TWI776095B - printed circuit board - Google Patents
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- TWI776095B TWI776095B TW108141370A TW108141370A TWI776095B TW I776095 B TWI776095 B TW I776095B TW 108141370 A TW108141370 A TW 108141370A TW 108141370 A TW108141370 A TW 108141370A TW I776095 B TWI776095 B TW I776095B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
佔據面積2具備具有兩端E1、E2且彼此保有間隔而對向之一對印刷本體2a、2b。印刷本體之兩端彼此間整體具有導電性,且印刷本體自印刷基板露出。印刷本體之間隔於兩端彼此間之至少1個部位變寬。The occupied area 2 includes a pair of printing bodies 2 a and 2 b which have both ends E1 and E2 and face each other with a space therebetween. The two ends of the printed body are electrically conductive as a whole, and the printed body is exposed from the printed substrate. The interval between the printed bodies is widened at at least one location between both ends.
Description
本發明之實施形態係關於一種印刷基板。Embodiments of the present invention relate to a printed circuit board.
於印刷基板,設置例如用於安裝IC(Integrated Circuit:積體電路)晶片或電容器等電子零件之佔據面積(連接端子、焊墊、焊盤)。佔據面積根據安裝零件之種類或尺寸(大小)等,由預先設定之圖案(形狀、圖形、圖案)構成。於此情形時,作為佔據面積之圖案,已知可選擇性地安裝2種尺寸(大小)之電子零件者。 [先前技術文獻] [專利文獻]On the printed circuit board, for example, an occupied area (connection terminals, pads, and pads) for mounting electronic components such as IC (Integrated Circuit) chips and capacitors is provided. The occupied area consists of a preset pattern (shape, figure, pattern) according to the type or size (size) of the mounted parts, etc. In this case, it is known that electronic components of two sizes (sizes) can be selectively mounted as a pattern occupying an area. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開平9-83116號公報[Patent Document 1] Japanese Patent Laid-Open No. 9-83116
[發明所欲解決之問題][Problems to be Solved by Invention]
然而,近年來,為謀求現有之安裝零件之有效利用,故要求印刷基板(佔據面積)可安裝2種以上之各式各樣之尺寸(大小)之電子零件。然而,於上述先前之印刷基板(佔據面積),於選擇可安裝之電子零件之自由度有限制,無法應對該要求。However, in recent years, in order to effectively utilize the existing mounting components, it is required that two or more electronic components of various sizes (sizes) can be mounted on a printed circuit board (occupied area). However, in the above-mentioned conventional printed circuit board (occupied area), the degree of freedom in selecting electronic components that can be mounted is limited, and this requirement cannot be met.
於此情形時,藉由使用例如跨接配線或基板等,亦可將尺寸(大小)不同之電子零件安裝於印刷基板(佔據面積)。然而,如此一來,除電子零件之安裝步驟以外,還需跨接配線或基板之附設步驟。其結果,印刷基板之製造步驟增加且複雜化,製造成本上升。In this case, by using, for example, a jumper wiring, a board, or the like, electronic components having different dimensions (sizes) can be mounted on a printed board (occupied area). However, in this way, in addition to the mounting step of the electronic components, a jumper wiring or an additional step of the substrate is also required. As a result, the manufacturing steps of the printed circuit board are increased and complicated, and the manufacturing cost is increased.
本發明之目的在於提供一種具有可安裝之電子零件之選擇自由度較高之佔據面積之低成本之印刷基板。 [解決問題之技術手段]An object of the present invention is to provide a low-cost printed circuit board having a high degree of freedom of selection of mountable electronic components and an occupied area. [Technical means to solve problems]
根據實施形態,佔據面積具備具有兩端且彼此保有間隔而對向之一對印刷本體。一對印刷本體之兩端彼此間整體具有導電性,且一對印刷本體自印刷基板露出。一對印刷本體之間隔於兩端彼此間之至少1個部位變寬。According to an embodiment, the occupied area is provided with a pair of printing bodies which have both ends and face each other with a gap therebetween. Both ends of the pair of printed bodies are electrically conductive as a whole, and the pair of printed bodies are exposed from the printed substrate. The space between a pair of printing bodies is widened at at least one location between both ends.
「一實施形態之構成」
圖1係本實施形態之印刷基板1之構成圖。如圖1所示,於印刷基板1之表面,設置佔據面積2、3、阻焊劑4。另,對佔據面積2、3之圖案(形狀、圖形、圖案)之詳細稍後予以敍述(參照圖4、圖5)。"Constitution of an Embodiment"
FIG. 1 is a configuration diagram of a printed
佔據面積2、3由例如銅箔等之導體構成,且構成為可安裝各式各樣之尺寸(大小)之電子零件。阻焊劑4覆蓋佔據面積2、3以外之印刷基板1之表面。藉此,設置於印刷基板1之表面之電路圖案(未圖示)由阻焊劑4保護,僅佔據面積2、3露出至外部。於圖1之例中,連接器5、電阻6、及電容器7等電子零件安裝於佔據面積2、3。The occupied
圖2及圖3係電子零件5、6、7之安裝方法之模式圖。如圖2所示,於佔據面積2、3(稍後敍述之一對印刷本體2a、3a、2b、3b),根據預先設定之安裝計劃,隔以間隔塗佈安裝用焊料8。焊料8具有膏狀,並於安裝電子零件5、6、7之前塗佈於佔據面積2、3上。另,因塗佈方法可應用現有之方法,故省略其說明。FIG. 2 and FIG. 3 are schematic views of the mounting method of the
如圖3所示,於使電子零件5、6、7載置於焊料8之狀態下,於預先設定之溫度管理之下,使該焊料8熔融並凝固。藉此,電子零件5、6、7之電極Te焊接於佔據面積2、3。且,電子零件5、6、7介隔佔據面積2、3安裝於印刷基板1。As shown in FIG. 3 , in a state where the
圖4係第1圖案(形狀、圖形、圖案)之佔據面積2之輪廓構成圖。如圖4所示,於第1圖案,佔據面積2具有一對印刷本體(第1印刷本體2a、第2印刷本體2b)。印刷本體2a、2b彼此保有間隔而對向配置。FIG. 4 is an outline configuration diagram of the occupied
印刷本體2a、2b成具有兩端(一端E1、另一端E2)之曲線狀。印刷本體2a、2b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體2a、2b自印刷基板1之表面露出至外部。於圖4之例中,印刷本體2a、2b整體(全部)具有相互相同之輪廓,即圓弧形狀。The printed
此處,印刷本體2a、2b彼此之間隔於兩端E1、E2彼此間至少1個部位最寬。於圖4之例中,該間隔於兩端E1、E2最窄,隨著遠離該兩端E1、E2而變寬。換言之,該間隔於與兩端E1、E2等距離之部位(即,印刷本體2a、2b之中央部)最寬。Here, the distance between the printed
進而,印刷本體2a、2b相對於相互正交之2條直線L1、L2具有線對稱之關係,且相對於2條直線L1、L2之交點Ps具有點對稱之關係。直線L1自印刷本體2a、2b之兩端E1彼此間之中央通過兩端E2彼此間之中央延伸。直線L2穿越與兩端E1、E2等距離之部位(印刷本體2a、2b之中央部)延伸。且,規定交點Ps作為印刷本體2a、2b(即佔據面積2)之重心。Furthermore, the
圖5係第2圖案(形狀、圖形、圖案)之佔據面積3之輪廓構成圖。如圖5所示,於第2圖案,佔據面積3具有一對印刷本體(第1印刷本體3a、第2印刷本體3b)。印刷本體3a、3b彼此保有間隔而對向配置。FIG. 5 is an outline configuration diagram of the occupied
印刷本體3a、3b成具有兩端(一端E1、另一端E2)之直線狀。印刷本體3a、3b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體3a、3b自印刷基板1之表面露出於外部。於圖5之例中,印刷本體3a、3b其整體(全部)具有相互相同之輪廓,即長條之矩形狀。The printed
此處,印刷本體3a、3b彼此之間隔於兩端E1、E2彼此間至少1個部位最寬。於圖5之例中,該間隔於一端E1最窄,隨著自一端E1向另一端E2逐漸變寬,於另一端E2為最寬。於此情形時,該間隔自一端E1向另一端E2以漸寬狀擴展。換言之,該間隔自另一端E2向一端E1前端以漸細狀變窄。Here, the distance between the printed
進而,印刷本體3a、3b相對於1條直線L1具有線對稱之關係。此處,直線L1自印刷本體3a、3b之兩端E1彼此間之中央通過兩端E2彼此間之中央而延伸。Furthermore, the printed
圖6係顯示佔據面積2、3之圖案形成法之模式圖。於圖6中,作為一例,顯示第1圖案之佔據面積2(印刷本體2a、2b)之形成方法。於此情形時,假設以下2種圖案形成法。1種圖案形成方法雖未特別圖示,但與佔據面積2(印刷本體2a、2b)之輪廓一致,例如將銅箔等導體設置於印刷基板1之表面。而另1種圖案形成方法係使用稍後敍述之防焊開口4a、4b之方法,且於圖6顯示該另1個圖案形成方法。FIG. 6 is a schematic diagram showing a patterning method of occupying
如圖6所示,首先於印刷基板1之表面,設置一對銅箔圖案9a、9b。銅箔圖案9a、9b係以於印刷基板1之表面廣範圍地塗滿銅箔之方式形成。其次,以覆蓋一對銅箔圖案9a、9b之方式,設置阻焊劑4。As shown in FIG. 6 , first, a pair of
於阻焊劑4,預先形成一對防焊開口(第1防焊開口4a、第2防焊開口4b)。第1防焊開口4a貫通阻焊劑4而形成,具有與上述第1印刷本體2a之輪廓一致之形狀。第2防焊開口4b貫通阻焊劑4而形成,具有與上述第2印刷本體2b之輪廓一致之形狀。In the solder resist 4, a pair of solder resist openings (a first solder resist
藉此,經由一對防焊開口(第1防焊開口4a、第2防焊開口4b),於印刷基板1之表面,形成第1圖案之佔據面積2(印刷本體2a、2b)。Thereby, the
圖7係第1圖案之安裝狀態之模式圖。於圖7中,作為一例,尺寸(大小)不同之4個電子零件10、11、12、13安裝於佔據面積2(印刷本體2a、2b)。於此情形時,使小型尺寸之電子零件10、11逐個安裝於兩端側。使中型尺寸之電子零件12偏於單側而安裝。使大型尺寸之電子零件13旋轉(傾斜)安裝。FIG. 7 is a schematic view of the installation state of the first pattern. In FIG. 7, as an example, four
圖8係第2圖案之安裝狀態之模式圖。於圖8中,作為一例,尺寸(大小)不同之2個電子零件14、15安裝於佔據面積3(印刷本體3a、3b)。於此情形時,使短條尺寸之電子零件14安裝於印刷本體3a、3b之彼此間隔較窄之部位。使長條尺寸之電子零件15安裝於印刷本體3a、3b之彼此間隔較寬之部位。FIG. 8 is a schematic view of the installation state of the second pattern. In FIG. 8, as an example, two
「一實施形態之作用效果」
以上,根據本實施形態,佔據面積2、3(一對印刷本體2a、3a、2b、3b)整體具有導電性,且自印刷基板1之表面露出。藉此,於遍及佔據面積2、3整體之任意部位(位置),可安裝任意尺寸之電子零件。其結果,能提高可安裝之電子零件之選擇自由度。"Effects of an Embodiment"
As described above, according to the present embodiment, the occupying
根據本實施形態,印刷本體2a、3a、2b、3b之間隔於兩端E1、E2彼此間之至少1個部位變寬。藉此,可安裝各式各樣之尺寸(大小)之電子零件。於此情形時,無需例如跨接配線或基板等。其結果,可使印刷基板1之印刷成本減少。According to the present embodiment, the interval between the printed
根據本實施形態,可自由地選擇並安裝零件規格或製造商不同之各式各樣之電子零件。藉此,安裝零件之多供應商化變得容易。其結果,可謀求現有之安裝零件之有效利用。According to this embodiment, it is possible to freely select and mount various electronic components with different component specifications and manufacturers. Thereby, it becomes easy to become a supplier of many installation parts. As a result, the existing mounting parts can be effectively utilized.
「變化例」 本發明不限定於上述實施形態,以下之變化例亦包含於本發明之技術範圍。"Variation" The present invention is not limited to the above-described embodiments, and the following modifications are also included in the technical scope of the present invention.
圖9係第3圖案(形狀、圖形、圖案)之佔據面積16之輪廓構成圖。如圖9所示,於第3圖案中,佔據面積16具有一對印刷本體(第1印刷本體16a、第2印刷本體16b)。印刷本體16a、16b彼此保有間隔而對向配置。FIG. 9 is an outline configuration diagram of the occupied
印刷本體16a、16b成具有兩端(一端E1、另一端E2)之曲線狀。印刷本體16a、16b之兩端E1、E2彼此間整體(全部)具有導電性,且印刷本體16a、16b自印刷基板1之表面露出於外部。於圖9之例中,印刷本體16a、16b其整體(全部)具有相互相同之輪廓,即圓弧形狀。The printed
此處,印刷本體16a、16b彼此之間隔於兩端E1、E2彼此間之至少1個部位最寬。於圖9之例中,該間隔於兩端E1、E2最寬,隨著遠離該兩端E1、E2而變窄。換言之,於與兩端E1、E2等距離之部位(即,印刷本體16a、16b之中央部),印刷本體16a、16b彼此之間隔最窄。Here, the distance between the printed
進而,印刷本體16a、16b相對於相互正交之2條直線L1、L2具有線對稱之關係,且相對於2條直線L1、L2之交點Ps具有點對稱之關係。直線L1自印刷本體16a、16b之兩端E1彼此間之中央通過兩端E2彼此間之中央而延伸。直線L2穿越與兩端E1、E2等距離之部位(印刷本體16a、16b之中央部)而延伸。且,將交點Ps規定作為印刷本體16a、16b(即佔據面積16)之重心。Furthermore, the printed
圖10係第4圖案(形狀、圖形、圖樣)之佔據面積17之輪廓構成圖。如圖10所示,具有一對印刷本體(第1印刷本體17a、第2印刷本體17b)。印刷本體17a、17b彼此保有間隔而對向配置。FIG. 10 is an outline configuration diagram of the occupied
第1印刷本體17a成具有兩端(一端E1、另一端E2)之曲線狀,第2印刷本體17b成具有兩端(一端E1、另一端E2)之直線狀。印刷本體17a、17b之兩端E1、E2彼此間整體具有導電性,且印刷本體17a、17b自印刷基板1之表面露出於外部。於圖10之例中,第1印刷本體17a其整體(全部)具有圓弧形狀。另一方面,第2印刷本體17b其整體(全部)具有長條之矩形狀。The first printed
此處,印刷本體17a、17b彼此之間隔於兩端E1、E2彼此間之至少1個部位最寬。於圖10之例中,第2印刷本體17b以自一端E1向另一端E2與第1印刷本體17a分開之方式直線狀傾斜。因此,印刷本體17a、17b彼此之間隔於一端E1最窄,於另一端E2之間隔較一端E1之間隔更寬。於此情形時,該間隔隨著遠離兩端E1、E2而變寬。換言之,該間隔於相對於與兩端E1、E2等距離之部位(即印刷本體17a、17b之中央部)靠近另一端E2之部位,最寬。Here, the distance between the
進而,印刷本體17a、17b既非線對稱亦非點對稱,而具有非對稱之位置關係。於此情形時,印刷本體17a、17b之彼此之位置關係可隨機地設定。例如,可代替圖10之位置關係,而使第1印刷本體17a上下翻轉,亦可將第2印刷本體17b之傾斜方位相反。Furthermore, the
以上,根據圖9及圖10之變化例,可根據印刷基板1之使用目的與使用環境,將佔據面積16、17設定為任意之圖案。藉此,可使佔據面積16、17之設定自由度飛躍性提高。其結果,可大幅度提高安裝零件之選擇自由度。另,因其他作用效果與上述實施形態同樣,故省略其說明。As described above, according to the modification of FIGS. 9 and 10 , the
本申請案係以日本專利申請案第2018-237603號(申請日期:2018年12月19日)為基礎,並根據該申請案享受優先權。本申請案藉由參照基礎申請案而包含該等基礎申請案之所有內容。This application is based on Japanese Patent Application No. 2018-237603 (filing date: December 19, 2018), and enjoys priority according to this application. This application incorporates all the contents of the basic applications by reference to those basic applications.
1:印刷基板
2:佔據面積
2a:印刷本體
2b:印刷本體
3:佔據面積
3a:印刷本體
3b:印刷本體
4:阻焊劑
4a:第1防焊開口
4b:第2防焊開口
5:連接器
6:電阻
7:電容器
8:安裝用焊料
9a:銅箔圖案
9b:銅箔圖案
10:電子零件
11:電子零件
12:電子零件
13:電子零件
14:電子零件
15:電子零件
16:佔據面積
16a:第1印刷本體
16b:第2印刷本體
17:佔據面積
17a:第1印刷本體
17b:第2印刷本體
E1:一端
E2:另一端
L1:直線
L2:直線
Ps:交點
Te:電極1: Printed substrate
2:
圖1係將一實施形態之印刷基板一部分放大之立體圖。 圖2係塗佈於佔據面積之安裝用焊料之立體圖。 圖3係顯示電子零件之安裝狀態之剖視圖。 圖4係第1圖案之佔據面積之俯視圖。 圖5係第2圖案之佔據面積之俯視圖。 圖6係顯示使用阻焊劑之佔據面積之圖案形成法之俯視圖。 圖7係顯示電子零件對第1圖案之安裝狀態之俯視圖。 圖8係顯示電子零件對第2圖案之安裝狀態之俯視圖。 圖9係第3圖案之佔據面積之俯視圖。 圖10係第4圖案之佔據面積之俯視圖。FIG. 1 is an enlarged perspective view of a part of a printed circuit board according to one embodiment. FIG. 2 is a perspective view of the mounting solder applied to the occupied area. FIG. 3 is a cross-sectional view showing a mounted state of electronic components. FIG. 4 is a plan view of the occupied area of the first pattern. FIG. 5 is a plan view of the occupied area of the second pattern. FIG. 6 is a plan view showing a patterning method using an occupied area of a solder resist. FIG. 7 is a plan view showing the mounting state of the electronic component to the first pattern. FIG. 8 is a plan view showing the mounting state of the electronic component to the second pattern. FIG. 9 is a plan view of the occupied area of the third pattern. FIG. 10 is a plan view of the occupied area of the fourth pattern.
2:佔據面積 2: Occupied area
2a:印刷本體 2a: printed body
2b:印刷本體 2b: printed body
E1:一端 E1: one end
E2:另一端 E2: the other end
L1:直線 L1: Straight line
L2:直線 L2: Straight line
Ps:交點 Ps: intersection
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018237603A JP2020102472A (en) | 2018-12-19 | 2018-12-19 | Printed board |
JP2018-237603 | 2018-12-19 |
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TW202027593A TW202027593A (en) | 2020-07-16 |
TWI776095B true TWI776095B (en) | 2022-09-01 |
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TW108141370A TWI776095B (en) | 2018-12-19 | 2019-11-14 | printed circuit board |
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JP (1) | JP2020102472A (en) |
KR (1) | KR102309794B1 (en) |
CN (1) | CN111343783A (en) |
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KR20240095742A (en) | 2022-12-19 | 2024-06-26 | 백승호 | Horizontal sensing barbell |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202262030U (en) * | 2011-07-27 | 2012-05-30 | 雅达电子国际有限公司 | Printed circuit board |
CN107006122A (en) * | 2014-12-19 | 2017-08-01 | 高通股份有限公司 | For the apparatus and method for the equivalent series resistance for controlling capacitor |
CN208113059U (en) * | 2018-05-14 | 2018-11-16 | 信利光电股份有限公司 | A kind of display module FPC |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990028493A (en) * | 1995-06-30 | 1999-04-15 | 니시무로 타이죠 | Electronic component and method of production thereof |
JPH0983116A (en) | 1995-09-11 | 1997-03-28 | Fujitsu Ltd | Printed wiring board |
JP2002290020A (en) * | 2001-03-27 | 2002-10-04 | Fujitsu Ltd | Pattern for mounting surface-mounted parts and circuit board equipped with it |
JP2003243814A (en) * | 2002-02-21 | 2003-08-29 | Hitachi Ltd | Land for mounting chip component |
JP2006173167A (en) * | 2004-12-13 | 2006-06-29 | Murata Mfg Co Ltd | Land structure, inductor component mounting structure, power supply circuit of radio communication apparatus |
-
2018
- 2018-12-19 JP JP2018237603A patent/JP2020102472A/en active Pending
-
2019
- 2019-11-14 TW TW108141370A patent/TWI776095B/en active
- 2019-12-03 KR KR1020190158932A patent/KR102309794B1/en active IP Right Grant
- 2019-12-06 CN CN201911239208.8A patent/CN111343783A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202262030U (en) * | 2011-07-27 | 2012-05-30 | 雅达电子国际有限公司 | Printed circuit board |
CN107006122A (en) * | 2014-12-19 | 2017-08-01 | 高通股份有限公司 | For the apparatus and method for the equivalent series resistance for controlling capacitor |
CN208113059U (en) * | 2018-05-14 | 2018-11-16 | 信利光电股份有限公司 | A kind of display module FPC |
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Publication number | Publication date |
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KR20200076589A (en) | 2020-06-29 |
TW202027593A (en) | 2020-07-16 |
CN111343783A (en) | 2020-06-26 |
KR102309794B1 (en) | 2021-10-08 |
JP2020102472A (en) | 2020-07-02 |
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