JP3067326B2 - Soldering method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method, and more particularly to a soldering method suitable for soldering a shield case to a high-frequency board.

[0002]

2. Description of the Related Art A sheet metal shield case is mounted on a high frequency substrate. Conventionally, the above-mentioned sheet metal shield case (hereinafter, simply referred to as a shield case) is different from a chip component or the like, cannot be soldered with a cream solder and a reflow furnace, or is soldered using a dipping bath, or
It was soldered by hand.

[0003]

SUMMARY OF THE INVENTION Among the above prior arts,
In the soldering using the dip tank, there is a problem that the amount of solder adhering to the substrate cannot be controlled and the accuracy of the soldering is low.

Further, in the manual soldering, since the quality of the soldering depends solely on the skill of the operator, it is difficult to stabilize the accuracy of the soldering, and it is difficult to always maintain good accuracy. There was a problem.

Accordingly, an object of the present invention is to provide a soldering method capable of soldering a shield case to a high-frequency board with good precision and accuracy by using a reflow oven and cream solder.

[0006]

Means for Solving the Problems] The present invention includes a pattern surface, in the soldering process for soldering the shield case to a substrate having a mounting surface, through the pattern surface side
Apply cream solder so as to cover the hole, insert the convex leg of the shield case into the through hole from the mounting surface side, heat the board with the shield case attached in a reflow furnace, and solder it. .

[0007]

The cream solder is applied from the pattern surface side of the substrate, and the cream solder is applied to the through holes formed in the substrate. Next, the convex leg of the shield case is inserted into the through hole from the mounting surface side of the substrate.

As a result, cream solder is sufficiently adhered to the protruding legs of the shield case in the through holes and on the pattern surface side.

Then, the substrate on which the shield case and other components are mounted is heated in a reflow furnace. By this heating, the cream solder is melted, and various components including the shield case are soldered to the substrate.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. First, the substrate and the sheet metal shield case will be described with reference to FIG.

FIG. 3 shows a high-frequency board [hereinafter simply referred to as a board] 1 and a sheet metal shield case [hereinafter simply referred to as a shield case] 2 fixed to the board 1.

One surface of the substrate 1 is a mounting surface 1a for mounting and fixing various chip components (not shown), the above-mentioned shield case 2 and the like. The other surface of the substrate 1 is a pattern surface 1b on which an earth pattern, a wiring pattern, and the like are formed.

The substrate 1 is provided with a large number of through holes 3 and 4 for inserting and inserting lead wires of components or convex legs of a shield case 2 to be described later.

The shield case 2 has a substantially box shape, and a plurality of convex legs 2a and 2b are formed in a lower portion 2d.

Next, a soldering method will be described with reference to FIGS. This soldering method is performed according to the following procedure. (1) Apply cream solder to the mounting surface 1a of the substrate 1. (2) Chip components are automatically placed on the mounting surface 1a of the substrate 1.

(3) The substrate 1 is placed in a reflow furnace (heating furnace) (not shown) and heated. As a result, the cream solder melts and the chip component is soldered and fixed.

(4) A cream solder 6 is applied to the through holes 3 and 4 from the pattern surface 1b side of the substrate 1 shown in FIG. 1 by screen printing.

When the shield case 2 is soldered to the substrate 1, the shield case 2 extends over the entire circumference of the shield case 2 in contact with the substrate 1, and the shield case 2 is connected to the ground pattern provided on the pattern surface 1b. Must be attached.

FIG. 2 shows a state where the cream solder 6 is applied. As apparent from FIG. 2, the cream solder 6 enters the through holes 3 and 4 and is applied in a state of closing the through holes 3 and 4.

Generally, soldering of components (excluding the shield case 2) to the substrate 1 is performed by screen printing of the cream solder 6 on the mounting surface 1a side, and then mounting the components on the mounting surface 1a, and The heating procedure is performed in a reflow furnace. The soldering of the shield case 2 is performed separately as described above.

However, in this embodiment, soldering of the shield case 2 is performed by first screen-printing the cream solder 6 on the pattern surface 1b,
The procedure is performed by inserting the convex legs 2a, 2b of the shield case 2 from the side a, bending the convex legs 2b on the pattern surface 1b side, and heating in a reflow furnace.

(5) As shown in FIG. 3, the convex legs 2a and 2b of the shield case 2 are connected to the mounting surface 1 of the substrate 1.
Insert the through holes 3 and 4 from the side a.

FIG. 4 shows a state in which the convex legs 2a, 2b of the shield case 2 are inserted into the through holes 3, 4.
As a result of the insertion, the convex leg 2b is
FIG. 5 shows a state in which the projection has been made to the side. FIG.
As is clear from the above, the insertion of the convex legs 2a, 2b causes the tips of the convex legs 2a, 2b to be covered with the cream solder 6.

(6) The convex leg 2b of the shield case 2 is bent as shown in FIG. A plurality of, in the illustrated example, four, convex legs 2b are provided below the shield case 2d. FIG. 6, FIG.
The shield case 2 is fixed to the mounting surface 1a side of the substrate 1 by being bent as shown in FIG.

(7) As shown in FIG. 8, the lead wire 8a of the component 8 mounted on the pattern surface 1b of the substrate 1
Into the through hole 4.

(8) The shield case 2 and various chip parts are mounted on the mount surface 1a side, and the pattern surface 1b
The substrate 1 with the components 8 placed on the side is placed in a reflow furnace and heated. As a result, the cream solder 6 is melted, and the convex legs 2a and 2b of the shield case 2, the component 8, and the like are soldered and fixed to the substrate 1.

According to this embodiment, the shield case 2
As for the method, screen printing of the cream solder 6 on the pattern surface 1b side, insertion of the shield case 2 from the mounting surface 1a side, bending of the convex leg portion 2b on the pattern surface 1b side, and reflow furnace Since the shield 1 is soldered to the board 1 by a procedure such as heating, the shield case 2 can be soldered to the high-frequency board 1 by using a cream solder 6 and a reflow furnace.
Solder all the components to the board 1 with cream solder 6
Coating and heating in a reflow oven.
Further, the soldering of the shield case 2 to the substrate 1 can always be performed with good precision and accuracy.

[0028]

In the soldering method according to the present invention, cream solder is applied from the pattern surface side of the substrate, cream solder is applied to the through holes, and then the convex legs of the shield case are attached to the mounting surface side of the substrate. Since the shield case and other components are soldered to the board by heating the board on which the shield case and other parts are placed in a reflow furnace, Has the effect of being able to be soldered to a high-frequency substrate in a reflow oven,
There is an effect that soldering of all components to the substrate can be performed by applying cream solder and heating in a reflow furnace.

Therefore, there is an effect that a component such as a shield case can be soldered to the substrate with good precision and accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a substrate according to an embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view taken along line AA in FIG.

FIG. 3 is a perspective view showing a state where a shield case is assembled to a substrate.

FIG. 4 is a partially enlarged cross-sectional view showing a state in which a convex leg of a shield case is inserted into a through hole of a substrate.

FIG. 5 is a perspective view showing a state in which a convex leg has protruded toward the pattern surface side of the substrate 1;

FIG. 6 is a perspective view showing a state where a convex leg is bent.

FIG. 7 is a perspective view showing a state where the shield case is fixed to the substrate.

FIG. 8 is a perspective view showing a state where components are mounted on a pattern surface of a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Board 1a Mounting surface 1b Pattern surface 2 Shield case 2a, 2b Convex leg 2d Lower part 3, 4, Through hole 6 Cream solder

Claims (1)

(57) [Claims] 1. A soldering method for soldering a shield case to a substrate having a pattern surface and a mounting surface, wherein a cream solder is applied so as to cover a through hole from the pattern surface side. The shield from the mounting surface side to the through hole
A soldering method, comprising: inserting a convex leg of a case; and heating and soldering the substrate on which the shield case is mounted in a reflow furnace.