JP2021158079A - Connection terminal and electronic equipment - Google Patents

Abstract

To reduce the number of components in electronic components with two boards and to make an electronic device smaller.SOLUTION: A connection terminal 4 consists of a single plate material. The connection terminal 4 supports two boards 2,3 with a predetermined distance between them, and has inter-board connection portions 41-43 that electrically connect the two boards 2,3, and a joint portion 421 to which a plate-shaped conductor member 5 that is electrically connected to an electric component different from the two boards 2,3 is joined.SELECTED DRAWING: Figure 1

Description

The present invention relates to connection terminals and electronic devices.

Patent Document 1 discloses an electronic device in which two substrates are arranged at intervals in the thickness direction thereof and the two substrates are electrically connected to each other. In this electronic device, two boards are electrically connected by an inter-board connection terminal, and the two boards are supported at intervals in the plate thickness direction by a connection terminal different from the inter-board connection terminal.

Japanese Unexamined Patent Publication No. 2009-252933

Since the electronic device of Patent Document 1 includes a component for electrically connecting the two substrates and a component for supporting the two substrates, the number of components increases, and these components are provided. There is a problem that space is required.

The present invention has been made in view of the above-mentioned problems, and provides a connection terminal capable of reducing the number of parts of an electronic device and miniaturization of the electronic device, and an electronic device provided with the connection terminal. The purpose is to do.

One aspect of the present invention is a connection terminal made of a single plate material, which supports two substrates at a predetermined interval and electrically connects the two substrates to each other, and the above-mentioned connection portion between substrates. It is a connection terminal including a joint portion to which a plate-shaped conductor member electrically connected to another electric component is joined to the two substrates.

One aspect of the present invention is an electronic device including two substrates and the connection terminal.

According to the present invention, two substrates can be electrically connected by the same connection terminal, and two substrates can be supported, so that the number of parts of an electronic device can be reduced. Further, since the space for providing the connection terminal for electrically connecting the two substrates or supporting the two substrates can be suppressed to a small size, the size of the electronic device can be reduced.

It is a perspective view which shows the main part of the electronic device which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the modification of the electronic device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the main part of the electronic device which concerns on 2nd Embodiment of this invention. It is a perspective view which shows the main part of the electronic device which concerns on 3rd Embodiment of this invention. It is a perspective view which shows the main part of the electronic device which concerns on 4th Embodiment of this invention.

[First Embodiment]
Hereinafter, the first embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, the electronic device 1 according to the present embodiment is attached to the first substrate 2, the second substrate 3 arranged at a predetermined interval from the first substrate 2, and the first substrate 2. It includes a connection terminal 4 provided, and a conductor member 5 that is electrically connected to an electric component (not shown). In the following description, for convenience of explanation, the directions indicated by the up / down, left / right, and front / back arrows shown in FIG. ..

The first substrate 2 is a printed circuit board in which a plurality of wiring portions made of conductors are provided on at least the upper surface of a flat plate made of an insulator. Various electronic components (not shown) and connection terminals 4 are provided on the upper surface of the first substrate 2 by being connected to the wiring portion. In the present embodiment, the connection terminal 4 is provided at a position on the upper surface of the first substrate 2 on the end side.

The second substrate 3 is a printed circuit board similar to the first substrate 2. Various electronic components (not shown) are connected to the wiring portion and provided on the second substrate 3. A through hole 31 penetrating vertically is formed at a position on the end side of the second substrate 3.

The connection terminal 4 is formed of a single plate material made of a conductor. The connection terminal 4 includes a first terminal portion 41 formed by being bent in a U shape, a rectangular second terminal portion 42 bent outward from one end of the first terminal portion 41, and a second terminal portion 42. It has an L-shaped third terminal portion 43 extending outward from one side end portion of the two terminal portions 42.

Since the first terminal portion 41 is formed by bending the plate material into a U shape, it can be elastically deformed mainly in the plate thickness direction (vertical direction in FIG. 1) of the first terminal portion 41. By bringing one outer surface of the first terminal portion 41 into surface contact with the wiring portion on the upper surface of the first substrate 2 and joining the contact portion by soldering or the like, the connection terminal 4 is connected to the wiring portion of the first substrate 2. It is installed in an electrically connected state. In the state where the connection terminal 4 is provided on the first substrate 2 in this way, the upper end portion of the first terminal portion 41 on the side not joined to the first substrate 2 is substantially relative to the first terminal portion 41. A second terminal portion 42 that is bent in the orthogonal direction and extends upward is provided.

In a state where the connection terminal 4 is provided on the first substrate 2, the rectangular flat plate-shaped second terminal portion 42 extends upward in a posture in which the plate thickness direction is directed in the front-rear direction. The U-shaped first terminal portion 41 is elastically deformed in the vertical direction, so that the second terminal portion 42 is displaced in the vertical direction or in the left-right direction (width direction of the first and second terminal portions 41 and 42). Is displaced around an axis with the axis as the axis, and is displaced in the front-rear direction (the thickness direction of the second terminal portion 42). The second terminal portion 42 can also be displaced around an axis whose axis is the front-rear direction as the U-shaped first terminal portion 41 is elastically deformed.

A third terminal portion 43 extending to the left from an intermediate position in the vertical direction is integrally provided on the left side portion of the second terminal portion 42. The third terminal portion 43 is a rectangular flat plate-shaped substrate support portion 431 extending from the left side portion of the second terminal portion 42 to the left, and a rectangular rod-shaped substrate insertion portion extending upward from the left end portion (tip portion) of the substrate support portion 431. It has a portion 432, and the third terminal portion 43 has an L-shaped flat plate shape as a whole. The substrate insertion portion 432 extends to a position slightly higher than the upper end portion of the second terminal portion 42. The rectangular rod-shaped substrate insertion portion 432 has an external dimension that can be inserted into the through hole 31 of the second substrate 3.

The board insertion portion 432 of the third terminal portion 43 is inserted into the through hole 31 of the second substrate 3, and the lower surface of the second substrate 3 is placed on the upper end portion of the substrate support portion 431, whereby the connection terminal 4 is connected. , The second substrate 3 is supported with respect to the first substrate 2 at a predetermined interval. In the state where the second substrate 3 is supported in this way, the substrate insertion portion 432 inserted through the through hole 31 and the second substrate 3 are joined by soldering or the like, so that the connection terminal 4 is wired to the second substrate 3. It is electrically connected to the part. The connection terminal 4 is electrically connected to the wiring portion of the first substrate 2 and electrically connected to the wiring portion of the second substrate 3, so that the wiring portion of the first substrate 2 and the second substrate 3 are connected. It is designed to be electrically connected to the wiring section. From the above, the first terminal portion 41, the second terminal portion 42, and the third terminal portion 43 of the connection terminal 4 support the two boards 2 and 3 at predetermined intervals, and the two boards 2 and 2 are supported. A board-to-board connection portion of a connection terminal 4 for electrically connecting 3 is configured.

Similar to the connection terminal 4, the conductor member 5 is formed by bending a plate material made of a conductor or the like. One end side of the conductor member 5 (not shown) is electrically connected to an electric component (not shown) such as a capacitor. This electric component is an electric component different from the electric component mounted on the first substrate 2 and the third substrate 3. The other end side of the conductor member 5 is in surface contact with the upper portion of the side surface 421 of the second terminal portion 42 of the connection terminal 4 facing in the plate thickness direction, and the contact portion is joined by welding or the like. By joining the conductor member 5 in a state where the other end side is brought into surface contact with the upper portion of the side surface 421 of the second terminal portion 42 in this way, the conductor member 5 is electrically connected to the connection terminal 4. The side surface 421 of the second terminal portion 42 constitutes a joint portion of the connection terminal 4 to which the conductor member 5 is joined.

As described above, according to the first embodiment, the two substrates 2 and 3 are supported at a predetermined interval by the same connection terminal 4, and the two substrates 2 and 3 are electrically connected. , Two boards 2 and 3 are electrically connected to another electric component such as a capacitor. As a result, a component that supports the two boards 2 and 3 at a predetermined interval, a component that electrically connects the two boards 2 and 3, and a component that electrically connects the two boards 2 and 3 and another electric component are electrically connected. Compared with the case where each component to be connected is prepared, the number of components constituting the electronic device 1 can be reduced. Further, the two boards 2 and 3 are supported at a predetermined interval, the two boards 2 and 3 are electrically connected, and the two boards 2 and 3 are electrically connected to another electric component. Since it is possible to keep the space for providing the components for the operation small, it is possible to reduce the size of the electronic device 1.

In the first embodiment, since the connection terminal 4 is made of a single plate material, a large current can be passed through the connection terminal 4. That is, the connection terminal 4 can be used as an electric wiring corresponding to a large current.

Further, in the first embodiment, the connection terminal 4 has a first terminal portion 41 joined to the first substrate 2, a second terminal portion 42 extending from the first terminal portion 41 toward the second substrate 3, and a second terminal portion 42. A third terminal portion 43 provided at a side end portion of the two terminal portions 42 is provided. Further, the third terminal portion 43 is a substrate support portion 431 extending in a direction along the lower surface (surface) of the second substrate 3 from the side end portion of the second terminal portion 42, and a second from the tip end portion of the substrate support portion 431. It has a substrate insertion portion 432 extending in the extension direction of the terminal portion 42. Therefore, by joining the first terminal portion 41 to the first substrate 2 and inserting the substrate insertion portion 432 of the third terminal portion 43 into the second substrate 3 to join them, the two substrates 2 and 3 are electrically connected. Can be connected. Further, by supporting the second substrate 3 through which the substrate insertion portion 432 is inserted by the substrate support portion 431 of the third terminal portion 43, the distance between the first substrate 2 and the second substrate 3 can be maintained. Further, the conductor member 5 can be joined to the side surface 421 of the second terminal portion 42.

Further, in the first embodiment, the first terminal portion 41 is formed in a U shape and can be elastically deformed in the vertical direction, and when the U-shaped first terminal portion 41 is elastically deformed in the vertical direction. The second terminal portion 42 is displaced in the front-rear direction (the plate thickness direction of the second terminal portion 42). Therefore, when the conductor member 5 is joined to the side surface 421 of the second terminal portion 42, the first terminal portion 41 is elastic even if the conductor member 5 and the second terminal portion 42 are located apart from each other in the front-rear direction. By deforming and displacing the position of the second terminal portion 42 in the front-rear direction, the conductor member 5 and the second terminal portion 42 can be overlapped and joined. That is, the elastically deformable first terminal portion 41 can absorb the positional deviation between the conductor member 5 and the second terminal portion 42.

In the first embodiment, the board support portion 431 of the third terminal portion 43 is bent from the side end portion of the second terminal portion 42 to the plate thickness of the second terminal portion 42, for example, by being bent with respect to the second terminal portion 42. It may extend in the direction (front-back direction). In this case, the substrate insertion portion 432 of the third terminal portion 43 is positioned with respect to the second terminal portion 42 at intervals in the plate thickness direction.

In the first embodiment, the third terminal portion 43 may be provided at both the left and right side ends of the second terminal portion 42, for example. That is, the connection terminal 4 may have two third terminal portions 43. When the connection terminal 4 has two third terminal portions 43, the two second boards 3 can be attached to the two third terminal portions 43 of the connection terminal 4, respectively.

In the first embodiment, a plurality of (for example, three or more) third terminal portions 43 may be arranged in the vertical direction, for example, at the side end portions of the second terminal portion 42. When a plurality of third terminal portions 43 are arranged in the vertical direction in the connection terminal 4, the plurality of second boards can be arranged in the vertical direction by attaching the plurality of second boards to the plurality of third terminal portions 43, respectively.

In the first embodiment, the substrate support portion 431 of the third terminal portion 43 may be integrally provided at the lower end portion of the side end portions of the second terminal portion 42, for example, as shown in FIG. In this case, the substrate support portion 431 may be provided so as to extend upward from the upper end portion of the first terminal portion 41, similarly to the second terminal portion 42. The upper end portion of the substrate support portion 431 illustrated in FIG. 2 is located lower than the upper end portion of the second terminal portion 42. In the connection terminal 4 illustrated in FIG. 2, the board insertion portion 432 extends upward from the left end portion of the board support portion 431, and the upper end portion of the board insertion portion 432 is located lower than the upper end portion of the second terminal portion 42. ing.

In the first embodiment, the upper portion of the second terminal portion 42 located higher than the upper end portion of the substrate support portion 431 is formed on the second substrate 3 in the same manner as the substrate insertion portion 432, for example, as shown in FIG. It may be inserted through another through hole 32. The upper portion of the second terminal portion 42 inserted through another through hole 32 may be joined to the second substrate 3 by soldering or the like and electrically connected to the wiring portion of the second substrate 3. When the upper portion of the second terminal portion 42 is inserted into another through hole 32 of the second substrate 3, the conductor member 5 is the upper portion of the side surface 421 of the second terminal portion 42 located above the second substrate 3. May be joined to.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 3, the electronic device 1A of the present embodiment has the first substrate 2 and the second substrate 3 arranged at predetermined intervals in the vertical direction and the first substrate as in the first embodiment. It includes a connection terminal 4A provided on the upper surface of No. 2 and a conductor member 5 that is electrically connected to the connection terminal 4A. The connection terminal 4A is formed of a single plate material made of a conductor. The connection terminal 4A has a first terminal portion 41 formed in a U shape and joined to the upper surface of the first substrate 2, and a second terminal portion 41 extending upward from the upper end portion of the first terminal portion 41 toward the second substrate 3. It has two terminal portions 42A.

The second terminal portion 42A is formed in a rectangular flat plate shape as in the first embodiment, and extends upward from the upper end portion of the first terminal portion 41 in a posture in which the plate thickness direction is directed in the front-rear direction. The side surface 421 of the second terminal portion 42A facing the plate thickness direction of the second terminal portion 42A constitutes a joint portion of the connection terminal 4A to which the conductor member 5 is joined, as in the first embodiment.

By placing the second substrate 3 on the upper end surface 422A (tip surface) of the second terminal portion 42A so that the lower surface (surface) of the second substrate 3 comes into surface contact, the connection terminal 4A attaches the second substrate 3 to the first substrate 2. It is designed to be supported at a predetermined interval. In the state where the second substrate 3 is supported in this way, the upper end surface 422A of the second terminal portion 42A and the lower surface of the second substrate 3 are joined by soldering or the like, so that the connection terminal 4A is wired to the second substrate 3. It is electrically connected to the part. The connection terminal 4A is electrically connected to the wiring portions of the first substrate 2 and the second substrate 3, so that the wiring portion of the first substrate 2 and the wiring portion of the second substrate 3 are electrically connected. It has become. From the above, the first terminal portion 41 and the second terminal portion 42A of the connection terminal 4A support the two boards 2 and 3 at a predetermined interval, and electrically connect the two boards 2 and 3. It constitutes an inter-board connection portion of the connection terminal 4A to be connected.

According to the second embodiment, the same effect as that of the first embodiment is obtained. Further, in the second embodiment, the connection terminal 4A has only the first terminal portion 41 formed in a U shape and the second terminal portion 42A formed in a rectangular flat plate shape, and the first substrate 2 and the second. It is provided so as to be sandwiched between the substrate 3 and the substrate 3. As a result, the connection terminal 4A is compared with the connection terminal 4 (see FIGS. 1 and 2) of the first embodiment having the third terminal portion 43 (particularly the rod-shaped substrate insertion portion 432) formed in the shape of an L-shaped flat plate. The shape of the can be simplified. By simplifying the shape of the connection terminal 4A, the mold structure used for manufacturing the connection terminal 4A can be simplified, the lead time for mold manufacturing can be shortened, and the mold manufacturing cost can be reduced. The inspection process of the manufactured connection terminal 4A can be shortened and the cost can be reduced.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the same components as those in the second embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 4, the electronic device 1B of the present embodiment includes the first substrate 2 and the second substrate 3, the connection terminal 4B, and the conductor member 5 as in the second embodiment. The connection terminal 4B has a first terminal portion 41 and a second terminal portion 42B as in the second embodiment. The second terminal portion 42B is formed in a flat plate shape, and extends upward from the upper end portion of the first terminal portion 41 in a posture in which the plate thickness direction is directed in the front-rear direction, as in the second embodiment.

The upper end surface 422B (tip surface) of the second terminal portion 42B is formed in a stepped shape having a stepped surface 423B extending in the vertical direction (extension direction of the second terminal portion 42B). The upper end surface 422B has a low portion side region 424B connected to the lower end of the stepped surface 423B and a high portion side region 425B connected to the upper end of the stepped surface 423B. The low portion side region 424B and the high portion side region 425B are flat surfaces orthogonal to each other in the vertical direction. The low portion side region 424B and the high portion side region 425B are arranged in the left-right direction, and the stepped surface 423B faces the low portion side region 424B side (right side in FIG. 4). The step surface 423B is orthogonal to the low portion side region 424B and the high portion side region 425B. The stepped surface 423B is located in the middle of the second terminal portion 42B in the left-right direction.

By placing the second substrate 3 on the lower region 424B so that the lower surface (surface) of the second substrate 3 comes into surface contact with the lower region 424B of the second terminal 42B, the connection terminal 4B can be connected. The second substrate 3 is supported with respect to the first substrate 2 at a predetermined interval. In the state where the second substrate 3 is supported in this way, the low portion side region 424B of the second terminal portion 42B and the lower surface of the second substrate 3 are joined by soldering or the like, so that the connection terminal 4B becomes the second substrate 3 It is electrically connected to the wiring part of. The first terminal portion 41 and the second terminal portion 42B of the connection terminal 4B support the two substrates 2 and 3 at predetermined intervals and electrically support the two substrates 2 and 3 as in the second embodiment. It constitutes a board-to-board connection portion of the connection terminal 4B to be specifically connected.

According to the third embodiment, the same effect as that of the first and second embodiments is obtained. Further, in the third embodiment, the upper end surface 422B of the second terminal portion 42B is formed in a stepped shape having a stepped surface 423B. Therefore, when the lower surface of the second substrate 3 is placed on the lower region 424B of the second terminal portion 42B, the side portion of the second substrate 3 faces the stepped surface 423B in the left-right direction. Thereby, the side portion of the second substrate 3 can be abutted against the stepped surface 423B to limit the movement of the second substrate 3 (movement to the left in FIG. 4) on the low portion side region 424B. Therefore, the second substrate 3 can be easily positioned with respect to the connection terminal 4B and the first substrate 2 to which the upper end surface 422B is attached, as compared with the case where the upper end surface 422B is not formed in a stepped manner.

In the third embodiment, by using the two connection terminals 4B, the second substrate 3 can be more reliably positioned with respect to the connection terminal 4B and the first substrate 2. Specifically, the two connection terminals 4B are arranged at intervals in the left-right direction so that the stepped surfaces 423B of the two connection terminals 4B face each other in the left-right direction. As a result, when the lower surface of the second substrate 3 is placed on the lower region 424B of the two connection terminals 4B, the second substrate 3 is arranged between the stepped surfaces 423B of the two connection terminals 4B. , The movement of the second substrate 3 in the left-right direction can be restricted, and the second substrate 3 can be positioned more reliably.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the same components as those in the third embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 5, the electronic device 1C of the present embodiment includes two substrates 2 and 3, a connection terminal 4C, and a conductor member 5 as in the third embodiment. The connection terminal 4C has a first terminal portion 41 and a second terminal portion 42C as in the third embodiment. The second terminal portion 42C is formed in a flat plate shape as in the third embodiment, and extends upward from the upper end portion of the first terminal portion 41 in a posture in which the plate thickness direction is directed in the front-rear direction. The upper end surface 422C (tip surface) of the second terminal portion 42C is a stepped surface 423B extending in the vertical direction, a low portion side region 424B connected to the lower end of the stepped surface 423B, and a stepped surface 423B, as in the third embodiment. It has a high portion side region 425B connected to the upper end.

The stepped surface 423B of the second terminal portion 42C is an inclined surface 423C that is obliquely inclined on the upper end surface 422C. The inclined surface 423C is inclined so as to move upward from the lower region 424B and to move away from the lower region 424B in the left-right direction (left in FIG. 5).

According to the fourth embodiment, the same effect as that of the first to third embodiments is obtained. Further, according to the fourth embodiment, when the second substrate 3 is placed in the low portion side region 424B of the second terminal portion 42C, the side portion (the left end portion in FIG. 5) of the second substrate 3 is low. Even if the portion side region 424B is shifted to the higher portion side region 425B side (left side of the lower portion side region 424B in FIG. 5), the side portion of the second substrate 3 hits the inclined surface 423C, so that the second substrate 3 Is guided from the high portion side region 425B side to the low portion side region 424B side (right side in FIG. 5). As a result, when the second substrate 3 is placed on the lower region 424B, the second substrate 3 can be easily attached to the connection terminal 4C in a state of being displaced with respect to the connection terminal 4C and the first substrate 2. Can be suppressed or prevented. That is, the second board 3 can be easily assembled to the connection terminal 4C and the first board 2.

In the third and fourth embodiments, for example, the second substrate 3 may be formed with a recess recessed from the side portion of the second substrate 3 in the direction along the lower surface of the second substrate 3. When the second substrate 3 having the recess formed is placed on the lower region 424B, the portion (upper portion) of the second terminal portions 42B and 42C located above the lower region 424B is the second. It may be inserted into the recess of the substrate 3. By inserting the upper portions of the second terminal portions 42B and 42C into the recesses of the second substrate 3, the second substrate 3 is oriented along the lower surface of the second substrate 3 with respect to the connection terminals 4B and 4C (in the recesses). It is restricted to move in the recess direction and the width direction of the recess orthogonal to the recess. Therefore, the second substrate 3 can be more reliably positioned with respect to the connection terminals 4B and 4C and the first substrate 2.

Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the first terminal portion of the connection terminal may be formed in a flat plate shape so as not to be positively elastically deformed. In the present invention, the electronic device may include at least two substrates and connection terminals. That is, the electronic device does not have to include the conductor member.

1,1A, 1B, 1C Electronic device 2 1st board 3 2nd board 4,4A, 4B, 4C Connection terminal 41 1st terminal part 42, 42A, 42B, 42C 2nd terminal part 421 Side surface (joint part)
422A, 422B, 422C Upper end surface (tip surface)
423B Step surface 423C Inclined surface 424B Low side area 43 Third terminal part 431 Board support part 432 Board insertion part 5 Conductor member

Claims (7)

It is a connection terminal made of a single plate material,
A board-to-board connection portion that supports the two boards at a predetermined interval and electrically connects the two boards,
A connection terminal including a joint portion to which a plate-shaped conductor member electrically connected to an electric component different from the two substrates is joined. The inter-board connection portion includes a first terminal portion joined to the first substrate of the two substrates and a second terminal extending from the first terminal portion toward the second substrate of the two substrates. A portion and a third terminal portion provided at a side end portion of the second terminal portion are provided.
The third terminal portion is formed by extending from a side end portion of the second terminal portion in a direction along the surface of the second substrate to support the second substrate, and a substrate support portion of the substrate support portion. It has a substrate insertion portion extending from the tip portion in the extension direction of the second terminal portion and being inserted into the second substrate.
The connection terminal according to claim 1, wherein the joint portion is formed by a side surface of the second terminal portion facing in the plate thickness direction. The inter-board connection portion includes a first terminal portion joined to the first substrate of the two substrates and a second terminal extending from the first terminal portion toward the second substrate of the two substrates. With a department
The tip surface in the extension direction of the second terminal portion is joined to the surface of the second substrate to support the second substrate.
The connection terminal according to claim 1, wherein the joint portion is formed by a side surface of the second terminal portion facing in the plate thickness direction. The tip surface of the second terminal portion is formed in a stepped shape having a stepped surface extending in the extension direction of the second terminal portion.
The connection terminal according to claim 3, wherein the low portion side region on the tip surface is joined to the surface of the second substrate. The connection terminal according to claim 4, wherein the stepped surface is an inclined surface that is obliquely inclined on the tip surface. The connection terminal according to any one of claims 2 to 5, wherein the first terminal portion is formed in a U shape and is elastically deformable in the plate thickness direction of the first terminal portion. Two boards and
An electronic device including the connection terminal according to any one of claims 1 to 6.

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