JPS62241281A - Pin jack fitting method - Google Patents
Pin jack fitting methodInfo
- Publication number
- JPS62241281A JPS62241281A JP8235086A JP8235086A JPS62241281A JP S62241281 A JPS62241281 A JP S62241281A JP 8235086 A JP8235086 A JP 8235086A JP 8235086 A JP8235086 A JP 8235086A JP S62241281 A JPS62241281 A JP S62241281A
- Authority
- JP
- Japan
- Prior art keywords
- pin jack
- circuit board
- printed circuit
- metal plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電気機器等の回路接続に用いられるピンジャ
ックの金属板への取付方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for attaching a pin jack used for circuit connection of electrical equipment to a metal plate.
（従来の技術）
従来１回路接続に用いられるピンジャックをプリント基
板上に配置されている半田付は可能な金属板に取付ける
にはピンジャックの円形取付部と金属板の円形取付孔と
の半田付けによる一体化はプリント基板に配置する前に
手半田で一体化するか、リング半田をピンジャック取付
部に巻き付け、熱による溶解で金属板に取付けており、
その構成物をプリント基板に開けたピンジャック取付孔
にピンジャックを部品挿入側から挿入して構成する方法
がとられていた。(Prior art) To attach a pin jack, which is conventionally used for circuit connection, to a metal plate that can be soldered on a printed circuit board, it is necessary to solder the circular mounting part of the pin jack and the circular mounting hole of the metal plate. Integration by attachment is done by hand soldering before placing it on the printed circuit board, or by wrapping ring solder around the pin jack attachment part and attaching it to the metal plate by melting it with heat.
The conventional method was to construct the structure by inserting a pin jack into a pin jack mounting hole drilled in a printed circuit board from the component insertion side.
第５図は従来のピンジャック取付方法の構成を示すもの
で、１１はピンジャック、１２はリング半田であり、手
半田式の場合は必要としない。１３は薄板の半田付は可
能な金属板、１４は回路を構成するプリント基板である
。FIG. 5 shows the configuration of a conventional pin jack mounting method, in which 11 is a pin jack and 12 is a ring solder, which is not necessary in the case of manual soldering. 13 is a metal plate to which a thin plate can be soldered, and 14 is a printed circuit board that constitutes a circuit.
このように構成された従来例ではピンジャック１１をプ
リント基板１４との構成体にするには、前もって金属板
１３とピンジャック１１を金属板１３に開けたピンジャ
ック１１の挿入孔１３ａを介して一体化したのちにピン
ジャック１１の取付位置に円形孔１４ａを有するプリン
ト基板１４に合わせプリント基板１４を、固定爪１３ｂ
をプリント基板１４に開けた孔１４ｂに装着したのち、
プリント基板１４を半田付けして金属板１３とプリント
基板Ｉ４を一体化する方法をとっていた。In the conventional example configured as described above, in order to combine the pin jack 11 with the printed circuit board 14, the metal plate 13 and the pin jack 11 are connected in advance through the insertion hole 13a of the pin jack 11 made in the metal plate 13. After the integration, the printed circuit board 14 is aligned with the printed circuit board 14 having the circular hole 14a at the mounting position of the pin jack 11, and the fixing claw 13b is inserted.
After attaching it to the hole 14b made in the printed circuit board 14,
The method used was to solder the printed circuit board 14 to integrate the metal plate 13 and the printed circuit board I4.
（発明が解決しようとする問題点）
上記構成によれば、ピンジャックと金属板の構成体を作
るための半田付けとこの構成体とプリント基板を一体化
するための一括半田付け（ディップ）で２度の半田付は
工程が必要となり経済的でなかった。(Problems to be Solved by the Invention) According to the above configuration, soldering is required to create the structure of the pin jack and the metal plate, and batch soldering (dip) is required to integrate the structure and the printed circuit board. Soldering twice required a process and was not economical.
本発明の目的は、従来の欠点を解消し、プリント基板の
一括半田付け（ディップ）だけでピンジャックと金属板
が一体化できるピンジャック取付方法を提供することで
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a pin jack mounting method that eliminates the conventional drawbacks and allows a pin jack and a metal plate to be integrated by simply soldering (dipping) a printed circuit board.
（問題点を解決するための手段）
本発明のピンジャック取付方法は、金属板に開けたピン
ジャックの取付部の外周に合致した孔の周辺から複数個
の折り曲げ部をプリント基板の厚さと同じかそれ以上高
く切り起し、ピンジャックをその孔の切り起しの先端と
反対側から挿入し、その構成物をプリント基板の取付孔
に部品挿入側から挿入して半田付けするものである。(Means for Solving the Problems) The pin jack mounting method of the present invention includes bending a plurality of parts from the periphery of a hole that matches the outer periphery of the pin jack mounting part drilled in a metal plate to the same thickness as the printed circuit board. A pin jack is inserted into the hole from the side opposite to the tip of the cut-out, and the component is inserted into the mounting hole of the printed circuit board from the component insertion side and soldered.
（作 用）
上記構成により、プリント基板の一括半田付け（ディッ
プ）だけでピンジャックと金属板とプリント基板が一体
化できることになる。(Function) With the above configuration, the pin jack, metal plate, and printed circuit board can be integrated by simply soldering (dipping) the printed circuit board all at once.
（実施例）
本発明の一実施例を第１図ないし第４図に基づいて説明
する。(Example) An example of the present invention will be described based on FIGS. 1 to 4.
第１図は本発明のピンジャック取付方法の分解斜視図、
第２図は同断面図、第３図は同斜視図である。同図にお
いて、１はピンジャック、２は薄板の半田付は可能な金
属板、３は回路を構成するプリント基板である。FIG. 1 is an exploded perspective view of the pin jack mounting method of the present invention;
FIG. 2 is a sectional view of the same, and FIG. 3 is a perspective view of the same. In the figure, 1 is a pin jack, 2 is a thin metal plate that can be soldered, and 3 is a printed circuit board that constitutes a circuit.
ここにおいて、金属板２にはピンジャック１を挿入する
孔２ａを設け、孔２ａの周囲にはピンジャック１の挿入
方向４と同方向に曲げた複数個の切り起し２ｂをプリン
ト基板２の厚さと同じかそれ以上の高さに設け、切り起
し２ｂはピンジャック１の取付部１ａの外周部と微小な
間隙５をもつように形成されている。さらに金属板２に
はプリン−３＝
ト基板３と組合せるための固定爪２ｃを設け、固定爪２
ｃはプリント基板３の孔３ａに挿入されると共にプリン
ト基板３にはピンジャック１の取付部１ａの外径より大
きい円形孔３ｂが開けられており、切り起し２ｂおよび
ピンジャック取付部１ａは円形孔３ｂに挿入されるよう
になっている。Here, the metal plate 2 is provided with a hole 2a into which the pin jack 1 is inserted, and around the hole 2a, a plurality of cut-outs 2b bent in the same direction as the insertion direction 4 of the pin jack 1 are formed on the printed circuit board 2. The raised cut 2b is provided at a height equal to or greater than the thickness, and is formed so as to have a minute gap 5 with the outer circumference of the mounting portion 1a of the pin jack 1. Further, the metal plate 2 is provided with a fixing claw 2c for combination with the printed circuit board 3.
c is inserted into the hole 3a of the printed circuit board 3, and the printed circuit board 3 has a circular hole 3b larger than the outer diameter of the mounting portion 1a of the pin jack 1, and the cut-out 2b and the pin jack mounting portion 1a are It is designed to be inserted into the circular hole 3b.
このように構成された本実施例では、ピンジャック１と
金属板２およびプリント基板３の構成体において、プリ
ント基板２の銅面側（反部品挿入側）３ｃを一括半田付
け（ディップ）するとピンジャック取付部１ａの外周部
と微小な間隙５の関係にある金属板２の切り起し２ｂと
の間を半田が毛細管現象で流れ６のように上昇し、取付
部１ａの角面１ｂに達する。これにより、金属板２の孔
２ａの角面２ｄとの接触部に半田が回わり、取付部１ａ
の角面１ｂの全周と金属板２の孔２ａの角面２ｄの全周
が半田付は固定されることになる。その際には金属板２
の固定爪２ｃとプリント基板３の孔３ａの銅面側に設け
た半田付は箇所も同時に半田付けされ、一度の一括半田
付け（ディップ）でピンシャツ＝４−
り１と金属板２とプリン１一基板３の構成体ができるこ
とになる。In this embodiment configured in this way, in the configuration of the pin jack 1, the metal plate 2, and the printed circuit board 3, when the copper side 3c of the printed circuit board 2 (the side opposite to the component insertion side) is soldered (dipped) all at once, the pins are removed. Solder flows upward like 6 due to capillary action between the outer periphery of the jack mounting part 1a and the cut-out 2b of the metal plate 2, which is in a relationship with a minute gap 5, and reaches the corner surface 1b of the mounting part 1a. . As a result, the solder is applied to the contact portion of the hole 2a of the metal plate 2 with the corner surface 2d, and the mounting portion 1a
The entire circumference of the corner surface 1b of the metal plate 2 and the entire circumference of the corner surface 2d of the hole 2a of the metal plate 2 are fixed by soldering. In that case, metal plate 2
The fixing claw 2c and the soldering on the copper side of the hole 3a of the printed circuit board 3 are soldered at the same time, and the pin shirt = 4-ri 1, the metal plate 2, and the printed circuit board are soldered at the same time. A structure of 1-substrate 3 is completed.
ここにおいて、複数個の切り起し２ｂは可能な限り広い
幅で挿入孔２ａの外周に等全配置されているほうが作用
は円滑である。Here, the operation is smoother if the plurality of cut-outs 2b are arranged evenly around the outer periphery of the insertion hole 2a with the widest possible width.
なお、本実施例は円筒状のピンジャックを例としたが、
第４図に示すようなピンジャック７でも有効である。Note that this embodiment uses a cylindrical pin jack as an example, but
A pin jack 7 as shown in FIG. 4 is also effective.
（発明の効果）
本発明によれば、半田付は可能な薄板の金属板に開けた
ピンジャック取付部の外周に合せて形成した切り起しを
微小な間隙で複数個設けることにより、プリント基板の
部品挿入側に半田を毛細管現象で吸い上げ、ピンジャッ
ク取付部と金属板の円形孔を半田付けし、取付強度が従
来のリング半田や手半田によるものと同等であり、半田
付は工程を減少することができる効果がある。(Effects of the Invention) According to the present invention, by providing a plurality of cutouts with minute gaps in a thin metal plate that can be soldered to match the outer periphery of a pin jack mounting portion, soldering can be performed on a printed circuit board. The solder is sucked up by capillary action on the component insertion side, and the pin jack mounting part and the circular hole in the metal plate are soldered.The mounting strength is equivalent to that of conventional ring soldering or manual soldering, and the soldering process is reduced. There is an effect that can be done.
第１図は本発明の一実施例によるピンジャック取付方法
の分解斜視図、第２図は同断面図、第３図は同斜視図、
第４図はビンプラグの一種類の斜視図、第５図は従来の
ピンジャック取付方法の分解斜視図である。
１・・・ピンジャック、 １ａ・・・取付部、 ｌ
ｂ。
２ｄ・・・角面、 ２・・金属板、 ２ａ・・挿入孔、
２ｂ・・・切り起し、 ２ｃ・・・固定爪、 ３・・・
プリント基板、 ３ａ・・・孔、 ３ｂ・・・円形孔、
３ｃ・・・銅面側、 ４・・・挿入方向、 ５・・・間
隙、 ６・・・流れ、 ７・・・ビンプラグ。
特許出願人 松下電器産業株式会社
第１図
４、−挿入方向
第２図
第３図
第４図
７− 、ごンフ゛フク゛
第５図Fig. 1 is an exploded perspective view of a pin jack mounting method according to an embodiment of the present invention, Fig. 2 is a sectional view of the same, Fig. 3 is a perspective view of the same,
FIG. 4 is a perspective view of one type of bottle plug, and FIG. 5 is an exploded perspective view of a conventional pin jack mounting method. 1...Pin jack, 1a...Mounting part, l
b. 2d... corner surface, 2... metal plate, 2a... insertion hole,
2b...Cut up, 2c...Fixed claw, 3...
Printed circuit board, 3a...hole, 3b...circular hole,
3c...Copper surface side, 4...Insertion direction, 5...Gap, 6...Flow, 7...Bin plug. Patent Applicant: Matsushita Electric Industrial Co., Ltd.
Claims (1)
た孔の周辺から複数個の折り曲げ部をプリント基板の厚
さと同じか、該基板の厚さ以上高く切り起し、前記ピン
ジャックを、前記孔の切り起しの先端と反対面から挿入
し、その構成物を、前記プリント基板の取付孔に部品挿
入側から挿入して半田付けすることを特徴とするピンジ
ャック取付方法。A plurality of bent parts are cut from the periphery of the hole that matches the outer periphery of the mounting part of the pin jack drilled in the metal plate to a height equal to or greater than the thickness of the printed circuit board, and the pin jack is A method for attaching a pin jack, comprising inserting the component into the mounting hole of the printed circuit board from the component insertion side and soldering the component into the mounting hole of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235086A JPH0656781B2 (en) | 1986-04-11 | 1986-04-11 | Pin jack mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8235086A JPH0656781B2 (en) | 1986-04-11 | 1986-04-11 | Pin jack mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62241281A true JPS62241281A (en) | 1987-10-21 |
| JPH0656781B2 JPH0656781B2 (en) | 1994-07-27 |
Family
ID=13772118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8235086A Expired - Lifetime JPH0656781B2 (en) | 1986-04-11 | 1986-04-11 | Pin jack mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0656781B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146775U (en) * | 1989-05-18 | 1990-12-13 |
-
1986
- 1986-04-11 JP JP8235086A patent/JPH0656781B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146775U (en) * | 1989-05-18 | 1990-12-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0656781B2 (en) | 1994-07-27 |
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