JPH0423322Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and particularly to improvements in a hybrid integrated circuit having a folded structure.

(B) Prior Art As shown in FIG. 2, a conventional hybrid integrated circuit consists of two metal substrates 1 and 2, an insulating film 3 connecting the substrates 1 and 2, and a conductive path 4 provided on the film 3.
and a plurality of circuit elements 5 such as semiconductor integrated circuits, chip resistors, or chip capacitors fixed on a conductive path 4.

The metal substrates 1 and 2 are made of aluminum with good thermal conductivity and have a thickness of 0.5 to 1.0 mm, and the substrates 1 and 2 are separated by their respective thicknesses using an adhesive such as epoxy resin, and then connected with an insulating film 3 made of polyimide or the like. . A copper foil serving as a conductive path 4 is pasted on the opposite main surface of the insulating film 3, and the copper foil is selectively etched to form a conductive path 4 of a desired shape. The conductive path 4 is formed by arranging pads to which the external leads 6 are soldered at the end of one substrate 2, and connecting the conductive path 4 from the pads to the insulating film 3.
extend above. The circuit element 5 is fixed. The portion of the conductive path 4 is designed to be located on both the substrates 1 and 2, and the circuit element 5 is not provided in the separated portion of the substrates 1 and 2 for bending.

After the circuit element 5 was assembled, the insulating film 3 was folded between the separated parts of the substrates 1 and 2, and the opposite main surfaces of the substrates 1 and 2 were brought into contact with each other.

A technique similar to that described above is described in Japanese Patent Application No. 169868/1983.

(c) Problems to be solved by the invention However, in the above-mentioned conventional hybrid integrated circuit, the conductive paths formed on the insulating film are located at the bending portions of the insulating film, as shown in FIG. In some cases, the direction of the conductive path may be changed by bending the conductive path.In that case, when the insulating film between the boards is bent and the boards are bent and arranged, the corner part of the bent conductive path may peel off. It was hot.

(d) Means for solving the problems The present invention has been made in view of the above-mentioned points, and as shown in FIG. and film 3
It comprises a conductive path 4 of a desired shape provided on the conductive path 4 and a plurality of circuit elements 5 fixed on the conductive path 4, and the exposed metal surfaces of the two substrates 1 and 2 are brought into contact by bending the insulating film 3. In a hybrid integrated circuit arranged in a similar manner,
This problem is solved by extending the bent portion of the conductive path 4 in the bent portion of the insulating film 3 in an oblique direction.

(E) Effect By arranging the conductive path 4 at a position where the insulating film 3 is bent in this manner obliquely, the direction of the conductive path 4 can be changed without forming a corner portion.

(F) Embodiments The present invention will be described in detail below based on embodiments shown in the drawings.

FIG. 1 shows a hybrid integrated circuit showing an embodiment of the present invention.

The hybrid integrated circuit of the present invention consists of two metal substrates 1 and 2.
, an insulating film 3 that connects the substrates 1 and 2, a conductive path 4 provided on the film 3, and a plurality of circuit elements 5 such as semiconductor integrated circuits, chip resistors, or chip capacitors fixed on the conductive path 4. be done.

The metal substrates 1 and 2 are made of aluminum with good thermal conductivity and have a thickness of 0.5 to 1.0 mm, and the substrates 1 and 2 are separated by their respective thicknesses using an adhesive such as epoxy resin, and then connected with an insulating film 3 made of polyimide or the like. .

A copper foil serving as a conductive path 4 is adhered to the opposite main surface of the insulating film 3, and the copper foil is selectively etched to form a conductive path 4 of a desired shape.

The conductive path 4 has an external lead 6 at the end of one substrate 2.
Pads to be soldered are arranged, and a conductive path 4 is extended from the pads onto an insulating film 3. Circuit element 5
The portion of the conductive path 4 that fixes the substrate is designed to be located on both substrates 1 and 2.

The feature of the present invention is that when changing the direction of the conductive path 4 arranged on the substrates 1 and 2 at the bending part of the insulating film 3, the direction is changed by forming the conductive path 4 diagonally. It is something. Conductive path 4
is formed by resisting a pattern so that it is arranged diagonally during patterning and then etching it.

After installing the circuit element 5 on the conductive path 4, as shown in FIG. 2, the insulating film 3 on the separated parts of the substrates 1 and 2 is bent and the exposed metal surfaces of the substrates 1 and 2 are brought into contact. and place it.

According to the present invention, by forming the conductive path 4 at the bending portion of the insulating film 3 obliquely, the direction of the conductive path 4 can be changed without peeling.

(g) Effects of the invention As described above, according to the invention, by forming the conductive path diagonally at the bending portion of the insulating film and changing the direction of the conductive path, it is possible to avoid bending the conductive path. In other words, since the direction of the conductive path can be changed without forming a corner portion, it is possible to eliminate the peeling of the conductive path that has conventionally occurred.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention, and FIGS. 2 and 3 are a sectional view and a plan view showing a conventional example. 1, 2... Metal substrate, 3... Insulating film, 4
...Conducting path, 5...Circuit element, 6...External lead.

Claims (1)

[Scope of utility model registration request] It includes two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path of a desired shape provided on the film, and a plurality of circuit elements fixed on the conductive path. In a hybrid integrated circuit in which the insulating film is bent so that the exposed metal surfaces of the two metal substrates are in contact with each other, the bent part of the conductive path in the bent part of the insulating film is bent in an oblique direction. A hybrid integrated circuit characterized by extending.