JPH07240591A - Printed-circuit board with shield case and its manufacture - Google Patents
Printed-circuit board with shield case and its manufactureInfo
- Publication number
- JPH07240591A JPH07240591A JP3227694A JP3227694A JPH07240591A JP H07240591 A JPH07240591 A JP H07240591A JP 3227694 A JP3227694 A JP 3227694A JP 3227694 A JP3227694 A JP 3227694A JP H07240591 A JPH07240591 A JP H07240591A
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- circuit board
- frame member
- printed circuit
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はシールドケースを有する
プリント基板に関するものであり、特に表面実装型のプ
リント基板へのシールドケースの取付に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board having a shield case, and more particularly to mounting a shield case on a surface mount type printed circuit board.
【０００２】[0002]
【従来の技術】従来、表面実装型のプリント基板へのシ
ールドケースの取付は、たとえば特開平３ー１０４１９
８号公報（Ｈ０５Ｋ ９／００）に記載されているよう
に行われている。すなわちこの従来技術は、プリント基
板に設置されるシールドケース枠部材を備え、このシー
ルドケース枠部材にプリント基板の配線導体と直接半田
付けされる脚部を形成したものである。この従来技術に
よれば、シールドケース枠部材は、電子部品等と同時に
リフロー半田付けされるよう構成されているので、半田
付け工数の削減が図られる。2. Description of the Related Art Conventionally, the mounting of a shield case on a surface mount type printed circuit board is disclosed in, for example, Japanese Patent Laid-Open No. 10419/1991.
No. 8 (H05K 9/00). That is, this prior art is provided with a shield case frame member installed on the printed circuit board, and the leg portions directly soldered to the wiring conductors of the printed circuit board are formed on the shield case frame member. According to this conventional technique, since the shield case frame member is configured to be reflow-soldered at the same time as the electronic component and the like, the number of soldering steps can be reduced.
【０００３】しかしながら、シールドケース枠部材を半
田付けするランドの面積が大きくなると、半田付けの際
に溶融した半田の表面張力により枠部材の位置がずれ、
正しく半田付けできないという問題があった。そこで、
通常は電子部品をリフロー半田付けを行った後、枠部材
を別途手半田付けしていた。However, when the area of the land for soldering the shield case frame member becomes large, the position of the frame member shifts due to the surface tension of the solder melted during soldering,
There was a problem that it could not be soldered correctly. Therefore,
Usually, after reflow soldering an electronic component, the frame member is manually soldered separately.
【０００４】すなわち、図３はこのような従来技術を示
したものであり、図において１は面実装型のプリント配
線基板であり、周知のプリント配線技術によって回路パ
ターン２、部品載置ランド３およびシールドケース枠部
材載置用のアースパターンランド４が形成される。そし
て、部品載置ランド３およびアースパターンランド４に
クリーム半田を塗布し、電子部品５を所定の位置に載置
しリフロー炉にて半田付けを行うものである。その後、
プリント基板１にシールドケース枠部材６を密着させて
枠部材６とアースパターンランド４の半田とを半田付け
するものである。That is, FIG. 3 shows such a conventional technique. In FIG. 3, reference numeral 1 denotes a surface mount type printed wiring board, and a circuit pattern 2, a component mounting land 3 and a component mounting land 3 are formed by a known printed wiring technique. The ground pattern land 4 for mounting the shield case frame member is formed. Then, cream solder is applied to the component mounting land 3 and the earth pattern land 4, the electronic component 5 is mounted at a predetermined position, and soldering is performed in a reflow furnace. afterwards,
The shield case frame member 6 is brought into close contact with the printed circuit board 1 and the frame member 6 and the solder of the ground pattern land 4 are soldered.
【０００５】[0005]
【発明が解決しようとする課題】アースパターンランド
４にクリーム半田を塗布するのは、リフローによってラ
ンド表面が変化し、つぎにシールドケース枠部材６を半
田付けするときに半田が付着しにくいという問題を防止
するためであるが、上述のような従来技術の場合、アー
スパターンランド４に塗布したクリーム半田がリフロー
半田付けにより溶融固化し、アースパターンランド４に
もりあがってしまうため、次にシールドケース枠部材６
を半田付けする際に、枠部材が安定せず、半田付け作業
が行いにくいという問題点があった。The reason why cream solder is applied to the earth pattern land 4 is that the land surface changes due to reflow, and the solder does not easily adhere when the shield case frame member 6 is next soldered. However, in the case of the conventional technique as described above, the cream solder applied to the ground pattern land 4 is melted and solidified by reflow soldering and rises to the ground pattern land 4. Member 6
When soldering, the frame member was not stable, and the soldering work was difficult to perform.
【０００６】[0006]
【課題を解決するための手段】上述の従来技術を改善す
るため、本発明はシールドケースを有するプリント基板
において、プリント基板にシールドケース枠部材を半田
付けするためのアースパターンランドを設けるととも
に、該アースパターンランドの枠部材と接する部分に半
田レジストを設け、前記アースパターンランドと枠部材
を半田付けすることを特徴とするものである。In order to improve the above-mentioned prior art, the present invention provides a printed circuit board having a shield case with an earth pattern land for soldering a shield case frame member to the printed circuit board. A solder resist is provided on a portion of the earth pattern land which is in contact with the frame member, and the earth pattern land and the frame member are soldered.
【０００７】さらに本発明は、シールドケースを有する
プリント基板の製造方法であって、プリント基板に回路
パターンおよびシールドケース枠部材が半田付けされる
アースパターンランドを印刷形成し、該アースパターン
ランドの前記シールドケース枠部材が接する部分に半田
レジストを形成し、前記アースパターンランドおよび電
子部品載置ランドにクリーム半田を塗布し、電子部品を
実装してリフロー半田付けを行った後、前記プリント基
板とシールドケースを密着させて前記プリント基板のア
ースパターンランドとシールドケース枠部材を半田付け
することを特徴とするものである。Further, the present invention is a method for manufacturing a printed circuit board having a shield case, wherein a printed circuit board is formed with an earth pattern land to which a circuit pattern and a shield case frame member are soldered, A solder resist is formed on a portion in contact with the shield case frame member, cream solder is applied to the earth pattern land and the electronic component mounting land, and electronic components are mounted and reflow soldering is performed, and then the printed circuit board and the shield are mounted. The case is brought into close contact with the ground pattern land of the printed circuit board and the shield case frame member is soldered.
【０００８】[0008]
【作用】本発明によれば、電子部品をリフロー半田付け
する際にシールドケース枠部材を半田付けするアースパ
ターンランドの枠部材が接する部分には半田が付着しな
いので、その後シールドケース枠部材を半田付けする
際、枠部材の位置が安定するので、作業性良く正確に半
田付けを行うことができる。According to the present invention, since solder does not adhere to the portion of the earth pattern land for soldering the shield case frame member when the electronic component is reflow-soldered, the shield case frame member is soldered thereafter. Since the position of the frame member is stable during soldering, soldering can be performed accurately with good workability.
【０００９】[0009]
【実施例】以下本発明の実施例について図面と共に説明
する。図１および図２は本発明の実施例を示したもので
あり、図において１は、回路パターン２、部品載置ラン
ド３およびシールドケース枠部材載置用のアースパター
ンランド４が印刷形成された面実装型のプリント配線基
板である。そして、プリント基板１のアースパターンラ
ンド４のシールドケース枠部材６が接する部分に、枠部
材の板厚と同じかわずかに広い幅の半田レジスト７を印
刷形成する。そして、部品載置ランド３およびアースパ
ターンランド４にクリーム半田を塗布し、電子部品５を
所定の位置に載置しリフロー炉にて半田付けを行う。
その後、プリント基板１にシールドケース枠部材６を密
着させて枠部材６とアースパターンランド４の半田とを
半田付けする。このとき、アースパターンランド４のシ
ールドケース枠部材６が当接する部分には半田レジスト
が塗布されているので、図２（ａ）に示すように枠部材
６を安定して載置する事ができる。そしてその後、図２
（ｂ）に示すように枠部材６を半田付けし、蓋体８をか
ぶせ完成する。Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the present invention. In FIG. 1, a circuit pattern 2, a component mounting land 3 and an earth pattern land 4 for mounting a shield case frame member are formed by printing. It is a surface-mounted printed wiring board. Then, a solder resist 7 having a width equal to or slightly wider than the plate thickness of the frame member is printed and formed on a portion of the ground pattern land 4 of the printed circuit board 1 which is in contact with the shield case frame member 6. Then, cream solder is applied to the component mounting land 3 and the earth pattern land 4, the electronic component 5 is mounted at a predetermined position, and soldering is performed in a reflow furnace.
After that, the shield case frame member 6 is brought into close contact with the printed circuit board 1 and the frame member 6 and the solder of the ground pattern land 4 are soldered. At this time, since the solder resist is applied to the portion of the earth pattern land 4 which is in contact with the shield case frame member 6, the frame member 6 can be stably placed as shown in FIG. 2A. . And after that, FIG.
As shown in (b), the frame member 6 is soldered and the lid 8 is covered to complete the process.
【００１０】[0010]
【発明の効果】以上のように本発明によるシールドケー
スを有するプリント基板はシールドケース枠部材を半田
付けするためのアースパターンランドを設けるととも
に、該アースパターンランドの枠部材と接する部分にレ
ジストを設け、前記アースパターンランドと枠部材を半
田付けするよう構成したので、リフロー後にシールドケ
ースとプリント基板とが接するプリント基板の銅箔部分
に半田が付くこと無くシールドケースとプリント基板と
を密着して半田付けができる。As described above, the printed circuit board having the shield case according to the present invention is provided with the earth pattern land for soldering the shield case frame member, and the resist is provided at the portion of the earth pattern land which is in contact with the frame member. Since the ground pattern land and the frame member are configured to be soldered, the shield case and the printed circuit board are closely attached to each other without soldering on the copper foil portion of the printed circuit board where the shield case and the printed circuit board are in contact with each other after reflow. Can be attached.
【図１】本発明によるシールドケースを有するプリント
基板を示す分解斜視図である。FIG. 1 is an exploded perspective view showing a printed circuit board having a shield case according to the present invention.
【図２】本発明によるシールドケースを有するプリント
基板を示す断面図である。FIG. 2 is a sectional view showing a printed circuit board having a shield case according to the present invention.
【図３】従来のシールドケースを有するプリント基板を
示す分解斜視図である。FIG. 3 is an exploded perspective view showing a printed circuit board having a conventional shield case.
１ プリント基板 ２ 回路パターン ３ 電子部品載置ランド ４ アースパターンランド ５ 電子部品 ６ シールドケース枠部材 ７ 半田レジスト ８ シールドケース蓋体 1 Printed circuit board 2 Circuit pattern 3 Electronic component mounting land 4 Earth pattern land 5 Electronic component 6 Shield case frame member 7 Solder resist 8 Shield case lid
Claims (2)
おいて、プリント基板にシールドケース枠部材を半田付
けするためのアースパターンランドを設けるとともに、
該アースパターンランドの枠部材と接する部分に半田レ
ジストを設け、前記アースパターンランドと枠部材を半
田付けすることを特徴とするシールドケースを有するプ
リント基板。1. A printed circuit board having a shield case, wherein an earth pattern land for soldering the shield case frame member to the printed circuit board is provided, and
A printed circuit board having a shield case, characterized in that a solder resist is provided on a portion of the earth pattern land which is in contact with the frame member, and the earth pattern land and the frame member are soldered.
ルドケース枠部材が半田付けされるアースパターンラン
ドを印刷形成し、該アースパターンランドの前記シール
ドケース枠部材が接する部分に半田レジストを形成し、
前記アースパターンランドおよび電子部品載置ランドに
クリーム半田を塗布し、電子部品を実装してリフロー半
田付けを行った後、前記プリント基板とシールドケース
を密着させて前記プリント基板のアースパターンランド
とシールドケース枠部材を半田付けすることを特徴とす
るシースドケースを有するプリント基板の製造方法。2. A printed circuit board is provided with an earth pattern land to which a circuit pattern and a shield case frame member are soldered, and a solder resist is formed on a portion of the earth pattern land which is in contact with the shield case frame member.
After applying cream solder to the earth pattern land and the electronic component mounting land and mounting the electronic component and performing reflow soldering, the printed circuit board and the shield case are brought into close contact with each other and the earth pattern land and the shield of the printed circuit board are attached. A method of manufacturing a printed circuit board having a sheathed case, comprising soldering a case frame member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227694A JPH07240591A (en) | 1994-03-02 | 1994-03-02 | Printed-circuit board with shield case and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227694A JPH07240591A (en) | 1994-03-02 | 1994-03-02 | Printed-circuit board with shield case and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07240591A true JPH07240591A (en) | 1995-09-12 |
Family
ID=12354464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3227694A Pending JPH07240591A (en) | 1994-03-02 | 1994-03-02 | Printed-circuit board with shield case and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07240591A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593523B2 (en) | 2001-01-19 | 2003-07-15 | Mitsubishi Denki Kabushiki Kaisha | Shield structure for electronic circuit parts |
| DE102004043478B4 (en) * | 2003-09-09 | 2007-11-22 | Mitsubishi Denki K.K. | shield |
| JP2016207961A (en) * | 2015-04-28 | 2016-12-08 | 富士通株式会社 | Printed board and shield plate fixing method |
| WO2019072475A1 (en) * | 2017-10-10 | 2019-04-18 | Endress+Hauser SE+Co. KG | Method for mechanical contacting of a potting frame on a printed circuit board |
| CN113382620A (en) * | 2020-03-09 | 2021-09-10 | 启碁科技股份有限公司 | Electronic device and electromagnetic shielding frame |
-
1994
- 1994-03-02 JP JP3227694A patent/JPH07240591A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593523B2 (en) | 2001-01-19 | 2003-07-15 | Mitsubishi Denki Kabushiki Kaisha | Shield structure for electronic circuit parts |
| DE102004043478B4 (en) * | 2003-09-09 | 2007-11-22 | Mitsubishi Denki K.K. | shield |
| JP2016207961A (en) * | 2015-04-28 | 2016-12-08 | 富士通株式会社 | Printed board and shield plate fixing method |
| WO2019072475A1 (en) * | 2017-10-10 | 2019-04-18 | Endress+Hauser SE+Co. KG | Method for mechanical contacting of a potting frame on a printed circuit board |
| CN113382620A (en) * | 2020-03-09 | 2021-09-10 | 启碁科技股份有限公司 | Electronic device and electromagnetic shielding frame |
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