JPH043500Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Field of industrial application The present invention relates to a hybrid integrated circuit, and in particular to improvements in the packaging of a hybrid integrated circuit consisting of two metal substrates and suitable for high-density integration.

(B) Conventional technology As shown in FIG. 3, a conventional folded board using an insulating film consists of two metal boards 11 and 12, an insulating film 13 connecting the boards 11 and 12, and a folded board provided on the film 13. The conductive path 14 has a plurality of circuit elements 15 fixed on the conductive path 14, such as a semiconductor integrated circuit, a chip resistor, or a chip capacitor.

The metal substrates 11 and 12 are made of aluminum with a good thermal conductivity of 0.5 to 1.0 mm, and the substrates 11 and 12 are separated by their respective thicknesses using an adhesive such as epoxy resin, and connected by an insulating film 13 such as polyimide. . A conductive path 1 is provided on the opposite main surface of the insulating film 13.
A copper foil No. 4 is pasted, and the copper foil is selectively etched to form a conductive path 14 of a desired shape.
As is clear from FIG. 4, pads 17 to which external leads 16 are soldered are arranged at the end of one substrate 12, and the conductive path 14 extends from the pads 17 onto the insulating film 13. The portion of the conductive path 14 that fixes the circuit element 15 is connected to both substrates 11,1.
The circuit element 15 is not provided in the spaced apart portion of the substrates 11 and 12 due to bending.

After the circuit element 15 is assembled, the insulating film 13 is bent at the spaced apart portion of the substrates 11 and 12, and the opposite main surfaces of the substrates 11 and 12 are brought into contact with each other, as shown in FIG. The entire structure is molded with resin 18 except for the external leads 16.

The above-mentioned technique is described in Japanese Patent Publication No. 11809/1983.

Further, as shown in FIG. 6, a hybrid integrated circuit consisting of two substrates is inserted into a frame-shaped case material 22 after inserting two hybrid integrated circuit substrates 21, 21 to which a circuit element 20 is fixed, and then fixed. The two hybrid integrated circuit boards 21, 21 are electrically connected by leads 23, and a resin 24 is filled between the boards 21, 21 and the case material 22 to integrate them.

Such a hybrid integrated circuit is described in Japanese Utility Model Publication No. 55-8316.

(c) Problems to be solved by the invention However, conventional hybrid integrated circuits have various problems.

First, the folded board shown in Figure 3 was originally intended for miniaturized hybrid integrated circuits, and because the metal board that serves as a heat sink is in close contact with it, it is difficult to mount circuit elements that generate heat. There was a problem in that it was not suitable for this method, and it was not possible to provide a high-output type hybrid integrated circuit.

The hybrid integrated circuit shown in FIG. 6 has a structure in which the metal substrate is exposed on the surface, and the above-mentioned problems can be solved. However, since the two substrates are electrically connected by soldering through leads, there is a problem in that workability and reliability are reduced.

(d) Means for solving the problem The present invention was made in view of the above-mentioned problem, and as shown in FIG. Then, the circuit element 5 is fixed on the two metal substrates 1, 1, and the insulating film 2 between the two metal substrates 1, 1 is bent, and a space is created at the end of the metal substrates 1, 1 at the bent part. A space 3 is provided between the end portions of the metal substrates 1, 1, in which the circuit elements 5 are arranged to face each other, and the two metal substrates 1, 1 are spaced apart by a frame 7. The problem is solved by filling the resin with a resin layer 8 and integrating the resin layer 8.

(E) Effect According to the present invention, a space is provided between the ends of the metal substrates at the bent portion of the insulating film, the two metal substrates are spaced apart by a frame, and the space is filled with resin. By providing the resin layer, the surface of the metal substrate can be exposed, and since the bent portion of the insulating film is molded with the resin layer, the circuit element can be completely isolated from the outside.

(F) Embodiment The present invention will be explained in detail below based on the embodiment shown in FIG.

The hybrid integrated circuit of the present invention, as shown in FIG. A space 3 formed between the terminal ends of
and a resin layer 8 filled in the space 3.

The two metal substrates 1, 1 are made of aluminum, which has good thermal conductivity, and an aluminum oxide film is formed on the surfaces thereof by anodic oxidation. The metal substrates 1, 1 are arranged with a predetermined distance between them, and an insulating film 2 made of polyimide resin or the like is pasted on the surfaces of the two metal substrates 1, 1 to bond them together.

The insulating film 2 is made of a resin such as polyimide resin, and the insulating resin 2 has a copper foil integrated in advance for forming the conductive path 4, and as described above, the entire surface of the two metal substrates 1, 1 is The desired conductive path 4 is formed by selectively etching the copper foil on the insulating film 2. At this time, the conductive path 4 is formed so as to span the metal substrates 1, 1, and a plurality of circuit elements 5 such as power semiconductor elements, chip resistors, or chip capacitors are fixed on the conductive path 4, and the metal substrates 1, 1 are further fixed. An external lead 6 is fixed to a pad formed at the peripheral end of the pad.

The space 3 is formed by applying silicone resin of a predetermined width near the end portions of the metal substrates 1, 1, which are the bent portions of the insulating film 2, before pasting the insulating film 2 on the metal substrates 1, 1. be done. In other words, the insulating film 2 is not attached to the area near the end of the metal substrates 1, 1 where silicone resin is applied and is peeled off, and when the insulating film 2 is bent, a space is created between the end of the metal substrates 1, 1. 3 is formed. More specifically, as shown in FIG. 2, the space 3 is a region surrounded by the end portions of the metal substrates 1, 1 and the frame 7, that is, a diagonally shaded region.

The frame 7 is made of insulating resin or the like, and can have any shape as long as it allows the two metal substrates 1, 1 to be spaced apart from each other. The frame body 7 of this embodiment includes a sealing space 9 that seals the circuit element 5 fixed on the metal substrates 1, 1, and a lead space that surrounds the external leads 6 provided at the peripheral edges of the metal substrates 1, 1. 10, and is provided with a stepped portion for accommodating the metal substrates 1, 1, and is formed to coincide with the end sides of the metal substrates 1, 1.

An adhesive sheet is provided on the stepped portion of the frame 7, and the frame 7 is
Fold the insulating film 2 between the metal substrates 1, 1 so as to sandwich the metal substrates 1, 1, place the metal substrates 1, 1 on the stepped part, and form the frame 7.
sticks to. At this time, the insulating film 2 near the end portions of the metal substrates 1, 1 is in a state of being peeled off from the metal substrates. The bent portion 2' of the insulating film 2 is bent inside the end edges of the metal substrates 1, 1, and is an area surrounded by the frame 7 and between the end edges of the metal substrates 1, 1 (shaded area). A space 3 is formed in the space 3, and a resin layer 8 is formed by filling the space 3 with a resin such as epoxy resin. At this time, the resin is also filled between the frame 7 and the film 2 through the gap. Further, at the same time as forming the resin layer 8, the lead space 10 is also filled with resin to form a resin layer 8' and are integrated.

In this way, the space 3 is provided between the ends of the metal substrates 1, 1 at the bent portion of the insulating film 2, and the resin layer 8 is provided in the space 3, thereby completely shielding the circuit element 5 from the outside. be able to.

(g) Effects of the invention As described above, according to the invention, by providing a resin layer in the space, the circuit elements can be isolated from the outside, improving reliability, giving a good appearance, and making handling easier. It improves the performance.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a - sectional view, Fig. 2 is a perspective view showing the present embodiment, and Figs. . 1... Metal substrate, 2... Insulating film, 3...
Space part, 4... Conductive path, 5... Circuit element, 6...
External lead, 7...Frame body, 8...Resin layer, 9...
Sealed space, 10... lead space.

Claims (1)

[Scope of utility model registration request] It includes two metal substrates, an insulating film that connects the two metal substrates at a distance, a conductive path of a desired shape provided on the film, and a plurality of circuit elements fixed on the conductive path. a frame body in which the insulating film between the metal substrates is bent so that the circuit elements face each other and the metal substrates are spaced apart from each other for a certain period of time; and an end of the metal substrate at the bent portion of the insulating film. A space provided between the parts,
A hybrid integrated circuit comprising: a resin layer filled in the space.