JPS62149145A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To make the height of a hybrid integrated circuit half that of a conventional circuit, by coupling two separated metal substrates with an insulating film, providing conductor paths on the insulating film, providing circuit elements on the conductor paths on the substrates, and bending the insulating film. CONSTITUTION:Two separated metal substrates 11 and 12 having the same configuration are coupled with an insulating film 13. Conductor paths 14 having a desired shape are provided on the film 13. Circuit elements 15 are formed only on the conductor paths 14 on the substrates 11 and 12. The film 13 is bent between the substrates 11 and 12, and the opposite main surfaces of the substrates 11 and 12 are contacted. Thus, the height of the hybrid integrated circuit is made half that of a conventional circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to improvements in a hybrid integrated circuit having a folded structure.

(B) Conventional technology A conventional hybrid integrated circuit has a metal substrate (one
), a desired conductive path (2) is provided by providing a thin insulating layer on the main surface of the conductive path (2), and a circuit element (3) such as a semiconductor integrated circuit, a chip resistor or a chip capacitor is fixed on the conductive path (2), As shown in FIG. 5, the entire structure was molded with resin (5), leaving only the external leads (4).

(c) Problems to be Solved by the Invention Since hybrid integrated circuits are formed on the -main surface of the metal substrate (1), a certain height is required to ensure a certain degree of integration, and the thinness of electronic devices This was a difficult point in the design. This is mainly due to the fact that the fixing pad (6) of the external lead (4) requires a considerable area.

(d) Means for solving the problems The present invention has been made in view of the above-mentioned points.
As shown in the figure and FIG.
4) and conductive paths (1) on the metal substrates (11) and (12).
3) A circuit element (15) is provided on the substrate (11) (12).
) to allow bending of the insulating film (13) between the substrates (11)
(12) The opposite main surfaces are placed in contact with each other.

(e) Operation As described above, two metal substrates of the same shape separated from each other are bonded with an insulating film, a conductive path is provided on the insulating film, a circuit element is provided on the conductive path on the two substrates, and the board By allowing the insulating film between the two to bend and arranging the opposite major surfaces of the respective substrates so that they are in contact, the opposite major surfaces of the respective substrates can be brought into perfect contact and the height of the hybrid integrated circuit can be halved compared to the conventional one. .

(f) Examples The present invention will be described in detail below based on the examples shown in FIGS. 1 and 2.

As shown in FIGS. 1 and 2, the hybrid integrated circuit of the present invention includes two metal substrates (11) < 12) and a substrate (11) (
12> and an insulating film (13) that connects the film (
13) It comprises a conductive path 14) provided on the conductive path 14) and a plurality of circuit elements (15) such as a semiconductor integrated circuit, a chip resistor, or a chip capacitor fixed on the conductive path 14).

As shown in Fig. 2, the metal substrates (11) (2) are made of aluminum with good thermal conductivity and have the same shape and a thickness of 0.5 to 1.0 cm.
) (12) are spaced apart by their respective thicknesses and connected with an insulating film (13) made of polyamide or the like. Insulating film (13
A copper foil serving as a conductive path <14) is pasted on the opposite main surface of the conductive path 14), and the copper foil is selectively etched to form a conductive path 14) of a desired shape. As is clear from FIG. 1, the conductive path (14) is connected to an external lead (
Line up the pads (17) to which you want to solder the pads (16)
A conductive path (14>) is extended from 17) onto the insulating film (13).The conductive path (14) to which the circuit element (15) is fixed
) is designed to be located on both substrates m) (12), and no circuit element (15) is provided in the separated portion of the substrates (11) and (12) due to bending.

After incorporating the circuit element (15), the board (11) (12)
Fold the insulating film (13) at the spaced apart part and bring the opposite main surfaces of the substrates (11 and 12) into contact with each other as shown in Figure 3, leaving the external leads (16) intact. Mold with resin (18).

(G) Effects of the Invention According to the present invention, by bending and arranging two metal substrates of the same shape, the opposite main surfaces of each substrate are brought into perfect contact with each other, and a hybrid assembly having the same degree of integration as the conventional one can be achieved. The height of the circuit can be reduced to about half, and by using a flexible insulating film (13), there is no need to connect the conductive path (14) of both substrates m>(12), and the circuit can be manufactured using the same method as before. As a result, in the past, one side of the substrate was used, but in the present invention, it is equivalent to using both sides of the substrate, which can greatly contribute to miniaturization of hybrid integrated circuits.

[Brief explanation of drawings]

FIG. 1 is a plan view illustrating a hybrid integrated circuit according to the present invention;
FIG. 2 is a side view thereof, FIG. 3 is a sectional view of a completed hybrid integrated circuit according to the present invention, FIG. 4 is a plan view showing a conventional hybrid integrated circuit, and FIG. 5 is a side view thereof. (11) (12) are metal substrates, (13> are insulating films, (14) are conductive paths, (15) are circuit elements, (16) are external leads, (17) are pads, (18) are It is resin.

Claims (1)

[Claims] (1) comprising two metal substrates, an insulating film that connects the metal substrates at a distance, a conductive path of a desired shape provided on the film, and a plurality of circuit elements fixed on the conductive path,
Both the metal substrates have the same shape, the circuit element is provided only on the conductive path on the both substrates, and the insulating film between the two substrates is bent so that the opposite main surfaces of the substrates are in contact with each other, A hybrid integrated circuit characterized in that circuit elements provided in the insulating film are connected via conductive paths extending on the bent portions of the insulating film.