JP3906563B2 - Surface mount module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mount module, and more particularly to a terminal structure thereof.
[0002]
[Prior art]
The conventional surface mount module has the configuration shown in FIGS. FIG. 6 is an external perspective view of the module, and FIG. 7 is an arrangement diagram of electric circuits on a substrate constituting the module. A conventional surface mount module will be described below with reference to the drawings. 6A is a perspective view of the front surface of the module 1, and FIG. 6B is a perspective view of the back surface of the module 1. Reference numeral 2 denotes a resin-type printed circuit board (hereinafter referred to as a module board) on which a high-frequency circuit used for a module is formed, and a terminal electrode 3 formed by dividing a through hole in the axial direction is formed around the printed circuit board. A module mounting land 4 connected to the terminal electrode 3 is formed on the back surface of the module substrate 2. Electronic parts constituting an electric circuit are mounted on the surface of the module substrate 2, and a metal cover 5 for electromagnetic shielding is attached. Reference numeral 6 denotes a substrate on which the module 1 is mounted. On the mounting surface, mounting lands 7 having appropriate sizes are formed at positions corresponding to the terminal electrodes 3 and the lands 4 of the module 1.
[0003]
When the module 1 is mounted, cream solder is printed on the lands 7 of the substrate 6, the cream solder is melted through a reflow furnace, and the terminal electrodes 3 and lands 4 of the module 1 and the lands 7 of the substrate 6 are soldered. FIG. 7 is an outline of an electric circuit layout on a substrate constituting the module, and a circuit block 8 constituting an electric circuit is formed on the module substrate 2. The layout of the electrical components constituting the circuit block 8 is connected to the terminal electrodes 3 formed around the module substrate 2 as indicated by arrows.
[0004]
[Problems to be solved by the invention]
However, in such a conventional configuration, in order to connect the electric circuit pattern formed on the module substrate 2 and the internal electric components to the terminal electrode 3 formed on the periphery of the module substrate 2, the internal components and the terminals are particularly arranged. When connecting to the electrode 3, a case where a long pattern such as 9 is routed on the module substrate 2 or the inner layer of the module substrate 2 occurs, and the circuit pattern length becomes long by this routing, and a predetermined performance cannot be obtained. was there. In addition, the number of layers of the module substrate 2 is increased, which is a constraint condition in the design of the electric circuit pattern and the layout design of the electric components constituting the module.
[0005]
An object of the present invention is to provide a surface mount module for solving such problems and for facilitating the design of an electric circuit pattern constituting the module.
[0006]
[Means for Solving the Problems]
The present invention in order to achieve this goal is to divide the through holes around the module substrate of the module and terminal electrodes formed by dividing the axial direction, a through hole in the axial direction inside the module substrate An internal terminal electrode formed; a first hole provided in an internal terminal electrode portion of the module substrate; and an electromagnetic shield cover attached to cover the module substrate, wherein the internal terminal electrode is the module Is smaller than a mounting land provided at a position corresponding to the internal terminal electrode of the board on which the internal terminal is mounted, and the internal terminal is passed through the first hole in a portion corresponding to the internal terminal electrode of the electromagnetic shield cover. A hole for confirming the soldering state between the electrode and the mounting land is provided .
[0007]
This facilitates circuit pattern layout design.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention is to divide the through holes around the module substrate of the module and terminal electrodes formed by dividing the axial direction, a through hole in the axial direction inside the module substrate An internal terminal electrode , a first hole provided in an internal terminal electrode portion of the module substrate, and an electromagnetic shield cover attached so as to cover the module substrate, The size is smaller than the mounting land provided at a position corresponding to the internal terminal electrode of the substrate on which the module is mounted, and the portion corresponding to the internal terminal electrode of the electromagnetic shield cover is connected to the internal through the first hole. a surface-mounted module having a hole for checking the soldering state between the mounting land with the terminal electrodes, thus module group The circuit layout design of the module is possible because the electrical circuit on the board on which the module is mounted can be connected not only with the terminal electrodes formed around the module board but also with the terminal electrodes inside the module board. It becomes easy.
[0009]
Further, since the soldering state of the terminal electrode inside the module substrate can be confirmed through the hole of the module substrate from above the cover, good soldering quality can be ensured.
[0010]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a layout diagram of an electric circuit of a module substrate 10 constituting a module according to an embodiment of the present invention. A terminal electrode 11 is formed around the module substrate 10, and a circuit block 12 constituting an electric circuit is formed on the module substrate 10. Inside the module substrate 10, internal terminal electrodes 13 formed by dividing through holes in the axial direction are formed. Here, the inside of the module substrate 10 means the periphery of the module substrate 10 and not the inside of the base material. In this embodiment, the through hole is divided by a mold, but it can be formed by a router. A hole 14 having an appropriate width is formed in the internal terminal electrode 13 portion. The circuit pattern 15 constituting the circuit block 12 is connected to the terminal electrode 11 and the internal terminal electrode 13 in the vicinity as shown by arrows.
[0011]
FIG. 2 shows an example in which the module substrate 10 is covered with a metal electromagnetic shield cover 16. The cover 16 has a hole 17 formed by removing an upper portion corresponding to the internal terminal electrode 13 formed on the module substrate 10. .
[0012]
FIG. 3 shows the back surface of the module 20, in which lands 18 connected to the terminal electrodes 11 around the module substrate 10 and lands 19 connected to the internal terminal electrodes 13 are formed.
[0013]
4A and 4B show an external perspective view of the module 20 described with reference to FIGS. 1 to 3 and a partial perspective view of a substrate 21 on which the module 20 is mounted. The board 21 is a board on which the module 20 is mounted, and on the mounting surface, the terminal electrode 11, the land 18, and the internal land are located on the mounting surface at positions corresponding to the terminal electrode 11, the land 18, the internal terminal electrode 13, and the internal land 19. A larger mounting land 22 is formed corresponding to the size of the terminal electrode 13 and the internal land 19. When mounting the module 20, cream solder is printed on the mounting lands 22, and the cream solder is melted through a reflow furnace so that the terminal electrodes 11, lands 18, internal terminal electrodes 13, internal lands 19 and the substrate 21 of the module 20 are melted. The land 22 is soldered.
[0014]
FIG. 5 is a plan view of the module 20 mounted on the substrate 21, confirming the soldering state to the terminal electrodes 11 around the module 20, and through the punched hole 14 of the module substrate 10 by the hole 17 provided in the cover 16. The soldering state to the terminal electrode 13 can be confirmed.
[0015]
As described above, according to the present embodiment, not only the terminal electrode 11 formed around the module substrate 10 but also the module substrate is connected to the electric circuit on the module substrate 10 and the electric circuit on the substrate on which the module 20 is mounted. Since the internal terminal electrodes 13 in the 10 can be connected, the circuit layout design of the module 20 becomes easy. Further, the routing pattern from the electric circuit inside the module substrate 10 to the surrounding terminal electrodes 11 is reduced, which is effective for reducing the number of layers of the substrate.
[0016]
Further, since the soldering state of the internal terminal electrodes 13 inside the module substrate 10 can be confirmed from above the substrate, good solder quality can be ensured.
[0017]
【The invention's effect】
As described above, according to the present invention, the connection between the electrical circuit on the module board and the electrical circuit on the board on which the module is mounted is connected not only to the terminal electrodes formed around the module board but also to the inside formed in the module board. Since the terminal electrodes can be connected, the circuit layout design of the module becomes easy . Further, since the soldering state of the terminal electrode inside the module substrate can be confirmed through the hole of the module substrate from above the cover, good soldering quality can be ensured.
[Brief description of the drawings]
FIG. 1 is a circuit layout diagram of a substrate of a surface mount module according to an embodiment of the present invention. FIG. 2 is a plan view of the surface mount module. FIG. FIG. 5A is a perspective view of the surface mounting module as viewed from the front surface. FIG. 5B is a perspective view of the surface mounting module as viewed from the rear surface. FIG. 5 is a plan view of the surface mounting module after being mounted on the parent printed circuit board. a) is a perspective view as seen from the front surface of a conventional surface mount module, and (b) is a perspective view as seen from the back surface. FIG. 7 is a circuit layout diagram of the module substrate.
10 Module board 11 Terminal electrode 13 Internal terminal electrode 14 Hole 16 Cover 17 Hole 18 Land 19 Land 20 Module 21 Board 22 Land

Claims (1)

And terminal electrodes formed by dividing the through hole in the axial direction around the module substrate constituting the module, the internal terminal electrodes formed by dividing the through hole in the axial direction inside the module substrate, wherein the module substrate A first hole provided in the internal terminal electrode portion, and an electromagnetic shield cover attached to cover the module substrate, the internal terminal electrode and the internal terminal electrode of the substrate on which the module is mounted The soldering state of the internal terminal electrode and the mounting land through the first hole is made smaller than the mounting land provided at the corresponding position, and the portion corresponding to the internal terminal electrode of the electromagnetic shield cover Surface mount module with holes for confirming .

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