JP2005038929A

JP2005038929A - Surface-mounting electronic circuit module

Info

Publication number: JP2005038929A
Application number: JP2003197891A
Authority: JP
Inventors: Yukimasa Monma; 幸昌門馬
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2003-07-16
Filing date: 2003-07-16
Publication date: 2005-02-10

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting electronic circuit module wherein the flatness of a circuit board to a mother board is good and the soldering performance of the circuit board to the mother board is good. <P>SOLUTION: In the surface-mounting electronic circuit module, first slits 5f having clearances by which capillarity is generated are formed on the side board 5b of a shielding case 5. In the case of soldering attachment legs 5e arranged in the shielding case 5 and inner surface electrodes 3 arranged on the circuit board 1, liquefied flux and melted solder invade into the first slits 5f by capillarity and are brought into retained states in the first slits 5f. As a result, effluences of the liquefied flux and the melted solder to the lower surface 1b side of the circuit board 1 are restrained, and a convex part formed by the flux and the solder is eliminated in the lower surface 1b side, so that the flatness of the circuit board 1 to the mother board becomes good, and the module is obtained wherein the soldering performance of the circuit board 1 to the mother board is good. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は近距離無線装置等に使用して好適な面実装型電子回路モジュールに関する。
【０００２】
【従来の技術】
従来の面実装型電子回路モジュールの図面を説明すると、図１０は従来の面実装型電子回路モジュールの分解斜視図、図１１は従来の面実装型電子回路モジュールの斜視図である。
【０００３】
次に、従来の面実装型電子回路モジュールの構成を図１０，図１１に基づいて説明すると、絶縁材からなる回路基板５１は、上面から下面に跨って貫通した状態で、側面（端面）に設けられた凹部５１ａを有する。
【０００４】
また、回路基板５１の上面には、導電パターン５２が設けられると共に、凹部５１ａの内面には、導電パターン５２に接続されたサイド電極５３が設けられ、そして、回路基板５１の上面には、種々の電子部品５４が搭載されて、所望の電気回路が形成されている。
【０００５】
金属板からなる箱形のシールドケース５５は、上面板５５ａと、この上面板５５ａから折り曲げられて下方に延びる４つの側面板５５ｂと、この側面板５５ｂの下端から下方の延びる複数個の取付脚５５ｃと、この取付脚５５ｃから側面板５５ｂに跨って設けられた幅の広い隙間からなるスリット部５５ｄを有する。
【０００６】
このシールドケース５５は、電子部品５４を覆った状態で、側面板５５ｂの下端が回路基板５１の上面に係止されると共に、取付脚５５ｃが凹部５１ａ内に挿入され、取付脚５５ｃとサイド電極５３が半田付けされて、シールドケース５５が回路基板５１に取り付けられる。（例えば、特許文献１参照）
【０００７】
このような構成を有する従来の面実装型電子回路モジュールは、回路基板５１の下面がマザー基板（図示せず）に載置されて、回路基板５１の下面に設けられたランド部（図示せず）がマザー基板の配線パターン（図示せず）に半田等によって接続、固定されて、マザー基板に面実装されるようになっている。
【０００８】
従来の面実装型電子回路モジュールは、取付脚５５ｃにスリット部５５ｄを設けることによって、取付脚５５ｃとサイド電極５３との半田付け境界が増加して、半田付性の向上が図れるようにしている。
【０００９】
しかし、従来のシールドケース５５に設けられたスリット部５５ｄは、幅の広い隙間によって形成されているため、取付脚５５ｃとサイド電極５３を半田付けした時、フラックスや余分となった半田がスリット部５５ｄ内に留まらず、回路基板５１の下面側に流出して、下面側に流出したフラックスや余分となった半田は、回路基板５１の下面から下方に突出して、凸部が形成された状態となる。
【００１０】
その結果、このような構成となった回路基板５１の下面をマザー基板上に載置した際、フラックスや余分となった半田からなる凸部によって、マザー基板に対する回路基板５１の平坦度が悪くなって、回路基板５１のマザー基板への半田付け性が悪くなる。
【００１１】
【特許文献１】
特開平６−２３２６２８
【００１２】
【発明が解決しようとする課題】
従来の面実装型電子回路モジュールにおいて、シールドケース５５に設けられたスリット部５５ｄは、幅の広い隙間によって形成されているため、取付脚５５ｃとサイド電極５３を半田付けした時、フラックスや余分となった半田がスリット部５５ｄ内に留まらず、回路基板５１の下面側に流出して、回路基板５１の下面から下方に突出した凸部が形成された状態となり、その結果、回路基板５１の下面をマザー基板上に載置した際、フラックスや余分となった半田からなる凸部によって、マザー基板に対する回路基板５１の平坦度が悪くなって、回路基板５１のマザー基板への半田付け性が悪くなるという問題がある。
【００１３】
そこで、本発明はマザー基板に対する回路基板の平坦度が良く、回路基板のマザー基板への半田付け性の良好な面実装型電子回路モジュールを提供することを目的とする。
【００１４】
【課題を解決するための手段】
上記課題を解決するための第１の解決手段として、上面に電子部品が搭載され、下面がマザー基板上に搭載可能な回路基板と、箱形をなし、前記電子部品を覆った状態で前記回路基板に半田付けされるシールドケースとを備え、前記回路基板は、上面から下面に跨って貫通して形成された取付部と、この取付部の内面に形成された内面電極を有し、前記シールドケースは、上面板と、この上面板から折り曲げられて下方に延びる側面板と、この側面板の下端よりも下方に延びる取付脚と、前記側面板の下端から前記上面板側に向かって延び、毛細管現象を生じさせる隙間を持って、前記取付脚に隣接した位置で前記側面板に設けられた第１のスリット部を有し、前記シールドケースは、前記側面板の下端が前記回路基板の上面に係止された状態で、前記取付脚が前記取付部内に挿入されると共に、前記取付脚の下端が前記回路基板の下面よりも上方に位置して配置され、前記取付脚と前記内面電極を半田付けした時、半田とフラックスが前記第１のスリット部内に侵入するようにした構成とした。
【００１５】
また、第２の解決手段として、前記側面板には、前記第１のスリット部の上端側に繋がり、前記第１のスリット部より幅の広い孔からなる溜部を設けた構成とした。
また、第３の解決手段として、前記溜部が円形状の孔で形成された構成とした。
【００１６】
また、第４の解決手段として、前記取付脚には、前記第１のスリット部の下端側に繋がった第２のスリット部が設けられた構成とした。
また、第５の解決手段として、前記第２のスリット部が前記第１のスリット部と同じ幅の隙間で形成された構成とした。
また、第６の解決手段として、前記第２のスリット部が前記第１のスリット部より幅の広い隙間で形成された構成とした。
【００１７】
また、第７の解決手段として、前記第１のスリット部が前記取付脚の側部の延長線上に形成された構成とした。
また、第８の解決手段として、前記取付部が貫通孔で形成された構成とした。
【００１８】
また、第９の解決手段として、前記取付部が前記回路基板の側面に設けられた凹部で形成された構成とした。
また、第１０の解決手段として、前記取付脚が少なくとも互いに対向する一対の前記側面板に設けられた構成とした。
【００１９】
【発明の実施の形態】
本発明の面実装型電子回路モジュールの図面を説明すると、図１は本発明の面実装型電子回路モジュールの第１実施例に係る分解斜視図、図２は本発明の面実装型電子回路モジュールの第１実施例に係る正面図、図３は本発明の面実装型電子回路モジュールの第１実施例に係り、取付脚の状態を示す要部断面図、図４は本発明の面実装型電子回路モジュールの第１実施例に係り、シールドケースの取付状態を示す要部断面図である。
【００２０】
また、図５は本発明の面実装型電子回路モジュールの第２実施例に係り、回路基板の斜視図、図６は本発明の面実装型電子回路モジュールの第２実施例に係る正面図、図７は本発明の面実装型電子回路モジュールの第３実施例に係り、シールドケースの要部の斜視図、図８は本発明の面実装型電子回路モジュールの第４実施例に係り、シールドケースの要部の斜視図、図９は本発明の面実装型電子回路モジュールの第５実施例に係り、シールドケースの要部の斜視図である。
【００２１】
次に、本発明の面実装型電子回路モジュールの第１実施例の構成を図１〜図４に基づいて説明すると、一枚、或いは複数枚が積層された絶縁材からなる回路基板１は、上、下面１ａ、１ｂと、この上、下面１ａ、１ｂ間に位置する側面（端面）１ｃと、上面１ａから下面１ｂに跨って貫通した状態で設けられた貫通孔からなる取付部１ｄを有する。
【００２２】
また、回路基板１の上面１ａには、取付部１ｄの近傍を含む位置に形成された導電パターン２を有すると共に、取付部１ｄの内面には、導電パターン２に接続された状態で、内面電極３設けられ、そして、回路基板１１の上面１ａには、種々の電子部品４が搭載されて、所望の電気回路が形成されている。
また、ここでは図示しないが、回路基板１の下面１ｂには、電気回路に接続された外部接続用のランド部等が設けられている。
【００２３】
金属板からなる箱形のシールドケース５は、上面板５ａと、この上面板５ａから折り曲げられて下方に延びる４つの側面板５ｂと、この側面板５ｂの下端５ｃから下方の延び、下端５ｄを有する複数個の取付脚５ｅと、側面板１ｂの下端１ｃから上面板１ａ側に向かって延び、毛細管現象を生じさせる隙間を持って、取付脚５ｅに隣接した位置で側面板１ｂに設けられた第１のスリット部５ｆを有する。
【００２４】
また、シールドケース５は、第１のスリット部１ｆの下端側に繋がり、この第１のスリット部１ｆと同じ幅の隙間で取付脚１ｅに形成された第２のスリット部５ｇと、第１のスリット部１ｆの上端側に繋がり、第１のスリット部１ｆよりも幅の広い円形状の孔が側面板５ｂに形成されてなる溜部５ｈを有する。
【００２５】
そして、第２のスリット部５ｇは、取付脚５ｅの下端５ｄまで形成されて、第２のスリット部２ｆが下端５ｄで開放状態となっている。
なお、この実施例では、溜部５ｈが円形状の孔で形成されたもので説明したが、溜部５ｈが楕円や多角形状の孔で形成されたものでも良い。
【００２６】
このような構成を有するシールドケース５は、電子部品４を覆った状態で、側面板５ｂの下端５ｃが回路基板１の上面に係止されると共に、取付脚５ｅが取付部１ｄ内に挿入される。
【００２７】
この時、取付脚５ｅの下端５ｄは、回路基板１の下面１ｂよりも上方に位置して配置されると共に、第２のスリット部５ｇは、回路基板１の取付部１ｄの内面に対向し、また、第１のスリット部５ｆと溜部５ｈは、回路基板１の上面１ａより上方に位置した状態となる。
【００２８】
この状態で、取付脚５ｅと内面電極３が半田６付けされて、シールドケース５が回路基板１に取り付けられる。
そして、この半田６付の際、液状のフラックスや溶けた余分な半田は、毛細管現象によって、第１のスリット部５ｆ内に侵入し、且つ、侵入したフラックスや半田は、第１のスリット部５ｆを介して溜部５ｈに流入して、フラックスと半田が第１のスリット部５ｆと溜部５ｈに留まった状態となる。
【００２９】
その結果、回路基板１の下面１ｂ側への液状のフラックスや溶けた余分な半田の流出が抑止され、下面１ｂ側において、液状のフラックスや溶けた余分な半田によって形成される凸部が無くなる。
【００３０】
このような構成を有する本発明の面実装型電子回路モジュールは、回路基板１の下面１ｂがマザー基板７（図２参照）に載置されて、回路基板１の下面１ｂに設けられたランド部がマザー基板７の配線パターン（図示せず）に半田等によって接続、固定されて、マザー基板７に面実装されるようになっている。
【００３１】
そして、本発明の面実装型電子回路モジュールの面実装時、液状のフラックスや溶けた余分な半田によって形成される凸部が下面１ｂ側に存在しないため、マザー基板７に対する回路基板１の平坦度が良くなって、回路基板１のマザー基板７への半田付け性が良好となる。
【００３２】
なお、上記実施例では、取付脚５ｅが４つの側面板５ｂのそれぞれに設けられたもので説明したが、取付脚５ｅは、互いに対向する一対の側面板５ｂに設けられたものでも良い。
また、上記実施例において、第２のスリット部５ｇと溜部５ｈの何れか一方、或いは双方を無くしても良い。
【００３３】
また、図５，図６は本発明の面実装型電子回路モジュールの第２実施例を示し、この第２実施例について説明すると、回路基板１の側面１ｃには、凹部からなる取付部１ｄが設けられ、取付脚５ｅが取付部１ｄ内に挿入されて、取付脚５ｅと内面電極３が半田３付けされたものである。
【００３４】
その他の構成は、前記第１実施例と同様であるので、同一部品に同一番号を付し、ここでは、その説明を省略する。
【００３５】
また、図７は本発明の面実装型電子回路モジュールの第３実施例を示し、この第３実施例について説明すると、第１のスリット部５ｆの下端側に繋がって、取付脚５ｅに設けられた第２のスリット部５ｇは、第１のスリット部５ｆより幅の広い隙間で形成され、この幅の広い第２のスリット部５ｇを通して、液状のフラックスや溶けた半田が毛細管現象により第１のスリット部５ｆに侵入するようにしたものである。
【００３６】
その他の構成は、前記第１、或いは第２実施例と同様であるので、同一部品に同一番号を付し、ここでは、その説明を省略する。
【００３７】
また、図８は本発明の面実装型電子回路モジュールの第４実施例を示し、この第４実施例について説明すると、孔からなる溜部５ｈを無くし、第１のスリット部５ｆがＬ字状に設けられると共に、この第１のスリット５ｆの下端側に繋がって設けられた第２のスリット部５ｇは、第１のスリット部５ｆと同じ幅の隙間で形成され、且つ、取付脚５ｅの下端５ｄに至らない状態で形成されたものである。
【００３８】
その他の構成は、前記第１、或いは第２実施例と同様であるので、同一部品に同一番号を付し、ここでは、その説明を省略する。
【００３９】
なお、この第４実施例において、第１のスリット部５ｆの端部には、孔からなる溜部５ｈを設けても良く、また、第２のスリット部５ｇは、第１のスリット部５ｆより幅の広い隙間で形成されても良い。
【００４０】
また、図９は本発明の面実装型電子回路モジュールの第５実施例を示し、この第５実施例について説明すると、第２のスリット部５ｇと孔からなる溜部５ｈを無くし、第１のスリット部５ｆが取付脚５ｅの側部５ｊの延長線上の側面板５ｂに形成されたものである。
【００４１】
そして、取付脚５ｅが取付部１ｄ内に挿入されて、取付脚５ｅと内面電極３が半田３付けされた際、液状のフラックスや溶けた半田が第１のスリット部５ｆに侵入するようにしたものである。
【００４２】
その他の構成は、前記第１、或いは第２実施例と同様であるので、同一部品に同一番号を付し、ここでは、その説明を省略する。
【００４３】
なお、この第５実施例において、第１のスリット部５ｆの端部には、孔からなる溜部５ｈを設けても良い。
【００４４】
【発明の効果】
本発明の面実装型電子回路モジュールは、上面に電子部品が搭載され、下面がマザー基板上に搭載可能な回路基板と、箱形をなし、電子部品を覆った状態で回路基板に半田付けされるシールドケースとを備え、回路基板は、上面から下面に跨って貫通して形成された取付部と、この取付部の内面に形成された内面電極を有し、シールドケースは、上面板と、この上面板から折り曲げられて下方に延びる側面板と、この側面板の下端よりも下方に延びる取付脚と、側面板の下端から上面板側に向かって延び、毛細管現象を生じさせる隙間を持って、取付脚に隣接した位置で側面板に設けられた第１のスリット部を有し、シールドケースは、側面板の下端が回路基板の上面に係止された状態で、取付脚が取付部内に挿入されると共に、取付脚の下端が回路基板の下面よりも上方に位置して配置され、取付脚と内面電極を半田付けした時、半田とフラックスが第１のスリット部内に侵入するようにした構成とした。
このように、側面板に第１のスリット部が形成されて、取付脚と内面電極の半田付の際、液状のフラックスや溶けた余分な半田は、毛細管現象によって、第１のスリット部５ｆ内に侵入して、第１のスリット部内に留まった状態となって、回路基板の下面側への液状のフラックスや溶けた余分な半田の流出が抑止され、下面側において、液状のフラックスや溶けた余分な半田によって形成される凸部が無くなる。
その結果、マザー基板に対する回路基板の平坦度が良くなって、回路基板のマザー基板への半田付け性が良好な面実装型電子回路モジュールを提供できる。
【００４５】
また、側面板には、第１のスリット部の上端側に繋がり、第１のスリット部より幅の広い孔からなる溜部を設けたため、第１のスリット部内に侵入しフラックスや半田は、第１のスリット部を介して溜部に流入して、フラックスと半田が溜部に留まった状態となり、従って、フラックスや半田の留め量を多くできると共に、回路基板の下面側への液状のフラックスや溶けた半田の流出が一層抑止できて、回路基板のマザー基板への半田付け性の一層良好な面実装型電子回路モジュールを提供できる。
【００４６】
また、溜部が円形状の孔で形成されたため、その構成が簡単で、生産性の良好なものが得られる。
【００４７】
また、取付脚には、第１のスリット部の下端側に繋がった第２のスリット部が設けられたため、取付脚と内面電極の半田付の性の良好なものが得られると共に、液状のフラックスや溶けた半田は、第２のスリット部を通して第１のスリット部への侵入が容易となって、フラックスや溶けた半田の第１のスリット部への侵入性の良好なものが得られる。
【００４８】
また、第２のスリット部が第１のスリット部と同じ幅の隙間で形成されたため、その構成が簡単で、生産性の良好なものが得られる。
【００４９】
また、第２のスリット部が第１のスリット部より幅の広い隙間で形成されたため、その構成が簡単で、生産性が良好であると共に、フラックスや溶けた半田の第１のスリット部への侵入性の一層良好なものが得られる。
【００５０】
また、第１のスリット部が取付脚の側部の延長線上に形成されたため、その構成が簡単で、生産性の良好なものが得られる。
【００５１】
また、取付部が貫通孔で形成されたため、その構成が簡単で、且つ、内面電極の形成と、回路基板の生産性の良好なものが得られる。
【００５２】
また、取付部が回路基板の側面に設けられた凹部で形成されたため、回路基板を小さくできて、小型で、安価なものが得られる。
【００５３】
また、取付脚が少なくとも互いに対向する一対の側面板に設けられたため、シールドケースの回路基板への取付の安定したものが得られる。
【図面の簡単な説明】
【図１】本発明の面実装型電子回路モジュールの第１実施例に係る分解斜視図。
【図２】本発明の面実装型電子回路モジュールの第１実施例に係る正面図。
【図３】本発明の面実装型電子回路モジュールの第１実施例に係り、取付脚の状態を示す要部断面図。
【図４】本発明の面実装型電子回路モジュールの第１実施例に係り、シールドケースの取付状態を示す要部断面図。
【図５】本発明の面実装型電子回路モジュールの第２実施例に係り、回路基板の斜視図。
【図６】本発明の面実装型電子回路モジュールの第２実施例に係る正面図。
【図７】本発明の面実装型電子回路モジュールの第３実施例に係り、シールドケースの要部の斜視図。
【図８】本発明の面実装型電子回路モジュールの第４実施例に係り、シールドケースの要部の斜視図。
【図９】本発明の面実装型電子回路モジュールの第５実施例に係り、シールドケースの要部の斜視図。
【図１０】従来の面実装型電子回路モジュールの分解斜視図。
【図１１】従来の面実装型電子回路モジュールの斜視図。
【符号の説明】
１回路基板
１ａ上面
１ｂ下面
１ｃ側面
１ｄ取付部
２導電パターン
３内面電極
４電子部品
５シールドケース
５ａ上面板
５ｂ側面板
５ｃ下端
５ｄ下端
５ｅ取付脚
５ｆ第１のスリット部
５ｇ第２のスリット部
５ｈ溜部
５ｊ側部
６半田
７マザー基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface-mount type electronic circuit module suitable for use in a short-range wireless device or the like.
[0002]
[Prior art]
FIG. 10 is an exploded perspective view of a conventional surface mount electronic circuit module, and FIG. 11 is a perspective view of the conventional surface mount electronic circuit module.
[0003]
Next, the configuration of a conventional surface mount electronic circuit module will be described with reference to FIGS. 10 and 11. The circuit board 51 made of an insulating material is formed on the side surface (end surface) in a state of penetrating from the upper surface to the lower surface. It has the recessed part 51a provided.
[0004]
In addition, a conductive pattern 52 is provided on the upper surface of the circuit board 51, and a side electrode 53 connected to the conductive pattern 52 is provided on the inner surface of the recess 51 a. The electronic component 54 is mounted to form a desired electric circuit.
[0005]
A box-shaped shield case 55 made of a metal plate includes an upper surface plate 55a, four side plates 55b that are bent from the upper surface plate 55a and extend downward, and a plurality of mounting legs that extend downward from the lower end of the side plate 55b. 55c and a slit portion 55d having a wide gap provided from the mounting leg 55c to the side plate 55b.
[0006]
In the shield case 55 covering the electronic component 54, the lower end of the side plate 55b is locked to the upper surface of the circuit board 51, and the mounting leg 55c is inserted into the recess 51a. 53 is soldered, and the shield case 55 is attached to the circuit board 51. (For example, see Patent Document 1)
[0007]
In a conventional surface mount electronic circuit module having such a configuration, a lower surface of a circuit board 51 is placed on a mother board (not shown), and a land portion (not shown) provided on the lower surface of the circuit board 51 is provided. ) Are connected and fixed to a wiring pattern (not shown) of the mother board by solder or the like, and are surface-mounted on the mother board.
[0008]
In the conventional surface mount electronic circuit module, by providing the mounting leg 55c with the slit portion 55d, the soldering boundary between the mounting leg 55c and the side electrode 53 is increased, so that the solderability can be improved. .
[0009]
However, since the slit portion 55d provided in the conventional shield case 55 is formed by a wide gap, when the mounting leg 55c and the side electrode 53 are soldered, the flux or excess solder is removed by the slit portion. The flux or excess solder that flows out to the lower surface side of the circuit board 51 and does not stay within 55d protrudes downward from the lower surface of the circuit board 51 and has a convex portion formed. Become.
[0010]
As a result, when the lower surface of the circuit board 51 having such a configuration is placed on the mother board, the flatness of the circuit board 51 with respect to the mother board deteriorates due to the protrusions made of flux or excess solder. As a result, the solderability of the circuit board 51 to the mother board deteriorates.
[0011]
[Patent Document 1]
JP-A-6-232628
[0012]
[Problems to be solved by the invention]
In the conventional surface mount type electronic circuit module, the slit portion 55d provided in the shield case 55 is formed by a wide gap, and therefore, when the mounting leg 55c and the side electrode 53 are soldered, flux or extra The solder thus formed does not stay in the slit portion 55d but flows out to the lower surface side of the circuit board 51, and a convex portion protruding downward from the lower surface of the circuit board 51 is formed. As a result, the lower surface of the circuit board 51 is formed. When the circuit board 51 is placed on the mother board, the flatness of the circuit board 51 with respect to the mother board is deteriorated due to the convex portion made of flux or excess solder, and the solderability of the circuit board 51 to the mother board is poor. There is a problem of becoming.
[0013]
SUMMARY OF THE INVENTION An object of the present invention is to provide a surface-mount type electronic circuit module having good flatness of a circuit board with respect to a mother board and good solderability of the circuit board to the mother board.
[0014]
[Means for Solving the Problems]
As a first means for solving the above problems, a circuit board having an electronic component mounted on an upper surface and a lower surface mounted on a mother substrate, a box shape, and the circuit in a state of covering the electronic component A shield case soldered to the substrate, wherein the circuit board has an attachment portion formed so as to penetrate from the upper surface to the lower surface, and an inner surface electrode formed on the inner surface of the attachment portion, and the shield The case includes an upper surface plate, a side plate that is bent from the upper surface plate and extends downward, an attachment leg that extends downward from the lower end of the side surface plate, and extends from the lower end of the side surface plate toward the upper surface plate, The shield case has a first slit portion provided in the side plate at a position adjacent to the mounting leg with a gap for causing capillary action, and the shield case has a lower end of the side plate on the upper surface of the circuit board. Locked in When the mounting leg is inserted into the mounting portion and the lower end of the mounting leg is positioned above the lower surface of the circuit board, the mounting leg and the inner surface electrode are soldered. And the flux intrude into the first slit portion.
[0015]
Further, as a second solving means, the side plate is provided with a reservoir portion that is connected to the upper end side of the first slit portion and has a hole wider than the first slit portion.
As a third solution, the reservoir is formed by a circular hole.
[0016]
As a fourth solution, the mounting leg is provided with a second slit portion connected to a lower end side of the first slit portion.
As a fifth solving means, the second slit portion is formed with a gap having the same width as that of the first slit portion.
As a sixth solution, the second slit portion is formed with a gap wider than the first slit portion.
[0017]
As a seventh solution, the first slit portion is formed on an extension line of the side portion of the mounting leg.
Further, as an eighth solving means, the attachment portion is formed by a through hole.
[0018]
As a ninth solution, the mounting portion is formed by a recess provided on a side surface of the circuit board.
As a tenth solution, the mounting legs are provided at least on the pair of side plates facing each other.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is an exploded perspective view of a surface mount electronic circuit module according to a first embodiment of the present invention, and FIG. 2 is a surface mount electronic circuit module according to the present invention. FIG. 3 is a front sectional view showing the state of the mounting leg according to the first embodiment of the surface-mounted electronic circuit module of the present invention, and FIG. 4 is a surface-mounted type according to the present invention. It is principal part sectional drawing which concerns on 1st Example of an electronic circuit module, and shows the attachment state of a shield case.
[0020]
5 is a perspective view of a circuit board according to a second embodiment of the surface-mounted electronic circuit module of the present invention, FIG. 6 is a front view according to the second embodiment of the surface-mounted electronic circuit module of the present invention, FIG. 7 is a perspective view of the main part of the shield case according to a third embodiment of the surface mount electronic circuit module of the present invention, and FIG. 8 is a shield according to the fourth embodiment of the surface mount electronic circuit module of the present invention. FIG. 9 is a perspective view of the main part of the shield case, and FIG. 9 is a perspective view of the main part of the shield case according to the fifth embodiment of the surface mount electronic circuit module of the present invention.
[0021]
Next, the configuration of the first embodiment of the surface-mount type electronic circuit module of the present invention will be described with reference to FIGS. 1 to 4. A circuit board 1 made of an insulating material in which one or a plurality of layers is laminated, There are upper and lower surfaces 1a and 1b, side surfaces (end surfaces) 1c located between the upper and lower surfaces 1a and 1b, and a mounting portion 1d composed of a through hole provided so as to penetrate from the upper surface 1a to the lower surface 1b. .
[0022]
In addition, the upper surface 1a of the circuit board 1 has a conductive pattern 2 formed at a position including the vicinity of the mounting portion 1d, and the inner surface of the mounting portion 1d is connected to the conductive pattern 2 with an inner surface electrode. 3 and various electronic components 4 are mounted on the upper surface 1a of the circuit board 11 to form a desired electric circuit.
Although not shown here, the lower surface 1b of the circuit board 1 is provided with a land portion for external connection connected to an electric circuit.
[0023]
A box-shaped shield case 5 made of a metal plate has an upper surface plate 5a, four side plates 5b that are bent from the upper surface plate 5a and extend downward, and extends downward from a lower end 5c of the side plate 5b. A plurality of mounting legs 5e and a side panel 1b provided on the side panel 1b at a position adjacent to the mounting legs 5e with a gap extending from the lower end 1c of the side panel 1b toward the upper panel 1a and causing capillary action. It has the 1st slit part 5f.
[0024]
The shield case 5 is connected to the lower end side of the first slit portion 1f, the second slit portion 5g formed on the mounting leg 1e with a gap having the same width as the first slit portion 1f, and the first slit portion 1f. It has a reservoir portion 5h that is connected to the upper end side of the slit portion 1f and has a circular hole formed in the side plate 5b that is wider than the first slit portion 1f.
[0025]
The second slit portion 5g is formed up to the lower end 5d of the mounting leg 5e, and the second slit portion 2f is open at the lower end 5d.
In this embodiment, the reservoir 5h is described as being formed with a circular hole. However, the reservoir 5h may be formed with an ellipse or a polygonal hole.
[0026]
In the shield case 5 having such a configuration, the lower end 5c of the side plate 5b is locked to the upper surface of the circuit board 1 while the electronic component 4 is covered, and the mounting leg 5e is inserted into the mounting portion 1d. The
[0027]
At this time, the lower end 5d of the mounting leg 5e is disposed above the lower surface 1b of the circuit board 1, and the second slit portion 5g faces the inner surface of the mounting portion 1d of the circuit board 1, Further, the first slit portion 5 f and the reservoir portion 5 h are located above the upper surface 1 a of the circuit board 1.
[0028]
In this state, the mounting leg 5e and the inner surface electrode 3 are attached to the solder 6, and the shield case 5 is attached to the circuit board 1.
When the solder 6 is attached, liquid flux or melted excess solder penetrates into the first slit portion 5f due to capillary action, and the penetrated flux or solder enters the first slit portion 5f. Then, the flux and the solder flow into the reservoir 5h and remain in the first slit 5f and the reservoir 5h.
[0029]
As a result, the outflow of the liquid flux and the melted excess solder to the lower surface 1b side of the circuit board 1 is suppressed, and the convex portion formed by the liquid flux and the melted excess solder is eliminated on the lower surface 1b side.
[0030]
In the surface-mount type electronic circuit module of the present invention having such a configuration, the lower surface 1b of the circuit board 1 is placed on the mother board 7 (see FIG. 2), and the land portion is provided on the lower surface 1b of the circuit board 1. Is connected and fixed to a wiring pattern (not shown) of the mother substrate 7 by soldering or the like, and is surface-mounted on the mother substrate 7.
[0031]
Further, when the surface mounting type electronic circuit module of the present invention is surface mounted, the convexity formed by the liquid flux or the melted excess solder does not exist on the lower surface 1b side, so the flatness of the circuit board 1 with respect to the mother substrate 7 As a result, the solderability of the circuit board 1 to the mother board 7 is improved.
[0032]
In the above embodiment, the mounting legs 5e are provided on each of the four side plates 5b. However, the mounting legs 5e may be provided on a pair of side plates 5b facing each other.
In the above embodiment, either one or both of the second slit portion 5g and the reservoir portion 5h may be eliminated.
[0033]
FIGS. 5 and 6 show a second embodiment of the surface mount electronic circuit module according to the present invention. The second embodiment will be described. The side surface 1c of the circuit board 1 has a mounting portion 1d formed of a recess. The mounting leg 5e is inserted into the mounting portion 1d, and the mounting leg 5e and the inner surface electrode 3 are soldered.
[0034]
Since other configurations are the same as those of the first embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0035]
FIG. 7 shows a third embodiment of the surface-mount type electronic circuit module according to the present invention. The third embodiment will be described. The third embodiment is connected to the lower end side of the first slit portion 5f and is provided on the mounting leg 5e. The second slit portion 5g is formed with a wider gap than the first slit portion 5f, and the liquid flux or the melted solder passes through the wider second slit portion 5g due to the capillary phenomenon. It is designed to enter the slit portion 5f.
[0036]
Since other configurations are the same as those of the first or second embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0037]
FIG. 8 shows a fourth embodiment of the surface-mount type electronic circuit module according to the present invention. The fourth embodiment will be described. The reservoir 5h made of a hole is eliminated and the first slit portion 5f is L-shaped. And the second slit portion 5g connected to the lower end side of the first slit 5f is formed with a gap having the same width as the first slit portion 5f, and the lower end of the mounting leg 5e. It is formed in a state that does not reach 5d.
[0038]
Since other configurations are the same as those of the first or second embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0039]
In the fourth embodiment, the end portion of the first slit portion 5f may be provided with a reservoir portion 5h formed of a hole, and the second slit portion 5g is formed by the first slit portion 5f. It may be formed with a wide gap.
[0040]
FIG. 9 shows a fifth embodiment of the surface-mount type electronic circuit module according to the present invention. The fifth embodiment will be described. The second slit portion 5g and the reservoir portion 5h composed of holes are eliminated, and the first embodiment The slit portion 5f is formed on the side plate 5b on the extension line of the side portion 5j of the mounting leg 5e.
[0041]
Then, when the mounting leg 5e is inserted into the mounting part 1d and the mounting leg 5e and the inner surface electrode 3 are attached to the solder 3, the liquid flux or the melted solder enters the first slit part 5f. Is.
[0042]
Since other configurations are the same as those of the first or second embodiment, the same parts are denoted by the same reference numerals, and the description thereof is omitted here.
[0043]
In the fifth embodiment, a reservoir 5h made of a hole may be provided at the end of the first slit portion 5f.
[0044]
【The invention's effect】
The surface-mount type electronic circuit module of the present invention has an electronic component mounted on the upper surface, a circuit substrate that can be mounted on the mother substrate on the lower surface, and a box shape that is soldered to the circuit substrate in a state of covering the electronic component. The circuit board has an attachment portion formed so as to penetrate from the upper surface to the lower surface, and an inner surface electrode formed on the inner surface of the attachment portion, and the shield case includes an upper surface plate, A side plate that is bent from the upper surface plate and extends downward, a mounting leg that extends downward from the lower end of the side surface plate, and a gap that extends from the lower end of the side surface plate toward the upper surface plate and causes capillary action. The shield case has a first slit portion provided in the side plate at a position adjacent to the mounting leg, and the shield case has the mounting leg in the mounting portion in a state where the lower end of the side plate is locked to the upper surface of the circuit board. Inserted and under the mounting leg There is arranged located above the lower surface of the circuit board, when the mounting legs and the inner surface electrode is soldered, solder and flux has a structure which is adapted to penetrate into the first slit portion.
As described above, the first slit portion is formed on the side plate, and when the mounting leg and the inner surface electrode are soldered, the liquid flux or the melted excess solder is caused in the first slit portion 5f by capillary action. Intruded into the first slit portion, and the outflow of liquid flux and melted excess solder to the lower surface side of the circuit board is suppressed, and the liquid flux and melted on the lower surface side. The convex portion formed by excess solder is eliminated.
As a result, the flatness of the circuit board with respect to the mother board is improved, and a surface mount electronic circuit module with good solderability of the circuit board to the mother board can be provided.
[0045]
Further, since the side plate is provided with a reservoir that is connected to the upper end side of the first slit portion and has a hole that is wider than the first slit portion, the flux and solder that penetrates into the first slit portion and the 1 flows into the reservoir through the slit portion 1 so that the flux and the solder stay in the reservoir. Therefore, the amount of flux and solder can be increased, and the liquid flux on the lower surface side of the circuit board can be increased. It is possible to provide a surface-mount type electronic circuit module that can further suppress the outflow of the melted solder and has better solderability of the circuit board to the mother board.
[0046]
In addition, since the reservoir is formed of a circular hole, the structure is simple and a product with good productivity can be obtained.
[0047]
Further, since the mounting leg is provided with the second slit portion connected to the lower end side of the first slit portion, the mounting leg and the inner electrode having good solderability can be obtained, and the liquid flux can be obtained. The slightly melted solder can easily enter the first slit portion through the second slit portion, so that a flux or melted solder having good penetration properties into the first slit portion can be obtained.
[0048]
Further, since the second slit portion is formed with a gap having the same width as that of the first slit portion, the configuration is simple and a product with good productivity can be obtained.
[0049]
In addition, since the second slit portion is formed with a gap wider than the first slit portion, the configuration is simple, the productivity is good, and the flux or melted solder to the first slit portion A better penetration property can be obtained.
[0050]
Moreover, since the 1st slit part was formed on the extension line | wire of the side part of an attachment leg, the structure is simple and a thing with favorable productivity is obtained.
[0051]
In addition, since the attachment portion is formed by the through hole, the structure is simple, and the formation of the inner surface electrode and the good productivity of the circuit board can be obtained.
[0052]
In addition, since the attachment portion is formed by a recess provided on the side surface of the circuit board, the circuit board can be made small, and a small and inexpensive product can be obtained.
[0053]
Further, since the mounting legs are provided at least on the pair of side plates facing each other, a stable mounting of the shield case to the circuit board can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a surface mount electronic circuit module according to a first embodiment of the present invention.
FIG. 2 is a front view according to a first embodiment of a surface-mount type electronic circuit module of the present invention.
FIG. 3 is a cross-sectional view of a principal part showing a state of a mounting leg according to the first embodiment of the surface mount electronic circuit module of the present invention.
FIG. 4 is a cross-sectional view of a principal part showing a mounting state of a shield case according to the first embodiment of the surface mount electronic circuit module of the present invention.
FIG. 5 is a perspective view of a circuit board according to a second embodiment of the surface-mounted electronic circuit module of the present invention.
FIG. 6 is a front view according to a second embodiment of the surface-mounted electronic circuit module of the present invention.
FIG. 7 is a perspective view of an essential part of a shield case according to a third embodiment of the surface-mount type electronic circuit module of the present invention.
FIG. 8 is a perspective view of a main part of a shield case according to a fourth embodiment of the surface mount electronic circuit module of the present invention.
FIG. 9 is a perspective view of a main part of a shield case according to a fifth embodiment of the surface-mount type electronic circuit module of the present invention.
FIG. 10 is an exploded perspective view of a conventional surface mount electronic circuit module.
FIG. 11 is a perspective view of a conventional surface mount electronic circuit module.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 1a Upper surface 1b Lower surface 1c Side surface 1d Mounting part 2 Conductive pattern 3 Inner surface electrode 4 Electronic component 5 Shield case 5a Upper surface board 5b Side surface plate 5c Lower end 5d Lower end 5e Mounting leg 5f 1st slit part 5g 2nd slit part 5h Reservoir 5j Side 6 Solder 7 Mother board

Claims

A circuit board having an electronic component mounted on the upper surface and a lower surface mountable on a mother board; and a shield case that has a box shape and is soldered to the circuit board in a state of covering the electronic component. The substrate has a mounting portion formed so as to penetrate from the upper surface to the lower surface, and an inner surface electrode formed on the inner surface of the mounting portion, and the shield case is bent from the upper surface plate and the upper surface plate. A side plate extending downward, a mounting leg extending downward from a lower end of the side plate, a gap extending from the lower end of the side plate toward the upper plate and causing a capillary phenomenon, The shield case has a first slit portion provided in the side plate at an adjacent position, and the mounting leg is attached to the shield case in a state where the lower end of the side plate is locked to the upper surface of the circuit board. When inserted in the club The lower end of the mounting leg is positioned above the lower surface of the circuit board so that when the mounting leg and the inner surface electrode are soldered, the solder and flux enter the first slit portion. Surface mounted electronic circuit module characterized by

The surface-mount type electronic circuit according to claim 1, wherein the side plate is provided with a reservoir portion that is connected to an upper end side of the first slit portion and has a hole wider than the first slit portion. module.

3. The surface mount electronic circuit module according to claim 2, wherein the reservoir is formed of a circular hole.

The surface mounting type electronic circuit module according to any one of claims 1 to 3, wherein the mounting leg is provided with a second slit portion connected to a lower end side of the first slit portion.

5. The surface mount electronic circuit module according to claim 4, wherein the second slit portion is formed with a gap having the same width as the first slit portion.

5. The surface mount electronic circuit module according to claim 4, wherein the second slit portion is formed with a gap wider than the first slit portion.

4. The surface-mount type electronic circuit module according to claim 1, wherein the first slit portion is formed on an extension line of a side portion of the mounting leg. 5.

The surface mounting type electronic circuit module according to claim 1, wherein the attachment portion is formed by a through hole.

The surface mounting type electronic circuit module according to any one of claims 1 to 7, wherein the mounting portion is formed by a recess provided on a side surface of the circuit board.

The surface-mount type electronic circuit module according to claim 1, wherein the mounting legs are provided at least on a pair of the side plates facing each other.