JPH07122875A - Shield case - Google Patents
Shield caseInfo
- Publication number
- JPH07122875A JPH07122875A JP27061193A JP27061193A JPH07122875A JP H07122875 A JPH07122875 A JP H07122875A JP 27061193 A JP27061193 A JP 27061193A JP 27061193 A JP27061193 A JP 27061193A JP H07122875 A JPH07122875 A JP H07122875A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- shield case
- printed circuit
- substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子チュ−ナなどの高
周波回路ユニットのプリント基板のシ−ルドケ−スの構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shielded case structure for a printed circuit board of a high frequency circuit unit such as an electronic tuner.
【0002】[0002]
【従来の技術】プリント基板を固定するシールドケース
の構造としては、一般に特開平4−188793号公報
に記載されているものが知られている。従来例として、
図3に示す。2. Description of the Related Art As a structure of a shield case for fixing a printed circuit board, a structure described in Japanese Patent Laid-Open No. 4-188793 is generally known. As a conventional example,
As shown in FIG.
【0003】図3は基板を固定したシールドケース31
の側面断面図を示したもので、図3において34はアー
ス爪、33は基板受け、32は基板である。基板32は
シールドケース31内に挿入され、基板受け13で基板
32を支持し、さらにアース爪34をシールドケースの
内側に折りまげ、基板受け33とアース爪34とで基板
32を固定するものである。FIG. 3 shows a shield case 31 having a substrate fixed thereto.
3 is a side sectional view of FIG. 3, in which 34 is a grounding claw, 33 is a substrate receiver, and 32 is a substrate. The substrate 32 is inserted into the shield case 31, the substrate 32 is supported by the substrate receiver 13, the ground claw 34 is folded inside the shield case, and the substrate 32 is fixed by the substrate receiver 33 and the ground claw 34. is there.
【0004】また、特開平2−97095号公報には、
基板にガイド穴を設け、突起にガイドを挿入して固定す
る発明が開示されている。これを図4を用いて説明す
る。Further, in Japanese Patent Laid-Open No. 2-97095,
An invention has been disclosed in which a guide hole is provided in a substrate and a guide is inserted into a protrusion and fixed. This will be described with reference to FIG.
【0005】図4において42は基板、43はシールド
ケース41の突起、46は突起43に構成されているガ
イド、47は基板42に設けられているガイド穴、44
はテーパ付き爪である。In FIG. 4, 42 is a substrate, 43 is a protrusion of the shield case 41, 46 is a guide formed in the protrusion 43, 47 is a guide hole provided in the substrate 42, 44
Is a tapered claw.
【0006】基板42はシールドケース41内に挿入
し、突起43に設けられたガイド46を基板42のガイ
ド穴47に挿入して支持する。そしてテーパ付き爪44
を基板42上に折りまげ、突起43とともに基板42を
固定、支持するものである。The substrate 42 is inserted into the shield case 41, and the guide 46 provided on the protrusion 43 is inserted into the guide hole 47 of the substrate 42 to support it. And tapered pawl 44
Is folded on the substrate 42, and the substrate 42 is fixed and supported together with the protrusions 43.
【0007】[0007]
【発明が解決しようとする課題】上述しましたものにお
いて、図3のものについては、シールドケース31のフ
レーム部の基板32支持部の先端が基板32の下部に線
接触しており、半田ディップ槽に流す時に半田が充分に
付かなかつたり、また基板32をフレ−ム部の下部より
挿入する時、基板32の支持部が硬く、挿入が困難な時
がある等多くの問題点があった。In the one described above with reference to FIG. 3, the tip of the substrate 32 support portion of the frame portion of the shield case 31 is in line contact with the lower portion of the substrate 32, and the solder dip bath is used. There were many problems such as when the solder did not adhere enough when the substrate was poured into the substrate, or when the substrate 32 was inserted from the lower portion of the frame portion, the supporting portion of the substrate 32 was hard and sometimes the insertion was difficult. .
【0008】また、図3、図4のものについても、シー
ルドケース31、41には基板受け13、または突起4
1とアース爪44、またはテーパ付き爪44との2つの
部分で固定しなければならず、製造に手間が掛かるとい
う不具合が生じている。3 and 4, the shield cases 31 and 41 are provided with the substrate receiver 13 or the protrusions 4 in the shield cases 31 and 41.
1 and the grounding claw 44 or the tapered claw 44 must be fixed at two parts, which causes a trouble in manufacturing.
【0009】[0009]
【課題を解決するための手段】本発明は上記の問題点に
鑑み、周辺に複数個の半田スルーホール孔を有するアー
スパターンを設けたプリント基板と、前記半田スルーホ
ール孔に挿入できるようにフレーム部に複数個の切り起
こしガイドを設け、挿入後切り起こしガイドの先端を折
り曲げて前記プリント基板を固定し、更に前記アースパ
ターンと半田付けしたシールドケースを提供しようとす
るものである。In view of the above problems, the present invention provides a printed circuit board provided with an earth pattern having a plurality of solder through-holes on the periphery thereof, and a frame which can be inserted into the solder through-holes. A shield case is provided in which a plurality of cut-and-raised guides are provided in a portion, the tip of the cut-and-raised guide is bent after the insertion to fix the printed circuit board, and further, the shield pattern is soldered to the ground pattern.
【0010】[0010]
【作用】本発明によれば、プリント基板のシ−ルドケ−
スのフレーム部への取付方法は容易かつ確実であり、他
のプリント実装部品とともに半田ディップ槽に流すだけ
で容易にプリント基板のア−スパターンとシールドケー
スのフレーム部との半田接続が行える。According to the present invention, the shield case of the printed circuit board is used.
The method for attaching the space to the frame is easy and reliable, and the solder connection between the ground pattern of the printed circuit board and the frame of the shield case can be easily performed simply by pouring it into the solder dip tank together with other printed components.
【0011】[0011]
【実施例】以下、本発明の一実施例について図1と図2
を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be explained.
【0012】図1は本発明の一実施例であり、シールド
ケース1にプリント基板2を挿入したところの状態を示
す断面図であり、図2(a)は図1の状態におけるプリ
ント基板の固定部の詳細図(側面断面図)であり、図2
(b)は切り起こしガイド4の詳細図である。FIG. 1 is an embodiment of the present invention, and is a cross-sectional view showing a state in which a printed circuit board 2 is inserted in a shield case 1. FIG. 2 (a) is a printed circuit board fixed in the state shown in FIG. 2 is a detailed view (side cross-sectional view) of the portion shown in FIG.
(B) is a detailed view of the cut-and-raised guide 4.
【0013】以下、プリント基板2のシールドケース1
のフレーム部への取付手順につき説明する。Hereinafter, the shield case 1 of the printed circuit board 2
The procedure for attaching to the frame will be described.
【0014】プリント基板2はシールドケース1内に挿
入され、シールドケース1のフレーム部に設けられた複
数個の切り起こしガイド4がプリント基板2の半田スル
−ホ−ル孔7に挿入され、プリント基板2はシールドケ
ース1に支持される。次に切り起こしガイド4の折り曲
げ部6をプリント基板2の裏面で折り曲げ、プリント基
板2に当接させ、図2(c)に示すようにプリント基板
2を固定する。またこの折り曲げ部6には簡単に曲げら
れるようにV溝5のような物を設けていてもよい。The printed circuit board 2 is inserted into the shield case 1, and a plurality of cut-and-raised guides 4 provided on the frame portion of the shield case 1 are inserted into the solder through holes 7 of the printed circuit board 2 to print. The substrate 2 is supported by the shield case 1. Next, the bent portion 6 of the cut-and-raised guide 4 is bent on the back surface of the printed board 2 and brought into contact with the printed board 2, and the printed board 2 is fixed as shown in FIG. The bent portion 6 may be provided with an object such as the V groove 5 so that it can be easily bent.
【0015】この状態で、切り起こしガイド4は他のプ
リント実装部品とともに半田ディップ槽に流す際に自動
的に半田付けされる。In this state, the cut-and-raised guide 4 is automatically soldered together with other print-mounted components when flowing into the solder dip bath.
【0016】本実施例のように、プリント基板2の半田
スルーホール孔7にシールドケース1の切り起こしガイ
ド4を挿入し、さらに折り曲げ部6を曲げてプリント基
板2を固定し、半田付けするため、プリント基板2の位
置がずれることなく精度よく接続することができる。To insert the cut-and-raised guide 4 of the shield case 1 into the solder through hole 7 of the printed circuit board 2 as in the present embodiment, and further bend the bent portion 6 to fix the printed circuit board 2 for soldering. Therefore, the printed circuit board 2 can be connected with high accuracy without displacement.
【0017】[0017]
【発明の効果】このように本発明によれば、シールドケ
ースからは切り起こし部のみでプリント基板を固定する
ことができるため、プリント基板のア−スパターンとシ
ールドケースの接続が容易かつ確実、又、組立作業が単
純な為、組立に要する時間が大幅に短縮される。As described above, according to the present invention, since the printed circuit board can be fixed only from the cut-and-raised portion from the shield case, the ground pattern of the printed circuit board and the shield case can be connected easily and securely. Further, since the assembling work is simple, the time required for assembling is greatly reduced.
【0018】更に、プリント基板には形状の単純な切り
起こしガイドが1種類しか必要としないために、シール
ドケースの金型製作はきわめて簡単である。Further, since only one type of cut-and-raised guide having a simple shape is required for the printed circuit board, the shield case is very easily manufactured by a die.
【図1】本発明の一実施例であるシールドケースにプリ
ント基板を取り付けた状態を示す断面斜視図FIG. 1 is a cross-sectional perspective view showing a state in which a printed circuit board is attached to a shield case that is an embodiment of the present invention.
【図2】(a),(b) 同シールドケースの切り起こ
しガイド部を示す断面図 (c) 同シールドケースの切り起こし部の状態を示す
断面図2A and 2B are cross-sectional views showing a cut-and-raised guide portion of the shield case, and FIG. 2C is a cross-sectional view showing a cut-and-raised portion of the shield case.
【図3】従来のシ−ルドケ−スのプリント基板を固定す
る状態の一例を示す断面図FIG. 3 is a sectional view showing an example of a state in which a printed circuit board of a conventional shield case is fixed.
【図4】(a),(b),(c) 従来例のシールドケ
ースのプリント基板を固定する状態の他の例を示す斜視
図4A, 4B, and 4C are perspective views showing another example of a state where a printed circuit board of a shield case of a conventional example is fixed.
1 シールドケース 2 プリント基板 4 切り起こしガイド 5 V溝 6 折り曲げ部 7 半田スルーホール孔 1 Shield Case 2 Printed Circuit Board 4 Cut and Raised Guide 5 V Groove 6 Bent Section 7 Solder Through Hole Hole
Claims (1)
するアースパターンを設けたプリント基板と、前記半田
スルーホール孔に挿入できるようにフレーム部に複数個
の切り起こしガイドを設け、挿入後切り起こしガイドの
先端を折り曲げて前記プリント基板を固定し、更に前記
アースパターンと半田付けしたことを特徴とするシール
ドケース。1. A printed circuit board having a ground pattern having a plurality of solder through-holes on the periphery thereof, and a plurality of cut-and-raised guides provided on a frame portion so that the frame can be inserted into the solder through-holes. A shield case in which the tip of the raising guide is bent to fix the printed circuit board, and is further soldered to the ground pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27061193A JPH07122875A (en) | 1993-10-28 | 1993-10-28 | Shield case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27061193A JPH07122875A (en) | 1993-10-28 | 1993-10-28 | Shield case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07122875A true JPH07122875A (en) | 1995-05-12 |
Family
ID=17488505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27061193A Pending JPH07122875A (en) | 1993-10-28 | 1993-10-28 | Shield case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07122875A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003142847A (en) * | 2001-10-30 | 2003-05-16 | Kenwood Corp | Method of electrically connecting printed board and connecting piece |
JP2006278962A (en) * | 2005-03-30 | 2006-10-12 | Alps Electric Co Ltd | Electronic circuit unit |
-
1993
- 1993-10-28 JP JP27061193A patent/JPH07122875A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003142847A (en) * | 2001-10-30 | 2003-05-16 | Kenwood Corp | Method of electrically connecting printed board and connecting piece |
JP2006278962A (en) * | 2005-03-30 | 2006-10-12 | Alps Electric Co Ltd | Electronic circuit unit |
JP4502862B2 (en) * | 2005-03-30 | 2010-07-14 | アルプス電気株式会社 | Electronic circuit unit |
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