-mounting the electronic component on another substrate.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の第1の実施例に係る電子部品搭載用基板を示す外観図である。 1 is an external view showing an electronic component mounting board according to a first embodiment of the present invention.

【図2】図1に示した基板の製造方法を工程順に示す断面図である。 2 is a cross-sectional view sequentially showing the steps of producing the substrate shown in FIG.

【図3】本発明の第2の実施例に係る電子部品搭載用基板を示す外観図である。 3 is an external view showing an electronic component mounting board according to a second embodiment of the present invention.

【図4】(a)乃至(c)は従来の電子部品搭載用基板を示す断面図である。 4 (a) to (c) is a sectional view showing a conventional electronic component mounting board.

【符号の説明】 DESCRIPTION OF SYMBOLS

1;電子部品の端子 2;基板のスルーホール 3;基板上の配線 4;基板 5;接触用導体板 6;スルーホール埋込材料 7;多層基板配線接続用スルーホール 8;電子部品 9;半田 10;ソケット 11;丸ピンソケット 1; electronic component terminal 2; substrate through-hole 3 of; substrate 5; contacting conductor plates 6; Through Hole embedding material 7; Through Hole 8 multi-layer substrate wiring connection; electronic component 9; wiring 4 on the substrate solder 10; socket 11; round pin socket

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 電子部品が搭載され、基板配線により電子部品の端子が電気的に接続される電子部品搭載用基板において、電子部品端子挿入用スルーホール部に延出した形状をなし、前記基板配線に接続された電子部品端子接触用の導体部材を有することを特徴とする電子部品搭載用基板。 1. A electronic component is mounted, the electronic component mounting board terminal of the electronic component are electrically connected to the substrate wiring, without the extending therefrom shape to the electronic component terminal inserting through hole, said substrate electronic component carrier and having a conductive member for connection to contact an electronic component terminals on the wiring.
JP4231661A 1992-08-31 1992-08-31 Board for mounting electronic part thereon Pending JPH0685425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4231661A JPH0685425A (en) 1992-08-31 1992-08-31 Board for mounting electronic part thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4231661A JPH0685425A (en) 1992-08-31 1992-08-31 Board for mounting electronic part thereon

Publications (1)

Publication Number Publication Date
JPH0685425A true JPH0685425A (en) 1994-03-25

Family

ID=16927004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4231661A Pending JPH0685425A (en) 1992-08-31 1992-08-31 Board for mounting electronic part thereon

Country Status (1)

Country Link
JP (1) JPH0685425A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5812378A (en) * 1994-06-07 1998-09-22 Tessera, Inc. Microelectronic connector for engaging bump leads
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
EP0764352A4 (en) * 1994-06-07 2000-03-15 Tessera Inc Microelectronic contacts and assemblies
US6205660B1 (en) 1994-06-07 2001-03-27 Tessera, Inc. Method of making an electronic contact
JP2003009457A (en) * 2001-06-18 2003-01-10 Nidec Copal Corp Axial flow fan motor
JP2009252901A (en) * 2008-04-03 2009-10-29 Toyota Motor Corp Electric connection structure
JP2014220428A (en) * 2013-05-09 2014-11-20 株式会社デンソー Multilayer wiring board and manufacturing method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148586A (en) * 1988-11-28 1990-06-07 Fujitsu Ltd Lsi socket

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148586A (en) * 1988-11-28 1990-06-07 Fujitsu Ltd Lsi socket

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5812378A (en) * 1994-06-07 1998-09-22 Tessera, Inc. Microelectronic connector for engaging bump leads
EP0764352A4 (en) * 1994-06-07 2000-03-15 Tessera Inc Microelectronic contacts and assemblies
US6205660B1 (en) 1994-06-07 2001-03-27 Tessera, Inc. Method of making an electronic contact
US6938338B2 (en) 1994-06-07 2005-09-06 Tessera, Inc. Method of making an electronic contact
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US6229100B1 (en) 1996-11-27 2001-05-08 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
JP2003009457A (en) * 2001-06-18 2003-01-10 Nidec Copal Corp Axial flow fan motor
JP2009252901A (en) * 2008-04-03 2009-10-29 Toyota Motor Corp Electric connection structure
JP2014220428A (en) * 2013-05-09 2014-11-20 株式会社デンソー Multilayer wiring board and manufacturing method therefor

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