JPH0983116A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the need for the pattern design of a printed circuit board even if a part size is changed due to circuit change and to facilitate wiring connection operation by dividing a foot print into outer and inner parts and forming a non-conduction part at least one portion of the boundary position. SOLUTION: A non-conduction part 5 with a width which does not affect soldering operation is provided between a common part (inner part) and its outer part 4. Further, a conductive part 6 for continuing the common part 3 and the outer part 4 is provided. When packaging, for example, a 1608-type chip part to the foot print, the common part 3 is used. Then, when packaging a 2125-type chip part, the outer part 4 and the inner common part 3 are used. The non-conduction part 5 is provided in frame shape within the foot print, thus preventing a positional deviation when packaging parts and packaging parts in different sizes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a footprint (land or pad) provided on the board for mounting surface mount components on the board.
Regarding

The size of the footprint varies depending on the size of the component, and the size of the footprint is also increasing with the increase in the types of components mounted on the board. Therefore, if parts with different sizes are adopted due to changes in the circuit specifications, it is necessary to design patterns for changing the footprint size. Also, in the modified wiring connection work after component mounting, wiring connection by hand soldering requires skill because the mounted components are minute, and the number of work processes is increasing. The present invention can be used to solve these problems.

[0003]

2. Description of the Related Art FIGS. 5A and 5B are explanatory views of a conventional footprint. FIG. 5A is a plan view of the footprint of the 1608 type chip component, and FIG. 5B is a plan view of the 2125 type footprint.

The size of the footprint is set by adding the area required in the manufacturing process to the area of the electrode part of the component to be mounted. The size of the footprint varies depending on the part size as shown in Figures 5 (A) and 5 (B), and the standard shape is rectangular or square.

[0005]

[Problems to be Solved by the Invention] The footprint of the conventional example cannot easily cope with the change of the component size.
A design change of the pattern including wiring around the footprint was required. Further, when a component of a size that does not correspond to the footprint is mounted, there arises a problem that the component is displaced as shown in FIG.

Further, in the modified wiring connection work after mounting the components, the wiring connection by hand soldering requires skill because the mounted components are minute, and the number of work steps is increasing. Therefore, it is required to shorten the product development period and shorten the delivery period to cope with the intensifying market competition accompanying the rapid development of electronic technology, and increase the number of man-hours in the design process and modification work process for cost reduction. In addition, the increase in design costs accompanying this is a major obstacle to products using printed wiring boards.

[0007] It is an object of the present invention to provide a footprint shape that does not require a pattern design of a printed board even if a component size is changed due to a circuit change, and that a wiring connection work is easy.

[0008]

Means for Solving the Problems To solve the above problems, 1) a footprint (connecting terminal) is provided on a printed wiring board for mounting a surface mount component, and the footprint is an outer part. A printed wiring board divided into an inner part and a non-conductive part formed at least at a part of the boundary position, or 2) a conductive part formed by the outer part and the inner part crossing the non-conductive part. 1) The printed wiring board according to 1 above, or 3) the printed wiring board according to 1 or 2 above, wherein the inner portion has a size including a small footprint.

According to the present invention, a large component is mounted by using the outer portion and the inner portion of the footprint, and a small component is mounted by using the inner portion, so that two size components can be formed by a pair of footprints. Can be implemented.

When mounting a small component, the component is not displaced because it is mounted along the non-conductive portion. Further, at that time, since the wiring connection can be performed by utilizing the outer portion connected to the inner portion, workability is improved.

[0011]

1 is an explanatory view showing an embodiment of the present invention. This example shows a footprint in which the 1608 type chip component and the 2125 type chip component can be freely selected and mounted.

The plane dimension of the 1608 type chip component is 1.6 mm × 0.
8mm rectangle with a footprint of 0.765mm x 0.508m
Rectangular patterns of m are arranged with their long sides facing each other at an interval of 1.524 mm.

The plane size of the 2125 type chip component is 2.4 mm × 1.
It is a 5mm rectangle with a footprint of 1.905mm x 1.143m.
Rectangular patterns of m are arranged with their long sides facing each other at an interval of 1.905 mm.

The common portion 3 of the footprint 1 of the 1608 type chip component and the footprint 2 of the 2125 type chip component in FIG. 5 is obtained. In Figure 1, the common part (inner part)
A non-conductive part 5 having a width that does not affect the soldering work is provided between the outer part 3 and the outer part 4, and a conductive part 5 for electrically connecting the common part 3 and the outer part 4 is provided.

This footprint has 1608 type chip parts 7
2 is used for mounting, and 2125 type chip component 8 is mounted for mounting using outer part 4 and inner common part 3 as shown in FIG. To do.

1608 type chip parts mounted on the common part 3
When performing the modified wiring connection work on 7, the 1608 type chip component 7 and the wiring 9 are electrically connected by connecting the wiring 9 to the outer portion 4 at the connecting portion 10 as shown in FIG. You can

[0017]

According to the present invention, by providing the frame-like non-conductive area in the footprint, it is possible to prevent the positional deviation during mounting of components and mount components of different sizes. Therefore, the pattern design of the printed circuit board is not necessary even if the component size is changed due to the circuit change. Further, since the wiring connection area can be allocated by using the outer portion, the modified wiring connection work can be easily performed.

[Brief description of drawings]

FIG. 1 is an explanatory view of an embodiment of the present invention (1).

FIG. 2 is an explanatory diagram (2) of the embodiment of the present invention.

FIG. 3 is an explanatory view of an embodiment of the present invention (3).

FIG. 4 is an explanatory diagram (4) of the embodiment of the present invention.

FIG. 5 is an explanatory diagram of a conventional example.

FIG. 6 is an explanatory diagram of problems in the conventional example.

[Explanation of symbols]

 1 Footprint of 1608 type chip parts 2 Footprint of 2125 type chip parts 3 Inner part (common part) 4 Outer part 5 Non-conductive part 6 Conductive part connecting inner part and inner part 7 1608 type chip part 8 2125 type chip Part 9 Wiring 10 Wiring connection

Claims (3)

[Claims] 1. A footprint (connection terminal) provided on a printed wiring board for mounting a surface mount component, wherein the footprint is divided into an outer portion and an inner portion, and at least a boundary position thereof is provided. A printed wiring board having a non-conductive portion formed in a part thereof. 2. The printed wiring board according to claim 1, wherein the outer portion and the inner portion are connected by a conductive portion formed across the non-conductive portion. 3. The printed wiring board according to claim 1, wherein the inner portion has a size including a small footprint.