JP3100059U - High frequency unit - Google Patents

High frequency unit Download PDF

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JP3100059U
JP3100059U JP2003270776U JP2003270776U JP3100059U JP 3100059 U JP3100059 U JP 3100059U JP 2003270776 U JP2003270776 U JP 2003270776U JP 2003270776 U JP2003270776 U JP 2003270776U JP 3100059 U JP3100059 U JP 3100059U
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frequency unit
screw
frame
wiring pattern
circuit board
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山本 亮
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

【課題】 電気的な性能が良好で、小型の高周波ユニットを提供する。
【解決手段】 本考案の高周波ユニットは、箱形の枠体1と、この枠体1内に取り付けられ、少なくとも一面側に配線パターン6が設けられた回路基板5と、配線パターン6上に搭載された電子部品7とを備え、枠体1には、外部機器8にネジ11止めされる取付孔1bを有すると共に、配線パターン6は、引き回し用パターン6aを有し、この引き回し用パターン6aは、取付孔1bにネジ込まれて枠体1内に突出するネジ11の側部に対して非対向状態となるように、ネジ11の側部を避けて配設されたため、引き回し用パターン6aとネジ11との間隔が大きくなって、電気的な特性の変化が極めて小さく、電気的な性能の良好なものが得られる。
【選択図】    図2

PROBLEM TO BE SOLVED: To provide a small high-frequency unit having good electric performance.
A high-frequency unit according to the present invention has a box-shaped frame body, a circuit board mounted in the frame body and provided with a wiring pattern on at least one surface side, and mounted on the wiring pattern. The frame 1 has a mounting hole 1b to be screwed to the external device 8 and the wiring pattern 6 has a routing pattern 6a, and the wiring pattern 6a Since it is arranged so as not to be opposed to the side of the screw 11 which is screwed into the mounting hole 1b and protrudes into the frame body 1, the side of the screw 11 is disposed. Since the distance from the screw 11 is increased, the change in the electrical characteristics is extremely small, and a good electrical performance is obtained.
[Selection] Fig. 2

Description

 本考案はテレビチューナ等の電子機器に使用して好適な高周波ユニットに関する。 The present invention relates to a high-frequency unit suitable for use in electronic equipment such as a TV tuner.

 従来の高周波ユニットの図面を説明すると、図6は従来の高周波ユニットに係り、外部機器への取付状態を示す分解斜視図、図7は従来の高周波ユニットに係り、外部機器への取付状態を示す要部の縦断面図、図8は従来の高周波ユニットに係り、外部機器への取付状態を示す要部の横断面図である。 FIG. 6 shows an exploded perspective view of a conventional high-frequency unit and shows an attached state to an external device, and FIG. 7 shows a conventional high-frequency unit and shows an attached state of an external device. FIG. 8 is a cross-sectional view of a main part of the conventional high-frequency unit, showing a state where the main part is attached to an external device.

 次に、従来の高周波ユニットの構成を図6〜図8に基づいて説明すると、金属板から成る箱形の枠体51は、下方に突出する複数個の取付脚51aと、正面壁51bに設けられた切り起こし部51cと、この切り起こし部51cの中央部に設けられた取付孔51dを有する。 Next, a configuration of a conventional high-frequency unit will be described with reference to FIGS. 6 to 8. A box-shaped frame body 51 made of a metal plate is provided on a plurality of mounting legs 51 a projecting downward and a front wall 51 b. It has a cut-and-raised portion 51c and a mounting hole 51d provided at the center of the cut-and-raised portion 51c.

このような構成を有する高周波ユニットは、外部機器(セット機器)58内に収納され、取付脚51aと端子が後述するマザー基板59に半田付けされて取り付けられると共に、外部機器58のシャーシ60に設けられた孔60aに挿入されたネジ61が取付孔51dにネジ込まれて、枠体51がシャーシ60に支持されるようになっている。(例えば、引用文献1参照)   The high-frequency unit having such a configuration is housed in an external device (set device) 58, the mounting legs 51a and the terminals are soldered and attached to a mother board 59 described later, and provided on a chassis 60 of the external device 58. The screws 61 inserted into the holes 60a are screwed into the mounting holes 51d so that the frame body 51 is supported by the chassis 60. (See, for example, Reference 1)

 また、このような高周波ユニットの枠体51には、図7,図8に示すように、開放部を塞ぐようにカバー52が取り付けられて、筺体53が構成されている。 {Circle around (5)} As shown in FIGS. 7 and 8, a cover 52 is attached to the frame body 51 of such a high-frequency unit so as to close the open portion, thereby forming a housing 53.

 更に、図7,図8に示すように、筺体53内には、絶縁基板から成る回路基板55が配置され、この回路基板55には、側辺に沿って配設された引き回し用パターン56aを有する配線パターン56が設けられ、この配線パターン56上には、種々の電子部品57が搭載されて、所望の電気回路が構成されている。 Further, as shown in FIGS. 7 and 8, a circuit board 55 made of an insulating substrate is disposed in the housing 53, and a wiring pattern 56a disposed along the side is disposed on the circuit board 55. A wiring pattern 56 is provided, and various electronic components 57 are mounted on the wiring pattern 56 to form a desired electric circuit.

 このような回路基板55は、筺体54内に収納され、枠体51に半田付等によって取り付けられると共に、ここでは図示しないが、回路基板55に取り付けられた端子(図示せず)が枠体51を通って下方に突出している。 Such a circuit board 55 is housed in a housing 54 and attached to the frame 51 by soldering or the like, and terminals (not shown) attached to the circuit board 55 are connected to the frame 51 (not shown). Projecting downward through

 このような構成を有する高周波ユニットは、外部機器(セット機器)58内に収納され、取付脚51aと端子がマザー基板59に半田付けされて取り付けられると共に、外部機器58のシャーシ60に設けられた孔60aに挿入されたネジ61が取付孔51dにネジ込まれて、枠体51がシャーシ60に支持される。 The high-frequency unit having such a configuration is housed in an external device (set device) 58, and is attached to the mother board 59 by soldering the mounting legs 51a and terminals, and is provided on the chassis 60 of the external device 58. The screws 61 inserted into the holes 60a are screwed into the mounting holes 51d, and the frame 51 is supported by the chassis 60.

 この時、取付孔51dにネジ込まれたネジ61が枠体51内に突出し、ネジ61の側部が引き回し用パターン56aに近接した状態で対向した状態となる。
 そして、ネジ61の側部が引き回し用パターン56aに近接すると、高周波ユニットの電気的な特性が変化して、電気的な性能が悪くなる。
At this time, the screw 61 screwed into the mounting hole 51d protrudes into the frame 51, and the side of the screw 61 is opposed to the wiring pattern 56a in a state of being close to it.
When the side of the screw 61 approaches the routing pattern 56a, the electrical characteristics of the high-frequency unit change and the electrical performance deteriorates.

特開2003−123913号公報JP 2003-123913 A

 従来の高周波ユニットは、枠体51の取付孔51dにネジ61がネジ込まれた際、ネジ61が枠体51内に突出して、ネジ61の側部が引き回し用パターン56aに近接した状態となるため、高周波ユニットの電気的な特性が変化して、電気的な性能が悪くなるという問題がある。 In the conventional high-frequency unit, when the screw 61 is screwed into the mounting hole 51d of the frame 51, the screw 61 protrudes into the frame 51, and a side portion of the screw 61 comes close to the drawing pattern 56a. Therefore, there is a problem that the electrical characteristics of the high-frequency unit change and the electrical performance deteriorates.

 そこで、本考案は電気的な性能が良好で、小型の高周波ユニットを提供することを目的とする。 Therefore, an object of the present invention is to provide a small high-frequency unit having good electric performance.

 上記課題を解決するための第1の解決手段として、箱形の枠体と、この枠体内に取り付けられ、少なくとも一面側に配線パターンが設けられた回路基板と、前記配線パターン上に搭載された電子部品とを備え、前記枠体には、外部機器にネジ止めされる取付孔を有すると共に、前記配線パターンは、引き回し用パターンを有し、この引き回し用パターンは、前記取付孔にネジ込まれて前記枠体内に突出する前記ネジの側部に対して非対向状態となるように、前記ネジの側部を避けて配設された構成とした。 As a first means for solving the above problems, a box-shaped frame, a circuit board attached to the frame and provided with a wiring pattern on at least one surface side, and mounted on the wiring pattern An electronic component, the frame body has a mounting hole screwed to an external device, the wiring pattern has a wiring pattern, and the wiring pattern is screwed into the mounting hole. In this configuration, the screw is protruded into the frame so as not to face the side of the screw so as to avoid the side of the screw.

 また、第2の解決手段として、前記回路基板には、前記枠体内に突出する前記ネジと対向する位置に切り欠き部が設けられた構成とした。
 また、第3の解決手段として、前記ネジが前記切り欠き部内に位置するようにした構成とした。
As a second solution, a notch is provided on the circuit board at a position facing the screw protruding into the frame.
As a third solution, the screw is located in the notch.

 また、第4の解決手段として、前記枠体には、前記取付孔の外周部から前記枠体内に突出し、前記ネジがネジ込まれる突出部を有し、前記突出部が前記切り欠き部内に位置するようにした構成とした。 As a fourth solution, the frame has a projection that projects into the frame from an outer peripheral portion of the mounting hole and into which the screw is screwed, and the projection is located in the notch. The configuration was made so that

 本考案の高周波ユニットは、箱形の枠体と、この枠体内に取り付けられ、少なくとも一面側に配線パターンが設けられた回路基板と、配線パターン上に搭載された電子部品とを備え、枠体には、外部機器にネジ止めされる取付孔を有すると共に、配線パターンは、引き回し用パターンを有し、この引き回し用パターンは、取付孔にネジ込まれて枠体内に突出するネジの側部に対して非対向状態となるように、ネジの側部を避けて配設されたため、引き回し用パターンとネジとの間隔が大きくなって、電気的な特性の変化が極めて小さく、電気的な性能の良好なものが得られる。 The high-frequency unit of the present invention includes a box-shaped frame, a circuit board mounted in the frame, and provided with a wiring pattern on at least one surface side, and an electronic component mounted on the wiring pattern. Has a mounting hole that is screwed to an external device, and the wiring pattern has a wiring pattern, and the wiring pattern is provided on the side of the screw that is screwed into the mounting hole and protrudes into the frame. Since it is arranged so as not to face the side of the screw so as to be in a non-opposed state, the distance between the routing pattern and the screw becomes large, the change in electrical characteristics is extremely small, and the electrical performance Good ones are obtained.

 また、回路基板には、枠体内に突出するネジと対向する位置に切り欠き部が設けられたため、枠体内に突出するネジの位置を回路基板側に近づけることができ、その結果、枠体を上下方向に小型化できる。 In addition, the circuit board is provided with a notch at a position facing the screw protruding into the frame body, so that the position of the screw protruding into the frame body can be closer to the circuit board side. Can be downsized vertically.

 また、ネジが切り欠き部内に位置するようにしたため、ネジのネジ込み位置が回路基板の位置に設定できて、従って、枠体を上下方向に一層小型化できて、小型の高周波ユニットを提供できる。 In addition, since the screw is located in the notch, the screwing position of the screw can be set to the position of the circuit board. Therefore, the size of the frame can be further reduced in the vertical direction, and a small high-frequency unit can be provided. .

 また、枠体には、取付孔の外周部から枠体内に突出し、ネジがネジ込まれる突出部を有し、突出部が切り欠き部内に位置するようにしたため、ネジのネジ込み強度を大きくできると共に、小型の高周波ユニットを提供できる。 In addition, the frame has a protrusion that projects into the frame from the outer peripheral portion of the mounting hole and into which the screw is screwed, and the protrusion is located within the notch, so that the screwing strength of the screw can be increased. In addition, a small high-frequency unit can be provided.

 本考案の高周波ユニットの図面を説明すると、図1は本考案の高周波ユニットの第1実施例に係り、外部機器への取付状態を示す要部断面図、図2は図1の2−2線における断面図である。 Referring to the drawings of the high frequency unit of the present invention, FIG. 1 relates to a first embodiment of the high frequency unit of the present invention, and is a sectional view of an essential part showing a state of attachment to an external device, and FIG. FIG.

 また、図3は本考案の高周波ユニットの第2実施例に係り、外部機器への取付状態を示す要部断面図、図4は図3の4−4線における断面図、図5は本考案の高周波ユニットの第3実施例に係り、外部機器への取付状態を示す要部断面図である。 FIG. 3 is a sectional view of a main part of a high-frequency unit according to a second embodiment of the present invention, showing a state of attachment to an external device. FIG. 4 is a sectional view taken along line 4-4 in FIG. 3, and FIG. FIG. 13 is a cross-sectional view of a principal part showing a state of attachment to an external device according to a third embodiment of the high-frequency unit.

 次に、本考案の高周波ユニットの第1実施例の構成を図1,図2に基づいて説明すると、金属板から成る箱形の枠体1は、上下が開放したロ字状をなして、下方に突出する複数個の取付脚1aと、取付孔1bと、この取付孔1bの外周部から枠体1内に突出する突出部1cを有する。 Next, the configuration of the first embodiment of the high-frequency unit of the present invention will be described with reference to FIGS. 1 and 2. The box-shaped frame 1 made of a metal plate has a rectangular shape with its top and bottom open. It has a plurality of mounting legs 1a protruding downward, a mounting hole 1b, and a protruding portion 1c protruding into the frame 1 from an outer peripheral portion of the mounting hole 1b.

 また、この枠体1の上部には、開放部を塞ぐように上カバー2が取り付けられると共に、枠体1の下部には、開放部を塞ぐように下カバー3が取り付けられて、筺体4が構成されている。 An upper cover 2 is attached to the upper part of the frame 1 so as to cover the opening, and a lower cover 3 is attached to the lower part of the frame 1 so as to cover the opening. It is configured.

 絶縁基板から成る回路基板5には、側辺に沿って配設された引き回し用パターン6aを有する配線パターン6が設けられ、この配線パターン6上には、種々の電子部品7が搭載されて、所望の電気回路が構成されている。
 また、回路基板5の側辺に沿って配設された引き回し用パターン6aの一部は、図2に示すように、コ字状となして、回路基板5の側辺から離れるように配設されている。
A circuit board 5 made of an insulating substrate is provided with a wiring pattern 6 having a wiring pattern 6a arranged along the side, and various electronic components 7 are mounted on the wiring pattern 6, A desired electric circuit is configured.
Further, a part of the routing pattern 6a disposed along the side of the circuit board 5 is formed in a U shape as shown in FIG. Have been.

 このような回路基板5は、筺体4内に収納され、枠体1に半田付等によって取り付けられると共に、ここでは図示しないが、回路基板5に取り付けられた端子(図示せず)が下カバー3を通って下方に突出している。 Such a circuit board 5 is housed in the housing 4 and attached to the frame 1 by soldering or the like, and terminals (not shown) attached to the circuit board 5 are connected to the lower cover 3 (not shown). Projecting downward through

 このような構成を有する高周波ユニットは、外部機器(セット機器)8内に収納され、取付脚1aと端子がマザー基板9に半田付けされて取り付けられると共に、外部機器8のシャーシ10に設けられた孔10aに挿入されたネジ11が取付孔1b、及び突出部1cにネジ込まれて、枠体1がシャーシ10に支持される。 The high-frequency unit having such a configuration is housed in an external device (set device) 8, and is mounted on a chassis 10 of the external device 8 while the mounting legs 1 a and terminals are soldered to the mother board 9. The screws 11 inserted into the holes 10a are screwed into the mounting holes 1b and the protrusions 1c, and the frame 1 is supported by the chassis 10.

 この時、取付孔1bにネジ込まれたネジ11が枠体1内に突出するが、ネジ11の下部には、引き回し用パターン6aが非対向状態で、ネジ11の下部(側部)を避けて配設された状態となっている。
 このため、ネジ11の下部(側部)が引き回し用パターン6aに近接せず、高周波ユニットの電気的な特性の変化が極めて小さく、電気的な性能が良好となる。
At this time, the screw 11 screwed into the mounting hole 1b protrudes into the frame 1, but the drawing pattern 6a is not opposed to the lower part of the screw 11 so as to avoid the lower part (side part) of the screw 11. It is in a state of being arranged.
For this reason, the lower part (side part) of the screw 11 does not approach the routing pattern 6a, the change in the electrical characteristics of the high-frequency unit is extremely small, and the electrical performance is improved.

 また、図3,図4は本考案の高周波ユニットの第2実施例を示し、この第2実施例は、枠体1内に突出するネジ11,及び枠体1の突出部1cと対向する位置において、回路基板5に切り欠き部5aを設けたものである。
 その他の構成は、前記第1実施例と同様であるので、同一部品に同一番号を付し、ここではその説明を省略する。
3 and 4 show a second embodiment of the high-frequency unit according to the present invention. The second embodiment has a screw 11 projecting into the frame 1 and a position facing the projecting portion 1c of the frame 1. , A notch 5a is provided in the circuit board 5.
Other configurations are the same as those of the first embodiment, and therefore, the same components are denoted by the same reference numerals and description thereof will not be repeated.

 また、図5は本考案の高周波ユニットの第3実施例を示し、この第3実施例は、枠体1内に突出するネジ11,及び枠体1の突出部1cが回路基板5に設けた切り欠き部5a内に位置するようにしたものである。
 その他の構成は、前記第2実施例と同様であるので、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 5 shows a third embodiment of the high-frequency unit of the present invention. In this third embodiment, a screw 11 projecting into the frame 1 and a projecting portion 1c of the frame 1 are provided on the circuit board 5. It is located in the notch 5a.
The other configuration is the same as that of the second embodiment, so that the same components are denoted by the same reference numerals and description thereof will be omitted.

本考案の高周波ユニットの第1実施例に係り、外部機器への取付状態を示す要部断面図。FIG. 2 is a sectional view of a main part of the high-frequency unit according to the first embodiment of the present invention, showing a state of attachment to an external device. 図1の2−2線における断面図。FIG. 2 is a sectional view taken along line 2-2 in FIG. 1. 本考案の高周波ユニットの第2実施例に係り、外部機器への取付状態を示す要部断面図。FIG. 4 is a sectional view of a main part of a second embodiment of the high-frequency unit according to the present invention, showing a state of attachment to an external device. 図3の4−4線における断面図。FIG. 4 is a sectional view taken along line 4-4 in FIG. 3. 本考案の高周波ユニットの第3実施例に係り、外部機器への取付状態を示す要部断面図。FIG. 9 is a sectional view of a main part of a high-frequency unit according to a third embodiment of the present invention, showing a state of attachment to an external device. 従来の高周波ユニットに係り、外部機器への取付状態を示す分解斜視図。FIG. 9 is an exploded perspective view showing a state of attachment to an external device in a conventional high-frequency unit. 従来の高周波ユニットに係り、外部機器への取付状態を示す要部の縦断面図。FIG. 9 is a longitudinal sectional view of a main part showing a state of attachment to an external device in a conventional high-frequency unit. 従来の高周波ユニットに係り、外部機器への取付状態を示す要部の横断面図。FIG. 9 is a cross-sectional view of a main part of a conventional high-frequency unit, showing a state of attachment to an external device.

符号の説明Explanation of reference numerals

 1:枠体
 1a:取付脚
 1b:取付孔
 1c:突出部
 2:上カバー
 3:下カバー
 4:筺体
 5:回路基板
 5a:切り欠き部
 6:配線パターン
 6a:引き回し用パターン
 7:電子部品
 8:外部機器
 9:マザー基板
 10:シャーシ
 10a:孔
 11:ネジ
1: Frame 1a: Mounting leg 1b: Mounting hole 1c: Projection 2: Upper cover 3: Lower cover 4: Housing 5: Circuit board 5a: Notch 6: Wiring pattern 6a: Routing pattern 7: Electronic component 8 : External equipment 9: Mother board 10: Chassis 10a: Hole 11: Screw

Claims (4)

箱形の枠体と、この枠体内に取り付けられ、少なくとも一面側に配線パターンが設けられた回路基板と、前記配線パターン上に搭載された電子部品とを備え、前記枠体には、外部機器にネジ止めされる取付孔を有すると共に、前記配線パターンは、引き回し用パターンを有し、この引き回し用パターンは、前記取付孔にネジ込まれて前記枠体内に突出する前記ネジの側部に対して非対向状態となるように、前記ネジの側部を避けて配設されたことを特徴とする高周波ユニット。 A box-shaped frame, a circuit board mounted in the frame and provided with a wiring pattern on at least one surface side, and an electronic component mounted on the wiring pattern, wherein the frame includes an external device. And the wiring pattern has a wiring pattern, and the wiring pattern is screwed into the mounting hole and protrudes into the frame with respect to a side portion of the screw. A high-frequency unit, wherein the high-frequency unit is disposed so as to be in a non-opposed state, avoiding a side portion of the screw. 前記回路基板には、前記枠体内に突出する前記ネジと対向する位置に切り欠き部が設けられたことを特徴とする請求項1記載の高周波ユニット。 The high-frequency unit according to claim 1, wherein the circuit board is provided with a notch at a position facing the screw projecting into the frame. 前記ネジが前記切り欠き部内に位置するようにしたことを特徴とする請求項2記載の高周波ユニット。 The high-frequency unit according to claim 2, wherein the screw is located in the notch. 前記枠体には、前記取付孔の外周部から前記枠体内に突出し、前記ネジがネジ込まれる突出部を有し、前記突出部が前記切り欠き部内に位置するようにしたことを特徴とする請求項3記載の高周波ユニット。
The frame body has a protruding portion that protrudes from the outer peripheral portion of the mounting hole into the frame body and into which the screw is screwed, and the protruding portion is located in the notch portion. The high-frequency unit according to claim 3.
JP2003270776U 2003-08-26 2003-08-26 High frequency unit Expired - Lifetime JP3100059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003270776U JP3100059U (en) 2003-08-26 2003-08-26 High frequency unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003270776U JP3100059U (en) 2003-08-26 2003-08-26 High frequency unit

Publications (1)

Publication Number Publication Date
JP3100059U true JP3100059U (en) 2004-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003270776U Expired - Lifetime JP3100059U (en) 2003-08-26 2003-08-26 High frequency unit

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Country Link
JP (1) JP3100059U (en)

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