JPH0138678B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method for manufacturing a thermal print head, and in particular, to a first substrate on which a dot portion is formed;
The present invention relates to a method of manufacturing a thermal print head in which a flexible substrate is connected to a second substrate on which an electronic circuit device (IC chip) is mounted.

(b) Prior art and its problems Generally, in a thermal print head, as shown in FIG. 2, a dot portion 2 consisting of a plurality of dots d is formed on a single substrate 1, and an
Some electronic circuit devices 3 such as the above are mounted. Note that 4 is a terminal for connecting a lead.

However, since this thermal print head has the dot section 2 and the electronic circuit device 3 arranged side by side on a single board 1, the total length L of the board 1 becomes longer to some extent, and the length L of the board 1 is longer than that shown in FIG. , dot part 2
If the platen 5 is brought into contact with the
The IC 3 had to be provided at a distance of 1 from the dot portion 2, which caused the problem that the overall length L was inevitably increased. Therefore, this type of thermal print head has the disadvantage that it cannot be used in mechanical parts that do not have enough space in the longitudinal direction of the substrate.

Therefore, in order to solve this drawback, as shown in FIG. 4, a substrate 1a on which dot portions 2 are formed,
It is conceivable to form the substrate 1b on which the IC 3 is mounted separately, connect these substrates 1a and 1b with a flexible substrate 6, and fix the substrate 1b at an arbitrary angle with respect to the substrate 1a. .

However, when connecting two boards using a flexible board, the flexible board must be soldered to the board while adjusting the distance between the two boards and the left/right misalignment, which requires extreme care. However, in addition to being troublesome,
It is not possible to obtain a connection with good finishing accuracy.

(c) Purpose of the Invention In view of the above, the purpose of the present invention is to provide a thermal print that can accurately and easily connect a substrate on which a dot portion is formed and a substrate on which an IC or the like is mounted using a flexible substrate. An object of the present invention is to provide a method for manufacturing a head.

(d) Structure of the Invention In order to achieve the above object, the method for manufacturing a thermal print head of the present invention includes:
A score line for cutting and separating the first substrate and the second substrate is provided, and when the first substrate is in the state of the single substrate, the first substrate is
A predetermined pattern is formed on the portions corresponding to the first substrate and the second substrate, and then the patterns on the portions corresponding to the first substrate and the second substrate are made flexible by straddling the scored lines. They are connected by a substrate, and then the single substrate is cut and separated into a first and a second substrate.

(E) Examples The present invention will be explained in more detail below with reference to Examples.

FIG. 1 is a diagram showing the manufacturing process of a thermal print head showing one embodiment of the present invention. A method of manufacturing the thermal print head of this embodiment will be explained with reference to the same figure.

First, as shown in FIG. 1a, one ceramic substrate 11 is prepared. This ceramic substrate 11
There is a notch groove (engraved line) on the back of the center part slightly to the left.
12 are provided. With this notch groove 12 as a boundary, the ceramic substrate 11 is connected to the first substrate portion 11a.
and a second substrate 11b.

Next, as shown in FIG. 1b, wiring patterns 15a and 15b are simultaneously formed on the first substrate portion 11a and the second substrate 11b of the prepared ceramic substrate 11 with the notched groove 12 by a photomask method or the like. Form. Heat generating resistors are arranged in a dot shape in the dot portion 13, and an IC 14 is mounted on the second substrate portion 11b side. These, dot part 1
The formation of IC 14 and the mounting of IC 14 are no different from conventional well-known methods.

Next, as shown in FIG. 1c, the wiring pattern 1
Notch groove 1 of substrate 11 in which grooves 5a and 15b are formed
2, the flexible substrate 16 and the first substrate 11
The wiring pattern 15a of a and the wiring pattern 15b of the second board 11b are soldered to electrically connect both wiring patterns 15a and 15b.

Subsequently, the substrate 11 is bent around the notch groove 12, and the substrate 11 is cut and separated into a first substrate 11a and a second substrate 11b, as shown in FIG. 1d.

In the manner described above, a thermal print head board consisting of the two boards 11a and 11b connected to the flexible board 16 is obtained. By fixing the substrates 11a and 11b to a frame or the like at an appropriate angle, a relatively short thermal print head can be obtained.

In addition, in the above embodiment, the ceramic substrate 1
Although notch grooves 12 are formed to facilitate cutting of the substrate 1, the shape thereof is not limited to the embodiment, and in short, any score line for cutting the substrate may be provided.

Further, in the above embodiment, the second substrate 11b
Although the IC 14 is mounted on the IC 14, this may be an electronic circuit device other than the IC.

(F) Effects of the Invention According to the present invention, the dot portion and the wiring pattern on the electronic circuit device side are simultaneously formed on one board, and the flexible board is soldered in that state. , there is no need for positioning or pattern matching of the substrates, and the work of connecting flexible substrates becomes extremely easy. Moreover, it is possible to perform a highly accurate connection without any positional deviation.

[Brief explanation of drawings]

FIG. 1 shows one embodiment of the invention, and FIG.
1 is a side view of a ceramic substrate used in carrying out the present invention, FIG. 1b is a plan view for explaining the process of forming a wiring pattern on the same substrate, and FIG. A side view for explaining the soldering process, Figure 1 d shows that the same board is the first and second
A side view showing the process of cutting and separating into substrates, 2nd
This figure is a perspective view of a conventional thermal print head board, FIG. 3 is a side view of the same thermal print head board, and FIG. 4 is a side view of another conventional thermal print head board. 11: ceramic substrate, 11a: first substrate,
11b: second substrate, 12: notch groove, 13: dot portion, 14: IC, 15a, 15b: wiring pattern, 16: flexible substrate.

Claims (1)

[Claims] 1. A method for manufacturing a thermal print head in which a first substrate on which a dot portion is formed and a second substrate on which an electronic circuit device is mounted are connected by a flexible substrate, the method comprising: , the first substrate and the second substrate
A score line is provided to cut and separate the board.
In the state of the single substrate, the first substrate and the second substrate
forming respective predetermined patterns on portions corresponding to the substrates, and then connecting the patterns on the portions corresponding to the first substrate and the second substrate with a flexible substrate across the scored lines; Thereafter, one substrate is cut and separated into a first substrate and a second substrate along the scored lines.