JPH0582953A - Soldering method - Google Patents

Abstract

PURPOSE:To solder a shielded case precisely to a substrate for high frequency with excellent accuracy by using a reflow furnace and cream solder. CONSTITUTION:A shielded case 2 is soldered to a substrate 1 by the following procedure. 1. the screen printing of cream solder to the pattern surface 1b side. 2. the insertion of the projecting leg sections 2a, 2b of the shielded case 2 from the mount surface 1a side. 3. the bending of the projecting leg section 2b on the pattern surface 1b side. 4. heating in a reflow furnace.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method, and more particularly to a soldering method suitable for soldering a shield case to a high frequency board.

[0002]

2. Description of the Related Art A sheet metal shield case is attached to a high frequency substrate. Conventionally, the above-mentioned sheet metal shield case (hereinafter, simply referred to as a shield case) is different from chip parts and the like and cannot be soldered by a cream solder and a reflow furnace, and is soldered using a dip bath, or,
It was soldered by hand.

[0003]

Of the above-mentioned conventional techniques,
In the soldering using the dip bath, there is a problem that the amount of solder attached to the substrate cannot be controlled and the soldering accuracy is low.

Further, in the manual soldering, the quality of the soldering depends on the skill of the operator, so that it is difficult to stabilize the soldering accuracy and it is difficult to always maintain the good accuracy. There was a problem.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a soldering method capable of soldering a shield case to a high frequency board with good precision and accuracy by using a reflow oven and cream solder.

[0006]

The present invention relates to a soldering method for soldering a component to a substrate having a pattern surface and a mount surface, in which cream solder is applied from the pattern surface side and a predetermined amount is applied from the mount surface side. The components are inserted, and the board to which the predetermined components are attached is heated in a reflow furnace and soldered.

[0007]

Function: The cream solder is applied from the pattern surface side of the board, and the cream solder is applied to the through holes formed in the board. Then, the convex leg of the shield case is inserted into the through hole from the mount surface side of the substrate.

As a result, the cream solder is sufficiently attached to the convex leg of the shield case in the through hole and on the pattern surface side.

Then, the substrate on which the shield case and other parts are placed is heated in a reflow furnace. By this heating, the cream solder is melted and various components including the shield case are soldered to the substrate.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, the substrate and the sheet metal shield case will be described with reference to FIG.

FIG. 3 shows a high frequency substrate [hereinafter simply referred to as a substrate] 1 and a sheet metal shield case [hereinafter simply referred to as a shield case] 2 fixed to the substrate 1.

One surface of the substrate 1 serves as a mount surface 1a for mounting and fixing various chip components (not shown), the shield case 2 and the like. The other surface of the substrate 1 is a pattern surface 1b on which an earth pattern, a wiring pattern, etc. are formed.

Further, the substrate 1 is provided with a large number of through holes 3 and 4 for inserting and inserting lead wires of components or convex leg portions of a shield case 2 which will be described later.

The shield case 2 has a substantially box shape, and a plurality of convex leg portions 2a and 2b are formed on the lower portion 2d.

Next, a soldering method will be described with reference to FIGS. This soldering method is performed by the following procedure. (1) Apply cream solder to the mount surface 1a of the substrate 1. (2) Chip components are automatically placed on the mount surface 1a of the substrate 1.

(3) The substrate 1 is put in a reflow furnace (heating furnace) not shown and heated. As a result, the cream solder is melted and the chip component is soldered and fixed.

(4) The cream solder 6 is applied to the through holes 3 and 4 from the pattern surface 1b side of the substrate 1 shown in FIG. 1 by screen printing.

When soldering the shield case 2 to the substrate 1, the shield case 2 covers the entire circumference of the shield case 2 in contact with the substrate 1, and the shield case 2 is soldered to an earth pattern provided on the pattern surface 1b. Must be attached.

The applied state of the cream solder 6 is shown in FIG. As is clear from FIG. 2, the cream solder 6 is applied so as to enter the through holes 3 and 4 and close the through holes 3 and 4.

In general, soldering of components (excluding the shield case 2) to the substrate 1 is performed by screen printing the cream solder 6 on the mount surface 1a side, then mounting the components on the mount surface 1a, and It is done by the procedure of heating in the reflow furnace. Soldering of the shield case 2 is separately performed as described above.

In this embodiment, however, the shield case 2 is soldered by first screen-printing the cream solder 6 on the pattern surface 1b side, and then mounting the surface 1b.
The procedure is performed by inserting the convex leg portions 2a and 2b of the shield case 2 from the side a, bending the convex leg portion 2b on the pattern surface 1b side, and heating in the reflow furnace.

(5) As shown in FIG. 3, the convex legs 2 a and 2 b of the shield case 2 are attached to the mounting surface 1 of the substrate 1.
Insert from the side a into the through holes 3 and 4.

FIG. 4 shows a state in which the convex leg portions 2a, 2b of the shield case 2 are inserted into the through holes 3, 4.
As a result of the insertion, the convex leg portion 2b becomes the pattern surface 1b of the substrate 1.
FIG. 5 shows a state in which it has come to project to the side. Figure 4
As is apparent from the above, by inserting the convex legs 2a and 2b, the tip ends of the convex legs 2a and 2b are covered with the cream solder 6.

(6) The convex leg portion 2b of the shield case 2 is bent as shown in FIG. A plurality of convex leg portions 2b, four in the illustrated example, are provided below the shield case 2 at 2d. The convex leg 2b is shown in FIG.
The shield case 2 is fixed to the mount surface 1 a side of the substrate 1 by being bent in the state shown in FIG. 7.

(7) As shown in FIG. 8, the lead wire 8a of the component 8 mounted on the pattern surface 1b of the substrate 1
Is inserted into the through hole 4.

(8) The shield case 2 and various chip parts are attached to the mount surface 1a side, and the pattern surface 1b
The substrate 1 with the component 8 placed on the side is placed in a reflow furnace and heated. As a result, the cream solder 6 is melted and the convex leg portions 2a, 2b of the shield case 2, the component 8 and the like are soldered and fixed to the substrate 1.

According to this embodiment, the shield case 2
For screen printing of the cream solder 6 on the pattern surface 1b side, then inserting the shield case 2 from the mount surface 1a side, bending the convex leg portions 2b on the pattern surface 1b side, and using a reflow oven. Since it is soldered to the substrate 1 by a procedure such as heating, the shield case 2 can be soldered to the high frequency substrate 1 by using the cream solder 6 and the reflow furnace.
Solder all parts to the board 1 with cream solder 6
Can be done by coating and heating in a reflow oven,
Furthermore, soldering of the shield case 2 to the substrate 1 can always be performed with good accuracy and precision.

[0028]

According to the soldering method of the present invention, the cream solder is applied from the pattern surface side of the substrate, the cream solder is applied to the through holes, and then the convex legs of the shield case are attached to the mount surface side of the substrate. The various components including the shield case are soldered to the substrate by inserting the shield case and other components into the through hole and heating the substrate on which the shield case and other components are placed in a reflow oven. There is an effect that can be soldered to the board for high frequency in the reflow furnace, by which,
There is an effect that all components can be soldered to the substrate by applying cream solder and heating in a reflow furnace.

Therefore, there is an effect that a component such as a shield case can be soldered to the substrate with good precision and accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate according to an embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view taken along the line AA in FIG.

FIG. 3 is a perspective view showing a state in which a shield case is attached to a substrate.

FIG. 4 is a partial enlarged cross-sectional view showing a state in which the convex leg of the shield case is inserted into the through hole of the substrate.

FIG. 5 is a perspective view showing a state in which the convex leg portion reaches the pattern surface side of the substrate 1.

FIG. 6 is a perspective view showing a state in which a convex leg portion is bent.

FIG. 7 is a perspective view showing a state where a shield case is fixed to a substrate.

FIG. 8 is a perspective view showing a state in which components are mounted on the pattern surface of the substrate.

[Explanation of symbols]

 1 board 1a mounting surface 1b pattern surface 2 shield case 2a, 2b convex leg 2d lower part 3, 4 through hole 6 cream solder

Claims (1)

[Claims] 1. A soldering method for soldering a component to a substrate having a pattern surface and a mount surface, wherein cream solder is applied from the pattern surface side, and a predetermined component is inserted from the mount surface side, A soldering method, characterized in that a substrate on which the predetermined components are attached is heated in a reflow furnace to be soldered.