JP2006278962A - Electronic circuit unit - Google Patents

Electronic circuit unit Download PDF

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JP2006278962A
JP2006278962A JP2005099450A JP2005099450A JP2006278962A JP 2006278962 A JP2006278962 A JP 2006278962A JP 2005099450 A JP2005099450 A JP 2005099450A JP 2005099450 A JP2005099450 A JP 2005099450A JP 2006278962 A JP2006278962 A JP 2006278962A
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circuit board
hole
electronic circuit
circuit unit
frame
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JP4502862B2 (en
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Yoshikiyo Watanabe
芳清 渡辺
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Priority to JP2005099450A priority Critical patent/JP4502862B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit in where there is no rattling between a frame and a circuit board, and which can be mounted with accuracy, is small and inexpensive. <P>SOLUTION: In the electronic circuit unit, a pair of mounting legs 2b located on the side wall 2 of a frame 1 has an arm 2e and a protrusion 2f positioned near the tip of the arm 2e, and the protrusion 2f elastically contacts with the wall inside the through hole 5a of the circuit board 5 to hold the circuit board 5, whereby, there is no rattling between the frame 1 and the circuit board 5, and the mounting position between the frame 1 and the circuit board 5 is fixed even in soldering etc. by reflowing. Therefore, the electronic circuit unit can be accurately mounted. Moreover, the tip of the arm 2e is flush with the circuit board 5 or slightly protrudes from the circuit board 5, whereby, the electronic circuit unit can be downsized in a upward/downward direction (a thickness direction). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は携帯電話機に使用される送受信ユニット等に適用して好適な電子回路ユニットに関する。   The present invention relates to an electronic circuit unit suitable for application to a transmission / reception unit used in a mobile phone.

図9は従来の電子回路ユニットの分解斜視図を示し、次に、従来の電子回路ユニットの構成を図9に基づいて説明すると、金属板からなる枠体51は、四方を囲む4つの側壁52を有し、この側壁52は、上、下部に設けられた開口部52a、52bと、下端部52cから下方に直線状に延びる複数個の取付脚52dを有する。   FIG. 9 shows an exploded perspective view of a conventional electronic circuit unit. Next, the configuration of the conventional electronic circuit unit will be described with reference to FIG. 9. A frame 51 made of a metal plate has four side walls 52 surrounding four sides. The side wall 52 has openings 52a and 52b provided at the upper and lower portions, and a plurality of mounting legs 52d extending linearly downward from the lower end portion 52c.

平板状の回路基板53は、複数個の貫通孔53aを有し、この回路基板53には、ここでは図示しないが、配線パターンが設けられると共に、電子部品が搭載されて、所望の電気回路が形成されている。
そして、回路基板53と枠体51の取付は、取付脚52dが貫通孔53aに挿通され、取付脚52dが配線パターンに半田付けされ取り付けられて、従来の電子回路ユニットが形成されている。
The flat circuit board 53 has a plurality of through holes 53a. Although not shown here, the circuit board 53 is provided with a wiring pattern and mounted with electronic components so that a desired electric circuit is provided. Is formed.
The circuit board 53 and the frame 51 are attached by attaching the attachment legs 52d to the through holes 53a and soldering the attachment legs 52d to the wiring pattern to form a conventional electronic circuit unit.

そして、枠体51と回路基板53が取り付けられた際、枠体51の開口部52bを回路基板53で塞ぎ、側壁52の下端部52cが回路基板53の上面に当接すると共に、回路基板53の厚みより長い取付脚52dが回路基板53の下方から大きく突出した状態となって、(例えば、特許文献1参照)   When the frame 51 and the circuit board 53 are attached, the opening 52b of the frame 51 is closed with the circuit board 53, and the lower end 52c of the side wall 52 is in contact with the upper surface of the circuit board 53. The mounting legs 52d that are longer than the thickness project greatly from the lower side of the circuit board 53 (see, for example, Patent Document 1).

しかし、従来の電子回路ユニットは、枠体51の取付脚52dが回路基板53の貫通孔53aに挿通されるため、取付脚52dは、貫通孔53a内の遊びの範囲でガタツキを生じ、リフローによる半田付等において、枠体51と回路基板53間の取付位置にバラツキを生じる。
また、取付脚52dは、貫通孔53aから大きく突出しているため、上下方向(厚み方向)に大きくなると共に、取付脚52dが下端部52cから直線状に突出しているため、回路基板53の外周部には、貫通孔53aを形成するために、側壁52の外面から突出する余裕代部を必要とし、従って、回路基板53が大きくなって、コスト高で、電子回路ユニットが横方向に大きくなる。
However, in the conventional electronic circuit unit, the mounting leg 52d of the frame body 51 is inserted into the through hole 53a of the circuit board 53. Therefore, the mounting leg 52d is rattled in the range of play in the through hole 53a, and is caused by reflow. In soldering or the like, the mounting position between the frame 51 and the circuit board 53 varies.
Since the mounting leg 52d protrudes greatly from the through hole 53a, the mounting leg 52d increases in the vertical direction (thickness direction), and the mounting leg 52d protrudes linearly from the lower end 52c. In order to form the through-hole 53a, a margin part protruding from the outer surface of the side wall 52 is required. Therefore, the circuit board 53 becomes large, and the cost increases and the electronic circuit unit becomes laterally large.

特開2002−94279号公報JP 2002-94279 A

従来の電子回路ユニットは、枠体51の取付脚52dが回路基板53の貫通孔53aに単に挿通されるため、取付脚52dは、貫通孔53a内の遊びの範囲でガタツキを生じ、リフローによる半田付等において、枠体51と回路基板53間の取付位置にバラツキを生じるという問題がある。
また、取付脚52dは、貫通孔53aから大きく突出しているため、上下方向(厚み方向)に大きくなると共に、取付脚52dが下端部52cから直線状に突出しているため、回路基板53の外周部には、貫通孔53aを形成するための余裕代部を必要とし、従って、回路基板53が大きくなって、コスト高で、電子回路ユニットが横方向に大きくなるという問題がある。
In the conventional electronic circuit unit, the mounting leg 52d of the frame body 51 is simply inserted into the through hole 53a of the circuit board 53. Therefore, the mounting leg 52d is rattled in the range of play in the through hole 53a, and soldering due to reflow is performed. In addition, there is a problem that the mounting position between the frame 51 and the circuit board 53 varies.
Since the mounting leg 52d protrudes greatly from the through hole 53a, the mounting leg 52d increases in the vertical direction (thickness direction), and the mounting leg 52d protrudes linearly from the lower end 52c. This requires a margin for forming the through-holes 53a. Therefore, there is a problem that the circuit board 53 becomes large, the cost is high, and the electronic circuit unit becomes laterally large.

そこで、本発明は枠体と回路基板間のガタツキがなく、精度の良い取付ができると共に、小型で、安価な電子回路ユニットを提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic circuit unit that is free from backlash between the frame and the circuit board, can be mounted with high accuracy, and is small and inexpensive.

上記課題を解決するための第1の解決手段として、金属板からなり、四方を囲む側壁を有する箱形の枠体と、この枠体に取り付けられ、電子部品が搭載されて所望の電気回路を形成した回路基板とを備え、前記回路基板には、複数個の貫通孔が設けられると共に、1個の前記側壁、或いは互いに対向する2個の前記側壁には、一対の取付脚が設けられ、この一対の取付脚は、前記側壁から延びる腕部と、この腕部の先端近傍に設けられ、互いに向かい合う方向、或いは互いに反対方向に突出する凸部を有し、一対の前記取付脚の前記凸部のそれぞれは、前記貫通孔内に挿入されて、前記凸部が前記貫通孔内の壁面に弾接して、前記回路基板を保持すると共に、前記凸部の背面と前記貫通孔内の壁面との間には隙間を設け、前記貫通孔内に挿入された前記腕部の先端部は、前記回路基板と面一、或いは前記回路基板から僅かに突出させた構成とした。   As a first means for solving the above problems, a box-shaped frame made of a metal plate and having side walls surrounding four sides, and a desired electric circuit mounted on the frame and mounted with electronic components A plurality of through holes are provided in the circuit board, and a pair of mounting legs are provided on the one side wall or the two side walls facing each other, The pair of mounting legs includes an arm portion extending from the side wall and a convex portion provided in the vicinity of the tip of the arm portion and projecting in a direction facing each other or in a direction opposite to each other. Each of the portions is inserted into the through-hole, and the convex portion elastically contacts the wall surface in the through-hole to hold the circuit board, and the back surface of the convex portion and the wall surface in the through-hole A gap is provided between them and inserted into the through hole. Tip of the arm portion which is the circuit board flush, or has a structure obtained by slightly protruding from the circuit board.

また、第2の解決手段として、前記貫通孔内の前記壁面には導電体が設けられ、前記貫通孔内に位置した前記腕部と前記導電体が半田付けされて、前記回路基板が前記枠体に取り付けられた構成とした。
また、第3の解決手段として、前記腕部の先端から前記凸部の頂部間に位置する前記凸部の外面は、傾斜面となし、前記腕部への前記回路基板の挿入時、前記傾斜面が前記貫通孔のエッジ部に当接して、前記貫通孔への前記腕部の挿入をガイドするようにした構成とした。
As a second solution, a conductor is provided on the wall surface in the through hole, and the arm portion located in the through hole and the conductor are soldered, and the circuit board is attached to the frame. It was set as the structure attached to the body.
Further, as a third solving means, an outer surface of the convex portion located between a tip of the arm portion and a top portion of the convex portion is an inclined surface, and the inclined portion is inserted when the circuit board is inserted into the arm portion. The surface is in contact with the edge portion of the through hole to guide the insertion of the arm portion into the through hole.

また、第4の解決手段として、前記取付脚の前記腕部は、前記側壁に対して直角に前記枠体内方向に延びる第1の延設部と、この第1の延設部の端部から前記枠体の外方向に前記側壁と平行に延びる第2の延設部を有し、前記凸部が前記第2の延設部に設けられた構成とした。
また、第5の解決手段として、互いに対向する2個の前記側壁に設けられた前記腕部の前記凸部は、前記側壁の厚み方向に形成された構成とした。
また、第6の解決手段として、1個の前記側壁に設けられた前記腕部の前記凸部は、前記側壁の厚み方向と直交する幅方向に形成された構成とした。
As a fourth solution, the arm portion of the mounting leg includes a first extending portion extending in the frame body direction at a right angle to the side wall, and an end portion of the first extending portion. It has the 2nd extension part extended in parallel with the said side wall in the outward direction of the said frame, and set it as the structure by which the said convex part was provided in the said 2nd extension part.
As a fifth solution, the convex portions of the arm portions provided on the two opposite side walls are formed in the thickness direction of the side walls.
As a sixth solution, the convex portion of the arm provided on one of the side walls is formed in a width direction perpendicular to the thickness direction of the side walls.

また、第7の解決手段として、前記枠体の上、下部の一方には開放部が設けられ、前記回路基板は、前記電子部品を前記枠体内に位置した状態で、前記開放部を塞ぐように前記側壁の端部に当接して、前記回路基板の上下方向の位置決めが行われるようにした構成とした。
また、第8の解決手段として、前記回路基板を取り付けた前記開口部と反対側の前記枠体の上、下部の他方には、塞ぎ壁が設けられると共に、前記枠体外に露出した前記回路基板の外表面、或いは前記回路基板の積層内には、シールド用導体が設けられた構成とした。
As a seventh solution, an open part is provided on one of the upper and lower parts of the frame, and the circuit board closes the open part with the electronic component positioned in the frame. The circuit board is positioned in the vertical direction by contacting the end of the side wall.
Further, as an eighth solving means, the circuit board exposed to the outside of the frame body is provided with a blocking wall on the other of the upper side and the lower side of the frame body on the side opposite to the opening to which the circuit board is attached. A shield conductor is provided on the outer surface of the substrate or in the laminated circuit board.

本発明の電子回路ユニットは、金属板からなり、四方を囲む側壁を有する箱形の枠体と、この枠体に取り付けられ、電子部品が搭載されて所望の電気回路を形成した回路基板とを備え、回路基板には、複数個の貫通孔が設けられると共に、1個の側壁、或いは互いに対向する2個の側壁には、一対の取付脚が設けられ、この一対の取付脚は、側壁から延びる腕部と、この腕部の先端近傍に設けられ、互いに向かい合う方向、或いは互いに反対方向に突出する凸部を有し、一対の取付脚の凸部のそれぞれは、貫通孔内に挿入されて、凸部が貫通孔内の壁面に弾接して、回路基板を保持すると共に、凸部の背面と貫通孔内の壁面との間には隙間を設け、貫通孔内に挿入された腕部の先端部は、回路基板と面一、或いは回路基板から僅かに突出させた構成とした。
即ち、枠体の側壁に設けた一対の取付脚は、腕部と、この腕部の先端近傍に設けられた凸部を有し、この凸部が回路基板の貫通孔内の壁面に弾接して、回路基板を保持するようにしたため、枠体と回路基板間のガタツキがなく、リフローによる半田付等においても、枠体と回路基板間の取付位置が一定して、精度の良い取付ができ、また、凸部の背面と貫通孔内の壁面との間には隙間を設けたため、加工時等によって、一対の貫通孔間や一対の取付脚間の寸法に誤差が生じても、取付脚が隙間によって容易に変移できて、組立の容易なものが得られると共に、腕部の先端部は、回路基板と面一、或いは回路基板から僅かに突出した状態になっているため、上下方向(厚み方向)に小型化できる。
An electronic circuit unit of the present invention includes a box-shaped frame body made of a metal plate and having side walls that surround four sides, and a circuit board that is attached to the frame body and on which electronic components are mounted to form a desired electric circuit. The circuit board is provided with a plurality of through holes, and a pair of mounting legs are provided on one side wall or two side walls facing each other. An extending arm part and a convex part provided in the vicinity of the tip of the arm part and projecting in a direction facing each other or in a direction opposite to each other, and each of the convex parts of the pair of mounting legs are inserted into the through holes The convex portion elastically contacts the wall surface in the through hole to hold the circuit board, and a gap is provided between the back surface of the convex portion and the wall surface in the through hole so that the arm portion inserted into the through hole The tip should be flush with the circuit board or slightly protrude from the circuit board. It was constructed.
That is, the pair of mounting legs provided on the side wall of the frame has an arm part and a convex part provided near the tip of the arm part, and the convex part elastically contacts the wall surface in the through hole of the circuit board. Since the circuit board is held, there is no backlash between the frame body and the circuit board, and the mounting position between the frame body and the circuit board is constant even when soldering by reflow, etc., and accurate mounting is possible. In addition, since a gap is provided between the back surface of the convex portion and the wall surface in the through hole, the mounting leg can be used even if an error occurs in the dimension between the pair of through holes or the pair of mounting legs due to processing or the like. Can be easily changed by the gap, and an easy assembly is obtained, and the tip of the arm is flush with the circuit board or slightly protrudes from the circuit board. It can be downsized in the thickness direction).

また、貫通孔内の壁面には導電体が設けられ、貫通孔内に位置した腕部と導電体が半田付けされて、回路基板が枠体に取り付けられたため、回路基板と取付脚の半田付が強固になると共に、回路基板外への半田付部のはみ出し量を少なくできる。   In addition, a conductor is provided on the wall surface in the through hole, and the arm portion and the conductor located in the through hole are soldered, and the circuit board is attached to the frame, so that the circuit board and the mounting leg are soldered. And the amount of protrusion of the soldered portion outside the circuit board can be reduced.

また、腕部の先端から凸部の頂部間に位置する凸部の外面は、傾斜面となし、腕部への回路基板の挿入時、傾斜面が貫通孔のエッジ部に当接して、貫通孔への腕部の挿入をガイドするようにしたため、貫通孔内への腕部の挿入作業が容易となって、組立作業の良好なものが得られる。   Also, the outer surface of the convex portion located between the tip of the arm portion and the top of the convex portion is an inclined surface, and when the circuit board is inserted into the arm portion, the inclined surface contacts the edge portion of the through hole and penetrates Since the insertion of the arm portion into the hole is guided, the insertion operation of the arm portion into the through hole is facilitated, and a good assembly operation can be obtained.

また、取付脚の腕部は、側壁に対して直角に枠体内方向に延びる第1の延設部と、この第1の延設部の端部から枠体の外方向に側壁と平行に延びる第2の延設部を有し、凸部が第2の延設部に設けられたため、腕部を長くできて、凸部側の変移の良好なものが得られると共に、回路基板には、貫通孔を形成するための従来の余裕代部を無くすることができ、従って、回路基板を小さくできて、安価で、電子回路ユニットを横方向に小型化できる。   The arm portion of the mounting leg extends in a direction perpendicular to the side wall in the frame body direction, and extends from the end of the first extension portion to the outside of the frame body in parallel with the side wall. Since it has the 2nd extension part and the convex part was provided in the 2nd extension part, the arm part can be lengthened, and a good thing of the change of the convex part side is obtained, The conventional margin portion for forming the through-hole can be eliminated, so that the circuit board can be made small, inexpensive, and the electronic circuit unit can be downsized in the lateral direction.

また、互いに対向する2個の側壁に設けられた腕部の凸部は、側壁の厚み方向に形成されたため、凸部の外面が滑らかになって、貫通孔内への凸部の挿入が円滑にできる。   In addition, since the convex portions of the arm portions provided on the two side walls facing each other are formed in the thickness direction of the side walls, the outer surface of the convex portions becomes smooth, and the convex portions are smoothly inserted into the through holes. Can be.

また、1個の側壁に設けられた腕部の凸部は、側壁の厚み方向と直交する幅方向に形成されたため、腕部と凸部は、金属板の打ち抜き加工によって形成できて、加工性の良好なものが得られる。   In addition, since the convex part of the arm part provided on one side wall is formed in the width direction orthogonal to the thickness direction of the side wall, the arm part and the convex part can be formed by punching a metal plate, and workability Can be obtained.

また、枠体の上、下部の一方には開放部が設けられ、回路基板は、電子部品を枠体内に位置した状態で、開放部を塞ぐように側壁の端部に当接して、回路基板の上下方向の位置決めが行われるようにしたため、回路基板の位置決めが簡単で、精度の良いものが得られる。   In addition, an open part is provided on one of the upper and lower parts of the frame, and the circuit board is in contact with the end of the side wall so as to close the open part with the electronic component positioned in the frame. Therefore, the circuit board can be easily positioned with high accuracy.

また、回路基板を取り付けた開口部と反対側の枠体の上、下部の他方には、塞ぎ壁が設けられると共に、枠体外に露出した回路基板の外表面、或いは回路基板の積層内には、シールド用導体が設けられたため、回路基板がシールドを兼ねることができて、部品点数が少なく、薄型のものが得られる。   In addition, a blocking wall is provided on the other side of the upper and lower parts of the frame opposite to the opening to which the circuit board is attached, and the outer surface of the circuit board exposed outside the frame or in the stack of circuit boards Since the shield conductor is provided, the circuit board can also serve as a shield, and the number of components is small and a thin one can be obtained.

本発明の電子回路ユニットの図面を説明すると、図1は本発明の電子回路ユニットの第1実施例に係る分解斜視図、図2は本発明の電子回路ユニットの第1実施例に係る要部の拡大斜視図、図3は本発明の電子回路ユニットの第1実施例に係る要部の拡大断面図、図4は本発明の電子回路ユニットの第2実施例に係る要部の拡大断面図、図5は本発明の電子回路ユニットの第3実施例に係る要部の拡大斜視図、図6は本発明の電子回路ユニットの第4実施例に係る要部の拡大斜視図、図7は本発明の電子回路ユニットの第5実施例に係る要部の拡大斜視図、図8は本発明の電子回路ユニットの第6実施例に係る要部の拡大斜視図である。   FIG. 1 is an exploded perspective view according to a first embodiment of the electronic circuit unit of the present invention, and FIG. 2 is a main portion according to the first embodiment of the electronic circuit unit of the present invention. FIG. 3 is an enlarged cross-sectional view of the main part according to the first embodiment of the electronic circuit unit of the present invention, and FIG. 4 is an enlarged cross-sectional view of the main part according to the second embodiment of the electronic circuit unit of the present invention. 5 is an enlarged perspective view of the main part according to the third embodiment of the electronic circuit unit of the present invention, FIG. 6 is an enlarged perspective view of the main part according to the fourth embodiment of the electronic circuit unit of the present invention, and FIG. FIG. 8 is an enlarged perspective view of the main part according to the sixth embodiment of the electronic circuit unit of the present invention, and FIG. 8 is an enlarged perspective view of the main part according to the sixth embodiment of the electronic circuit unit of the present invention.

次に、本発明の電子回路ユニットの第1実施例に係る構成を図1〜図3に基づいて説明すると、金属板からなる箱形の枠体1は、四方を囲む4つの側壁2と、この側壁2の一方(上方部)に設けられた開口部3と、側壁2の他方(下方部)の開口を塞ぐ塞ぎ壁4を有する。   Next, the configuration according to the first embodiment of the electronic circuit unit of the present invention will be described with reference to FIGS. 1 to 3. A box-shaped frame body 1 made of a metal plate includes four side walls 2 surrounding four sides, An opening 3 provided on one side (upper part) of the side wall 2 and a blocking wall 4 that closes an opening on the other side (lower part) of the side wall 2 are provided.

また、側壁2には、開口部3側の端部2aから突出した複数個の取付脚2bが設けられ、この取付脚2bは、側壁2に対して直角に枠体1内方向に延びる第1の延設部2c、及びこの第1の延設部2cの端部から開口部3方向(枠体1の外方向)に側壁2と平行に延びる第2の延設部2dとからなる腕部2eと、側壁2の厚み方向と直交する幅方向に形成され、腕部2eの端部近傍に設けられて丸味を持たせた凸部2fを有する。   The side wall 2 is provided with a plurality of mounting legs 2b protruding from the end 2a on the opening 3 side. The mounting legs 2b extend inwardly in the frame 1 at right angles to the side wall 2. And an arm portion comprising a second extending portion 2d extending in parallel with the side wall 2 in the direction of the opening 3 (outward direction of the frame 1) from the end portion of the first extending portion 2c. 2e and a convex portion 2f formed in the width direction orthogonal to the thickness direction of the side wall 2 and provided in the vicinity of the end portion of the arm portion 2e and rounded.

1個の側板2には、2個で対となった取付脚2bが間隔を置いて設けられ、この一対の取付脚2bの凸部2fは、互いに反対方向に突出して配置されると共に、腕部2eの先端から凸部2fの頂部間(上方部側)に位置する凸部2fの外面は、傾斜面2gに形成されている。   One side plate 2 is provided with a pair of two mounting legs 2b spaced apart from each other, and the convex portions 2f of the pair of mounting legs 2b are arranged to protrude in opposite directions, The outer surface of the convex part 2f located between the tip of the part 2e and the top of the convex part 2f (upper part side) is formed on the inclined surface 2g.

セラミック基板等からなる回路基板5は、取付脚2bの凸部2fに対応して設けられた複数個の貫通孔5aを有すると共に、回路基板5には、一面側の全面に設けられた導電材からなるシールド用導体6と、このシールド用導体6に繋がり、貫通孔5a内の壁面に設けられた導電体7と、他面側に設けられた配線パターン(図示せず)に接続されて、他面側に搭載された種々の電子部品8を有して、回路基板5は、所望の電気回路を有したものとなっている。   The circuit board 5 made of a ceramic substrate or the like has a plurality of through holes 5a provided corresponding to the convex portions 2f of the mounting legs 2b, and the circuit board 5 has a conductive material provided on the entire surface on one side. Connected to the shield conductor 6, the conductor 7 connected to the shield conductor 6, provided on the wall surface in the through hole 5 a, and a wiring pattern (not shown) provided on the other surface side, The circuit board 5 includes various electronic components 8 mounted on the other side, and has a desired electric circuit.

このような構成を有する回路基板5は、枠体1の開放部3を塞ぐように、電子部品8が枠体1内に収納された状態で、側壁2の端部2a上に載置されて、下方向(上下方向)の位置決めが行われると共に、回路基板5の外周部は、側壁2の外面と面一状態になっている。   The circuit board 5 having such a configuration is placed on the end portion 2a of the side wall 2 in a state where the electronic component 8 is housed in the frame body 1 so as to close the open portion 3 of the frame body 1. Positioning in the downward direction (vertical direction) is performed, and the outer peripheral portion of the circuit board 5 is flush with the outer surface of the side wall 2.

なお、回路基板5の下方向の位置決めは、側壁2の端部2aに代わる適宜手段によって行っても良く、この場合、回路基板5全体が枠体1内に収納できる構成が可能となって、回路基板5の小型化を図ることができる。   The downward positioning of the circuit board 5 may be performed by appropriate means instead of the end 2a of the side wall 2. In this case, a configuration in which the entire circuit board 5 can be accommodated in the frame 1 is possible. The circuit board 5 can be downsized.

また、回路基板5の取付時、凸部2fの傾斜面2gが貫通孔5aのエッジ部に当接して、腕部2eが傾斜面2gに沿って変移すると共に、凸部2fの全体が貫通孔5a内に位置すると、図3に示すように、凸部2fの頂部が貫通孔5a内の壁面に弾接し、一対の取付脚2bによって、回路基板5を矢印A1方向に弾圧して、回路基板5を保持するようになっている。
この時、腕部2eの先端部は、回路基板5の外表面と面一、或いは回路基板5の外表面から僅かに突出した状態にあると共に、凸部2fの背面と貫通孔5a内の壁面との間には、隙間が存在した状態となっている。
Further, when the circuit board 5 is attached, the inclined surface 2g of the convex portion 2f contacts the edge portion of the through hole 5a, the arm portion 2e changes along the inclined surface 2g, and the entire convex portion 2f is formed in the through hole. When located in 5a, as shown in FIG. 3, the top of the convex portion 2f is elastically contacted with the wall surface in the through hole 5a, and the circuit board 5 is elastically pressed in the direction of the arrow A1 by the pair of mounting legs 2b. 5 is held.
At this time, the tip of the arm 2e is flush with the outer surface of the circuit board 5 or slightly protrudes from the outer surface of the circuit board 5, and the back surface of the convex part 2f and the wall surface in the through hole 5a. There is a gap between them.

そして、取付脚2bの貫通孔5a内に位置した腕部2eと導電体7は、貫通孔5a内で半田9付されて、枠体1は、シールド用導体6に接続されて接地された構成となって、枠体1内の電子部品8は、側壁2と塞ぎ壁4,及びシールド用導体6によって電気的にシールドされた状態となる。
この半田9付は、貫通孔5a内にクリーム半田が充填された状態で、リフロー炉に搬送されて、その半田9付が行われるが、回路基板5は、取付脚2bによって保持された状態になっているため、搬送時等におけるガタツキが無く、精度の良い取付ができる。
The arm 2e and the conductor 7 located in the through hole 5a of the mounting leg 2b are soldered 9 in the through hole 5a, and the frame 1 is connected to the shield conductor 6 and grounded. Thus, the electronic component 8 in the frame body 1 is electrically shielded by the side wall 2, the closing wall 4, and the shield conductor 6.
The solder 9 is transferred to a reflow furnace in a state where cream solder is filled in the through-hole 5a, and the solder 9 is applied. However, the circuit board 5 is held by the mounting legs 2b. Therefore, there is no backlash at the time of conveyance or the like, and attachment with high accuracy can be performed.

また、図4は本発明の電子回路ユニットの第2実施例を示し、この第2実施例は、一対の取付脚2bに設けられた凸部2fが互いに向かい合って配置され、この一対の取付脚2bによって、回路基板5を矢印A2方向に弾圧して、回路基板5を保持するようになっている。
その他の構成は、前記第1実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 4 shows a second embodiment of the electronic circuit unit according to the present invention. In the second embodiment, the convex portions 2f provided on the pair of mounting legs 2b are arranged to face each other, and the pair of mounting legs. By 2b, the circuit board 5 is pressed in the direction of the arrow A2 to hold the circuit board 5.
Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

また、図5は本発明の電子回路ユニットの第3実施例を示し、この第3実施例は、取付脚2bの腕部2eが側壁2の端部2aから上方に向かって直線状に延びて形成されたものである。
その他の構成は、前記第1実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 5 shows a third embodiment of the electronic circuit unit of the present invention. In this third embodiment, the arm portion 2e of the mounting leg 2b extends linearly from the end portion 2a of the side wall 2 upward. It is formed.
Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

また、図6は本発明の電子回路ユニットの第4実施例を示し、この第4実施例は、取付脚2bの腕部2eが側壁2の端部2aから上方に向かって直線状に延びて形成されたものである。
その他の構成は、前記第2実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 6 shows a fourth embodiment of the electronic circuit unit according to the present invention. In the fourth embodiment, the arm portion 2e of the mounting leg 2b extends linearly from the end portion 2a of the side wall 2 upward. It is formed.
Other configurations are the same as those of the second embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

また、図7は本発明の電子回路ユニットの第5実施例を示し、この第5実施例について説明すると、互いに対向する2個の側壁2には、一対の取付脚2bが設けられ、この取付脚2bの腕部2eに設けられた凸部2fは、側壁2の厚み方向に形成されると共に、一対の取付脚2bの凸部2fは、互いに反対方向に突出して配置されたものである。
その他の構成は、前記第1実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 7 shows a fifth embodiment of the electronic circuit unit according to the present invention. The fifth embodiment will be described. A pair of mounting legs 2b are provided on two side walls 2 facing each other. The convex portions 2f provided on the arm portions 2e of the legs 2b are formed in the thickness direction of the side wall 2, and the convex portions 2f of the pair of mounting legs 2b are arranged to protrude in opposite directions.
Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

また、図8は本発明の電子回路ユニットの第6実施例を示し、この第6実施例について説明すると、互いに対向する2個の側壁2には、一対の取付脚2bが設けられ、この取付脚2bの腕部2eに設けられた凸部2fは、側壁2の厚み方向に形成されると共に、一対の取付脚2bの凸部2fは、互いに向かい合った状態で配置されたものである。
その他の構成は、前記第2実施例と同様の構成を有し、同一部品に同一番号を付し、ここではその説明を省略する。
FIG. 8 shows a sixth embodiment of the electronic circuit unit of the present invention. The sixth embodiment will be described. A pair of mounting legs 2b are provided on two side walls 2 facing each other. The convex part 2f provided in the arm part 2e of the leg 2b is formed in the thickness direction of the side wall 2, and the convex part 2f of the pair of mounting legs 2b is arranged facing each other.
Other configurations are the same as those of the second embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

なお、上記第5,第6実施例における取付脚2bの腕部2eは、側壁2の端部2aから上方に向かって直線状に延びて形成されたものでも良い。
また、上記実施例では、回路基板5の外表面にシールド用導体6を設けたもので説明したが、回路基板5の積層内にシールド用導体6を設けても良い。
In addition, the arm part 2e of the attachment leg 2b in the said 5th, 6th Example may be extended and formed linearly from the edge part 2a of the side wall 2 upwards.
In the above embodiment, the shield conductor 6 is provided on the outer surface of the circuit board 5. However, the shield conductor 6 may be provided in the laminated circuit board 5.

本発明の電子回路ユニットの第1実施例に係る分解斜視図。The disassembled perspective view which concerns on 1st Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第1実施例に係る要部の拡大斜視図。The expanded perspective view of the principal part which concerns on 1st Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第1実施例に係る要部の拡大断面図。The expanded sectional view of the principal part which concerns on 1st Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第2実施例に係る要部の拡大断面図。The expanded sectional view of the principal part which concerns on 2nd Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第3実施例に係る要部の拡大斜視図。The expanded perspective view of the principal part which concerns on 3rd Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第4実施例に係る要部の拡大斜視図。The expanded perspective view of the principal part which concerns on 4th Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第5実施例に係る要部の拡大斜視図。The expanded perspective view of the principal part which concerns on 5th Example of the electronic circuit unit of this invention. 本発明の電子回路ユニットの第6実施例に係る要部の拡大斜視図。The expanded perspective view of the principal part which concerns on 6th Example of the electronic circuit unit of this invention. 従来の電子回路ユニットに係る分解斜視図。The disassembled perspective view which concerns on the conventional electronic circuit unit.

符号の説明Explanation of symbols

1:枠体
2:側壁
2a:端部
2b:取付脚
2c:第1の延設部
2d:第2の延設部
2e:腕部
2f:凸部
2g:傾斜面
3:開口部
4:塞ぎ壁
5:回路基板
5a:貫通孔
6:シールド用導体
7:導電体
8:電子部品
9:半田
1: Frame body 2: Side wall 2a: End 2b: Mounting leg 2c: First extending portion 2d: Second extending portion 2e: Arm portion 2f: Convex portion 2g: Inclined surface 3: Opening portion 4: Blocking Wall 5: Circuit board 5a: Through hole 6: Conductor for shield 7: Conductor 8: Electronic component 9: Solder

Claims (8)

金属板からなり、四方を囲む側壁を有する箱形の枠体と、この枠体に取り付けられ、電子部品が搭載されて所望の電気回路を形成した回路基板とを備え、前記回路基板には、複数個の貫通孔が設けられると共に、1個の前記側壁、或いは互いに対向する2個の前記側壁には、一対の取付脚が設けられ、この一対の取付脚は、前記側壁から延びる腕部と、この腕部の先端近傍に設けられ、互いに向かい合う方向、或いは互いに反対方向に突出する凸部を有し、一対の前記取付脚の前記凸部のそれぞれは、前記貫通孔内に挿入されて、前記凸部が前記貫通孔内の壁面に弾接して、前記回路基板を保持すると共に、前記凸部の背面と前記貫通孔内の壁面との間には隙間を設け、前記貫通孔内に挿入された前記腕部の先端部は、前記回路基板と面一、或いは前記回路基板から僅かに突出させたことを特徴とする電子回路ユニット。 A box-shaped frame made of a metal plate and having side walls that surround four sides, and a circuit board mounted on the frame and mounted with electronic components to form a desired electric circuit, the circuit board includes: A plurality of through holes are provided, and a pair of mounting legs are provided on one side wall or the two side walls facing each other, and the pair of mounting legs includes arm portions extending from the side walls. , Provided in the vicinity of the tip of the arm portion, and having a convex portion projecting in a direction facing each other or in the opposite direction, each of the convex portions of the pair of mounting legs is inserted into the through hole, The convex portion elastically contacts the wall surface in the through hole to hold the circuit board, and a gap is provided between the back surface of the convex portion and the wall surface in the through hole, and is inserted into the through hole. The tip of the arm portion is flush with the circuit board, Electronic circuit unit have is characterized in that is slightly protruding from the circuit board. 前記貫通孔内の前記壁面には導電体が設けられ、前記貫通孔内に位置した前記腕部と前記導電体が半田付けされて、前記回路基板が前記枠体に取り付けられたことを特徴とする請求項1記載の電子回路ユニット。 A conductor is provided on the wall surface in the through hole, the arm portion located in the through hole and the conductor are soldered, and the circuit board is attached to the frame. The electronic circuit unit according to claim 1. 前記腕部の先端から前記凸部の頂部間に位置する前記凸部の外面は、傾斜面となし、前記腕部への前記回路基板の挿入時、前記傾斜面が前記貫通孔のエッジ部に当接して、前記貫通孔への前記腕部の挿入をガイドするようにしたことを特徴とする請求項1、又は2記載の電子回路ユニット。 The outer surface of the convex portion located between the tip of the arm portion and the top of the convex portion is an inclined surface, and when the circuit board is inserted into the arm portion, the inclined surface becomes an edge portion of the through hole. The electronic circuit unit according to claim 1, wherein the electronic circuit unit is in contact with each other to guide insertion of the arm portion into the through hole. 前記取付脚の前記腕部は、前記側壁に対して直角に前記枠体内方向に延びる第1の延設部と、この第1の延設部の端部から前記枠体の外方向に前記側壁と平行に延びる第2の延設部を有し、前記凸部が前記第2の延設部に設けられたことを特徴とする請求項1から3の何れかに記載の電子回路ユニット。 The arm portion of the mounting leg includes a first extending portion extending in the frame body direction at a right angle to the side wall, and the side wall extending outward from the end portion of the first extending portion. 4. The electronic circuit unit according to claim 1, further comprising: a second extending portion extending in parallel with the second extending portion, wherein the convex portion is provided in the second extending portion. 5. 互いに対向する2個の前記側壁に設けられた前記腕部の前記凸部は、前記側壁の厚み方向に形成されたことを特徴とする請求項1から4の何れかに記載の電子回路ユニット。 5. The electronic circuit unit according to claim 1, wherein the convex portions of the arm portions provided on the two opposite side walls are formed in a thickness direction of the side walls. 1個の前記側壁に設けられた前記腕部の前記凸部は、前記側壁の厚み方向と直交する幅方向に形成されたことを特徴とする請求項1から4の何れかに記載の電子回路ユニット。 5. The electronic circuit according to claim 1, wherein the convex portion of the arm portion provided on one side wall is formed in a width direction orthogonal to a thickness direction of the side wall. unit. 前記枠体の上、下部の一方には開放部が設けられ、前記回路基板は、前記電子部品を前記枠体内に位置した状態で、前記開放部を塞ぐように前記側壁の端部に当接して、前記回路基板の上下方向の位置決めが行われるようにしたことを特徴とする請求項1から6の何れかに記載の電子回路ユニット。 An open portion is provided on one of the upper and lower portions of the frame body, and the circuit board abuts against an end portion of the side wall so as to close the open portion in a state where the electronic component is located in the frame body. The electronic circuit unit according to claim 1, wherein the circuit board is positioned in a vertical direction. 前記回路基板を取り付けた前記開口部と反対側の前記枠体の上、下部の他方には、塞ぎ壁が設けられると共に、前記枠体外に露出した前記回路基板の外表面、或いは前記回路基板の積層内には、シールド用導体が設けられたことを特徴とする請求項7記載の電子回路ユニット。
The other of the upper and lower parts of the frame opposite to the opening to which the circuit board is attached is provided with a blocking wall, and the outer surface of the circuit board exposed outside the frame or the circuit board 8. The electronic circuit unit according to claim 7, wherein a shield conductor is provided in the laminate.
JP2005099450A 2005-03-30 2005-03-30 Electronic circuit unit Active JP4502862B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076594A (en) * 2007-09-19 2009-04-09 Alps Electric Co Ltd Electronic circuit module
JP2012044017A (en) * 2010-08-20 2012-03-01 Alps Electric Co Ltd Electronic apparatus
JP2012109340A (en) * 2010-11-16 2012-06-07 Alps Electric Co Ltd Electronic circuit unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5663419B2 (en) * 2011-06-30 2015-02-04 アルプス電気株式会社 Electronic circuit module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555596U (en) * 1991-12-20 1993-07-23 日本ビクター株式会社 Lead shape of shield case for printed wiring board
JPH07122875A (en) * 1993-10-28 1995-05-12 Matsushita Electric Ind Co Ltd Shield case
JP2003179378A (en) * 2001-12-11 2003-06-27 Ngk Insulators Ltd Installation structure of shield case in circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555596U (en) * 1991-12-20 1993-07-23 日本ビクター株式会社 Lead shape of shield case for printed wiring board
JPH07122875A (en) * 1993-10-28 1995-05-12 Matsushita Electric Ind Co Ltd Shield case
JP2003179378A (en) * 2001-12-11 2003-06-27 Ngk Insulators Ltd Installation structure of shield case in circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076594A (en) * 2007-09-19 2009-04-09 Alps Electric Co Ltd Electronic circuit module
JP2012044017A (en) * 2010-08-20 2012-03-01 Alps Electric Co Ltd Electronic apparatus
JP2012109340A (en) * 2010-11-16 2012-06-07 Alps Electric Co Ltd Electronic circuit unit

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JP4502862B2 (en) 2010-07-14

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