JP3067168B2 - Manufacturing method of printed wiring board - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for aligning a printed wiring board which requires highly accurate SR (solder resist) printing.

[Conventional technology]

FIG. 4 shows an outline of SR printing of a conventional printed wiring board.
The SR printing alignment is performed while visually checking the pattern of the product. The non-SR printing portion 6 of the surface mounting pad 2 and the non-SR printing portion 7 of the through-hole land 3 include the surface mounting pad 2 and the through-hole land. It is set larger than 3. Therefore, during the SR printing, since the exact positions of the surface mounting pad 2 and the hole land 3 cannot be confirmed, the SR printing is shifted, and the surface mounting pad 2 and the through hole land 3
So-called SR fogging with SR5 occurs.

[Problems to be solved by the invention]

Since the above-described conventional SR printing of a printed wiring board is performed by matching the picture of a product, SR fogging due to SR printing misalignment often occurs, and there is a disadvantage that the printing must be reprinted or discarded.

An object of the present invention is to provide a method for manufacturing a printed wiring board which solves such a drawback and prevents SR fog.

[Means for solving the problem]

The configuration of the method for manufacturing a printed wiring board according to the present invention is a method for manufacturing a printed wiring board including a step of performing a solder resist printing after forming a conductive pattern on the main surface, wherein the same shape alignment conductive pattern is formed on the main surface. A step of forming a plurality of patterns, the solder resist overlaps the peripheral region in the conductive pattern for alignment, the conductive pattern for alignment,
And a step of aligning a pattern forming a non-solder-resist print portion having a different size smaller than the conductive pattern inside the conductive pattern.

〔Example〕

 Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view showing an alignment mark according to an embodiment of the present invention, and FIGS. 2 (A) and 2 (B) are plan views showing a printed wiring board manufactured using the mark of FIG. It is. First, in FIG. 1, in the present embodiment, the size of the non-SR printed portions 8a to 8d of the four square conductive patterns 1a to 1d is set smaller than these square conductive patterns 1a to 1d, and The sizes of the non-SR printing sections 8a to 8d are set as 8a>8b>8c> 8d. As described above, since the non-SR printed portions 8a to 8d are smaller than the square conductive patterns 1a to 1d, when the SR film or the screen is fitted, the outer peripheral portions of the square conductive patterns 1a to 1d
4a to 4d can be visually confirmed. Square conductive patterns 1a to
Since 1d is the same and the non-SR printing portions 8a to 8d are 8a>8b>8c> 8d, the sizes of the outer peripheral portions 4a to 4d are 4a <4b <4c <4d, and the square conductive patterns 1a to 1 Accurate positioning can be performed by adjusting Δd so as to be equal to 1d and similarly adjusting the order of 4c → 4b → 4a. Using such marks, as shown in FIG. 2 (A), the square-shaped conductive patterns 1a to 1d are formed simultaneously with the surface mounting pads 2, the through-hole lands 3, and the conductive patterns 4 by a photo printing method. .

Next, FIG. 2 (B) shows a state in which SR printing 5 is performed after the formation of the conduction pattern of FIG. 2 (A), and the non-SR printing portion 6 of the surface mounting pad 2 and the non-SR SR
Simultaneously with the printing section 7, the non-SR printing sections 8a to 8d of the square conductive patterns 1a to 1d are formed.

As described above, by combining the rectangular conductive patterns 1a to 1d and the non-SR printing portions 8a to 8d provided on the rectangular conductive patterns 1a to 1d, it is possible to perform more accurate SR printing alignment.

3 (A) and 3 (B) are plan views illustrating a manufacturing method according to another embodiment of the present invention.

In this embodiment, first, as shown in FIG. 3 (A), four octagonal square conductive patterns 10a to 10d are formed by photo printing, and are formed on the aforementioned square conductive patterns 10a to 10d. Further, by forming the octagonal square conductive patterns 80a to 80d respectively and performing SR printing alignment, misalignment in the 45 ° direction can be promptly processed.

Here, the non-SR printing portions 80 of the square conductive patterns 10a to 10d
The sizes of a to 80d are square conductive patterns 10a to 1d.
It is set smaller than 0d, and the sizes of the non-SR printing sections 80a to 80d are set as 80a>80b>80c> 80d.

FIG. 3 (B) shows a printed wiring board provided with the octagonal SR alignment marks of FIG. 3 (A). The SR matching method and the like of this embodiment are the same as those of the above-described embodiment.

〔The invention's effect〕

As is clear from the above description, according to the present invention, there is an effect that the SR printing position of the printed wiring board can be processed with higher accuracy, easily and quickly, and in particular, the square conductive pattern By arranging four blocks as one block and arranging a plurality of blocks per board, there is an effect that it is possible to cope with a printed wiring board that requires extremely high precision SR printing.

[Brief description of the drawings]

FIG. 1 is a plan view showing an alignment mark used in a method of manufacturing a printed wiring board according to one embodiment of the present invention.
2 (B) is a plan view showing an example of a printed wiring board manufactured using the marks of FIG. 1, and FIG. 3 (A) shows an alignment mark of another embodiment of the present invention. FIG. 3 (B) is a plan view showing an example of a printed wiring board using the marks of FIG. 3 (A), and FIG. 4 is a plan view showing a conventional printed wiring board. 1a, 1b, 1c, 1d, 10a, 10b, 10c, 10d ... square conduction pattern,
2 ... Surface mount pad, 3 ... Through hole land, 4
... Conduction pattern, 5 ... Solder resist, 6 ... Non-SR printing part of surface mounting pad, 7 ... Non-SR printing part of through hole land, 8a, 8b, 8c, 8d, 80a, 80b, 80c, 80d: Non-SR printing part with square conduction pattern.

Claims (1)

(57) [Claims] 1. A method for manufacturing a printed wiring board comprising a step of performing solder resist printing after forming a conductive pattern on a main surface, a step of forming a plurality of alignment conductive patterns having the same shape on the main surface. The solder resist overlaps the peripheral region in the alignment conductive pattern on the alignment conductive pattern, and positions a pattern forming a non-solder resist printed portion of a different size smaller than the conductive pattern inside the conductive pattern. And a method of manufacturing a printed wiring board.