JPH05327272A - Electronic circuit apparatus - Google Patents
Electronic circuit apparatusInfo
- Publication number
- JPH05327272A JPH05327272A JP12848692A JP12848692A JPH05327272A JP H05327272 A JPH05327272 A JP H05327272A JP 12848692 A JP12848692 A JP 12848692A JP 12848692 A JP12848692 A JP 12848692A JP H05327272 A JPH05327272 A JP H05327272A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- hole
- circuit device
- electronic
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は各種電子機器に用いるこ
とができる電子回路装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device which can be used in various electronic devices.
【０００２】[0002]
【従来の技術】以下に従来の電子回路装置を、図面を参
照しながら説明する。2. Description of the Related Art A conventional electronic circuit device will be described below with reference to the drawings.
【０００３】図９，１０は従来の電子回路装置を示すも
のである。実装基板１の上面には各種の表面実装部品６
が組込まれている。電子部品４には予めシールドカバー
８が被せてあり、不要な電波の侵入と外飛びを防止して
いる。そして電子部品４からは実装用の端子ピン３がで
ており、実装基板１への実装は、端子ピン３を基板電極
２に半田付けすることにより行われている。9 and 10 show a conventional electronic circuit device. Various surface mount components 6 are mounted on the upper surface of the mounting board 1.
Is incorporated. The electronic component 4 is covered with a shield cover 8 in advance to prevent unwanted radio waves from entering and jumping out. The electronic component 4 has terminal pins 3 for mounting, and the mounting on the mounting board 1 is performed by soldering the terminal pins 3 to the board electrodes 2.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
従来の電子回路装置では端子ピン３が電子部品４本体か
らつき出しており、不要な電波の侵入と外飛びを起こし
てしまい、また電子回路装置の高さも抑えられず小型化
を図る上で大きな課題となっていた。However, in the above-mentioned conventional electronic circuit device, the terminal pin 3 sticks out from the main body of the electronic component 4, which causes unwanted intrusion of radio waves and jumping out, and also the electronic circuit device. It was a big issue in downsizing because the height of the can not be controlled.
【０００５】本発明は上記従来の課題を解決するもの
で、完全なシールドと小型化を実現し、広い分野で採用
を可能にする電子回路装置を提供することを目的とする
ものである。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic circuit device which realizes complete shield and miniaturization and can be adopted in a wide field.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
に本発明の電子回路装置は、実装する電子部品と同じ形
状の孔をもつ実装基板で、実装した際、電子部品の側面
のスルホール電極と対向する実装基板側面にスルホール
電極を設け、これら対向する電極の間に導電体あるいは
半田を挿入して接続するようにし、シールドカバーを被
せた構成とするものである。In order to solve the above-mentioned problems, an electronic circuit device of the present invention is a through-hole electrode on a side surface of an electronic component when the electronic circuit device is mounted on a mounting board having holes of the same shape as the electronic component to be mounted. A through-hole electrode is provided on the side surface of the mounting substrate facing to, and a conductor or solder is inserted between these facing electrodes for connection, and a shield cover is covered.
【０００７】[0007]
【作用】以上のように電子部品実装用の孔が形成されて
いることにより、電子部品を完全にシールドすることが
でき、また電子部品本体の高さより低い高さで実装する
ことが可能となり、実装基板の高さを抑えることがで
き、小型化が実現できる。By forming the holes for mounting electronic components as described above, the electronic components can be completely shielded, and the electronic components can be mounted at a height lower than that of the main body. The height of the mounting board can be suppressed, and miniaturization can be realized.
【０００８】また、実装基板の表面部が平坦になるので
シールドカバーを取り付けやすいものとなる。Further, since the surface of the mounting board is flat, the shield cover can be easily attached.
【０００９】[0009]
（実施例１）以下、本発明の第一の実施例について図面
を参照しながら説明する。図１は本発明の第一の実施例
における電子回路装置の斜視図であり、図２はその断面
図である。また、図３は部品実装する前の実装基板を示
し、図４，５はシールドカバーを取り付けた状態の電子
回路装置を示す斜視図と断面図である。なお、実装する
電子部品の形状は図６に示す。(First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view of an electronic circuit device according to a first embodiment of the present invention, and FIG. 2 is a sectional view thereof. Further, FIG. 3 shows a mounting board before component mounting, and FIGS. 4 and 5 are a perspective view and a sectional view showing the electronic circuit device with a shield cover attached. The shape of the electronic components to be mounted is shown in FIG.
【００１０】図３に示すように実装基板１１に実装する
電子部品の形状の孔１７が設けてあり、この孔１７の壁
面に複数個のスルホール電極１２ａを設け、この孔１７
に複数個の表面実装部品１５を備え側面にスルホール電
極１２ｂを設けた電子部品１４を挿入し、側面のスルホ
ール電極１２ａと１２ｂの隙間に導電体１３を挿入して
両電極を接続している。この実装基板１１の上面には表
面実装部品１６が各種実施されている。また、シールド
カバー１８は電気的に実装基板１１の接地面と同電位に
なるように接地箇所２０と半田１９により接続してあ
る。As shown in FIG. 3, a hole 17 in the shape of an electronic component to be mounted on the mounting board 11 is provided, and a plurality of through-hole electrodes 12a are provided on the wall surface of the hole 17, and the hole 17 is formed.
An electronic component 14 having a plurality of surface mount components 15 and provided with through-hole electrodes 12b on the side surface is inserted, and a conductor 13 is inserted into a gap between the through-hole electrodes 12a and 12b on the side surface to connect both electrodes. Various surface mount components 16 are implemented on the upper surface of the mounting substrate 11. Further, the shield cover 18 is electrically connected to the grounding portion 20 with solder 19 so as to have the same electric potential as the grounding surface of the mounting substrate 11.
【００１１】このようにすれば、電子部品１４を完全に
シールドでき、高さが実装基板１１の厚さに含まれ電子
回路装置の高さを抑えることができ、小型化を進めるた
めに大いに役立つものとなる。In this way, the electronic component 14 can be completely shielded, the height is included in the thickness of the mounting substrate 11, and the height of the electronic circuit device can be suppressed, which is very useful for further miniaturization. Will be things.
【００１２】また、実装基板１１の表面が平坦になるた
め、シールドカバー１８を取り付ける際の作業性が向上
する。Further, since the surface of the mounting substrate 11 becomes flat, the workability in attaching the shield cover 18 is improved.
【００１３】（実施例２）以下、本発明の第二の実施例
について図面を参照しながら説明する。図７は本発明の
第二の実施例における実装基板の斜視図であり、図８は
断面図である。(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings. FIG. 7 is a perspective view of a mounting board according to the second embodiment of the present invention, and FIG. 8 is a sectional view.
【００１４】第一の実施例と異なるのは、図７に示すよ
うに実装基板２１を多層基板とするか基板の厚みを厚く
するなどして前記の電子部品１４を挿入する孔２７を深
くした点である。以上のようにして孔２７を深くする
と、シールドカバー２８を取り付けても実装基板２１の
厚み内に収まり、高さ方向に関していっそう小型化を推
し進めることができる。The difference from the first embodiment is that, as shown in FIG. 7, the mounting board 21 is a multilayer board or the board is thickened to deepen the hole 27 into which the electronic component 14 is inserted. It is a point. When the hole 27 is deepened as described above, even if the shield cover 28 is attached, the hole 27 is contained within the thickness of the mounting substrate 21, and the size can be further reduced in the height direction.
【００１５】[0015]
【発明の効果】以上のように本発明の電子回路装置は、
電子部品を挿入して嵌合できる孔を形成しさらに側面の
スルホールをめっきした電極を形成したものであり、し
たがって前記電子部品を実装する場合、この電子部品を
完全にシールドでき、高さも実装基板内に取り込むこと
ができ、完全なシールドや小型薄型化を進めるために大
いに役立つものである。As described above, the electronic circuit device of the present invention is
A hole into which an electronic component can be inserted and fitted is formed, and an electrode is formed by plating a through hole on the side surface. Therefore, when mounting the electronic component, the electronic component can be completely shielded and the height is also a mounting board. It can be incorporated inside and is very useful for promoting complete shielding and miniaturization and thinning.
【００１６】また、シールド板を取り付ける際、平坦部
分をシールドすれば良いので作業性にとても優れてい
る。Further, when the shield plate is attached, it suffices to shield the flat portion, which is very excellent in workability.
【図１】本発明の第一の実施例における電子回路装置の
斜視図FIG. 1 is a perspective view of an electronic circuit device according to a first embodiment of the present invention.
【図２】本発明の第一の実施例における電子回路装置を
示す図１のＡ−Ａ’断面図FIG. 2 is a sectional view taken along the line AA ′ of FIG. 1 showing an electronic circuit device according to a first embodiment of the present invention.
【図３】本発明の第一の実施例における実装基板の斜視
図FIG. 3 is a perspective view of a mounting board according to the first embodiment of the present invention.
【図４】本発明の第一の実施例における電子回路装置に
シールドカバーを取り付けた時の斜視図FIG. 4 is a perspective view when a shield cover is attached to the electronic circuit device according to the first embodiment of the present invention.
【図５】本発明の第一の実施例における電子回路装置を
示す図４のＢ−Ｂ’断面図5 is a sectional view taken along the line BB ′ of FIG. 4 showing the electronic circuit device according to the first embodiment of the present invention.
【図６】本発明の第二の実施例における電子回路装置の
斜視図FIG. 6 is a perspective view of an electronic circuit device according to a second embodiment of the present invention.
【図７】本発明の第二の実施例における実装基板の斜視
図FIG. 7 is a perspective view of a mounting board according to a second embodiment of the present invention.
【図８】本発明の第二の実施例における電子回路装置の
図７のＣ−Ｃ’断面図FIG. 8 is a sectional view taken along the line CC ′ of FIG. 7 of the electronic circuit device according to the second embodiment of the present invention.
【図９】従来の電子回路装置の斜視図FIG. 9 is a perspective view of a conventional electronic circuit device.
【図１０】従来の電子回路装置を示す図９のＤ−Ｄ’断
面図10 is a sectional view taken along the line DD ′ of FIG. 9 showing a conventional electronic circuit device.
１１ 実装基板 １２ａ，１２ｂ スルホール電極 １３ 導電体 １４ 電子部品 １５ 表面実装部品 １６ 表面実装部品 １７ 孔 １８ シールドカバー １９ 半田 ２０ 接地箇所 ２１ 実装基板 ２７ 孔 ２８ シールドカバー 11 Mounting Substrate 12a, 12b Through Hole Electrode 13 Conductor 14 Electronic Component 15 Surface Mounting Component 16 Surface Mounting Component 17 Hole 18 Shield Cover 19 Solder 20 Grounding Point 21 Mounting Substrate 27 Hole 28 Shield Cover
Claims (2)
部に、側面にスルホール電極を有する電子部品を挿入し
て嵌合できる形状の孔が形成され、この孔に前記の電子
部品を挿入したときにこの電子部品のスルホール電極と
対向する側面にスルホール電極を設けこの電子部品のス
ルホール電極とスルホール電極の間に導電体あるいは半
田を挿入して両スルホール電極を接続した電子回路装
置。1. A hole having a shape into which an electronic component having a through-hole electrode can be inserted and fitted on a side surface is formed in a part of a mounting board in which various surface mounting components are incorporated. An electronic circuit device in which a through hole electrode is provided on a side surface of the electronic component that faces the through hole electrode when inserted, and a conductor or solder is inserted between the through hole electrode and the through hole electrode of the electronic component to connect the through hole electrodes.
ルドカバーを電子部品上に被せた請求項１記載の電子回
路装置。2. The electronic circuit device according to claim 1, wherein the electronic component is covered with a shield cover for preventing unwanted radio waves from entering and jumping out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12848692A JPH05327272A (en) | 1992-05-21 | 1992-05-21 | Electronic circuit apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12848692A JPH05327272A (en) | 1992-05-21 | 1992-05-21 | Electronic circuit apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05327272A true JPH05327272A (en) | 1993-12-10 |
Family
ID=14985943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12848692A Pending JPH05327272A (en) | 1992-05-21 | 1992-05-21 | Electronic circuit apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05327272A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6320756B1 (en) | 1999-01-18 | 2001-11-20 | Alps Electric Co., Ltd. | Electronic device mounting structure using electronic device mounting member and cushioning |
| JP2004095851A (en) * | 2002-08-30 | 2004-03-25 | Ngk Spark Plug Co Ltd | Wiring board |
| EP4207954A3 (en) * | 2021-12-09 | 2023-10-11 | Japan Aviation Electronics Industry, Limited | Assembly and harness assembly |
-
1992
- 1992-05-21 JP JP12848692A patent/JPH05327272A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6320756B1 (en) | 1999-01-18 | 2001-11-20 | Alps Electric Co., Ltd. | Electronic device mounting structure using electronic device mounting member and cushioning |
| JP2004095851A (en) * | 2002-08-30 | 2004-03-25 | Ngk Spark Plug Co Ltd | Wiring board |
| EP4207954A3 (en) * | 2021-12-09 | 2023-10-11 | Japan Aviation Electronics Industry, Limited | Assembly and harness assembly |
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