JP6738688B2 - Substrate for setting and fixing - Google Patents

Description

The present invention relates to a substrate set and a fixing sub substrate.

A wiring board has a circuit pattern formed by conducting paths made of thin metal foil on one surface of an insulating substrate made of insulating synthetic resin, etc. The through hole is formed. For electronic parts and parts such as transformers, the pin terminals are inserted into the through holes and mounted, and the pin terminals and the conductive paths are soldered to form an electric circuit. The wiring board on which the electronic components and the like are mounted is mounted in the housing of the electric device.

In order to realize a desired function, a small sub-board may be electrically connected and attached to the main board. For example, it is known that the sub-board is held perpendicular to the main board, and the board terminals of the sub-board and the board terminals of the main board are electrically connected to each other via solder (Patent Document 1).

When the sub-board is mounted on the main board as described above, the sub-board insertion opening is formed on the main board, and a plurality of pads are formed on both sides of the sub-board insertion opening on the solder side. On the other hand, a plurality of pads are formed on both sides of the lower end of the sub-board. Then, the lower end of the sub-board is inserted into the sub-board insertion opening of the main board, and the pads of the main board and the pads of the sub-board are connected by soldering to mount the sub-board on the main board.

JP, 2004-153178, A

However, when the sub-board is mounted on the main board, since only solder is connected, there is a problem that the connection strength is poor and the reliability is low. Although it is possible to adopt a structure in which a fall prevention jig is attached to the lateral end of the sub-board as described in Patent Document 1, a space for the jig is required when a plurality of sub-boards are attached to the main board. At the same time, since it is necessary to attach each sub-board, there is a problem that the manufacturing cost is high.

The present invention has been made to solve such a problem, and when mounting a sub-board on a main board, it is possible to fix a plurality of boards with a relatively simple configuration. The purpose is to provide sets, etc.

The above problems are solved by the present invention having the following features. That is, a substrate set according to one aspect of the present invention includes a main substrate, a sub substrate attached to the main substrate, a fixing sub substrate having openings into which the main substrate and the sub substrate can be inserted, respectively. A substrate set including, wherein the fixing sub-board is attached to the main board and the sub-board in a state where the main board and the sub-board penetrate the corresponding openings. It is a characteristic board set.

According to the present invention thus configured, the fixing sub-board is attached to the main board and the sub-board in a state where the main board and the sub-board penetrate through the openings of the corresponding fixing sub-board. It is possible to fix the main board and the sub board through the fixing sub board. Accordingly, it is possible to fix the plurality of substrates in a more stable state with a relatively simple configuration.

A substrate set according to one embodiment of the present invention includes a main substrate, a sub substrate attached to the main substrate, another sub substrate attached to the main substrate, the sub substrate and the other sub substrate. And a fixing sub-board having an opening into which each of the sub-boards can be inserted, wherein the fixing board is provided with the sub-board and the other sub-board penetrating the corresponding openings. The sub-board is a board set characterized by being attached to the sub-board and the other sub-board.

According to the present invention thus configured, since the fixing sub-boards are attached to the two sub-boards with the two sub-boards penetrating through the openings of the corresponding fixing sub-boards, The two sub-boards can be fixed via the sub-board for use. Accordingly, it is possible to fix the plurality of substrates in a more stable state with a relatively simple configuration.

As one aspect of the present invention, the sub-board is connected to the fixing sub-board by soldering.

According to the present invention thus configured, the sub-board can be fixed while being electrically connected to the fixing sub-board.

As one aspect of the present invention, the main substrate has a convex portion protruding from a side surface, and the opening portion of the fixing sub-board into which the main substrate can be inserted is an opening portion into which the convex portion can be inserted. Then, the fixing sub-board is attached to the main board in a state where the protrusion penetrates the corresponding opening.

According to the present invention configured as described above, the fixing sub-board has an opening into which a protrusion protruding from the side surface of the main substrate can be inserted, and the fixing sub-board is fixed with the protrusion penetrating the opening. The sub-board for mounting is attached to the main board. Accordingly, the fixing sub-board can be fixedly attached to the side surface of the main board.

As one aspect of the present invention, the main substrate has another protrusion protruding from another side adjacent to the side having the protrusion, and the sub-substrate is larger than an end face of the other protrusion. An opening is formed, and the sub-board is attached to the side surface of the main board with the other projection passing through the opening.

According to the present invention thus configured, since the sub-board is attached in a state where the sub-board is pierced through the other convex portion projecting from the other side surface of the main board, the sub-board can be mounted on the main board in a relatively stable state. The main board and the sub board can be fixed in a more stable state via the fixing sub board while mounting.

A fixing sub-board according to one aspect of the present invention is a fixing sub-board that fixes a sub-board attached to a main board, and has an opening for inserting the sub-board. The fixing sub-board can be attached to the main board while penetrating the corresponding opening.

According to the present invention having such a configuration, the fixing sub-board can be attached to the main board in a state where the sub-board penetrates the opening of the corresponding fixing sub-board. It can be used to fix the main substrate and the sub-substrate.

According to the present invention, when mounting a sub-board on a main board, a plurality of boards can be fixed with a relatively simple configuration.

It is the top view seen from the surface of the substrate set of the 1st Embodiment of this invention. It is a perspective view of the substrate set of the 1st Embodiment of this invention. It is the top view seen from the surface of the main substrate of the 1st Embodiment of this invention. It is a perspective view of the main board of the 1st Embodiment of this invention. It is the top view seen from the surface of the 1st sub board of a 1st embodiment of the present invention. It is the top view seen from the surface of the 2nd sub board of the 1st embodiment of the present invention. It is the top view seen from the surface of the fixing sub-board of the 1st Embodiment of this invention. It is the top view seen from the surface of the board|substrate set of the 2nd Embodiment of this invention. It is a perspective view of the substrate set of the 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same or corresponding parts unless otherwise specified, and for convenience, the vertical and horizontal scales of members or parts may be different from actual ones.

FIG. 1 is an outline view showing a board set according to a first embodiment, FIG. 1 a is a plan view of the board set 10 seen from the surface of the main board 11, and FIG. 1b is a perspective view of the board set 10. is there. The substrate set 10 includes a main substrate 11, a first sub substrate 12, a second sub substrate 13, and a fixing sub substrate 14. Each board is preferably a general printed board, and electronic components can be mounted on the wired board (not shown).

FIG. 2 is an external view showing the main substrate according to the first embodiment, FIG. 2a is a plan view seen from the surface of the main substrate 11, and FIG. 2b is a perspective view of the main substrate 11. The main board 11 has a main body 11a and a convex portion 11b protruding from the side surface of the outer edge of the main body 11a. Further, the main substrate 11 includes a first convex portion 11c protruding from another side surface adjacent to a side surface of the main body portion 11a having the convex portion 11b and a second convex portion 11c protruding from an end surface (tip surface) of the first convex portion 11c. 11d.

It is preferable that the width and the thickness of each of the convex portion 11b, the first convex portion 11c, and the second convex portion 11d do not substantially change depending on the height direction, that is, the protruding direction of each convex portion. The end surface of the first convex portion 11c and the end surface (tip surface) of the second convex portion 11d at the base portion of the second convex portion 11d are the side surfaces of the main body portion 11a at the base portion of the first convex portion 11c. Is preferably substantially parallel to. Further, as understood from the configuration shown in FIG. 1a, the height of the convex portion 11b is larger than the thickness of the fixing sub-board 15, and the height of the first convex portion 11c is larger than the thickness of the first sub-board 12. And the height of the second convex portion 11d is larger than the thickness of the second sub-board 13.

FIG. 3 is an outline view showing each sub-board according to the first embodiment, FIG. 3 a is a plan view seen from the surface of the first sub-board 12, and FIG. 3 b is a view of the second sub-board 13. It is the top view seen from the surface. The first sub-board 12 has a first opening 12a, and the second sub-board 13 has a second opening 13a.

The 1st opening part 12a has a shape of the size which can penetrate the 1st convex part 11c and the 2nd convex part 11d, and is the side surface of the main-body part 11a from which the 1st convex part 11c protrudes. Has a smaller shape than. For example, the first opening 12a has dimensions (length and width) larger than the end surface of the first convex portion 11c and the end surface of the second convex portion 11d, and the first convex portion 11b projects. The opening has a width smaller than the width of the side surface of the main body 11a. The second opening 13a has a size that allows it to penetrate the second protrusion 11d, and has a shape smaller than the end surface of the first protrusion 11c. For example, the second opening 13a is an opening having a size larger than the end surface of the second protrusion 11d and a width smaller than the width of the first protrusion 11c. The size of each sub-board may be smaller or larger than that of the main board 11 as long as the above-mentioned opening can be formed.

As shown in FIG. 1, in the substrate set 10 according to the first embodiment, the first sub-portion 11c and the second protuberance portion 11d penetrate the first opening 12a, and the first sub The substrate 12 is mounted on the side surface of the main body 11a, and the second sub-substrate 13 is placed on the end surface of the first protrusion 11c with the second protrusion 11d passing through the second opening 13a. It is attached.

Next, the connection between the main board 11 and each sub-board 12, 13 will be described. As shown in FIG. 1a, a plurality of pads P for connecting the first sub-board 12 are formed on the surfaces of the main body portion 11a and the first convex portion 11c, and the main body portion 11a and the first convex portion are formed. A plurality of pads P are similarly formed on the back surface of 11c. As shown in FIG. 3 a, a plurality of pads P corresponding to the pads P on the front surface and the back surface of the first convex portion 11 c are formed on the front surface of the first sub-substrate 12, and Similarly, on the back surface, a plurality of pads P corresponding to the pads P on the front surface and the back surface of the main body 11a are formed. Therefore, by connecting the pads P on the front and back surfaces of the main body 11a and the first convex portion 11c to the pads P on the front and back surfaces of the first sub-board 12 by soldering, the first sub-board 12 can be fixed while being electrically connected to the main board 11. In another example, the pad for connecting the first sub-board 12 is not formed on the main body portion 11a, and the pad is not formed on the back surface of the first sub-board 12 as well. With such a structure, the space of the main body 11a can be utilized more effectively. Here, the surface of the sub-board means the surface opposite to the contact surface with the main board.

Similarly, a plurality of pads P for connecting the second sub-board 13 are formed on the surface of the second convex portion 11d, as shown in FIGS. A plurality of pads P are similarly formed on the back surface. As shown in FIGS. 1b and 3b, a plurality of pads P corresponding to the pads P on the front surface and the back surface of the second convex portion 11d are formed on the front surface of the second sub-substrate 13. Therefore, by connecting the pads P on the front and back surfaces of the second convex portion 11d and the pads P on the front surface of the second sub-board 13 by soldering, the second sub-board 13 is connected to the main board 11. It can be fixed while being electrically connected.

In the present embodiment, preferably, the first sub-board 12 is moved only in the protruding direction of the first protrusion 11c in a state where the first protrusion 11c is inserted into the first opening 12a. The first protrusion 11c and the first opening 12a are formed (so as not to move substantially in a direction other than the protruding direction). Similarly, preferably, the second sub-board 13 is moved only in the protruding direction of the second protrusion 11d in a state where the second protrusion 11d is inserted into the second opening 13a (projection). The second protrusion 11d and the second opening 13a are formed so as not to move substantially in any direction other than the direction. As a result, the direction in which the sub-boards 12 and 13 are displaced can be limited, so that the sub-boards can be mounted in a more stable state. In addition, it is also possible to mount in a more stable state by additionally forming a mechanical mechanism such as a locking hole or a locking claw on the main board and each sub-board.

FIG. 4 is a plan view seen from the surface of the fixing sub-board 14 according to the first embodiment. The fixing sub-board 14 has a main board insertion opening 14a, a first sub-board insertion opening 14b, and a second sub-board insertion opening 14c.

The first sub-board insertion opening 14b has a size that allows it to penetrate the first sub-board 12. Preferably, the fixing sub-board 14 is moved only in the width direction of the first sub-board 12 (width when the first sub-board 12 is inserted into the first sub-board inserting opening 14b). The first sub-board 12 and the first sub-board insertion opening 14b are formed so as not to move substantially in a direction other than the direction.

Similarly, the second sub-board insertion opening 14c has a size that allows it to penetrate the second sub-board 13. Preferably, the fixing sub-board 14 is moved only in the width direction of the second sub-board 13 in a state where the second sub-board 13 is inserted into the second sub-board inserting opening 14c (width The second sub-board 13 and the second sub-board insertion opening 14c are formed so as not to move substantially in a direction other than the direction.

In addition, the main board insertion opening 14a has a size capable of penetrating the convex portion 11b. Preferably, the fixing sub-board 14 is moved only in the projecting direction of the projecting part 11b in a state where the projecting part 11b is inserted into the main board insertion opening 14a (not to substantially move in a direction other than the projecting direction). The convex portion 11b and the main board insertion opening 14a are formed.

As shown in FIG. 1, in the board set 10 according to the first embodiment, the second sub-board 13 is arranged in a state in which the first sub-board 12 penetrates the first sub-board insertion opening 14b. The fixing sub-board 14 is provided on the side surface of the main body 11a in a state of penetrating the second sub-board insertion opening 14c and the protrusion 11b penetrating the main board insertion opening 14a. It is mounted substantially orthogonal to the substrates 12,13. With this configuration, in this embodiment, the sub-boards 12 and 13 can be fixedly mounted on the main board 11.

Next, the connection between the fixing sub-board 14 and each of the boards 11, 12, and 13 will be described. A plurality of pads P for connecting the fixing sub-board 14 are formed on the front surface and the back surface of the first sub-board 12, and on the front surface and the back surface of the fixing sub-board 14, as shown in FIG. A plurality of pads P corresponding to the pads P on the front surface and the back surface of the first sub-board 12 are formed. Therefore, by connecting the pads P on the front and back surfaces of the first sub-board 12 to the pads P on the front and back surfaces of the fixing sub-board 14 by soldering, the first sub-board 12 is fixed. It can be fixed while being electrically connected to the substrate 14.

Similarly, a plurality of pads P for connecting the fixing sub-board 14 are formed on the front surface of the second sub-board 13 as shown in FIG. As shown in FIGS. 1B and 4, a plurality of pads P corresponding to the pads P on the surface of the second sub-board 13 are formed. Therefore, by connecting the pads P on the front surface of the second sub-board 13 and the pads P on the front and back surfaces of the fixing sub-board 14 by soldering, the second sub-board 13 is fixed. Can be fixed while being electrically connected to.

Further, as shown in FIG. 1A, a plurality of pads P are formed on the front surface of the main body 11a and the convex portion 11b, and a plurality of pads P are similarly formed on the back surface. As shown in FIG. 4, a plurality of pads P corresponding to the pads P on the front surface and the back surface of the convex portion 11b are formed on the front surface of the fixing sub-board 14, and the same on the back surface of the fixing sub-board 14. A plurality of pads P corresponding to the pads P on the front surface and the back surface of the main body portion 11a are formed on. Therefore, the main substrate 11 is fixed to the fixing sub-board 14 by connecting the pads P on the front and back surfaces of the main body 11a and the convex portion 11b to the pads P on the front and back surfaces of the fixing sub-board 14 by soldering. It can be fixed while being electrically connected.

With this configuration, in the present embodiment, the first sub-board 12, the second sub-board 13, and the convex portion 11b of the main board 11 can be fixed via the fixing sub-board 14. it can. This makes it possible to realize the substrate set 10 in which the plurality of sub substrates 12 and 13 are mounted on the main substrate 11 in a more stable state with a relatively simple configuration.

In addition, in the present embodiment, not only the main board 11 and the sub-boards 12 and 13 can be electrically connected, but also the sub-boards 12 and 13 can be electrically connected to each other. In addition, in the present embodiment, since the sub-boards 12 and 13 that are adjacent to each other are separated from the soldered portions on the main board 11, it is possible to provide a structure that can avoid a short circuit. Therefore, it is not necessary to provide a space for preventing a short circuit between adjacent soldered portions as in the conventional case. As a result, the sub-boards 12 and 13 can be mounted more densely on the main board 11, so that the board set 10 can be made smaller as a whole.

According to the embodiment of the present invention, when a larger number of sub-boards are mounted on the main board, the fixing sub-board can be configured to have an additional sub-board insertion opening, and It should be understood that the main board may be configured to have the stepwise protrusions depending on the number of sub-boards to be mounted.

FIG. 5 is an outline view showing a substrate set according to the second embodiment, FIG. 5a is a plan view of the substrate set 10 seen from the surface of the main substrate 11, and FIG. 5b is a perspective view of the substrate set 10. is there. The substrate set 10 includes a main substrate 11, a first sub substrate 12, a second sub substrate 13, and a fixing sub substrate 14. The fixing sub-board 14 is the same as that of the first embodiment, but the first sub-board 12 and the second sub-board 13 may not have the opening.

The main board 11 has a main body portion 11a and a convex portion 11b protruding from the side surface of the outer edge of the main body portion 11a, and has notches for inserting the first sub-board 12 and the second sub-board 13 respectively. (Not shown). A plurality of pads are formed on both sides of each cut at least on the solder surface side, and a plurality of pads corresponding to the plurality of pads are formed on the lower end of each sub-board (not shown). The first sub-board 12 and the second sub-board 13 are inserted into the respective notches, and the pads of the main board 11 and the pads of the sub-boards 12 and 13 are connected by soldering, so that the main board 11 is mounted. To do. However, the mounting method of the sub-board is an example, and the present invention is not limited to this.

Also in the board set 10 according to the second embodiment, as in the first embodiment, the second sub-board in the state where the first sub-board 12 penetrates the first sub-board insertion opening 14b. The fixing sub-board 14 is provided on the side surface of the main body 11a with 13 penetrating the second sub-board inserting opening 14c and with the convex portion 11b penetrating the main board inserting opening 14a. The sub-boards 12 and 13 may be mounted so as to be substantially orthogonal to each other. With such a configuration, in the present embodiment, the sub-boards 12 and 13 can be mounted more firmly on the main board 11. Also in this embodiment, regarding the connection between the fixing sub-board 14 and each of the substrates 11, 12 and 13, pads are formed in the same manner as in the first embodiment (not shown).

In another example of the first embodiment, the main board insertion opening 14a has a size that allows the main board 11 to penetrate therethrough. Preferably, the fixing sub-board 14 is moved only in the width direction of the main board 11 in a state where the main board 11 is inserted into the main board insertion opening 14a (not to substantially move in a direction other than the width direction). The main board 11 and the main board insertion opening 14a are formed.

In this case, the substrate set 10 does not have to include the second sub-board 13, and the main substrate 11 does not have to have the convex portions 11b, the convex portions 11c, and the convex portions 11d. When the board set 10 does not include the second sub-board 13, the fixing sub-board 14 may not have the second sub-board inserting opening 14c. When the main board 11 does not have the convex portion 11c, the first sub-board 12 is attached to the front surface or the side surface of the main board 11 by, for example, soldering.

With such a configuration, when the substrate set 10 does not include the second sub-board 13, the main board 11 and the first sub-board 12 have openings 14a in the fixing sub-board 14, which correspond to the main board 11 and the first sub-board 12, respectively. Since the fixing sub-board 14 is attached to the main board 12 and the first sub-board 13 while penetrating 14b, the main board 11 and the first sub-board 12 are fixed via the fixing sub-board 14. can do. Accordingly, it is possible to fix the plurality of substrates in a more stable state with a relatively simple configuration. The configuration of the present example can also be applied to the second embodiment.

In another example of the second embodiment, the main board 11 does not have the protrusion 11b, and the fixing sub-board 14 does not have the main board insertion opening 14a. Even in such a configuration, the fixing sub-board 14 is divided into the two sub-boards 12 and 13 with the two sub-boards 12 and 13 penetrating through the openings 14b and 14c of the corresponding fixing sub-boards 14, respectively. Since they are attached, the two sub substrates 12 and 13 can be fixed via the fixing sub substrate 14. Accordingly, it is possible to fix the plurality of substrates in a more stable state with a relatively simple configuration. The configuration of the present example can be applied to the first embodiment.

In another example of the first embodiment, the board set 10 does not include the second sub-board 13. Therefore, the main board 11 does not have to have the protrusion 11d. Even in such a configuration, since the first sub-board 12 is attached while penetrating the convex portion 11c of the main board 11, the first sub-board 12 is attached to the main board 11 in a relatively stable state. The main substrate 11 and the first sub substrate 12 can be fixed in a more stable state via the fixing sub substrate 14. Accordingly, it is possible to fix the plurality of substrates in a more stable state with a relatively simple configuration.

The respective embodiments described above are examples for explaining the present invention, and the present invention is not limited to these embodiments. For example, the above-described pad positions and soldering methods are merely examples, and the present invention is not limited to these. The respective examples can be appropriately combined and applied to any embodiment of the present invention as long as no contradiction occurs. That is, the present invention can be implemented in various forms without departing from the gist thereof.

10 substrate set 11 main substrate 11a main body 11b convex portion 11c first convex portion 11d second convex portion 12 first sub substrate 12a first opening portion 13 second sub substrate 13a second opening portion 14 fixing Sub-board 14a Main board insertion opening 14b First sub-board insertion opening 14c Second sub-board insertion opening

Claims (3)

Main board,
A sub-board attached to the main board,
The fixed sub board mounted on the main board and the sub board, a board set Ru provided with,
The main substrate has a first convex portion protruding from a side surface and a second convex portion protruding from another side surface adjacent to the side surface having the first convex portion,
The sub-board has an opening capable of penetrating the second convex portion, and is mounted on the other side surface of the main board in a state where the second convex portion penetrates the opening.
The fixing sub-board has an opening capable of penetrating the first convex portion, and is attached on a side surface of the main board in a state where the first convex portion penetrates the opening.
The fixing sub-board has an opening capable of penetrating the sub-board, and is attached to the sub-board with the sub-board penetrating the opening.
Board set. Main board,
A sub-board attached to the main board,
With another sub-board attached to the main board,
The main board, the sub board, and a fixing sub board attached to the other sub-substrate, a substrate set Ru provided with,
The main substrate has a first convex portion protruding from a side surface and a second convex portion protruding from another side surface adjacent to the side surface having the first convex portion and an end surface of the second convex portion. Has a protruding third convex portion,
The sub-board has an opening capable of penetrating the second convex portion, and is mounted on the other side surface of the main board in a state where the second convex portion penetrates the opening.
The other sub-board has an opening capable of penetrating the third convex portion, and is mounted on the end surface of the second convex portion with the third convex portion penetrating the opening. The
The fixing sub-board has an opening capable of penetrating the first convex portion, and is attached on a side surface of the main board in a state where the first convex portion penetrates the opening.
The fixing sub-board has an opening capable of penetrating each of the sub-board and the other sub-board, and the sub-board and the other sub-board penetrating each of the openings, Attached to the sub-board and the other sub-board,
Board set. The board set according to claim 1, wherein the sub-board is connected to the fixing sub-board by soldering.

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