JPH05259683A - High frequency electronic apparatus - Google Patents

Abstract

PURPOSE:To eliminate soldering malfunction without dropping a partition plate of a shielding case from a printed board before soldering. CONSTITUTION:A cut and bent part 10b is formed at an inserting part 10a of a partition plate 10 of a shielding case to be inserfed into a slit 1c of a printed board 1. If the part 10b is bent before it is inserted, the part 10b is brought into contact with a rear surface of the board 1 after it is inserted to prevent it from dropping. Since an end of the part 10b is brought into contact with resist 1d of the board 1, soldering can effectively be conducted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency electronic device such as a tuner used in a television receiver or a video tape recorder.

[0002]

2. Description of the Related Art In recent years, a high frequency electronic device incorporating a printed circuit board on which a high frequency electronic circuit component is mounted is housed in a metal shield case or the like and hermetically sealed so that interference from an external electronic circuit or electrical connection to the outside is prevented. It is configured to prevent unintended interference. Also inside the shield case, so as not to give or receive electrical interference between one part or parts group and another part or parts group,
The inside of the shield case is partitioned by a shield case partition plate or the like to prevent electrical interference or interference inside the high-frequency electronic circuit.

FIG. 3 is a diagram showing an example of an assembly structure of a conventional high frequency electronic device. In this figure, it is assumed that chip components 1a and 1b are mounted on the printed circuit board 1.
A slit 1c is formed in the central portion of the printed board 1, and a copper foil resist 1d is formed on the back surface adjacent to the slit. The shield case partition plate 2 is a flat plate-shaped member, and projections are provided on both sides and upper and lower sides in the longitudinal direction thereof. The insertion portion 2a of the shield case partition plate 2 is inserted into the slit 1c. Then, solder the resist 1d on the back surface of the printed circuit board 1,
The partition plate 2 is in a grounded state. The soldering of the shield case partition plate 2 and the printed circuit board 1 plays an extremely important role in improving the performance of the high frequency electronic device. The printed circuit board 1 and the shield case partition plate 2 are surrounded by a U-shaped shield case side plate 3 and a flat plate-shaped shield case side plate 4, the upper surface of which is covered by a shield case upper lid 5 and the lower surface of which is covered by a shield case lower lid 6. And is fixed in the housing.

In this way, the shield case partition plate 2 in the housing can prevent electrical interference or interference between the chip component 1a and the chip component 2b. In this way, the printed circuit board 1 is shielded by the shield case side plates 3 and 4, the shield case upper lid 5 and the shield case lower lid 6 to form a high frequency electronic device.

[0005]

However, in such a conventional high-frequency electronic device, when the shield case partition plate 2 is inserted into the slit 1c and is poured into the dip bath for soldering, the shield case partition plate 2 and the slit 1c are formed.
Since, for example, a gap of about 0.15 to 0.25 mm occurs,
Solder accumulates in the resist 1d, and it is difficult to attach the solder to the shield case partition plate 2. Therefore, there is a drawback that it is difficult to solder between the resist 1d and the shield case partition plate 2, and a soldering failure easily occurs. In addition, after passing the shield case partition plate 2 through the slit 1c and before soldering, the shield case partition plate 2
There was also a drawback that it was easy to fall off.

The present invention has been made in order to solve the above-mentioned conventional problems, and makes it possible to reliably solder the shield case partition plate 2 and the resist together, and at the same time, from the slit before soldering. The purpose is to prevent it from coming off.

[0007]

According to the present invention, a high frequency electronic circuit component is mounted, a printed board having a slit and a ground portion at a position adjacent to the slit, and a printed board inserted through the slit of the printed board. A shield case partition plate made of metal having a bent part by punching at the insertion part to the board and a shield case holding the printed board and the partition plate inside, the shield case partition plate is bent after being inserted into the printed board. The end of the part is soldered to the ground plane of the printed circuit board.

[0008]

According to the present invention having such characteristics, the bent portion is once returned to its original position and inserted by penetrating the shield case partition plate having the punched portion into the slit of the printed circuit board. After insertion, the end of the bent portion comes into contact with the ground surface of the printed circuit board, and this portion is soldered to ground and fix the shield case partition plate.

[0009]

EXAMPLE An example of the present invention will be described. FIG. 1 is an assembly configuration diagram of a high frequency electronic device according to an embodiment of the present invention. In this figure, the same parts as those in the conventional example described above are designated by the same reference numerals, and detailed description thereof will be omitted. Also in this embodiment, the high frequency chip components 1a and 1b are provided on the upper surface of the printed circuit board 1.
Is mounted, and a slit 1c is provided at the center thereof. A resist 1d is formed on the back surface adjacent to the slit 1c.

In this embodiment, the shield case partition plate 10 inserted into the slit 1c has the same outer shape as that of the conventional example described above, and has a partition plate insertion portion 10a on the lower surface. Then, in order to form a U-shaped groove in the insertion portion of the shield case partition plate 10, a peripheral punching press process is performed to form the bent portion 10b. Here, when punching by press work, the periphery is inevitably punched, so it is called peripheral punching press work. The bent portion 10b is slightly bent beforehand on the side of the printed board 1 on which the resist 1d is formed. Other parts constituting the high-frequency electronic device are the same as in the conventional example.

Now, with the folded portion 10b of the shield case partition plate 10 slightly folded, the printed circuit board 1
Is inserted into the slit 1c from above. Then, when passing through the slit 1c, it naturally bends slightly to the original state and passes through the slit 1c, and after passing, the bent portion 10
b returns to the original state. Therefore, since the bent portion 10b serves as a return member, the shield case partition plate 10 will not come off after being inserted into the slit 1c. At this time, since the bent portion 10b is in contact with the resist 1d on the back surface of the printed circuit board 1, even if the solder is accumulated in the resist 1d, the tip of the bent portion 10b which is in contact with the resist easily adheres to the resist, resulting in poor soldering. Will not occur.
After fixing the shield case partition plate 10 to the printed circuit board in this way, the printed circuit board 1 is attached to the U-shaped first shield case side plate 3 and the flat plate-shaped second shield case side plate 4.
To form a frame. At this time, the shield case partition plate 10 is inserted into the slits of the shield case side plates 3 and 4.
Fix by inserting the protrusions on both ends of the.

The shield case upper lid 5 and the shield case lower lid 6 are covered and sealed from the upper and lower sides of the frame body thus constructed in the same manner as in the conventional high frequency electronic apparatus to form a high frequency electronic apparatus.

In this embodiment, the shield case partition plate 2 is used.
The shield case side plate 3 and the shield case side plate 3 are configured as separate members.
The present invention can also be applied to a case where and are formed as an integrated body by press working. Further, the shield case partition plate 2 and the shield case side plate 3 are formed as a continuous part by providing a connection portion with the shield case side plate 3 at one point, and the shield case partition plate and the shield case partition plate are formed inside by bending. The present invention can also be applied to the shield case.

Further, in this embodiment, the bending portion is formed in the U-shaped peripheral punching press work in the insertion portion 10a of the partition plate 10 in the shield case, but it is particularly limited to the U-shaped peripheral punching press work. There is no need to do so, and any shape may be used for punching.

[0015]

As described above in detail, in the high-frequency electronic device according to the present invention, since the bent portion by press punching is formed in the insertion portion of the shield case partition plate, the partition plate is formed by the bent portion after the slit is inserted. Never leave. Moreover, since the tip of the bent portion comes into contact with the ground plane on the back surface of the printed circuit board,
It is possible to obtain the effect that the solder is easily attached and the soldering failure does not occur.

[Brief description of drawings]

FIG. 1 is an assembly configuration diagram of a high frequency electronic device according to an embodiment of the present invention.

2A is a front view showing a state where a shield case partition plate of the high-frequency electronic device according to the present embodiment is inserted into a printed circuit board, FIG. 2B is a side view thereof, and FIG. 2C is a rear view thereof.

FIG. 3 is an assembly configuration diagram of a conventional high-frequency electronic device.

[Explanation of symbols]

 1 Printed Circuit Board 1a, 1b Chip Component 1c Slit 1d Resist 2,10 Shield Case Partition Plate 2a Slit Insertion Part 3 First Shield Case Side Plate 4 Second Shield Case Side Plate 5 Shield Case Upper Cover 6 Shield Case Lower Cover 10a Partition Plate Insert Part 10b Bent part

Claims (1)

[Claims] 1. A printed circuit board on which a high-frequency electronic circuit component is mounted and which has a slit and a ground portion at a position adjacent to the slit, and a printed circuit board which is inserted through the slit of the printed circuit board and inserted into the printed circuit board. A shield case partition plate made of metal having a bent portion by punching, and a shield case for holding the printed circuit board and the partition plate inside, the shield case partition plate is an end portion of the bent portion after being inserted into the printed circuit board. A high-frequency electronic device characterized in that is connected to the ground plane of a printed circuit board by soldering.