JPH0220860Y2 - - Google Patents
Info
- Publication number
- JPH0220860Y2 JPH0220860Y2 JP8152084U JP8152084U JPH0220860Y2 JP H0220860 Y2 JPH0220860 Y2 JP H0220860Y2 JP 8152084 U JP8152084 U JP 8152084U JP 8152084 U JP8152084 U JP 8152084U JP H0220860 Y2 JPH0220860 Y2 JP H0220860Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- terminals
- flexible printed
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000002985 plastic film Substances 0.000 description 5
- 229920006255 plastic film Polymers 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Description
【考案の詳細な説明】
「産業上の利用分野」
本考案はフレキシブル印刷回路板に係り、特
に、印刷回路の端子を低融点金属により被覆して
おき、これを加熱溶融させて他の印刷回路板に固
着する際の接続精度を向上させたフレキシブル印
刷回路板に関する。[Detailed description of the invention] "Industrial application field" The invention relates to flexible printed circuit boards, and in particular, the terminals of the printed circuit are coated with a low melting point metal, which is heated and melted to form other printed circuits. This invention relates to a flexible printed circuit board with improved connection accuracy when fixed to a board.
「従来の技術」
一般に、フレキシブル印刷回路板は、ポリイミ
ドフイルムなどのプラスチツクフイルムの表面
に、銅箔などの金属箱を積層し、該金属箔にフオ
トエツチング等の技術により印刷回路を形成した
もので、薄肉で可撓性を有しているため、各種の
電気機器に折り曲げ状態で接続することができる
ものである。``Prior Art'' In general, flexible printed circuit boards are made by laminating a metal box such as copper foil on the surface of a plastic film such as polyimide film, and forming a printed circuit on the metal foil using techniques such as photoetching. Since it is thin and flexible, it can be connected to various electrical devices in a bent state.
従来、フレキシブル印刷回路板をプリンタヘツ
ド、フアクシミリ用サーマルヘツド等の例えばセ
ラミツク基板、アルミナ基板等を有する他の印刷
回路板に接続する場合、第１０図例に示すよう
に、フレキシブル印刷回路板２１および他の印刷
回路板１０のそれぞれの接続部２２，１１におけ
る端子２３，１２の上にメツキ加工などによりは
んだ等の低融点金属１３を設けておいて、これら
低融点金属１３どうしを接続させた状態に両印刷
回路板２１，１０を重ね合わせ、加熱ブロツク２
４により第１０図の矢印で示す方向にフレキシブ
ル印刷回路板２１のプラスチツクフイルム２５を
押圧し、低融点金属１３を加熱溶融させて両印刷
回路板２１，１０を固着することが行なわれてい
る。 Conventionally, when connecting a flexible printed circuit board to another printed circuit board having a ceramic substrate, an alumina substrate, etc., such as a printer head or a thermal head for facsimile, a flexible printed circuit board 21 and a A state in which a low melting point metal 13 such as solder is provided on the terminals 23 and 12 in the respective connecting portions 22 and 11 of another printed circuit board 10 by plating or the like, and these low melting point metals 13 are connected to each other. The two printed circuit boards 21 and 10 are superimposed on the heating block 2.
4, the plastic film 25 of the flexible printed circuit board 21 is pressed in the direction shown by the arrow in FIG.
しかしながら、このような技術であると、フレ
キシブル印刷回路板２１のプラスチツクフイルム
２５が、加熱時に熱収縮することにより第１１図
に示すように他の印刷回路板１０とフレキシブル
印刷回路板２１との両端子１２，２３が相互にず
れた状態で固着されることがあり、このため、端
子１２，２３の幅が小さい場合や接続部１１，２
２の幅（第１１図のＷで示す寸法）が大きい場
合、あるいは端子１２，２３間のピツチが小さい
場合などに、一部の端子と異なる端子に誤つて接
続されたりするなどの問題点がある。 However, with such a technique, the plastic film 25 of the flexible printed circuit board 21 shrinks when heated, so that both ends of the flexible printed circuit board 21 and another printed circuit board 10 are bonded to each other as shown in FIG. The terminals 12 and 23 may be fixed in a mutually shifted state, and for this reason, if the width of the terminals 12 and 23 is small or the
If the width of terminal 2 (dimension indicated by W in Figure 11) is large, or if the pitch between terminals 12 and 23 is small, problems may arise such as some terminals being mistakenly connected to different terminals. be.
「考案が解決しようとする問題点」
本考案は、端子を被覆する低融点金属を溶融さ
せて他の印刷回路板に接続する際の熱変形の問題
点を有効に解決するもので、端子相互の接続精度
を向上させ、端子あるいは接続部の形状や大きさ
等を広範囲に適用可能とすることを目的とする。``Problems that the invention attempts to solve'' This invention effectively solves the problem of thermal deformation when connecting the terminals to other printed circuit boards by melting the low-melting point metal that covers the terminals. The purpose of this invention is to improve the connection accuracy of the terminals and to make it possible to apply a wide range of shapes, sizes, etc. of terminals or connecting parts.
「問題点を解決するための手段」
本考案は、他の印刷回路板への接続部が、金属
基板の表面に接着剤層を介して印刷回路の端子を
固着した構造とされるもので、該端子を低融点金
属により被覆しておきこれを加熱溶融させて他の
印刷回路板に固着する際に、熱変形の小さい金属
基板により端子間の印刷ピツチを維持した状態で
他の印刷回路板に接続することができるものであ
る。``Means for Solving the Problems'' In the present invention, the connection part to another printed circuit board has a structure in which the terminals of the printed circuit are fixed to the surface of the metal substrate via an adhesive layer. When the terminals are coated with a low melting point metal and then heated and melted to be fixed to another printed circuit board, the printed circuit board can be attached to the other printed circuit board while maintaining the printing pitch between the terminals using a metal substrate with small thermal deformation. It is something that can be connected to.
「実施例」
以下、本考案の一実施例を第１図ないし第９図
に基づいて説明する。"Embodiment" An embodiment of the present invention will be described below with reference to FIGS. 1 to 9.
フレキシブル印刷回路板１は、第１図に示すよ
うに、接続部２を除く部分が屈曲自在な屈曲部３
とされるとともに、接続部２が、アルミニウムな
どからなる金属基板４の表面に、絶縁性を有しか
つ耐熱性が高くて非収縮性の接着剤層５（例えば
熱硬化型樹脂からなるもの）を介して、印刷回路
６の端子７を固着した構成とされるものである。 As shown in FIG. 1, the flexible printed circuit board 1 has a bending portion 3 that can be bent freely except for the connecting portion 2.
In addition, the connecting portion 2 is formed by forming an insulating, heat-resistant, and non-shrinkable adhesive layer 5 (for example, made of thermosetting resin) on the surface of a metal substrate 4 made of aluminum or the like. The terminal 7 of the printed circuit 6 is fixed to the terminal 7 through the terminal 7 of the printed circuit 6.
このように構成されるフレキシブル印刷回路板
１は、次に示す工程順に形成される。 The flexible printed circuit board 1 constructed as described above is formed in the following process order.
(1) 第２図に示すように、金属基板４の表面に接
着剤層５を介して銅箔などの金属箔６′を積層
する。(1) As shown in FIG. 2, a metal foil 6' such as copper foil is laminated on the surface of the metal substrate 4 with an adhesive layer 5 interposed therebetween.
(2) 第３図に示すように、金属基板４と金属箔
６′との表面をそれぞれエツチングフイルム８
により覆う。(2) As shown in FIG. 3, the surfaces of the metal substrate 4 and metal foil 6' are etched with an etching film 8.
covered by.
(3) フオトマスク（図示略）を通してエツチング
レジストフイルム８の上に露光することによ
り、第４図および第５図に示すように、金属箔
６′を覆うエツチングレジストフイルム８に所
望の印刷回路パターンを形成するとともに、金
属基板４を覆うエツチングレジストフイルム８
に接続部のパターンを形成する。(3) By exposing the etching resist film 8 through a photomask (not shown), a desired printed circuit pattern is formed on the etching resist film 8 covering the metal foil 6', as shown in FIGS. 4 and 5. An etching resist film 8 is formed and covers the metal substrate 4.
Form the connection pattern.
(4) エツチング加工により、第６図および第７図
に示すように、金属箔６′に印刷回路６を形成
するとともに接続部２を除く部分の金属基板４
を除去する。(4) By etching, as shown in FIGS. 6 and 7, a printed circuit 6 is formed on the metal foil 6', and the portion of the metal substrate 4 excluding the connection part 2 is
remove.
(5) 接続部２を除く部分の印刷回路６の上にポリ
イミドフイルムなどのプラスチツクフイルム９
を被覆すると、第８図に示す状態のフレキシブ
ル印刷回路板１が完成する。(5) Place a plastic film 9 such as polyimide film on the printed circuit 6 except for the connection part 2.
8, the flexible printed circuit board 1 in the state shown in FIG. 8 is completed.
そして、このフレキシブル印刷回路板１を他の
印刷回路板１０に接続する場合は、両印刷回路板
１，１０の接続部２，１１における端子７，１２
をそれぞれ低融点金属１３により被覆しておき、
これら低融点金属１３どうしを接触させた状態に
両印刷回路板１，１０を重ね合わせて、低融点金
属１３を加熱溶融することにより、第９図に示す
ように一体化することができるものであるが、こ
の場合、フレキシブル印刷回路板１の接続部２
は、金属基板４に支持されているので熱変形が生
じ難く、端子７間のピツチを変化させることなく
他の印刷回路板１０に固着することができるもの
である。したがつて、端子７，１２の幅が小さい
場合や接続部２，１１の幅が大きい場合、あるい
は端子７，１２間のピツチが小さい場合など、い
ずれの場合であつても、両印刷回路板１，１０の
端子７，１２相互のずれを確実に防止し、未配線
状態や誤配線状態をなくして両印刷回路板１，１
０を正確に接続し得て、接続精度を向上させるこ
とができるものである。 When connecting this flexible printed circuit board 1 to another printed circuit board 10, the terminals 7 and 12 at the connection parts 2 and 11 of both printed circuit boards 1 and 10
are each coated with a low melting point metal 13,
By overlapping both printed circuit boards 1 and 10 with these low melting point metals 13 in contact with each other and heating and melting the low melting point metals 13, they can be integrated as shown in FIG. However, in this case, the connection part 2 of the flexible printed circuit board 1
Since it is supported by the metal substrate 4, thermal deformation hardly occurs, and it can be fixed to another printed circuit board 10 without changing the pitch between the terminals 7. Therefore, in any case, such as when the width of the terminals 7 and 12 is small, when the width of the connecting portions 2 and 11 is large, or when the pitch between the terminals 7 and 12 is small, both printed circuit boards It reliably prevents the terminals 7, 12 of 1, 10 from being misaligned with each other, eliminates unwired states and incorrect wiring states, and connects both printed circuit boards 1, 1.
0 can be connected accurately and connection accuracy can be improved.
「効果」
以上説明したように、本考案のフレキシブル印
刷回路板によれば、次のような効果を奏すること
ができる。"Effects" As explained above, the flexible printed circuit board of the present invention can provide the following effects.
(a) 他の印刷回路板への接続部を金属基板により
支持したので、端子を被覆する低融点金属を加
熱溶融させて他の印刷回路板に接続する際の熱
変形を防止して、他の印刷回路板との端子相互
のずれを確実に防止し、これらを正確に接続し
得て、接続精度を向上させることができる。(a) Since the connection part to another printed circuit board is supported by a metal board, the low melting point metal covering the terminal is heated and melted to prevent thermal deformation when connecting to another printed circuit board, and It is possible to reliably prevent misalignment of the terminals with respect to the printed circuit board, and to connect them accurately, thereby improving connection accuracy.
(b) 接続部あるいは端子の大きさや形状等に影響
されることなく正確に他の印刷回路板に接続し
得るので、これら接続部や端子の大きさ、形状
等を広範囲に適用することができる。(b) Since it can be accurately connected to other printed circuit boards without being affected by the size, shape, etc. of the connecting portions or terminals, the size, shape, etc. of these connecting portions or terminals can be applied over a wide range. .
第１図ないし第９図は本考案の一実施例を示す
もので、第１図は一部を省略した斜視図、第２
図，第３図，第４図，第６図および第８図は製造
工程を順に示す一部を省略した断面図、第５図お
よび第７図はそれぞれ第４図および第６図の−
線または−線に沿う矢視図、第９図は他の
印刷回路板に接続した状態を示す断面図、第１０
図は従来のフレキシブル印刷回路板を他の印刷回
路板に接続する場合の概略を示す断面図、第１１
図は第１０図の両印刷回路板が接続された状態の
例を示す正面図である。
１……フレキシブル印刷回路板、２……接続
部、３……屈曲部、４……金属基板、５……接着
剤層、６……印刷回路、７……端子、９……プラ
スチツクフイルム、１０……他の印刷回路板、１
３……低融点金属。
Figures 1 to 9 show one embodiment of the present invention, with Figure 1 being a partially omitted perspective view and Figure 2 being a partially omitted perspective view.
Figures 3, 4, 6 and 8 are partially omitted sectional views showing the manufacturing process in order, and Figures 5 and 7 are - of Figures 4 and 6, respectively.
Fig. 9 is a cross-sectional view showing a state connected to another printed circuit board; Fig. 10 is a view taken along the line or - line;
The figure is a sectional view schematically showing the connection of a conventional flexible printed circuit board to another printed circuit board.
The figure is a front view showing an example of a state in which both printed circuit boards of FIG. 10 are connected. DESCRIPTION OF SYMBOLS 1... Flexible printed circuit board, 2... Connection part, 3... Bent part, 4... Metal substrate, 5... Adhesive layer, 6... Printed circuit, 7... Terminal, 9... Plastic film, 10...Other printed circuit boards, 1
3...Low melting point metal.
Claims (1)
を加熱溶融させて他の印刷回路板１０に固着する
ことにより、これと電気的に接続されるフレキシ
ブル印刷回路板において、他の印刷回路板への接
続部２は、金属基板４の表面に接続剤層５を介し
て前記端子が固着されていることを特徴とするフ
レキシブル印刷回路板。 Low melting point metal 13 covering terminals 7 of printed circuit 6
In a flexible printed circuit board that is electrically connected to another printed circuit board 10 by heating and melting it and fixing it, the connection part 2 to the other printed circuit board is connected to the surface of the metal substrate 4. A flexible printed circuit board characterized in that the terminals are fixed through an adhesive layer 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152084U JPS60194377U (en) | 1984-06-01 | 1984-06-01 | flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8152084U JPS60194377U (en) | 1984-06-01 | 1984-06-01 | flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60194377U JPS60194377U (en) | 1985-12-24 |
| JPH0220860Y2 true JPH0220860Y2 (en) | 1990-06-06 |
Family
ID=30628377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8152084U Granted JPS60194377U (en) | 1984-06-01 | 1984-06-01 | flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60194377U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4950500B2 (en) * | 2006-02-06 | 2012-06-13 | キヤノン株式会社 | Bonding structure of printed wiring board |
-
1984
- 1984-06-01 JP JP8152084U patent/JPS60194377U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60194377U (en) | 1985-12-24 |
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