JPH0514541Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field] The present invention relates to printed wiring boards.

[Prior Art] FIG. 3 is a plan view of a conventional example of a printed wiring board.
This printed wiring board has a wiring pattern 11 that becomes a product.
The copper layer on the substrate 40 is etched on the four corners of the copper-clad laminated substrate (hereinafter referred to as the "substrate") 40 outside the range of the product that has been formed with L-shaped alignment marks 20.
is formed at the same time as the wiring pattern 11 that will become the electrical circuit, has the same shape and dimensions as the L-shaped mark 20, and is printed at the same time as a solder resist that is printed to prevent solder from adhering to any part other than the desired part of the wiring pattern that will become the electrical circuit. An L-shaped alignment mark 20 is formed with this solder resist, and furthermore, when printing markings indicating electronic components, an L-shaped alignment mark with the same shape and dimensions as the mark 20 is formed with marking ink. has been done.

[Problems to be Solved by the Invention] The conventional printed wiring board described above has L-shaped marks 20 of the same shape and size at the four corners outside the product. When removing the marks, the marks are also removed at the same time, and when inspecting, it is necessary to check the entire surface of the product to confirm the printing position of the solder resist and markings. For patterns, when printing, top and bottom,
It is easy to confuse left and right or front and back, and furthermore, since the solder resist and marking ink overlap because of the same shape and size, it is difficult to judge the misalignment.

[Means for Solving the Problems] The printed wiring board of the present invention includes a first mark provided on a copper layer by etching, and a first mark provided at the same position and in the same direction as the first mark. a second mark made of a removed portion of the solder resist that is similar in shape and larger than the first mark; and a third mark made of marking ink that is similar in shape to the first mark and smaller in size at the same position and in the same direction as the first mark. The mark is provided at at least two spaced apart locations on the printed wiring board.

[Function] In this way, by providing a set of marks with similar shapes and different sizes in the same position and direction, at least in two separate locations on the printed wiring board, the marks can be easily printed or inspected. It is easy to judge the position and misalignment of the wiring board, and it also makes it easier to judge the position and misalignment of the wiring board.
It becomes easy to judge the front and back sides.

[Example] Next, an example of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an embodiment of the printed wiring board of the present invention.

On the printed wiring board 1 of this embodiment, two sets of cross-shaped inspection marks 2a are provided at different positions on the printed wiring board 1, and one set of inspection marks 2a is connected to a copper layer mark 3a. , a mark consisting of a removed portion of solder resist that is similar in shape to the copper layer mark 3a and slightly larger (hereinafter referred to as solder resist mark)
4a, and a marking mark 5a similar in shape to the copper layer mark 3a but slightly smaller than the copper layer mark 3a.
These one set of marks have the same center position and overlap in the same direction.

Note that the inspection mark 2a may be placed at any position as long as it does not interfere with the wiring, but it is preferable that the inspection mark 2a be placed in an asymmetrical position as far away as possible.

Next, a method of manufacturing each mark 3a, 4a, 5a will be explained.

The copper layer mark 3a is provided at the same time as the wiring pattern of the copper layer is formed by etching, and the solder resist mark 4a is formed by printing a solder resist on top of the wiring pattern so as to surround the copper layer mark.
is provided at the same time as the solder resist printing, and a marking mark 5a using marking ink is further formed thereon at the same time as the marking indicating the electronic component is printed.

FIG. 2 is a plan view of another embodiment of the present invention.
This embodiment differs from that shown in FIG. 1 in that the inspection mark 2b has a rectangular shape.

[Effects of the invention] As explained above, the present invention provides a set of marks of similar shapes and different sizes at the same position and in the same direction at at least two separated locations on the printed wiring board. Printing solder resists and markings, and determining misalignment between parts during inspection.
It is so easy that it can be quantitatively measured in units of length, and since the mark positions are arranged asymmetrically, there is no misreading between the top and bottom, left and right, and front and back.

[Brief explanation of the drawing]

FIG. 1 is a plan view of one embodiment of the printing flat plate of the present invention, FIG. 2 is a plan view of another embodiment of the present invention, and FIG.
The figure is a plan view of a conventional example of a printed wiring board. 1...Printed wiring board, 2a...Cross inspection mark, 2b...Square inspection mark, 3a, 3b...Copper layer mark, 4a, 4b...Solder resist mark, 5a, 5b...Marking mark.

Claims (1)

[Scope of utility model registration request] In the printed wiring board, a first mark provided by etching on the copper layer, and a removed portion of the solder resist that is similar in shape and larger than the first mark at the same position and in the same direction as the first mark. and a third mark made of marking ink similar to and smaller than the first mark at the same position and in the same direction as the first mark at at least two spaced apart locations on the printed wiring board. A printed wiring board characterized by being provided in.