JPH0414909Y2 - - Google Patents
Info
- Publication number
- JPH0414909Y2 JPH0414909Y2 JP1984165845U JP16584584U JPH0414909Y2 JP H0414909 Y2 JPH0414909 Y2 JP H0414909Y2 JP 1984165845 U JP1984165845 U JP 1984165845U JP 16584584 U JP16584584 U JP 16584584U JP H0414909 Y2 JPH0414909 Y2 JP H0414909Y2
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- feedthrough capacitor
- printed circuit
- circuit board
- feedthrough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 44
- 239000002184 metal Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 14
- 238000005192 partition Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は各種電子機器に組み込まれてノイズを
除去するのに使用される貫通コンデンサの取付構
造に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a mounting structure for a feedthrough capacitor that is incorporated into various electronic devices and used to remove noise.
（従来技術）
従来貫通コンデンサを電子機器に組み込む場
合、たとえば第４図ａに示すように、導電性の金
属板からなるシヤーシ１の側壁１ａに形成された
孔１ｂに貫通コンデンサ２を嵌入し、この貫通コ
ンデンサ２のアース電極２ａを上記シヤーシ１の
側壁１ａに半田付けする一方、貫通コンデンサ２
の貫通端子２ｂを折曲して他の電子部品３が実装
されたプリント回路基板４のパターン孔４ａに挿
通した後、プリント回路基板４をシヤーシ１に固
定し、貫通端子２ｂと回路基板４のパターン４ｂ
とを半田付けするようにしていた。(Prior Art) When incorporating a conventional feedthrough capacitor into an electronic device, for example, as shown in FIG. While the ground electrode 2a of the feedthrough capacitor 2 is soldered to the side wall 1a of the chassis 1, the feedthrough capacitor 2
After bending the through terminals 2b and inserting them into the pattern holes 4a of the printed circuit board 4 on which other electronic components 3 are mounted, the printed circuit board 4 is fixed to the chassis 1, and the through terminals 2b and the circuit board 4 are bent. pattern 4b
I was trying to solder them together.
また、薄形の電子機器では、第４図ｂに示すよ
うに、シヤーシ１の側壁１ａに形成された孔１ｂ
に貫通コンデンサ２を嵌入し、この貫通コンデン
サ２のアース電極２ａを上記シヤーシ１の側壁１
ａに半田付けし、プリント回路基板４をシヤーシ
１に取り付けた後、貫通コンデンサ２の貫通端子
２ｂを折曲することなく、プリント回路基板４の
パターン４ｂに直接、半田付けすることも行なわ
れている。 In addition, in a thin electronic device, as shown in FIG. 4b, a hole 1b formed in the side wall 1a of the chassis 1 is
The feedthrough capacitor 2 is fitted into the feedthrough capacitor 2, and the ground electrode 2a of the feedthrough capacitor 2 is connected to the side wall 1 of the chassis 1.
After soldering to the pattern 4b of the printed circuit board 4 and attaching the printed circuit board 4 to the chassis 1, the through terminal 2b of the feedthrough capacitor 2 is soldered directly to the pattern 4b of the printed circuit board 4 without bending it. There is.
さらに、第４図ｃに示すように、貫通コンデン
サ２をシヤーシ１の中仕切板１ｃの孔１ｂに嵌入
して貫通コンデンサ２のアース電極２ａを中仕切
板１ｃに半田付けするとともに、貫通端子２ｂの
両端部を折曲し、第４図ａと同様に、シヤーシ１
の中仕切板１ｃの両側に取り付けられたプリント
回路基板４，４′のパターン４ｂ，４b′に貫通端
子２ｂの両端部を夫々半田付けすることも行なわ
れている。 Furthermore, as shown in FIG. 4c, the feedthrough capacitor 2 is fitted into the hole 1b of the partition plate 1c of the chassis 1, the ground electrode 2a of the feedthrough capacitor 2 is soldered to the partition plate 1c, and the feedthrough terminal 2b is soldered to the partition plate 1c. Bend both ends of the chassis 1 as shown in Figure 4a.
Also, both ends of the through terminals 2b are soldered to patterns 4b, 4b' of printed circuit boards 4, 4' attached to both sides of the partition plate 1c.
ところで、上記のような貫通コンデンサ２の取
付構造では、貫通コンデンサ２のシヤーシ１への
取付、プリント回路基板４もしくは４′のシヤー
シ１への取付およびプリント回路基板４，４′の
パターン４ｂ，４b′への貫通端子２ｂの半田付け
は夫々別個の工程で行う必要があり、貫通コンデ
ンサ２の取付が非常に面倒であつた。 By the way, in the mounting structure of the feedthrough capacitor 2 as described above, the mounting of the feedthrough capacitor 2 to the chassis 1, the mounting of the printed circuit board 4 or 4' to the chassis 1, and the patterns 4b, 4b of the printed circuit boards 4 and 4' are performed. It was necessary to solder the feedthrough terminals 2b to the holes in separate steps, making the installation of the feedthrough capacitor 2 extremely troublesome.
（考案の目的）
本考案は従来の貫通コンデンサの取付構造にお
ける上記問題点に鑑みてなされたものであつて、
シヤーシとプリント回路基板との間に形成された
凹部内に貫通コンデンサの外周部に設けられた鍔
状の段部をシヤーシとプリント回路基板との間に
挾持することにより、貫通コンデンサとその貫通
端子の半田付けを同時に行い、半田付工数の低減
と半田付けの信頼性の向上を図つた貫通コンデン
サの取付構造を提供することを目的としている。(Purpose of the invention) The present invention was made in view of the above-mentioned problems in the conventional mounting structure of feedthrough capacitors.
By sandwiching the flange-shaped step provided on the outer periphery of the feed-through capacitor between the chassis and the printed circuit board within the recess formed between the chassis and the printed circuit board, the feed-through capacitor and its feed-through terminal The object of the present invention is to provide a mounting structure for a feedthrough capacitor in which soldering is performed at the same time, reducing the number of soldering steps and improving soldering reliability.
（実施例）
以下、添付図面を参照して本考案の実施例を説
明する。(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
第１図ａおよび第１図ｂにおいて、金属製のシ
ヤーシ１１の側壁１１ａには円形の孔１１ｂが形
成され、この孔１１ｂには段部１２ａを有する段
付きの貫通コンデンサ１２が嵌入され、その段部
１２ａの側面１２ｂがシヤーシ１１の側壁１１ａ
に当接している。 1a and 1b, a circular hole 11b is formed in a side wall 11a of a metal chassis 11, and a stepped feedthrough capacitor 12 having a stepped portion 12a is fitted into this hole 11b. The side surface 12b of the stepped portion 12a is the side wall 11a of the chassis 11.
is in contact with.
一方、コイルやチツプコンデンサ等の電子部品
１３が実装され、シヤーシ１１内に固定されるプ
リント回路基板１４には、上記貫通コンデンサ１
２の段部１２ａに対向する位置に、ほゞ台形状に
切り欠かれた凹部１５を備えている。この台形状
の凹部１５はその斜辺部１５ａ，１５ａが貫通コ
ンデンサ１２の段部１２ａの側面１２ｂに対向す
るいま一つの側面１２ｃの周縁部に当接してい
る。 On the other hand, a printed circuit board 14 is mounted with electronic components 13 such as coils and chip capacitors, and is fixed in the chassis 11.
A recess 15 cut into a substantially trapezoidal shape is provided at a position facing the second step 12a. The oblique sides 15a, 15a of this trapezoidal recess 15 are in contact with the peripheral edge of another side surface 12c opposite to the side surface 12b of the stepped portion 12a of the feedthrough capacitor 12.
すなわち、貫通コンデンサ１２の段部１２ａ
は、シヤーシ１１の側壁１１ａとプリント回路基
板１４の凹部１５の上記斜辺部１５ａ，１５ａと
の間に挾持されている。 That is, the step portion 12a of the feedthrough capacitor 12
is held between the side wall 11a of the chassis 11 and the oblique side portions 15a, 15a of the recess 15 of the printed circuit board 14.
貫通コンデンサ１２は、そのアース電極１２ｄ
がシヤーシ１１の側壁１１ａに半田付けされ、貫
通端子１２ｅはプリント回路基板１４のパターン
１４ａに半田付けされている。 The feedthrough capacitor 12 has its ground electrode 12d
is soldered to the side wall 11a of the chassis 11, and the through terminal 12e is soldered to the pattern 14a of the printed circuit board 14.
この半田付けは、上記のように、シヤーシ１１
の側壁１１ａとプリント回路基板１４の凹部１５
の斜辺部１５ａ，１５ａとの間に貫通コンデンサ
１２の段部１２ａを挾持した状態で、全体を半田
浸漬することにより一度に行なわれる。また、こ
の、この半田浸漬により、プリント回路基板１４
に接着剤等により仮付けされていた電子部品１３
のパターン１４ａへの半田も同時に行なわれる。 This soldering is done on the chassis 11 as described above.
side wall 11a and recess 15 of printed circuit board 14
This is done at once by immersing the entire body in solder while holding the stepped portion 12a of the feedthrough capacitor 12 between the hypotenuse portions 15a, 15a of the capacitor 12. Also, by this solder dipping, the printed circuit board 14
Electronic components 13 that had been temporarily attached with adhesive etc.
Soldering to pattern 14a is also performed at the same time.
このようにすれば、貫通コンデンサ１２のアー
ス電極１２ｄとシヤーシ１１の側壁１１ａとの半
田付け、貫通端子１２ｅとプリント回路基板１４
のパターン１４ａとの半田付け、およびプリント
回路基板１４に実装される電子部品１３の半田付
けを同時に行うことができる。また、貫通コンデ
ンサ１２はその周囲にシヤーシ１１の側壁１１ａ
およびプリント回路基板１４が存在するため熱容
量が大きくなる。このため、半田付け時に貫通コ
ンデンサ１２に加わる熱衝撃も小さく、半田付け
時に貫通コンデンサ１２にクラツク等が発生する
のを防止することができる。 By doing this, soldering between the ground electrode 12d of the feedthrough capacitor 12 and the side wall 11a of the chassis 11, and the soldering between the feedthrough terminal 12e and the printed circuit board 14 is possible.
The soldering with the pattern 14a and the soldering of the electronic component 13 mounted on the printed circuit board 14 can be performed simultaneously. Further, the feedthrough capacitor 12 is surrounded by a side wall 11a of the chassis 11.
Also, the presence of the printed circuit board 14 increases the heat capacity. Therefore, the thermal shock applied to the feedthrough capacitor 12 during soldering is small, and it is possible to prevent cracks from occurring in the feedthrough capacitor 12 during soldering.
上記実施例において、プリント回路基板１４に
設けられた凹部１５は、第２図ａに示すような三
角形状のもの、あるいは第２図ｂに示すような円
弧状のもの、あるいは単に断面がコ字形のもの
（図示せず。）であつてもよい。また、第２図ｃに
示すように、貫通コンデンサ１２の段部１２ａを
プリント回路基板１４との間で挾持する凹部１５
は、押出加工により、シヤーシ１１の側壁１１ａ
に形成するようにしてもよい。 In the above embodiment, the recess 15 provided in the printed circuit board 14 has a triangular shape as shown in FIG. 2a, an arc shape as shown in FIG. 2b, or a U-shaped cross section. (not shown). Further, as shown in FIG.
The side wall 11a of the chassis 11 is formed by extrusion processing.
It may be formed as follows.
一方、第３図に示すように、シヤーシ１１の中
仕切板１１ｃに貫通コンデンサ１２を取り付ける
場合も、電子部品１３を取り付けたプリント回路
基板１４および１４′を夫々切り欠いて第１図ａ、
第２図ａ、第２図ｂもしくは第２図ｃと同様の凹
部１５および１５′を形成し、これら凹部１５お
よび１５′と上記中仕切板１１ｃとの間で貫通コ
ンデンサ１２を挾持し、半田浸漬の手法を利用し
て貫通コンデンサ１２のアース電極１ｄお中仕切
板１１ｃに、また、貫通端子１２ｅをプリント回
路基板１４のパターン１４ａおよびプリント回路
基板１４′のパターン１４′ａに夫々半田付けする
ことができる。 On the other hand, as shown in FIG. 3, when attaching the feedthrough capacitor 12 to the partition plate 11c of the chassis 11, the printed circuit boards 14 and 14' on which the electronic components 13 are attached are cut out, respectively.
Recesses 15 and 15' similar to those in FIG. 2a, FIG. 2b, or FIG. Solder the through terminals 12e to the ground electrode 1d of the feedthrough capacitor 12 and the partition plate 11c using the dipping method, and to the pattern 14a of the printed circuit board 14 and the pattern 14'a of the printed circuit board 14', respectively. be able to.
なお、本考案は、段付の貫通コンデンサ１２に
限定されるものではなく、平板状の誘電体の両主
面に夫々アース電極および貫通端子に導通する電
極を形成した構成を有する貫通コンデンサの取付
にも適用することができる。 Note that the present invention is not limited to the stepped feedthrough capacitor 12, but is also applicable to the installation of a feedthrough capacitor having a configuration in which a ground electrode and an electrode connected to a feedthrough terminal are formed on both main surfaces of a flat dielectric material, respectively. It can also be applied to
（考案の効果）
以上、詳述したことからも明らかなように、本
考案は、プリント回路基板シヤーシとの間に貫通
コンデンサの段部を挾持して半田付けするように
したので、貫通コンデンサの半田付けをプリント
回路基板への電子部品の半田付けと同時に行うこ
とができ、貫通コンデンサの取付を非常に簡単化
することができる。(Effects of the invention) As is clear from the detailed description above, in the present invention, the step part of the feedthrough capacitor is sandwiched and soldered between the printed circuit board chassis, so the feedthrough capacitor Soldering can be performed at the same time as soldering the electronic components to the printed circuit board, greatly simplifying the installation of the feedthrough capacitor.
第１図ａは本考案に係る貫通コンデンサの取付
構造の一実施例の要部を示す平面図、第１図ｂは
第１図ａの−線断面図、第２図ａ、第２図ｂ
および第２図ｃは夫々凹部の変形例の説明図、第
３図は中仕切板に貫通コンデンサを取り付けた実
施例の説明図、第４図ａ，第４図ｂおよび第４図
ｃは夫々従来の貫通コンデンサの取付構造を示す
説明図である。
１１……シヤーシ、１１ａ……側壁、１１ｂ…
…孔、１１ｃ……中仕切板、１２……貫通コンデ
ンサ、１３……電子部品、１４，１４′……プリ
ント回路基板、１５，１５′……凹部。
Fig. 1a is a plan view showing the main parts of an embodiment of the mounting structure for a feedthrough capacitor according to the present invention, Fig. 1b is a sectional view taken along the - line of Fig. 1a, Fig. 2a, Fig. 2b
2c is an explanatory diagram of a modified example of the recess, FIG. 3 is an explanatory diagram of an embodiment in which a feedthrough capacitor is attached to the partition plate, and FIGS. 4a, 4b, and 4c are respectively FIG. 2 is an explanatory diagram showing the mounting structure of a conventional feedthrough capacitor. 11... Chassis, 11a... Side wall, 11b...
... hole, 11c ... partition plate, 12 ... feedthrough capacitor, 13 ... electronic component, 14, 14' ... printed circuit board, 15, 15' ... recess.
Claims (1)
金属製のシヤーシに形成された孔に嵌合させて貫
通コンデンサのアース電極及び貫通端子を夫々上
記シヤーシおよびこのシヤーシに取着されたプリ
ント回路基板のパターンに導通させて貫通コンデ
ンサをシヤーシに取り付ける貫通コンデンサの取
付構造において、 シヤーシとこのシヤーシの上記孔に近接するプ
リント回路基板の周縁との間に凹部が形成され、
貫通コンデンサの上記段部がこの凹部内にてシヤ
ーシとプリント回路基板との間に挾持されている
ことを特徴とする貫通コンデンサの取付構造。[Claims for Utility Model Registration] A feedthrough capacitor having a flange-like step on its outer periphery is fitted into a hole formed in a metal chassis, and the ground electrode and feedthrough terminal of the feedthrough capacitor are connected to the chassis and this chassis, respectively. In a mounting structure for a feedthrough capacitor that is attached to a chassis by conducting through a pattern of a printed circuit board attached to the chassis, a recess is formed between the chassis and the peripheral edge of the printed circuit board adjacent to the hole of the chassis. ,
A mounting structure for a feedthrough capacitor, characterized in that the stepped portion of the feedthrough capacitor is sandwiched between a chassis and a printed circuit board within the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984165845U JPH0414909Y2 (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984165845U JPH0414909Y2 (en) | 1984-10-31 | 1984-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6181127U JPS6181127U (en) | 1986-05-29 |
| JPH0414909Y2 true JPH0414909Y2 (en) | 1992-04-03 |
Family
ID=30723685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984165845U Expired JPH0414909Y2 (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414909Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6012269U (en) * | 1983-07-04 | 1985-01-28 | 日立造船株式会社 | Bipolar electrode for zinc halogen battery |
-
1984
- 1984-10-31 JP JP1984165845U patent/JPH0414909Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6012269U (en) * | 1983-07-04 | 1985-01-28 | 日立造船株式会社 | Bipolar electrode for zinc halogen battery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6181127U (en) | 1986-05-29 |
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