JPH10335795A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH10335795A JPH10335795A JP14265197A JP14265197A JPH10335795A JP H10335795 A JPH10335795 A JP H10335795A JP 14265197 A JP14265197 A JP 14265197A JP 14265197 A JP14265197 A JP 14265197A JP H10335795 A JPH10335795 A JP H10335795A
- Authority
- JP
- Japan
- Prior art keywords
- electronic element
- land
- center
- mounting
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、絶縁材料の表面に
金属箔等の電子素子実装用ランドが形成されたプリント
基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which an electronic element mounting land such as a metal foil is formed on a surface of an insulating material.
【０００２】[0002]
【従来の技術】図４に、チップサイズパケージ（Chip S
ize Package、以下CSPと記す）等の円形端子を持つ電子
素子をプリント基板に実装する際の従来の電子素子実装
用ランド１を示しており、電子素子の端子３と同一形状
・同一寸法の円形ランドとした電子素子実装用ランド１
と、電子素子実装用ランド１上に施した電子素子の端子
３と同一形状・同一寸法の円形のソルダーレジスト除去
部４で構成されている。2. Description of the Related Art FIG. 4 shows a chip size package (Chip S).
A conventional electronic element mounting land 1 for mounting an electronic element having a circular terminal such as an ize package (hereinafter referred to as CSP) on a printed circuit board is shown. The land 1 has the same shape and the same dimensions as the terminal 3 of the electronic element. Land for mounting electronic elements 1
And a circular solder resist removal section 4 having the same shape and the same dimensions as the terminals 3 of the electronic element provided on the electronic element mounting land 1.
【０００３】この方式では、電子素子を基板上に置いた
段階での微少な位置ずれは、半田が溶けたときの表面張
力によって電子素子が正常な位置に引き寄せられる、セ
ルフアライメント機能により自動的に修正される。In this method, a slight displacement at the stage when an electronic element is placed on a substrate is automatically adjusted by a self-alignment function in which the electronic element is drawn to a normal position by surface tension when the solder is melted. Will be modified.
【０００４】図５に、実装後のプリント基板の電子素子
実装用ランドのピール強度を強化する必要がある場合の
従来の電子素子実装用ランド１を示しており、ピール強
度を強化するために電子素子の端子３より大きな方形ラ
ンドとした電子素子実装用ランド１と、半田付着部分の
形状をＣＳＰの端子と同一形状・同一寸法の円形の半田
付着部とするために、電子素子実装用ランド１上に施し
た電子素子の端子３と同一形状・同一寸法の円形のソル
ダーレジスト除去部４で構成されている。FIG. 5 shows a conventional electronic element mounting land 1 in a case where it is necessary to enhance the peel strength of the electronic element mounting land on the printed circuit board after mounting. The electronic element mounting land 1 is a rectangular land larger than the element terminal 3 and the electronic element mounting land 1 is a circular solder adhesion portion having the same shape and the same dimensions as the terminals of the CSP. It is composed of a circular solder resist removing section 4 having the same shape and the same dimensions as the terminals 3 of the electronic element provided above.
【０００５】[0005]
【発明が解決しようとする課題】このプリント基板にお
いては、製造上のばらつきにより図６に示すようにソル
ダーレジス除去部４の位置が電子素子実装用ランド１の
中心よりずれる場合があり、電子素子の端子３と隣接す
る電子素子実装用ランド５との距離が短くなり、半田付
け時に短絡を起こす可能性が高くなる欠点があるので、
金属箔等のパターン及び電子素子実装用ランド形成位置
に対するソルダーレジスト塗布の高い相対位置精度が要
求されている。In this printed circuit board, the position of the solder resist removing portion 4 may be shifted from the center of the electronic element mounting land 1 as shown in FIG. The distance between the terminal 3 and the adjacent electronic element mounting land 5 is short, and there is a disadvantage that the possibility of short-circuiting during soldering increases.
There is a demand for a high relative positional accuracy of solder resist coating with respect to a pattern of a metal foil or the like and a land formation position for mounting an electronic element.
【０００６】本発明は、電子素子の端子より大きな円形
または方形ランドでピール強度を強化しつつ実装位置精
度の高いセルフアライメント機能が可能であり、且つ部
品と隣接ランドとの短絡がなく信頼性の高いプリント基
板を提供することを目的とする。The present invention enables a self-alignment function with high mounting position accuracy while enhancing the peel strength with a circular or square land larger than the terminals of an electronic element, and has no short-circuit between parts and adjacent lands, and has high reliability. An object is to provide a high printed circuit board.
【０００７】[0007]
【課題を解決するための手段】以上の問題点を解決する
ために、請求項１の本発明に記載の発明は、絶縁材料の
表面に金属箔等の電子素子実装用ランドが形成されたプ
リント基板において、電子素子の端子３より大きな円形
の電子素子実装用ランド１の円周部分に１個もしくは複
数のくぼみ２を形成したことを特徴とするプリント基板
としたものである。In order to solve the above-mentioned problems, the invention according to the first aspect of the present invention is directed to a printed circuit in which a land for mounting an electronic element such as a metal foil is formed on a surface of an insulating material. The printed circuit board is characterized in that one or a plurality of depressions 2 are formed in a circumferential portion of a circular electronic element mounting land 1 larger than a terminal 3 of the electronic element.
【０００８】円周部分にくぼみ２を形成した円形の電子
素子実装用ランド１に電子素子をリフロー半田付け法に
より半田付けした場合、半田の表面張力により上記電子
素子が移動する際に、円形の電子素子実装用ランド１の
円周部分に１個もしくは複数のくぼみ２を形成している
おかげで、半田付着部分をソルダーレジストのみで形成
した場合よりも、セルフアライメント機能により移動し
た後の実装位置精度が良いという作用を有する。When an electronic element is soldered by a reflow soldering method to a circular electronic element mounting land 1 having a recess 2 formed in a circumferential portion, when the electronic element moves due to the surface tension of the solder, a circular shape is formed. Due to the formation of one or a plurality of depressions 2 in the circumferential portion of the electronic element mounting land 1, the mounting position after moving by the self-alignment function is smaller than the case where the solder attachment portion is formed only by the solder resist. It has the effect that accuracy is good.
【０００９】また、本発明の請求項２に記載の発明は、
絶縁材料の表面に金属箔等の電子素子実装用ランドが形
成されたプリント基板において、電子素子の端子３より
大きな方形の電子素子実装用ランド１の各辺中央部分に
くぼみ２を形成したことを特徴とするプリント基板とし
たものである。Further, the invention according to claim 2 of the present invention provides:
On a printed circuit board on which an electronic element mounting land such as a metal foil is formed on the surface of an insulating material, a depression 2 is formed at the center of each side of a rectangular electronic element mounting land 1 larger than a terminal 3 of the electronic element. It is a printed circuit board which is a feature.
【００１０】各辺中央部分に１個もしくは複数のくぼみ
２を形成した方形の電子素子実装用ランド１に電子素子
をリフロー半田付け法により半田付けした場合、半田の
表面張力により上記電子素子が移動する際に、方形の電
子素子実装用ランド１の各辺中央部分に１個もしくは複
数のくぼみ２を形成しているおかげで、半田付着部分を
ソルダーレジストのみで形成した場合よりも、セルフア
ライメント機能により移動した後の実装位置精度が良
い、という作用を有する。When an electronic element is soldered by a reflow soldering method to a rectangular electronic element mounting land 1 having one or a plurality of depressions 2 formed at the center of each side, the electronic element moves due to the surface tension of the solder. In this case, one or a plurality of depressions 2 are formed at the center of each side of the rectangular electronic element mounting land 1, so that the self-alignment function is more improved than when the solder-attached portion is formed only with solder resist. Thus, the mounting position accuracy after the movement is good.
【００１１】また、本発明の請求項３に記載の発明は、
絶縁材料の表面に金属箔等の電子素子実装用ランドが形
成されたプリント基板において、格子状に並んだ電子素
子の端子３より大きな方形の電子素子実装用ランド１の
各辺中央部分にくぼみ２を形成したことを特徴とするプ
リント基板としたものである。Further, the invention according to claim 3 of the present invention provides:
In a printed circuit board on which an electronic element mounting land such as a metal foil is formed on the surface of an insulating material, a depression 2 is formed at the center of each side of a rectangular electronic element mounting land 1 larger than the terminals 3 of the electronic elements arranged in a grid. Formed on a printed circuit board.
【００１２】各辺中央部分に１個もしくは複数のくぼみ
２を形成した方形の電子素子実装用ランド１に電子素子
をリフロー半田付け法により半田付けした場合、半田の
表面張力により上記電子素子が移動する際に、方形の電
子素子実装用ランド１の各辺中央部分に１個もしくは複
数のくぼみ２を形成しているおかげで、半田付着部分を
ソルダーレジストのみで形成した場合よりも、セルフア
ライメント機能により移動した後の実装位置精度が良
い、という作用を有する。When an electronic element is soldered by a reflow soldering method to a rectangular electronic element mounting land 1 having one or a plurality of depressions 2 formed in the center of each side, the electronic element moves due to the surface tension of the solder. In this case, one or a plurality of depressions 2 are formed at the center of each side of the rectangular electronic element mounting land 1, so that the self-alignment function is more improved than when the solder-attached portion is formed only with solder resist. Thus, the mounting position accuracy after the movement is good.
【００１３】[0013]
【発明の実施の形態】以下に、本発明の実施の形態を図
１〜図３を参照して説明する。 （実施の形態１）図１は、本発明の第１の実施の形態に
おける、円周部分にくぼみ２を形成した円形の電子素子
実装用ランド１のランド形状を示し、図１において電子
素子実装用ランド１は実装位置精度の高いセルフアライ
メント機能の作用を行うもので、円周部分に４個のくぼ
み２を９０度おきに形成した円形の電子素子実装用ラン
ドから構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. (Embodiment 1) FIG. 1 shows a land shape of a circular electronic element mounting land 1 in which a recess 2 is formed in a circumferential portion according to a first embodiment of the present invention. The use land 1 performs a self-alignment function with high mounting position accuracy, and is formed of a circular electronic element mounting land in which four recesses 2 are formed at 90-degree intervals in a circumferential portion.
【００１４】以上のように構成されたプリント基板につ
いて、以下その動作について説明する。The operation of the printed circuit board configured as described above will be described below.
【００１５】まず、図１に示すように、円形端子を持つ
電子素子をリフロー半田付け法により半田付けした場
合、円形の電子素子実装用ランド１に形成した円周部分
の４個のくぼみ２のうち、対角に位置する二つのくぼみ
間の最短距離を、電子素子の端子３の直径と等しく、ま
たは少し短く設定することで、電子素子の端子３が半田
の表面張力によりその４個のくぼみ２で囲まれた中央す
なわち電子素子実装用ランド１の中央に移動し、その位
置で固定される。First, as shown in FIG. 1, when an electronic element having a circular terminal is soldered by a reflow soldering method, four recesses 2 in a circumferential portion formed on a circular electronic element mounting land 1 are formed. By setting the shortest distance between two diagonally located depressions to be equal to or slightly shorter than the diameter of the terminal 3 of the electronic element, the terminal 3 of the electronic element can be connected to the four depressions by the surface tension of the solder. It moves to the center surrounded by 2, that is, the center of the electronic element mounting land 1, and is fixed at that position.
【００１６】また、方形端子を持つ電子素子をリフロー
半田付け法により半田付けした場合も、円形の電子素子
実装用ランド１に形成した円周部分の４個のくぼみ２の
うち、対角に位置する二つのくぼみ間の最短距離を、電
子素子の方形端子の一辺と等しく、または少し短く設定
することで、電子素子の端子３が半田の表面張力により
その４個のくぼみ２で囲まれた中央すなわち電子素子実
装用ランド１の中央に移動し、その位置で固定される。Also, when an electronic element having a square terminal is soldered by a reflow soldering method, a diagonal position of the four recesses 2 in the circumferential portion formed on the circular electronic element mounting land 1 is also obtained. By setting the shortest distance between the two recesses to be equal to or slightly shorter than one side of the square terminal of the electronic element, the center of the terminal 3 of the electronic element is surrounded by the four recesses 2 due to the surface tension of the solder. That is, it moves to the center of the electronic element mounting land 1 and is fixed at that position.
【００１７】以上のように本実施形態によれば、電子素
子の端子３よりも大きな電子素子実装用ランド１を用い
ても正確に電子素子実装用ランド１の中央に電子素子の
端子３を実装できることとなる。 （実施の形態２）図２は、本発明の第２の実施の形態に
おける、各辺中央部分にくぼみ２を形成した方形の電子
素子実装用ランド１のランド形状を示し、図２において
電子素子実装用ランド１は実装位置精度の高いセルフア
ライメント機能の作用を行うもので、各辺中央部分に各
１個のくぼみ２を形成した方形の電子素子実装用ランド
１から構成されている。As described above, according to the present embodiment, the terminal 3 of the electronic element is accurately mounted at the center of the land 1 for mounting the electronic element even when the land 1 for mounting the electronic element is larger than the terminal 3 of the electronic element. You can do it. (Embodiment 2) FIG. 2 shows a land shape of a rectangular electronic element mounting land 1 in which a depression 2 is formed at the center of each side according to a second embodiment of the present invention. The mounting land 1 performs a function of a self-alignment function with high mounting position accuracy, and is configured by a rectangular electronic element mounting land 1 in which one recess 2 is formed at the center of each side.
【００１８】以上のように構成されたプリント基板につ
いて、以下その動作について説明する。The operation of the printed circuit board configured as described above will be described below.
【００１９】まず、円形端子を持つ電子素子をリフロー
半田付け法により半田付けした場合、方形の電子素子実
装用ランド１に形成した各辺中央部分のくぼみ２のう
ち、対角に位置する二つのくぼみ間の最短距離を、電子
素子の端子３の直径と等しく、または少し短く設定する
ことで、電子素子の端子３が半田の表面張力によりその
４個のくぼみ２で囲まれた中央すなわち電子素子実装用
ランド１の中央に移動し、その位置で固定される。First, when an electronic element having a circular terminal is soldered by a reflow soldering method, two diagonally located two dimples 2 at the center of each side formed in a rectangular electronic element mounting land 1 are formed. By setting the shortest distance between the depressions equal to or slightly shorter than the diameter of the terminal 3 of the electronic element, the terminal 3 of the electronic element is surrounded by the four depressions 2 due to the surface tension of the solder, that is, the electronic element. It moves to the center of the mounting land 1 and is fixed at that position.
【００２０】また、方形端子を持つ電子素子をリフロー
半田付け法により半田付けした場合、方形の電子素子実
装用ランド１に形成した各辺中央部分のくぼみ２のう
ち、対角に位置する二つのくぼみ間の最短距離を、電子
素子の方形端子の一辺と等しく、または少し短く設定す
ることで、電子素子の方形端子が半田の表面張力により
その４個のくぼみ２で囲まれた中央すなわち電子素子実
装用ランド１の中央に移動し、その位置で固定される。When an electronic element having square terminals is soldered by the reflow soldering method, two diagonally located two of the depressions 2 at the center of each side formed on the rectangular electronic element mounting land 1 are formed. By setting the shortest distance between the recesses equal to or slightly shorter than one side of the square terminal of the electronic element, the square terminal of the electronic element is surrounded by the four recesses 2 by the surface tension of the solder, that is, the electronic element. It moves to the center of the mounting land 1 and is fixed at that position.
【００２１】以上のように本実施形態によれば、電子素
子の端子３よりも大きな電子素子実装用ランド１を用い
ても正確に電子素子実装用ランド１の中央に電子素子の
端子３を実装できることとなる。 （実施の形態３）図３は、本発明の第３の実施の形態に
おける、各辺中央部分にくぼみ２を形成した格子状に並
んだ方形の電子素子実装用ランド１のランド形状を示
し、図３において電子素子実装用ランド１は実装位置精
度の高いセルフアライメント機能の作用を行うもので、
各辺中央部分に各１個のくぼみ２を形成した格子状に並
んだ方形の電子素子実装用ランド１から構成されてい
る。As described above, according to the present embodiment, the terminal 3 of the electronic element is accurately mounted at the center of the land 1 for mounting the electronic element, even if the land 1 for mounting the electronic element is larger than the terminal 3 of the electronic element. You can do it. (Embodiment 3) FIG. 3 shows a land shape of a rectangular electronic element mounting land 1 arranged in a grid and formed with a depression 2 at the center of each side in a third embodiment of the present invention. In FIG. 3, the electronic element mounting land 1 performs a self-alignment function with high mounting position accuracy.
It is composed of rectangular electronic element mounting lands 1 arranged in a grid and having one recess 2 formed at the center of each side.
【００２２】以上のように構成されたプリント基板につ
いて、以下その動作について説明する。The operation of the printed circuit board configured as described above will be described below.
【００２３】まず、格子状に並んだ電子素子の端子３を
持つ電子素子をリフロー半田付け法により半田付けした
場合、格子状に並んだ方形の電子素子実装用ランド１に
形成した各辺中央部分のくぼみ２のうち、対角に位置す
る二つのくぼみ間の最短距離を、格子状に並んだ電子素
子の端子３の直径と等しく、または少し短く設定するこ
とで、格子状に並んだ電子素子の端子３それぞれが、半
田の表面張力によりその４個のくぼみ２で囲まれた中央
すなわち電子素子実装用ランド１の中央に移動し、その
位置で固定される。First, when an electronic element having terminals 3 of an electronic element arranged in a grid is soldered by a reflow soldering method, a center portion of each side formed on a square electronic element mounting land 1 arranged in a grid is formed. By setting the shortest distance between two diagonally located recesses of the recesses 2 to be equal to or slightly shorter than the diameter of the terminals 3 of the electronic devices arranged in a lattice, the electronic devices arranged in a lattice are formed. Are moved to the center surrounded by the four depressions 2, that is, the center of the electronic element mounting land 1 by the surface tension of the solder, and fixed at that position.
【００２４】また、格子状に並んだ方形端子を持つ電子
素子をリフロー半田付け法により半田付けした場合、格
子状に並んだ方形の電子素子実装用ランド１に形成した
各辺中央部分のくぼみ２のうち、対角に位置する二つの
くぼみ間の最短距離を、格子状に並んだ電子素子の方形
端子の一辺と等しく、または少し短く設定することで、
格子状に並んだ方形端子それぞれが、半田の表面張力に
よりその４個のくぼみ２で囲まれた中央すなわち電子素
子実装用ランド１の中央に移動し、その位置で固定され
る。When an electronic element having square terminals arranged in a grid is soldered by a reflow soldering method, a depression 2 at the center of each side formed on a square electronic element mounting land 1 arranged in a grid. By setting the shortest distance between two diagonally located depressions equal to or slightly shorter than one side of the square terminals of the electronic elements arranged in a grid,
The square terminals arranged in a lattice move to the center surrounded by the four recesses 2, that is, the center of the electronic element mounting land 1, due to the surface tension of the solder, and are fixed at that position.
【００２５】以上のように本実施形態によれば、電子素
子の端子３よりも大きな電子素子実装用ランド１を用い
ても正確に電子素子実装用ランド１の中央に電子素子の
端子３を実装できることとなる。As described above, according to the present embodiment, the terminal 3 of the electronic element is accurately mounted at the center of the land 1 for mounting the electronic element even when the land 1 for mounting the electronic element is larger than the terminal 3 of the electronic element. You can do it.
【００２６】また、格子状に並んだ方形の電子素子実装
用ランド１の各辺中央部分にくぼみ２を形成したことに
より、隣接する電子素子の電子素子の端子３と方形の電
子素子実装用ランド１との距離を大きくすることがで
き、隣接する電子素子の電子素子の端子３と方形の電子
素子実装用ランド１との短絡を防止することができるこ
ととなる。Further, the recesses 2 are formed in the center portions of the sides of the square electronic element mounting lands 1 arranged in a grid, so that the terminals 3 of the electronic elements of the adjacent electronic elements and the square electronic element mounting lands are formed. 1 can be increased, and a short circuit between the terminal 3 of the electronic element of the adjacent electronic element and the rectangular electronic element mounting land 1 can be prevented.
【００２７】[0027]
【発明の効果】以上のように本発明によれば、ピール強
度を強化しつつ実装位置精度の高いセルフアライメント
機能が可能であり、且つ部品と隣接ランドとの短絡がな
く信頼性の高いプリント基板を提供することができると
いう有利な効果が得られる。As described above, according to the present invention, a self-alignment function with high mounting position accuracy while enhancing the peel strength is possible, and there is no short circuit between components and adjacent lands and a highly reliable printed circuit board. Can be provided.
【図１】本発明の一実施の形態におけるプリント基板の
円形電子素子実装用ランド１の円周部分に４個のくぼみ
２を形成した場合の平面図FIG. 1 is a plan view showing a case where four recesses 2 are formed in a circumferential portion of a land 1 for mounting a circular electronic element on a printed circuit board according to an embodiment of the present invention.
【図２】本発明の一実施の形態におけるプリント基板の
方形電子素子実装用ランド１の各辺中央部分に各１個の
くぼみ２を形成した場合の平面図FIG. 2 is a plan view of a printed circuit board according to an embodiment of the present invention in which one recess 2 is formed at the center of each side of a rectangular electronic element mounting land 1;
【図３】本発明の一実施の形態におけるプリント基板の
格子状に並んだ方形電子素子実装用ランド１の各辺中央
部分に各１個のくぼみ２を形成した場合の平面図FIG. 3 is a plan view of a printed circuit board according to an embodiment of the present invention in which one recess 2 is formed at the center of each side of a rectangular electronic element mounting land 1 arranged in a grid pattern;
【図４】従来のＣＳＰ等の円形端子を持つ電子素子をプ
リント基板に実装する場合の電子素子実装用ランド１の
平面図FIG. 4 is a plan view of an electronic element mounting land 1 when an electronic element having a circular terminal such as a conventional CSP is mounted on a printed circuit board.
【図５】従来のＣＳＰ等の円形端子を持つ電子素子をプ
リント基板に実装する際にピール強度を強化する必要が
ある場合の電子素子実装用ランド１の平面図FIG. 5 is a plan view of a land 1 for mounting an electronic element when it is necessary to enhance the peel strength when mounting an electronic element having a circular terminal such as a conventional CSP on a printed circuit board.
【図６】従来のＣＳＰ等の円形端子を持つ電子素子をプ
リント基板に実装する際にピール強度を強化する必要が
ある場合において、電子素子実装用ランド１、５に対し
てソルダーレジスト除去部４、６がずれた場合の平面図FIG. 6 shows a solder resist removing section 4 for the electronic element mounting lands 1 and 5 when it is necessary to enhance the peel strength when mounting an electronic element having a circular terminal such as a conventional CSP on a printed circuit board. Plan view when the and 6 are shifted
１ 電子素子実装用ランド ２ くぼみ ３ 電子素子の端子 ４ ソルダーレジスト除去部 ５ 電子素子実装用ランド ６ ソルダーレジスト除去部 DESCRIPTION OF SYMBOLS 1 Land for mounting electronic elements 2 Depression 3 Terminal of electronic element 4 Solder resist removing part 5 Land for mounting electronic element 6 Solder resist removing part
Claims (4)
用ランドが形成されたプリント基板において、円形の電
子素子実装用ランドの円周部分に１個もしくは複数のく
ぼみが形成されていることを特徴とするプリント基板。In a printed circuit board having an electronic element mounting land such as a metal foil formed on a surface of an insulating material, one or a plurality of depressions are formed in a circumferential portion of the circular electronic element mounting land. A printed circuit board, characterized in that:
用ランドが形成されたプリント基板において、方形の電
子素子実装用ランドの各辺中央部分に１個もしくは複数
のくぼみが形成されていることを特徴とするプリント基
板。2. A printed circuit board having an electronic element mounting land such as a metal foil formed on a surface of an insulating material, wherein one or a plurality of depressions are formed at a central portion of each side of the rectangular electronic element mounting land. A printed circuit board.
用ランドが形成されたプリント基板において、格子状に
並んだ方形の電子素子実装用ランドの各辺中央部分に１
個もしくは複数のくぼみが形成されていることを特徴と
するプリント基板。3. A printed circuit board having an electronic element mounting land such as a metal foil formed on a surface of an insulating material.
A printed circuit board, wherein one or more depressions are formed.
され、そのうち、対角に位置する二つのくぼみ間の最短
距離が、前記電子素子の端子の直径と等しく、または所
定量より短く設定されていることを特徴とする請求項１
〜３のいずれかに記載のプリント基板。4. The four recesses are arranged substantially symmetrically, wherein a shortest distance between two diagonally located recesses is equal to a diameter of a terminal of the electronic element or shorter than a predetermined amount. 2. The setting is set.
A printed circuit board according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14265197A JPH10335795A (en) | 1997-05-30 | 1997-05-30 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14265197A JPH10335795A (en) | 1997-05-30 | 1997-05-30 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10335795A true JPH10335795A (en) | 1998-12-18 |
Family
ID=15320326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14265197A Withdrawn JPH10335795A (en) | 1997-05-30 | 1997-05-30 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10335795A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010038492A1 (en) * | 2010-06-18 | 2011-12-22 | Askey Computer Corp. | Soldering structure in the form of cut edge positioning and method of preventing displacement of the tube foot |
| DE102010038493A1 (en) * | 2010-06-18 | 2011-12-22 | Askey Computer Corp. | Soldering structure in the form of cutout positioning and method for preventing displacement of the tube feet |
| DE102011115658A1 (en) * | 2011-09-28 | 2013-03-28 | Osram Opto Semiconductors Gmbh | Electronic device has main soldering surface structure whose section is partially matched with auxiliary soldering surface structure on which electronic component is mounted |
| JP2014060200A (en) * | 2012-09-14 | 2014-04-03 | Fujitsu Component Ltd | Printed circuit board and manufacturing method of the same |
| JP2015220455A (en) * | 2014-05-16 | 2015-12-07 | インテル・コーポレーション | Contact pads for integrated circuit packages |
| US10068821B2 (en) | 2012-07-18 | 2018-09-04 | Nichia Corporation | Semiconductor component support and semiconductor device |
| CN112055461A (en) * | 2019-06-05 | 2020-12-08 | Fdk株式会社 | High density mounting module |
-
1997
- 1997-05-30 JP JP14265197A patent/JPH10335795A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010038492A1 (en) * | 2010-06-18 | 2011-12-22 | Askey Computer Corp. | Soldering structure in the form of cut edge positioning and method of preventing displacement of the tube foot |
| DE102010038493A1 (en) * | 2010-06-18 | 2011-12-22 | Askey Computer Corp. | Soldering structure in the form of cutout positioning and method for preventing displacement of the tube feet |
| JP2012004521A (en) * | 2010-06-18 | 2012-01-05 | Askey Computer Corp | Separation positioning type wire bonding structure and method for preventing displacement of lead pin |
| DE102010038492B4 (en) * | 2010-06-18 | 2012-12-13 | Askey Computer Corp. | Arrangement and method for soldering an electronic SMT component with circular contact feet |
| DE102010038493B4 (en) * | 2010-06-18 | 2013-01-03 | Askey Computer Corp. | Arrangement and method for soldering an SMT component with circular contact feet |
| TWI387420B (en) * | 2010-06-18 | 2013-02-21 | Askey Computer Corp | Edge-orientating soldering structure and method of preventing shift of pin |
| DE102011115658A1 (en) * | 2011-09-28 | 2013-03-28 | Osram Opto Semiconductors Gmbh | Electronic device has main soldering surface structure whose section is partially matched with auxiliary soldering surface structure on which electronic component is mounted |
| US10068821B2 (en) | 2012-07-18 | 2018-09-04 | Nichia Corporation | Semiconductor component support and semiconductor device |
| JP2014060200A (en) * | 2012-09-14 | 2014-04-03 | Fujitsu Component Ltd | Printed circuit board and manufacturing method of the same |
| JP2015220455A (en) * | 2014-05-16 | 2015-12-07 | インテル・コーポレーション | Contact pads for integrated circuit packages |
| CN112055461A (en) * | 2019-06-05 | 2020-12-08 | Fdk株式会社 | High density mounting module |
| KR20200140195A (en) | 2019-06-05 | 2020-12-15 | 에프디케이 가부시키가이샤 | High density mounting module |
| CN112055461B (en) * | 2019-06-05 | 2024-05-31 | Fdk株式会社 | High-density mounting module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20040526 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060525 |