CN215010824U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application discloses circuit board subassembly and electronic equipment, wherein the circuit board subassembly includes: a circuit board; the bonding pad is arranged on the circuit board; the first side of the welding leg is connected with the bonding pad, the outer contour of the first side of the welding leg is provided with a stress adjusting part which is inwards sunken or outwards protruded along the circumferential direction of the first side of the welding leg, and a connecting part is arranged on the bonding pad at a position corresponding to the stress adjusting part; the first end of the metal wire is connected with the connecting part. This application makes metal walk the line and can avoid the stress zone through setting up stress adjustment portion to avoid metal to walk the influence that the line received the stress zone and fracture.

Description

Circuit board assembly and electronic equipment

Technical Field

The application belongs to the technical field of electronics, concretely relates to circuit board assembly and electronic equipment.

Background

Some electronic devices in electronic products have metal solder feet, the hardness of the metal solder feet is hard, when the metal solder feet are attached to the surface of a PCB, the hardness of the PCB is soft compared with the metal solder feet. The metal welding feet are connected with metal welding pads of the PCB, and the tail ends of the welding pads are connected with the wiring. When the electronic product is impacted by external force, the harder electronic metal welding leg has smaller deformation degree, and the softer PCB has larger deformation degree, so that the joint of the electronic metal welding leg and the PCB generates larger deformation (the area is also called as a stress band). If the wires (including the surface layer or the inner layer) are directly routed out from the edge of the PCB pad of the stress band, the wires are easy to break, so that the function of the electronic product is invalid.

SUMMERY OF THE UTILITY MODEL

The present application is directed to an electronic device that solves at least one of the problems set forth in the background art.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a circuit board assembly, including: a circuit board; the bonding pad is arranged on the circuit board; the first side of the welding leg is connected with the bonding pad, the outer contour of the first side of the welding leg is provided with a stress adjusting part which is inwards sunken or outwards protruded along the circumferential direction of the first side of the welding leg, and a connecting part is arranged on the bonding pad at a position corresponding to the stress adjusting part; the first end of the metal wire is connected with the connecting part.

In the embodiment of the application, the stress adjusting part which is inwards sunken or outwards protruded along the circumferential direction of the outer contour of the welding leg is arranged on the outer contour of the welding leg, so that the metal routing can avoid the stress belt, and the metal routing is prevented from being broken.

In a second aspect, an embodiment of the present application provides an electronic device, which includes the circuit board assembly according to any of the above embodiments.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a prior art circuit board assembly;

FIG. 2 is a side cut-away view of a prior art wiring board assembly;

FIG. 3 is a schematic diagram of a circuit board assembly according to one embodiment of the present application;

FIG. 4 is a schematic structural diagram of a circuit board assembly according to yet another embodiment of the present application;

FIG. 5 is a schematic diagram of a partial structure of an electronic device according to one embodiment of the present application;

FIG. 6 is a schematic diagram of a partial structure of an electronic device according to yet another embodiment of the present application;

FIG. 7 is a schematic view of an electronic component and a solder tail of an electronic device mating according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a solder tail of a circuit board assembly according to an embodiment of the present application;

fig. 9 is a partial exploded view of an electronic device according to an embodiment of the application.

Reference numerals:

a wiring board assembly 100;

a wiring board 10;

a pad 20;

a solder tail 30; a stress adjustment unit (31);

a first connecting piece section 311; a second connecting segment 312;

a metal trace 40; a first segment body 41; a second segment 42;

an electronic component 50;

a PCB board 1; a PCB pad 2; an electronic metal fillet 3; the traces 4 are at the edge of the PCB pads.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "horizontal," "bottom," "inner," "outer," "circumferential," and the like are used in the orientation or positional relationship indicated in the drawings for convenience and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The present application is an invention made by the inventors based on the following facts.

Fig. 1 shows a schematic structural diagram of a circuit board assembly in the prior art, and fig. 2 shows a side sectional view of a PCB 1 with a broken trace when an external force is applied.

As shown in fig. 1, the circuit board assembly includes a PCB board 1, a PCB pad 2, an electronic metal leg 3, and a wiring 4 at the edge of the PCB pad, wherein the PCB board 1, the PCB pad 2, the electronic metal leg 3, and the design manner of the stacked arrangement are adopted, the PCB pad 2 is arranged on the PCB board 1, the electronic metal leg 3 is arranged on the PCB pad 2, and the wiring 4 at the edge of the PCB pad is located at the edge of the electronic metal leg 3.

The inventor finds that the display panel in the prior art has the following defects when the prior art is implemented:

in the circuit board assembly in the prior art, when an electronic product is impacted by external force, the harder electronic metal leg 3 is deformed less, and the softer PCB 1 is deformed more, so that the joint of the electronic metal leg 3 and the PCB 1 is deformed more (this region is also called as a stress zone), as shown in a dotted line region in fig. 1.

If the trace (including the surface layer or the inner layer trace) directly comes out at the edge of the PCB pad 2 of the stress strip (sometimes, other areas of the surface layer or the inner layer do not avoid the trace space of the stress strip), the trace is easily broken, and the function of the electronic product is disabled.

Based on this, the inventors of the present application have conducted long-term studies and experiments to creatively develop the following inventions.

As shown in fig. 3 to 9, a circuit board assembly 100 according to an embodiment of the present application includes: wiring board 10, bonding pad 20, solder tail 30 and metal trace 40.

Specifically, the pad 20 is disposed on the circuit board 10, the first side of the fillet 30 is connected to the pad 20, the outer contour of the first side of the fillet 30 is provided with a stress adjustment portion 31 that is recessed inward or protrudes outward along the circumferential direction thereof, a connection portion is disposed on the pad 20 at a position corresponding to the stress adjustment portion 31, and the first end of the metal trace 40 is connected to the connection portion.

In other words, the circuit board assembly 100 according to the embodiment of the present application is mainly composed of the circuit board 10 capable of providing a supporting function, the pads 20 capable of providing soldering positions, the solder fillets 30 capable of serving as connection with the electronic component 50 and the pads 20, respectively, and the metal traces 40 capable of achieving electrical connection of the internal and external circuits. The circuit board 10 can function as a carrier, and can be an insulating substrate. The wiring board 10 is provided with pads 20 for mounting the electronic component 50, and the size and shape of the pads 20 are not limited herein. The circuit board 10 is also provided with metal traces 40 inside or on the surface thereof for electrical connection.

The electronic element 50 can be fixed by soldering the solder leg 30 to the solder pad 20, wherein it should be noted that a first side of the solder leg 30 can be connected to the solder pad 20 and a second side of the solder leg 30 can be connected to the electronic element 50.

In order to avoid the metal trace 40 from the stress zone, the fillet 30 is provided with a stress adjustment portion 31. Correspondingly, the pad 20 is provided with a connecting portion, that is, the position of the connecting portion corresponds to the position of the stress adjustment portion 31.

The stress adjustment portion 31 is provided at the edge of the fillet 30, and the stress adjustment portion 31 may be an opening or a protrusion. When the stress adjustment portion 31 is an opening, the extending direction of the stress adjustment portion 31 may be directed toward the inside of the fillet 30. When the stress adjustment portion 31 is a protrusion, the extending direction of the stress adjustment portion 31 may be directed to the outside of the fillet 30.

That is, the solder fillet 30 is connected to the wiring board 10 through the land 20, and there is a difference in hardness between the hardness of the solder fillet 30 and the hardness of the wiring board 10. On the premise that the hardness of the solder leg 30 is greater than that of the circuit board 10, when the electronic device is impacted by an external force, the deformation degree of the solder leg 30 is small, the deformation degree of the circuit board 10 is large, and a stress zone (for example, a dashed-line frame region in fig. 3) occurs at the edge where the solder leg 30 is connected to the circuit board 10. At this time, by providing the stress adjusting portion 31 at the edge position where the fillet 30 is connected to the wiring board 10, the direction and distribution state of the stress zone can be adjusted.

Specifically, when the stress adjustment portion 31 of the fillet 30 is recessed inward, a groove is formed in the extending direction of the fillet 30, and by providing the groove, the original stress zone can be divided into at least two stress zones (two dotted line regions in fig. 3) distributed at intervals, with a gap therebetween. At this time, the metal trace 40 is connected to the pad 20 (connection portion) at the gap position, so that the metal trace 40 can be prevented from being penetrated by the stress band, and the metal trace 40 can be ensured not to be easily broken, thereby realizing the protection of the circuit.

When the stress adjustment portion 31 of the fillet 30 protrudes outward, a protrusion is formed in the extending direction of the fillet 30, and by providing the protrusion, the original stress zone can be divided into at least two stress zones distributed at intervals with a gap therebetween. At this time, the metal trace 40 is connected to the pad 20 (connection portion) at the protruding position, so that the metal trace 40 is prevented from being penetrated by the stress band, and the metal trace 40 is not easily broken, thereby achieving the protection effect on the circuit.

Therefore, according to the circuit board assembly 100 of the embodiment of the present application, the stress adjusting portion 31 which is recessed inwards or protrudes outwards along the circumferential direction is arranged on the outer contour of the solder leg 30, so that the metal trace 40 can avoid a stress band, and the risk of breaking caused by the broken metal trace 40 is avoided.

According to one embodiment of the present application, as shown in fig. 3, the orthographic projection of the fillet 30 on the circuit board 10 is located on the pad 20. That is, the shape of the fillet 30 may be conformed to the pad 20, or a part of the pad 20 may be protruded beyond the outer periphery of the fillet 30. As shown in fig. 3, taking the example that the solder tail 30 and the pad 20 are assembled in the up-down direction as an example, the solder tail 30 may be located right above the pad 20, and the solder tail 30 may cover the pad 20 completely or even partially beyond the pad 20. By positioning the orthographic projection of the solder leg 30 on the circuit board 10 on the pad 20, the contact area between the solder leg 30 and the pad 20 can be larger, the solder leg 30 and the pad 20 can be welded more firmly, and the circuit conduction effect is better.

In some embodiments of the present application, as shown in fig. 3, the shape of the portion of the pad 20 disposed opposite the first side of the fillet 30 is identical to the shape of the first side of the fillet 30. In other words, the shape of the solder tail 30 may be adapted to the shape of the solder pad 20. For example, when the fillet 30 is a rectangular parallelepiped having a groove or a protrusion, the land 20 may be a rectangular parallelepiped having a groove or a protrusion. When the solder fillet 30 is a disk, the position where the pad 20 is soldered to the solder fillet 30 may be a disk.

When the shape of the portion of the pad 20 opposite to the first side of the fillet 30 is set to be the same as the shape of the first side of the fillet 30, the soldering of the fillet 30 is facilitated, the pad 20 does not occupy too much space on the circuit board 10, unnecessary waste is avoided, and the connection of the metal trace 40 and the pad 20 is facilitated.

Alternatively, as shown in fig. 3, the stress adjustment portion 31 is a groove recessed inward along the outer contour of the first side of the fillet 30, the connection portion corresponds to the shape of the groove, and the first end of the metal trace 40 is connected to the bottom of the connection portion in the depth direction. The shape of the groove and the depth of the groove are not limited herein.

In other words, the recess is a portion hollowed out on the edge of the solder tail 30, and the first end of the metal trace 40 can be electrically connected to the connection portion after passing through the recess. As shown in fig. 3, the metal trace 40 in the groove is exposed outside the solder tail 30 and may be at the same level as the solder tail 30. Moreover, the direction of the metal wire 40 can extend to the bottom of the groove in the depth direction, at this time, the metal wire 40 cannot be penetrated by the stress band, and the risk of breaking the metal wire 40 cannot occur.

In addition, through set up the recess in the first side of leg 30, reserve the line space in the recess position, can make the leg can not press on metal is walked line 40, can reduce stress.

In some embodiments of the present application, the bottom of the connecting portion is provided with a limiting portion, and the first end of the metal wire 40 is provided with a fixing portion matched with the limiting portion. The metal wiring 40 can be contacted with the connecting part more closely by arranging the limiting part at the bottom of the connecting part, and the circuit can be ensured to be conducted better. In addition, a fixing portion is disposed at the first end of the metal wire 40, and the fixing portion and the limiting portion can be matched with each other, so that the metal wire 40 and the connecting portion can be connected more firmly. As shown in fig. 3, the position-limiting portion may be a hollow ring member having a notch, and the fixing portion may be a disk.

Optionally, as shown in fig. 3 and 4, an outer contour of the first side of the fillet 30 is rectangular, a groove is disposed on a wide side of the outer contour of the first side of the fillet 30 and is recessed inwards along the length direction, and the metal trace 40 includes: the first section body 41 is located in the groove, the first end of the first section body 41 is connected with the connecting portion, the second end of the first section body 41 extends out of the groove, and the second section body 42 is connected with the second end of the first section body 41.

For convenience of description, the extending direction of the groove may be defined as extending in the left-right direction.

The groove may be a wide side on the left side of the solder tail 30, or a wide side on the right side of the solder tail 30, and is not limited herein. The recess may extend to the right when the recess is on the left broadside of the fillet 30. The recess may extend to the left when the recess is on the broadside of the right side of the solder tail 30.

Further, the metal trace 40 mainly comprises a first segment 41 and a second segment 42, wherein the first segment 41 and the second segment 42 can be integrally formed.

It should be noted that the first segment 41 may be located in the groove, a first end of the first segment 41 may be connected to the connecting portion, and a second end of the first segment 41 may extend out of the groove to be connected to the second segment 42, so as to realize distribution of the metal trace 40 on the circuit board 10.

In some embodiments of the present application, as shown in fig. 3, the first segment body 41 is disposed in parallel with both side walls of the groove in the depth direction. That is to say, the first segment 41 of the metal trace 40 may be a straight line segment, and two sidewalls of the groove are two parallel straight line structures, the first segment 41 is located between the two parallel straight line structures, and the first segment 41 is respectively disposed parallel to the two sidewalls.

It should be noted that the position of the stress band is not fixed, for example, the stress band may appear at a dotted box position in fig. 3 at a certain time, the stress band may also appear above and below the first segment body 41 in fig. 3 at another time, and the stress band extends in the left-right direction. At this time, since the first segment 41 is parallel to the two sidewalls corresponding to the groove, and the second segment 42 is also staggered from the two sidewalls corresponding to the groove, the stress band along the left-right direction does not pass through the first segment 41 and the second segment 42, so that the stress band can be more effectively prevented from passing through the metal trace 40, and the metal trace 40 is prevented from being broken.

Alternatively, as shown in fig. 4, the stress adjustment portion 31 is a protruding portion protruding outward along the outer contour of the first side of the fillet 30, the connection portion corresponds to the shape of the protruding portion, and the first end of the metal trace 40 is connected to at least a part of the side wall surface of the connection portion. That is, the stress adjustment portion 31 may be a boss portion, and the size and shape of the boss portion are not limited herein. The raised portion is located on the outer contour of the fillet 30 and may be integrally formed with the outer contour. The first end of the metal trace 40 can be connected to the pad 20 (connection portion) corresponding to the edge position of the bump.

In some embodiments of the present application, as shown in fig. 4, the protrusion portion includes: the first end of the first connecting section 311 is connected to the solder leg 30, the second end of the first connecting section 311 protrudes outwards along the outer contour of the first side of the solder leg 30, the first connecting section 311 is a straight section, the second connecting section 312 is arranged at the second end of the first connecting section 311, the second connecting section 312 is a circular section, and one side of the connecting portion corresponding to the shapes of the second connecting section 312 and the first connecting section 311 is connected to the first end of the metal trace 40.

That is, the boss portion is mainly composed of the first connection segment 311 and the second connection segment 312, wherein the first connection segment 311 and the second connection segment 312 may be integrally formed. A first end of the first connection piece section 311 may be provided at an edge of the fillet 30, and the second connection piece section 312 is connected with a second end of the first connection piece section 311. And the second connection segment 312 is arranged on the side of the first connection segment 311 departing from the solder leg 30, the second connection segment 312 may be a circular segment, and by arranging the circular segment, the trend of a stress band generated between the meter and the circuit board 10 can be shown. The metal trace 40 can simultaneously contact the pad 20 corresponding to the first connection segment 311 and the pad 20 corresponding to the second connection segment 312.

Further, the shape of the upper end of the metal trace 40 in fig. 4 can be set to be a triangle, and the hypotenuse of the triangle extends to the first connecting segment 311. When a stress band corresponding to the first connection segment 311 appears along the left-right direction, the stress band forms an included angle with the oblique edge, so that the stress band can be prevented from being perpendicular to the metal wire 40 to cause the metal wire 40 to be easily broken.

Alternatively, the extension line of the first connection segment 311 may be perpendicular to the edge of the solder tail 30, and the width of the first connection segment 311 may be smaller than the diameter of the second connection segment 312. When the circuit board assembly 100 is impacted by an external force, the shape of the stress band at the position of the protruding portion may be the same as the outer contours of the first connecting segment 311 and the second connecting segment 312, specifically, the shape of the stress band corresponding to the first connecting segment 311 is linear, the shape of the stress band corresponding to the second connecting segment 312 is arc, and the risk that the metal trace 40 is cut off by the stress is greatly reduced.

The following describes the metal trace 40 and the stress adjustment unit 31 in detail, taking the receiver as an example.

As shown in fig. 5 to 9, first, a through hole may be opened in the thickness direction of the wiring board 10, and then the receiver (electronic component 50) may be placed in the through hole. Then, the receiver is fixed on the circuit board 10 by using the solder legs 30 (patch spring plates), and the number of the solder legs 30 can be two and are respectively arranged at the left side and the right side of the receiver. It should be noted that the edge of the fillet 30 may be provided with an inwardly recessed or outwardly protruding stress adjustment portion 31. The metal trace 40 may be provided in the groove, or the metal trace 40 may be connected to the pad 20 (connection portion) corresponding to the protruding stress adjustment portion 31.

In summary, according to the circuit board assembly 100 of the present application, the stress adjustment portion 31 that is recessed inward or protrudes outward along the circumferential direction of the outer contour of the fillet 30 is provided, so that the metal trace 40 can avoid the stress zone, and the risk of breaking the metal trace 40 due to breaking is avoided.

The present application also provides an electronic device including the circuit board assembly 100 according to the above-described embodiment, including but not limited to a mobile phone, a tablet computer, a camera, etc. Since the circuit board assembly 100 according to the present application has the above technical effects, the electronic device according to the present application also has the corresponding technical effects, i.e. the metal traces 40 can be effectively prevented from being broken.

Other configurations and operations of the electronic device according to the present application are known to those of ordinary skill in the art and will not be described in detail herein.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A circuit board assembly, comprising:

a circuit board;

the bonding pad is arranged on the circuit board;

the first side of the welding leg is connected with the bonding pad, the outer contour of the first side of the welding leg is provided with a stress adjusting part which is inwards sunken or outwards protruded along the circumferential direction of the first side of the welding leg, and a connecting part is arranged on the bonding pad at a position corresponding to the stress adjusting part;

the first end of the metal wire is connected with the connecting part.

2. The circuit board assembly of claim 1, wherein an orthographic projection of the solder leg on the circuit board is on the solder pad.

3. A wiring board assembly as claimed in claim 2, wherein the portion of the pad disposed opposite the first side of the solder tail has a shape that conforms to the shape of the first side of the solder tail.

4. The circuit board assembly according to claim 1, wherein the stress adjustment portion is a groove recessed inward along an outer contour of the first side of the solder tail, the connection portion corresponds to the groove in shape, and the first end of the metal trace is connected to a bottom of the connection portion in a depth direction.

5. The circuit board assembly according to claim 4, wherein a position-limiting portion is disposed at a bottom of the connecting portion, and a fixing portion matched with the position-limiting portion is disposed at the first end of the metal trace.

6. The circuit board assembly according to claim 4, wherein the outer contour of the first side of the solder tail is rectangular, the groove is disposed on a wide side of the outer contour of the first side of the solder tail and is recessed inward along the length direction, and the metal trace comprises:

the first section body is positioned in the groove, the first end of the first section body is connected with the connecting part, and the second end of the first section body extends out of the groove;

a second segment connected to a second end of the first segment.

7. The wiring board assembly of claim 6, wherein the first segment is disposed parallel to two sidewalls of the recess in the depth direction.

8. The circuit board assembly according to claim 1, wherein the stress adjustment portion is a protrusion protruding outward along an outer contour of the first side of the solder tail, the connection portion corresponds to the protrusion, and the first end of the metal trace is connected to at least a portion of a side wall surface of the connection portion.

9. The circuit board assembly of claim 8, wherein the boss comprises:

the first end of the first connecting segment is connected with the welding foot, the second end of the first connecting segment protrudes outwards along the outer contour of the first side of the welding foot, and the first connecting segment is a linear segment;

the second connecting segment is arranged at the second end of the first connecting segment, the second connecting segment is a circular segment, and one side of the connecting part, corresponding to the shapes of the second connecting segment and the first connecting segment, is connected with the first end of the metal wiring.

10. An electronic device comprising the wiring board assembly of any one of claims 1-9.

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