TWI776095B - printed circuit board - Google Patents

printed circuit board Download PDF

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Publication number
TWI776095B
TWI776095B TW108141370A TW108141370A TWI776095B TW I776095 B TWI776095 B TW I776095B TW 108141370 A TW108141370 A TW 108141370A TW 108141370 A TW108141370 A TW 108141370A TW I776095 B TWI776095 B TW I776095B
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Taiwan
Prior art keywords
bodies
printed
pair
circuit board
printed circuit
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TW108141370A
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Chinese (zh)
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TW202027593A (en
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宮崎康道
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日商東芝股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

佔據面積2具備具有兩端E1、E2且彼此保有間隔而對向之一對印刷本體2a、2b。印刷本體之兩端彼此間整體具有導電性,且印刷本體自印刷基板露出。印刷本體之間隔於兩端彼此間之至少1個部位變寬。The occupied area 2 includes a pair of printing bodies 2 a and 2 b which have both ends E1 and E2 and face each other with a space therebetween. The two ends of the printed body are electrically conductive as a whole, and the printed body is exposed from the printed substrate. The interval between the printed bodies is widened at at least one location between both ends.

Description

印刷基板printed circuit board

本發明之實施形態係關於一種印刷基板。Embodiments of the present invention relate to a printed circuit board.

於印刷基板,設置例如用於安裝IC(Integrated Circuit:積體電路)晶片或電容器等電子零件之佔據面積(連接端子、焊墊、焊盤)。佔據面積根據安裝零件之種類或尺寸(大小)等,由預先設定之圖案(形狀、圖形、圖案)構成。於此情形時,作為佔據面積之圖案,已知可選擇性地安裝2種尺寸(大小)之電子零件者。 [先前技術文獻] [專利文獻]On the printed circuit board, for example, an occupied area (connection terminals, pads, and pads) for mounting electronic components such as IC (Integrated Circuit) chips and capacitors is provided. The occupied area consists of a preset pattern (shape, figure, pattern) according to the type or size (size) of the mounted parts, etc. In this case, it is known that electronic components of two sizes (sizes) can be selectively mounted as a pattern occupying an area. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開平9-83116號公報[Patent Document 1] Japanese Patent Laid-Open No. 9-83116

[發明所欲解決之問題][Problems to be Solved by Invention]

然而,近年來,為謀求現有之安裝零件之有效利用,故要求印刷基板(佔據面積)可安裝2種以上之各式各樣之尺寸(大小)之電子零件。然而,於上述先前之印刷基板(佔據面積),於選擇可安裝之電子零件之自由度有限制,無法應對該要求。However, in recent years, in order to effectively utilize the existing mounting components, it is required that two or more electronic components of various sizes (sizes) can be mounted on a printed circuit board (occupied area). However, in the above-mentioned conventional printed circuit board (occupied area), the degree of freedom in selecting electronic components that can be mounted is limited, and this requirement cannot be met.

於此情形時,藉由使用例如跨接配線或基板等,亦可將尺寸(大小)不同之電子零件安裝於印刷基板(佔據面積)。然而,如此一來,除電子零件之安裝步驟以外,還需跨接配線或基板之附設步驟。其結果,印刷基板之製造步驟增加且複雜化,製造成本上升。In this case, by using, for example, a jumper wiring, a board, or the like, electronic components having different dimensions (sizes) can be mounted on a printed board (occupied area). However, in this way, in addition to the mounting step of the electronic components, a jumper wiring or an additional step of the substrate is also required. As a result, the manufacturing steps of the printed circuit board are increased and complicated, and the manufacturing cost is increased.

本發明之目的在於提供一種具有可安裝之電子零件之選擇自由度較高之佔據面積之低成本之印刷基板。 [解決問題之技術手段]An object of the present invention is to provide a low-cost printed circuit board having a high degree of freedom of selection of mountable electronic components and an occupied area. [Technical means to solve problems]

根據實施形態,佔據面積具備具有兩端且彼此保有間隔而對向之一對印刷本體。一對印刷本體之兩端彼此間整體具有導電性,且一對印刷本體自印刷基板露出。一對印刷本體之間隔於兩端彼此間之至少1個部位變寬。According to an embodiment, the occupied area is provided with a pair of printing bodies which have both ends and face each other with a gap therebetween. Both ends of the pair of printed bodies are electrically conductive as a whole, and the pair of printed bodies are exposed from the printed substrate. The space between a pair of printing bodies is widened at at least one location between both ends.

「一實施形態之構成」 圖1係本實施形態之印刷基板1之構成圖。如圖1所示,於印刷基板1之表面,設置佔據面積2、3、阻焊劑4。另,對佔據面積2、3之圖案(形狀、圖形、圖案)之詳細稍後予以敍述(參照圖4、圖5)。"Constitution of an Embodiment" FIG. 1 is a configuration diagram of a printed circuit board 1 according to the present embodiment. As shown in FIG. 1 , on the surface of the printed circuit board 1 , occupied areas 2 and 3 and a solder resist 4 are provided. In addition, the details of the patterns (shapes, figures, patterns) occupying the areas 2 and 3 will be described later (see FIGS. 4 and 5 ).

佔據面積2、3由例如銅箔等之導體構成,且構成為可安裝各式各樣之尺寸(大小)之電子零件。阻焊劑4覆蓋佔據面積2、3以外之印刷基板1之表面。藉此,設置於印刷基板1之表面之電路圖案(未圖示)由阻焊劑4保護,僅佔據面積2、3露出至外部。於圖1之例中,連接器5、電阻6、及電容器7等電子零件安裝於佔據面積2、3。The occupied areas 2 and 3 are constituted by conductors such as copper foil, and are constituted so that electronic parts of various sizes (sizes) can be mounted. The solder resist 4 covers the surface of the printed circuit board 1 other than the occupied areas 2 and 3 . Thereby, the circuit pattern (not shown) provided on the surface of the printed circuit board 1 is protected by the solder resist 4, and only the occupied areas 2 and 3 are exposed to the outside. In the example of FIG. 1 , electronic components such as the connector 5 , the resistor 6 , and the capacitor 7 are mounted on the occupied areas 2 and 3 .

圖2及圖3係電子零件5、6、7之安裝方法之模式圖。如圖2所示,於佔據面積2、3(稍後敍述之一對印刷本體2a、3a、2b、3b),根據預先設定之安裝計劃,隔以間隔塗佈安裝用焊料8。焊料8具有膏狀,並於安裝電子零件5、6、7之前塗佈於佔據面積2、3上。另,因塗佈方法可應用現有之方法,故省略其說明。FIG. 2 and FIG. 3 are schematic views of the mounting method of the electronic components 5 , 6 , and 7 . As shown in FIG. 2, on the occupied areas 2, 3 (one pair of printed bodies 2a, 3a, 2b, 3b described later), according to a preset mounting plan, the mounting solder 8 is applied at intervals. The solder 8 has a paste form and is applied to the occupied areas 2 and 3 before mounting the electronic components 5 , 6 and 7 . In addition, since the conventional method can be applied to a coating method, the description is abbreviate|omitted.

如圖3所示,於使電子零件5、6、7載置於焊料8之狀態下,於預先設定之溫度管理之下,使該焊料8熔融並凝固。藉此,電子零件5、6、7之電極Te焊接於佔據面積2、3。且,電子零件5、6、7介隔佔據面積2、3安裝於印刷基板1。As shown in FIG. 3 , in a state where the electronic components 5 , 6 , and 7 are placed on the solder 8 , the solder 8 is melted and solidified under predetermined temperature control. Thereby, the electrodes Te of the electronic components 5 , 6 , and 7 are welded to the occupied areas 2 and 3 . Further, the electronic components 5 , 6 , and 7 are mounted on the printed circuit board 1 via the occupied areas 2 and 3 .

圖4係第1圖案(形狀、圖形、圖案)之佔據面積2之輪廓構成圖。如圖4所示,於第1圖案,佔據面積2具有一對印刷本體(第1印刷本體2a、第2印刷本體2b)。印刷本體2a、2b彼此保有間隔而對向配置。FIG. 4 is an outline configuration diagram of the occupied area 2 of the first pattern (shape, figure, pattern). As shown in FIG. 4, in the 1st pattern, the occupied area 2 has a pair of printing bodies (1st printing body 2a, 2nd printing body 2b). The printing bodies 2a and 2b are arranged to face each other with a gap therebetween.

印刷本體2a、2b成具有兩端(一端E1、另一端E2)之曲線狀。印刷本體2a、2b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體2a、2b自印刷基板1之表面露出至外部。於圖4之例中,印刷本體2a、2b整體(全部)具有相互相同之輪廓,即圓弧形狀。The printed bodies 2a and 2b have a curved shape having both ends (one end E1 and the other end E2). Both ends E1 and E2 of the printed bodies 2 a and 2 b are electrically conductive as a whole (all of them), and the printed bodies 2 a and 2 b are exposed to the outside from the surface of the printed circuit board 1 . In the example of FIG. 4, the printing bodies 2a, 2b as a whole (all) have mutually the same outline, that is, a circular arc shape.

此處,印刷本體2a、2b彼此之間隔於兩端E1、E2彼此間至少1個部位最寬。於圖4之例中,該間隔於兩端E1、E2最窄,隨著遠離該兩端E1、E2而變寬。換言之,該間隔於與兩端E1、E2等距離之部位(即,印刷本體2a、2b之中央部)最寬。Here, the distance between the printed bodies 2a and 2b is the widest at at least one location between the two ends E1 and E2. In the example of FIG. 4 , the interval is the narrowest at the two ends E1 and E2 , and widens as the distance from the two ends E1 and E2 is increased. In other words, the interval is the widest at a position equidistant from both ends E1, E2 (ie, the central portion of the printing bodies 2a, 2b).

進而,印刷本體2a、2b相對於相互正交之2條直線L1、L2具有線對稱之關係,且相對於2條直線L1、L2之交點Ps具有點對稱之關係。直線L1自印刷本體2a、2b之兩端E1彼此間之中央通過兩端E2彼此間之中央延伸。直線L2穿越與兩端E1、E2等距離之部位(印刷本體2a、2b之中央部)延伸。且,規定交點Ps作為印刷本體2a、2b(即佔據面積2)之重心。Furthermore, the printing bodies 2a and 2b have a line-symmetric relationship with respect to two mutually orthogonal straight lines L1 and L2, and have a point-symmetric relationship with respect to the intersection point Ps of the two straight lines L1 and L2. The straight line L1 extends from the center between the two ends E1 of the printing bodies 2a, 2b through the center between the two ends E2. The straight line L2 extends through a position equidistant from both ends E1 and E2 (the central portion of the printing bodies 2a and 2b). In addition, the intersection point Ps is defined as the center of gravity of the printed bodies 2a and 2b (that is, the occupied area 2).

圖5係第2圖案(形狀、圖形、圖案)之佔據面積3之輪廓構成圖。如圖5所示,於第2圖案,佔據面積3具有一對印刷本體(第1印刷本體3a、第2印刷本體3b)。印刷本體3a、3b彼此保有間隔而對向配置。FIG. 5 is an outline configuration diagram of the occupied area 3 of the second pattern (shape, figure, pattern). As shown in FIG. 5, in the 2nd pattern, the occupied area 3 has a pair of printing bodies (1st printing body 3a, 2nd printing body 3b). The printing bodies 3a and 3b are arranged to face each other with a gap therebetween.

印刷本體3a、3b成具有兩端(一端E1、另一端E2)之直線狀。印刷本體3a、3b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體3a、3b自印刷基板1之表面露出於外部。於圖5之例中,印刷本體3a、3b其整體(全部)具有相互相同之輪廓,即長條之矩形狀。The printed bodies 3a and 3b have a linear shape having both ends (one end E1 and the other end E2). Both ends E1 and E2 of the printed bodies 3 a and 3 b are electrically conductive as a whole (all of them), and the printed bodies 3 a and 3 b are exposed to the outside from the surface of the printed circuit board 1 . In the example of FIG. 5, the printing bodies 3a, 3b have the same outlines as a whole (all), that is, a long rectangular shape.

此處,印刷本體3a、3b彼此之間隔於兩端E1、E2彼此間至少1個部位最寬。於圖5之例中,該間隔於一端E1最窄,隨著自一端E1向另一端E2逐漸變寬,於另一端E2為最寬。於此情形時,該間隔自一端E1向另一端E2以漸寬狀擴展。換言之,該間隔自另一端E2向一端E1前端以漸細狀變窄。Here, the distance between the printed bodies 3a and 3b is the widest at at least one location between the two ends E1 and E2. In the example of FIG. 5 , the interval is the narrowest at one end E1 , widens gradually from one end E1 to the other end E2 , and is the widest at the other end E2 . In this case, the interval expands gradually from one end E1 to the other end E2. In other words, the interval narrows in a tapered shape from the other end E2 to the front end of the one end E1.

進而,印刷本體3a、3b相對於1條直線L1具有線對稱之關係。此處,直線L1自印刷本體3a、3b之兩端E1彼此間之中央通過兩端E2彼此間之中央而延伸。Furthermore, the printed bodies 3a and 3b have a line-symmetric relationship with respect to one straight line L1. Here, the straight line L1 extends from the center between the two ends E1 of the print bodies 3a and 3b through the center between the two ends E2.

圖6係顯示佔據面積2、3之圖案形成法之模式圖。於圖6中,作為一例,顯示第1圖案之佔據面積2(印刷本體2a、2b)之形成方法。於此情形時,假設以下2種圖案形成法。1種圖案形成方法雖未特別圖示,但與佔據面積2(印刷本體2a、2b)之輪廓一致,例如將銅箔等導體設置於印刷基板1之表面。而另1種圖案形成方法係使用稍後敍述之防焊開口4a、4b之方法,且於圖6顯示該另1個圖案形成方法。FIG. 6 is a schematic diagram showing a patterning method of occupying areas 2 and 3. FIG. In FIG. 6, as an example, the formation method of the occupation area 2 (printing main body 2a, 2b) of a 1st pattern is shown. In this case, the following two patterning methods are assumed. One patterning method is not particularly shown, but is consistent with the outline of the occupation area 2 (printed bodies 2a, 2b), for example, a conductor such as copper foil is provided on the surface of the printed circuit board 1 . Another pattern forming method is a method using the solder mask openings 4a and 4b described later, and the other pattern forming method is shown in FIG. 6 .

如圖6所示,首先於印刷基板1之表面,設置一對銅箔圖案9a、9b。銅箔圖案9a、9b係以於印刷基板1之表面廣範圍地塗滿銅箔之方式形成。其次,以覆蓋一對銅箔圖案9a、9b之方式,設置阻焊劑4。As shown in FIG. 6 , first, a pair of copper foil patterns 9 a and 9 b are provided on the surface of the printed circuit board 1 . The copper foil patterns 9a and 9b are formed so that the surface of the printed circuit board 1 may be covered with copper foil in a wide range. Next, the solder resist 4 is provided so as to cover the pair of copper foil patterns 9a and 9b.

於阻焊劑4,預先形成一對防焊開口(第1防焊開口4a、第2防焊開口4b)。第1防焊開口4a貫通阻焊劑4而形成,具有與上述第1印刷本體2a之輪廓一致之形狀。第2防焊開口4b貫通阻焊劑4而形成,具有與上述第2印刷本體2b之輪廓一致之形狀。In the solder resist 4, a pair of solder resist openings (a first solder resist opening 4a and a second solder resist opening 4b) are formed in advance. The first solder resist opening 4a is formed through the solder resist 4, and has a shape that conforms to the outline of the first printed body 2a. The second solder resist opening 4b is formed through the solder resist 4, and has a shape that conforms to the outline of the second printed body 2b.

藉此,經由一對防焊開口(第1防焊開口4a、第2防焊開口4b),於印刷基板1之表面,形成第1圖案之佔據面積2(印刷本體2a、2b)。Thereby, the occupation area 2 of the first pattern (printed bodies 2a, 2b) is formed on the surface of the printed circuit board 1 through the pair of solder resist openings (the first solder resist opening 4a, the second solder resist opening 4b).

圖7係第1圖案之安裝狀態之模式圖。於圖7中,作為一例,尺寸(大小)不同之4個電子零件10、11、12、13安裝於佔據面積2(印刷本體2a、2b)。於此情形時,使小型尺寸之電子零件10、11逐個安裝於兩端側。使中型尺寸之電子零件12偏於單側而安裝。使大型尺寸之電子零件13旋轉(傾斜)安裝。FIG. 7 is a schematic view of the installation state of the first pattern. In FIG. 7, as an example, four electronic components 10, 11, 12, 13 different in size (size) are mounted on the occupied area 2 (printed body 2a, 2b). In this case, the small-sized electronic components 10 and 11 are mounted on both end sides one by one. The middle-sized electronic components 12 are mounted on one side. The large-sized electronic parts 13 are rotated (tilted) mounted.

圖8係第2圖案之安裝狀態之模式圖。於圖8中,作為一例,尺寸(大小)不同之2個電子零件14、15安裝於佔據面積3(印刷本體3a、3b)。於此情形時,使短條尺寸之電子零件14安裝於印刷本體3a、3b之彼此間隔較窄之部位。使長條尺寸之電子零件15安裝於印刷本體3a、3b之彼此間隔較寬之部位。FIG. 8 is a schematic view of the installation state of the second pattern. In FIG. 8, as an example, two electronic components 14 and 15 different in size (size) are mounted on the occupied area 3 (printed bodies 3a, 3b). In this case, the electronic components 14 of the short strip size are mounted on the parts of the printed bodies 3a, 3b which are spaced narrowly from each other. The electronic components 15 of the strip size are mounted on the widely spaced parts of the printed bodies 3a and 3b.

「一實施形態之作用效果」 以上,根據本實施形態,佔據面積2、3(一對印刷本體2a、3a、2b、3b)整體具有導電性,且自印刷基板1之表面露出。藉此,於遍及佔據面積2、3整體之任意部位(位置),可安裝任意尺寸之電子零件。其結果,能提高可安裝之電子零件之選擇自由度。"Effects of an Embodiment" As described above, according to the present embodiment, the occupying areas 2 and 3 (a pair of printed bodies 2a, 3a, 2b, and 3b) have conductivity as a whole and are exposed from the surface of the printed circuit board 1 . Thereby, electronic components of any size can be mounted on any part (position) of the whole occupying areas 2 and 3 . As a result, the degree of freedom of selection of mountable electronic components can be improved.

根據本實施形態,印刷本體2a、3a、2b、3b之間隔於兩端E1、E2彼此間之至少1個部位變寬。藉此,可安裝各式各樣之尺寸(大小)之電子零件。於此情形時,無需例如跨接配線或基板等。其結果,可使印刷基板1之印刷成本減少。According to the present embodiment, the interval between the printed bodies 2a, 3a, 2b, and 3b is widened at at least one location between both ends E1 and E2. Thereby, various sizes (sizes) of electronic components can be mounted. In this case, for example, jumper wires or substrates are not required. As a result, the printing cost of the printed circuit board 1 can be reduced.

根據本實施形態,可自由地選擇並安裝零件規格或製造商不同之各式各樣之電子零件。藉此,安裝零件之多供應商化變得容易。其結果,可謀求現有之安裝零件之有效利用。According to this embodiment, it is possible to freely select and mount various electronic components with different component specifications and manufacturers. Thereby, it becomes easy to become a supplier of many installation parts. As a result, the existing mounting parts can be effectively utilized.

「變化例」 本發明不限定於上述實施形態,以下之變化例亦包含於本發明之技術範圍。"Variation" The present invention is not limited to the above-described embodiments, and the following modifications are also included in the technical scope of the present invention.

圖9係第3圖案(形狀、圖形、圖案)之佔據面積16之輪廓構成圖。如圖9所示,於第3圖案中,佔據面積16具有一對印刷本體(第1印刷本體16a、第2印刷本體16b)。印刷本體16a、16b彼此保有間隔而對向配置。FIG. 9 is an outline configuration diagram of the occupied area 16 of the third pattern (shape, figure, pattern). As shown in FIG. 9, in the 3rd pattern, the occupied area 16 has a pair of printing bodies (1st printing body 16a, 2nd printing body 16b). The printing bodies 16a and 16b are arranged to face each other with a gap therebetween.

印刷本體16a、16b成具有兩端(一端E1、另一端E2)之曲線狀。印刷本體16a、16b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體16a、16b自印刷基板1之表面露出於外部。於圖9之例中,印刷本體16a、16b其整體(全部)具有相互相同之輪廓,即圓弧形狀。The printed bodies 16a and 16b have a curved shape having both ends (one end E1 and the other end E2). Both ends E1 and E2 of the printed bodies 16 a and 16 b are electrically conductive as a whole (all of them), and the printed bodies 16 a and 16 b are exposed to the outside from the surface of the printed circuit board 1 . In the example of FIG. 9, the printing bodies 16a, 16b have the same outline as the whole (all), that is, the shape of an arc.

此處,印刷本體16a、16b彼此之間隔於兩端E1、E2彼此間之至少1個部位最寬。於圖9之例中,該間隔於兩端E1、E2最寬,隨著遠離該兩端E1、E2而變窄。換言之,於與兩端E1、E2等距離之部位(即,印刷本體16a、16b之中央部),印刷本體16a、16b彼此之間隔最窄。Here, the distance between the printed bodies 16a and 16b is the widest at at least one location between the two ends E1 and E2. In the example of FIG. 9 , the interval is widest at the two ends E1 and E2 , and becomes narrower as the distance from the two ends E1 and E2 is increased. In other words, at a position equidistant from both ends E1 and E2 (ie, the central portion of the printing bodies 16a and 16b), the distance between the printing bodies 16a and 16b is the narrowest.

進而,印刷本體16a、16b相對於相互正交之2條直線L1、L2具有線對稱之關係,且相對於2條直線L1、L2之交點Ps具有點對稱之關係。直線L1自印刷本體16a、16b之兩端E1彼此間之中央通過兩端E2彼此間之中央而延伸。直線L2穿越與兩端E1、E2等距離之部位(印刷本體16a、16b之中央部)而延伸。且,將交點Ps規定作為印刷本體16a、16b(即佔據面積16)之重心。Furthermore, the printed bodies 16a and 16b have a line-symmetric relationship with respect to the two straight lines L1 and L2 orthogonal to each other, and have a point-symmetric relationship with respect to the intersection point Ps of the two straight lines L1 and L2. The straight line L1 extends from the center between the two ends E1 of the printing bodies 16a, 16b through the center between the two ends E2. The straight line L2 extends through a portion (central portion of the printing bodies 16a, 16b) equidistant from both ends E1, E2. In addition, the intersection point Ps is defined as the center of gravity of the printing bodies 16a and 16b (that is, the occupied area 16).

圖10係第4圖案(形狀、圖形、圖樣)之佔據面積17之輪廓構成圖。如圖10所示,具有一對印刷本體(第1印刷本體17a、第2印刷本體17b)。印刷本體17a、17b彼此保有間隔而對向配置。FIG. 10 is an outline configuration diagram of the occupied area 17 of the fourth pattern (shape, figure, pattern). As shown in FIG. 10, it has a pair of printing bodies (1st printing body 17a, 2nd printing body 17b). The printing bodies 17a and 17b are arranged to face each other with a gap therebetween.

第1印刷本體17a成具有兩端(一端E1、另一端E2)之曲線狀,第2印刷本體17b成具有兩端(一端E1、另一端E2)之直線狀。印刷本體17a、17b之兩端E1、E2彼此間整體具有導電性,且印刷本體17a、17b自印刷基板1之表面露出於外部。於圖10之例中,第1印刷本體17a其整體(全部)具有圓弧形狀。另一方面,第2印刷本體17b其整體(全部)具有長條之矩形狀。The first printed body 17a has a curvilinear shape having both ends (one end E1, the other end E2), and the second printed body 17b has a linear shape having both ends (one end E1, the other end E2). Both ends E1 and E2 of the printed bodies 17a and 17b are electrically conductive as a whole, and the printed bodies 17a and 17b are exposed to the outside from the surface of the printed circuit board 1 . In the example of FIG. 10, the whole (entirely) of the first printing body 17a has a circular arc shape. On the other hand, the second printing body 17b has an elongated rectangular shape as a whole (entirely).

此處,印刷本體17a、17b彼此之間隔於兩端E1、E2彼此間之至少1個部位最寬。於圖10之例中,第2印刷本體17b以自一端E1向另一端E2與第1印刷本體17a分開之方式直線狀傾斜。因此,印刷本體17a、17b彼此之間隔於一端E1最窄,於另一端E2之間隔較一端E1之間隔更寬。於此情形時,該間隔隨著遠離兩端E1、E2而變寬。換言之,該間隔於相對於與兩端E1、E2等距離之部位(即印刷本體17a、17b之中央部)靠近另一端E2之部位,最寬。Here, the distance between the printing bodies 17a and 17b is the widest at at least one location between the two ends E1 and E2. In the example of FIG. 10, the 2nd printing body 17b is linearly inclined so that it may separate from the 1st printing body 17a from one end E1 to the other end E2. Therefore, the distance between the printing bodies 17a, 17b is the narrowest at one end E1, and the distance between the other end E2 is wider than that between the one end E1. In this case, the interval becomes wider away from both ends E1, E2. In other words, the interval is the widest at the position close to the other end E2 with respect to the position equidistant from the two ends E1 and E2 (ie, the central part of the printing bodies 17a and 17b).

進而,印刷本體17a、17b既非線對稱亦非點對稱,而具有非對稱之位置關係。於此情形時,印刷本體17a、17b之彼此之位置關係可隨機地設定。例如,可代替圖10之位置關係,而使第1印刷本體17a上下翻轉,亦可將第2印刷本體17b之傾斜方位相反。Furthermore, the printing bodies 17a and 17b are neither line-symmetric nor point-symmetric, but have an asymmetric positional relationship. In this case, the positional relationship between the printing bodies 17a and 17b can be randomly set. For example, instead of the positional relationship shown in FIG. 10, the first printing body 17a may be turned upside down, or the inclination orientation of the second printing body 17b may be reversed.

以上,根據圖9及圖10之變化例,可根據印刷基板1之使用目的與使用環境,將佔據面積16、17設定為任意之圖案。藉此,可使佔據面積16、17之設定自由度飛躍性提高。其結果,可大幅度提高安裝零件之選擇自由度。另,因其他作用效果與上述實施形態同樣,故省略其說明。As described above, according to the modification of FIGS. 9 and 10 , the occupied areas 16 and 17 can be set in any pattern according to the use purpose and use environment of the printed circuit board 1 . As a result, the freedom of setting the occupied areas 16 and 17 can be dramatically improved. As a result, the degree of freedom of selection of mounting parts can be greatly improved. In addition, since other functions and effects are the same as those of the above-described embodiment, the description thereof will be omitted.

本申請案係以日本專利申請案第2018-237603號(申請日期:2018年12月19日)為基礎,並根據該申請案享受優先權。本申請案藉由參照基礎申請案而包含該等基礎申請案之所有內容。This application is based on Japanese Patent Application No. 2018-237603 (filing date: December 19, 2018), and enjoys priority according to this application. This application incorporates all the contents of the basic applications by reference to those basic applications.

1:印刷基板 2:佔據面積 2a:印刷本體 2b:印刷本體 3:佔據面積 3a:印刷本體 3b:印刷本體 4:阻焊劑 4a:第1防焊開口 4b:第2防焊開口 5:連接器 6:電阻 7:電容器 8:安裝用焊料 9a:銅箔圖案 9b:銅箔圖案 10:電子零件 11:電子零件 12:電子零件 13:電子零件 14:電子零件 15:電子零件 16:佔據面積 16a:第1印刷本體 16b:第2印刷本體 17:佔據面積 17a:第1印刷本體 17b:第2印刷本體 E1:一端 E2:另一端 L1:直線 L2:直線 Ps:交點 Te:電極1: Printed substrate 2: Occupied area 2a: printed body 2b: printed body 3: Occupied area 3a: printed body 3b: printed body 4: Solder resist 4a: 1st solder mask opening 4b: 2nd solder mask opening 5: Connector 6: Resistor 7: Capacitor 8: Solder for mounting 9a: Copper foil pattern 9b: Copper foil pattern 10: Electronic Parts 11: Electronic Parts 12: Electronic Parts 13: Electronic Parts 14: Electronic Parts 15: Electronic Parts 16: Occupied area 16a: 1st printed body 16b: Second printed body 17: Occupied area 17a: 1st printed body 17b: Second printed body E1: one end E2: the other end L1: Straight line L2: Straight line Ps: intersection Te: electrode

圖1係將一實施形態之印刷基板一部分放大之立體圖。 圖2係塗佈於佔據面積之安裝用焊料之立體圖。 圖3係顯示電子零件之安裝狀態之剖視圖。 圖4係第1圖案之佔據面積之俯視圖。 圖5係第2圖案之佔據面積之俯視圖。 圖6係顯示使用阻焊劑之佔據面積之圖案形成法之俯視圖。 圖7係顯示電子零件對第1圖案之安裝狀態之俯視圖。 圖8係顯示電子零件對第2圖案之安裝狀態之俯視圖。 圖9係第3圖案之佔據面積之俯視圖。 圖10係第4圖案之佔據面積之俯視圖。FIG. 1 is an enlarged perspective view of a part of a printed circuit board according to one embodiment. FIG. 2 is a perspective view of the mounting solder applied to the occupied area. FIG. 3 is a cross-sectional view showing a mounted state of electronic components. FIG. 4 is a plan view of the occupied area of the first pattern. FIG. 5 is a plan view of the occupied area of the second pattern. FIG. 6 is a plan view showing a patterning method using an occupied area of a solder resist. FIG. 7 is a plan view showing the mounting state of the electronic component to the first pattern. FIG. 8 is a plan view showing the mounting state of the electronic component to the second pattern. FIG. 9 is a plan view of the occupied area of the third pattern. FIG. 10 is a plan view of the occupied area of the fourth pattern.

2:佔據面積 2: Occupied area

2a:印刷本體 2a: printed body

2b:印刷本體 2b: printed body

E1:一端 E1: one end

E2:另一端 E2: the other end

L1:直線 L1: Straight line

L2:直線 L2: Straight line

Ps:交點 Ps: intersection

Claims (10)

一種印刷基板,其係具有可安裝各式各樣之尺寸之電子零件之佔據面積者,且上述佔據面積具備:具有兩端且彼此保有間隔而對向之一對印刷本體,上述一對印刷本體之上述兩端彼此間整體具有導電性,且上述一對印刷本體自上述印刷基板露出,上述一對印刷本體之間隔於上述兩端彼此間之至少1個部位變寬,上述一對印刷本體中至少一者於其一部分或全部包含成曲線狀之部分。 A printed circuit board having an occupied area capable of mounting electronic components of various sizes, and the occupied area includes: a pair of printed bodies having two ends and spaced from each other and facing each other, the pair of printed bodies The two ends have electrical conductivity as a whole, and the pair of printed bodies is exposed from the printed circuit board, the interval between the pair of printed bodies is widened at at least one position between the two ends, and the pair of printed bodies is widened. At least one of them includes a curved portion in a part or the whole thereof. 如請求項1之印刷基板,其中上述一對印刷本體由點對稱、線對稱、及非對稱之至少1種圖案構成。 The printed circuit board according to claim 1, wherein the pair of printed bodies is composed of at least one pattern of point symmetry, line symmetry, and asymmetry. 如請求項1之印刷基板,其中上述一對印刷本體中至少一者於其一部分或全部包含成直線狀之部分。 The printed circuit board of claim 1, wherein at least one of the pair of printed bodies includes a linear portion in a part or the whole thereof. 如請求項1之印刷基板,其中上述一對印刷本體成具有上述兩端之曲線狀,上述一對印刷本體之間隔於上述兩端最窄,隨著遠離上述兩端而變寬。 The printed circuit board of claim 1, wherein the pair of printed bodies has a curved shape having both ends, and the interval between the pair of printed bodies is narrowest at the two ends, and widens as the distance from the two ends increases. 如請求項1之印刷基板,其中上述一對印刷本體成具有上述兩端之直線狀,上述一對印刷本體之間隔於一端最窄,於另一端最寬。 The printed circuit board of claim 1, wherein the pair of printed bodies is in a straight line shape having the two ends, and the interval between the pair of printed bodies is the narrowest at one end and the widest at the other end. 如請求項1之印刷基板,其中上述一對印刷本體成具有上述兩端之曲線狀,上述一對印刷本體之間隔於上述兩端最寬,隨著遠離上述兩端而變窄。 The printed circuit board of claim 1, wherein the pair of printed bodies has a curved shape having both ends, and the distance between the pair of printed bodies is widest at the two ends, and narrows as the distance from the two ends. 如請求項1之印刷基板,其中上述一對印刷本體中之一者成具有上述兩端之曲線狀,上述一對印刷本體中之另一者成具有上述兩端之直線狀,且上述另一印刷本體以自一端向另一端與上述一印刷本體分開之方式以直線狀傾斜。 The printed circuit board of claim 1, wherein one of the pair of printed bodies has a curved shape having both ends, the other of the pair of printed bodies has a straight line having both ends, and the other The printing body is linearly inclined in a manner of being separated from the above-mentioned one printing body from one end to the other end. 如請求項4或6之印刷基板,其中上述一對印刷本體相對於相互正交之2條直線具有線對稱之關係,且相對於2個上述直線之交點具有點對稱之關係,一上述直線通過上述一對印刷本體之上述兩端彼此間之中央而延伸,且另一上述直線穿越與上述兩端等距離之部位而延伸。 The printed circuit board according to claim 4 or 6, wherein the pair of printed bodies has a line-symmetric relationship with respect to two straight lines orthogonal to each other, and has a point-symmetric relationship with respect to the intersection of the two straight lines, and one of the straight lines passes through The two ends of the pair of printing bodies extend from the center of each other, and the other straight line extends through a position equidistant from the two ends. 如請求項5之印刷基板,其中上述一對印刷本體相對於1條直線具有線對稱之關係, 上述直線通過上述一對印刷本體之上述兩端彼此間之中央而延伸。 The printed circuit board of claim 5, wherein the pair of printed bodies has a line-symmetric relationship with respect to a straight line, The straight line extends through the center between the two ends of the pair of printing bodies. 如請求項7之印刷基板,其中上述一對印刷本體之間隔於一端最窄,於另一端較上述一端之間隔為寬,從而上述一對印刷本體具有非對稱之位置關係。 The printed circuit board of claim 7, wherein the distance between the pair of printing bodies is narrowest at one end, and wider than the distance between the one end at the other end, so that the pair of printing bodies have an asymmetrical positional relationship.
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CN208113059U (en) * 2018-05-14 2018-11-16 信利光电股份有限公司 A kind of display module FPC

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JP2020102472A (en) 2020-07-02

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