JPH055655Y2 - - Google Patents
Info
- Publication number
- JPH055655Y2 JPH055655Y2 JP1988066702U JP6670288U JPH055655Y2 JP H055655 Y2 JPH055655 Y2 JP H055655Y2 JP 1988066702 U JP1988066702 U JP 1988066702U JP 6670288 U JP6670288 U JP 6670288U JP H055655 Y2 JPH055655 Y2 JP H055655Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- terminal
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 230000037431 insertion Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、印刷基板と端子とを組付け接続する
印刷基板の端子構造の改良に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement in the terminal structure of a printed circuit board for assembling and connecting a printed circuit board and a terminal.
従来、この種の端子構成は、例えば、実開昭61
−197661号公報に係る技術などがある。これは、
第４図で示すように、印刷基板１０１上に配設し
た所望の導電パターンから成る導電回路の導電端
１０２位置において、該印刷基板１０１に穴１０
３を形成し、該印刷基板１０１を挟持する略コ字
状の端子１０４の一端に形成した突部１０５を、
該穴１０３と係合させて位置決めをした後に、該
導電端１０２と半田付け固着する構成である。
Conventionally, this type of terminal configuration was used, for example, in
-There is a technology related to Publication No. 197661, etc. this is,
As shown in FIG. 4, a hole 10 is formed in the printed circuit board 101 at a position of a conductive end 102 of a conductive circuit consisting of a desired conductive pattern disposed on the printed circuit board 101.
3 and a protrusion 105 formed at one end of a substantially U-shaped terminal 104 that sandwiches the printed circuit board 101.
After being engaged with the hole 103 and positioned, it is fixed to the conductive end 102 by soldering.
上記従来の技術にあつては、印刷基板と導電回
路の導電端との固着力は非常に弱いものであり、
端子に外力が加わつた場合に、その端子と共に該
導電回路や導電端が印刷基板から剥離するという
問題があつた。
In the above conventional technology, the adhesion between the printed circuit board and the conductive end of the conductive circuit is very weak.
There has been a problem in that when an external force is applied to the terminal, the conductive circuit and the conductive end together with the terminal peel off from the printed circuit board.
本考案は、上記問題点を解消するために考案し
たものであり、印刷基板上に導電回路を配設し、
上記導電回路位置において上記印刷基板に貫通穴
を形成し、上記印刷基板を挟持する略コ字状の端
子の挟持部に設けた突部と穴とをそれぞれ上記貫
通穴に臨ませ、上記貫通穴を介して半田層により
上記端子を印刷基板に固着して印刷基板の端子構
造を構成し、上記問題点を解決しようとするもの
である。
The present invention has been devised to solve the above problems, and provides a conductive circuit on a printed circuit board,
The above problem is solved by forming a through hole in the printed board at the conductive circuit position, making a protrusion and a hole provided in the clamping portion of a roughly U-shaped terminal that clamps the printed board face the through hole, and fixing the terminal to the printed board with a solder layer via the through hole to form a terminal structure for the printed board.
上記した構成によれば、印刷基板に形成した貫
通穴を介して、半田層により印刷基板に端子を固
着したので、該端子は該印刷基板と一体的に固着
される。従つて、端子に外力が加わつても、導電
回路が印刷基板から剥離することがなく、端子部
分の信頼性及び品質が向上する。
According to the above configuration, the terminal is fixed to the printed circuit board with the solder layer through the through hole formed in the printed circuit board, so that the terminal is fixed integrally with the printed circuit board. Therefore, even if an external force is applied to the terminal, the conductive circuit will not peel off from the printed circuit board, improving the reliability and quality of the terminal portion.
本考案に係る好適な一実施例を、添付図面に基
づき詳述する。
A preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
１は印刷基板であり、セラミツク、フエノール
樹脂やガラスエポキシ樹脂等で構成する。 1 is a printed circuit board, which is made of ceramic, phenol resin, glass epoxy resin, or the like.
２は印刷基板１上に配設した複数の導電回路で
あり、銅箔等により所望の導電パターンで形成し
ている。２ａは各導電回路２の導電端である。印
刷基板１における各導電端２ａの中央位置に、貫
通穴１ａを形成している。 Reference numeral 2 denotes a plurality of conductive circuits disposed on the printed circuit board 1, which are formed of copper foil or the like in a desired conductive pattern. 2a is a conductive end of each conductive circuit 2. A through hole 1a is formed at the center of each conductive end 2a of the printed circuit board 1.
３は端子であり、導電性板材で形成している。
端子３は印刷基板１を挟持するために略コ字状に
形成し、その差込み端部３ａと差込み折曲部３ｂ
を該印刷基板１の板厚方向に若干付勢している。
尚、差込み折曲部３ｂは必要に応じて、外方に折
曲形成することにより、コネクタ（図示せず）側
に延出している。差込み端部３ａと差込み折曲部
３ｂは貫通穴１ａに臨ませるべく延設している。
差込み端部３ａには、貫通穴１ａの下方開口部と
係合する突部３ｃを打出し形成している。差込み
折曲部３ｂには、貫通穴１ａの上方開口部に臨む
穴３ｄを形成している。 3 is a terminal, which is made of a conductive plate material.
The terminal 3 is formed into a substantially U-shape in order to sandwich the printed circuit board 1, and has an insertion end 3a and an insertion bent portion 3b.
is slightly biased in the thickness direction of the printed circuit board 1.
Incidentally, the insertion bending portion 3b may be bent outward as necessary to extend toward the connector (not shown). The insertion end portion 3a and the insertion bent portion 3b extend to face the through hole 1a.
The insertion end 3a is stamped with a protrusion 3c that engages with the lower opening of the through hole 1a. A hole 3d facing the upper opening of the through hole 1a is formed in the insertion bent portion 3b.
かかる構成の印刷基板の端子構造は、第１図で
示すように組み付けられる。 The terminal structure of the printed circuit board having such a configuration is assembled as shown in FIG.
即ち、端子３を印刷基板１の側端部から挿入
し、該印刷基板１を挟持させると共に、突部３ｃ
を貫通穴１ａに係合させ、且つ、穴３ｄを該貫通
穴１ａに臨ませる。 That is, the terminal 3 is inserted from the side end of the printed circuit board 1, and the printed circuit board 1 is held between the terminals 3 and the protrusion 3c.
is engaged with the through hole 1a, and the hole 3d is made to face the through hole 1a.
その後、差込み折曲部３ｂや穴３ｄから半田を
流すことにより、貫通穴１ａを介して半田層４に
よつて差込み端部３ａ、差込み折曲部３ｂ間を固
着する。 Thereafter, by flowing solder from the insertion bent portion 3b and the hole 3d, the insertion end portion 3a and the insertion bent portion 3b are fixed by the solder layer 4 through the through hole 1a.
尚、上記実施例において、穴３ｄは半田を流せ
るものであればよく、例えば、切欠き溝に形成し
てもよい。 In the above embodiment, the hole 3d may be any hole that allows solder to flow therein, and may be formed as a cutout groove, for example.
以上詳述したように本考案によれば、端子が印
刷基板と一体的に固着されるので、該端子に外力
が加わつても、導電回路と印刷基板とが剥離する
ことがなく、端子部分の品質及び信頼が向上す
る。しかも、印刷基板を挟持する略コ字状の端子
の挟持部に設けた突部と穴とをそれぞれ上記印刷
基板の貫通穴に臨ませ、上記貫通穴を介して半田
層により上記端子を印刷基板に固着した構成を備
えるので、貫通穴の一方の開口部を上記突部を設
けた側で閉鎖することができ、上記穴を設けた側
から貫通穴に流し込んだ半田の流失を防止するこ
とができる。そのため、充分な量の半田によつて
上記半田層を形成することができ、印刷基板に対
する端子の強固な固着力を確保することができ
る。
As detailed above, according to the present invention, the terminal is fixed integrally with the printed circuit board, so even if an external force is applied to the terminal, the conductive circuit and the printed circuit board will not separate, and the terminal portion will not peel off. Quality and trust will improve. Moreover, the protrusions and holes provided on the holding part of the substantially U-shaped terminal that holds the printed circuit board are respectively faced to the through holes of the printed circuit board, and the terminals are connected to the printed circuit board using a solder layer through the through holes. Since the solder is fixed to the through hole, one opening of the through hole can be closed on the side where the protrusion is provided, and solder poured into the through hole from the side where the hole is provided can be prevented from flowing away. can. Therefore, the solder layer can be formed with a sufficient amount of solder, and strong adhesion of the terminal to the printed circuit board can be ensured.
また、上記半田層の半田が単なる平面よりも表
面積の広い上記突部に接着するので、印刷基板に
対する端子の強固な固着力をよりいつそう期待す
ることができるといつた優れた効果を奏する。 Further, since the solder of the solder layer adheres to the protrusions having a larger surface area than a mere flat surface, an excellent effect is achieved in that the terminal can be expected to have a strong adhesion force to the printed circuit board more easily.
第１図ないし第３図は本考案に係る印刷基板の
端子構造の一実施例を示し、第１図は垂直断面組
立図、第２図は第１図における端子回りの分解斜
視図、第３図は第１図における端子の断面図であ
る。第４図は印刷基板の端子構造の従来例を示す
垂直断面組立図である。
１……印刷基板、１ａ……貫通穴、２……導電
回路、２ａ……導電端、３……端子、３ａ……差
込み端部、３ｂ……差込み折曲部、４……半田
層。
1 to 3 show an embodiment of the terminal structure of a printed circuit board according to the present invention, in which FIG. 1 is a vertical sectional assembly view, FIG. 2 is an exploded perspective view of the terminal area in FIG. 1, and FIG. The figure is a sectional view of the terminal in FIG. 1. FIG. 4 is a vertical cross-sectional assembly diagram showing a conventional example of the terminal structure of a printed circuit board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 1a... Through hole, 2... Conductive circuit, 2a... Conductive end, 3... Terminal, 3a... Plug-in end, 3b... Plug-in bent part, 4... Solder layer.
Claims (1)
の位置において上記印刷基板に貫通穴を形成し、
上記印刷基板を挟持する略コ字状の端子の挟持部
に設けた突部と穴とをそれぞれ上記貫通穴に臨ま
せ、上記貫通穴を介して半田層により上記端子を
印刷基板に固着したことを特徴とする印刷基板の
端子構造。 disposing a conductive circuit on a printed circuit board, forming a through hole in the printed circuit board at the position of the conductive circuit;
A protrusion and a hole provided on a holding part of a substantially U-shaped terminal that holds the printed circuit board are respectively faced to the through hole, and the terminal is fixed to the printed circuit board by a solder layer through the through hole. A printed circuit board terminal structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066702U JPH055655Y2 (en) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988066702U JPH055655Y2 (en) | 1988-05-20 | 1988-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170961U JPH01170961U (en) | 1989-12-04 |
| JPH055655Y2 true JPH055655Y2 (en) | 1993-02-15 |
Family
ID=31292098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988066702U Expired - Lifetime JPH055655Y2 (en) | 1988-05-20 | 1988-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH055655Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007060445A (en) * | 2005-08-26 | 2007-03-08 | Hosiden Corp | Electroacoustic transducer and method and structure for attaching terminal thereof |
| JP5711542B2 (en) * | 2011-01-13 | 2015-05-07 | 矢崎総業株式会社 | Board connection terminal and circuit board holding structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170961A (en) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | Optical printer |
-
1988
- 1988-05-20 JP JP1988066702U patent/JPH055655Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170961A (en) * | 1987-12-25 | 1989-07-06 | Matsushita Graphic Commun Syst Inc | Optical printer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01170961U (en) | 1989-12-04 |
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