JPH0631723Y2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a semiconductor device configured by mounting semiconductor chips on a front surface and a back surface of a film carrier.

(B) Prior Art Conventionally, in the case of mounting a semiconductor chip on each of the front surface and the back surface of one film carrier, JP-A-54-837
No. 68 (hereinafter referred to as prior art 1) discloses a semiconductor device in which semiconductor chips of the same size are connected to the front surface and the back surface of a film carrier, and leads of the same length corresponding to the semiconductor chips on the respective surfaces are connected. Is listed.

Japanese Utility Model Laid-Open No. 58-106951 (hereinafter referred to as prior art 2) discloses a semiconductor device in which a window portion is provided in a substrate, a conductor on the substrate is extended to the window portion, and semiconductor chips are stacked. The mounting structure of is described.

Further, in Japanese Utility Model Laid-Open No. 61-97857 (hereinafter referred to as prior art 3), semiconductor chips of the same size are respectively provided on the front surface and the back surface of an insulating substrate, and the same length corresponding to the semiconductor chips on the respective surfaces. The semiconductor device connected to the lead of the above is described.

(C) Problems to be Solved by the Invention Thus, in the semiconductor device configured by mounting the semiconductor chips on the front surface and the back surface of one film carrier, as shown in FIG. , The lead 6 ″ of the first surface and the lead 7 ″ of the second surface are of the same length and on different surfaces, so that the lead 6 ″ and the lead 7 ″ are not short-circuited. , 7 ″
There is a film 5 ″ between the two.

Therefore, there is a problem in that the semiconductor device is destroyed due to the peeling of the lead and the film due to the difference in thermal expansion coefficient between the leads 6 ″ and 7 ″ on the respective surfaces and the film 5 ″. .

In addition, since there is a problem of peeling, the lead cannot be freely bent, and thus the usage of the semiconductor device is restricted.

Further, as in the prior art 3, since the leads are formed on both surfaces of the film or the circuit wiring board, it is not possible to form the leads at one time during the manufacturing thereof, so the leads must be formed in two steps. Not only is the manufacturing efficiency of the semiconductor device poor, but when connecting the semiconductor device to other electronic components such as a substrate, the leads on the front surface and the leads on the back surface must be connected separately. The implementation efficiency of was also poor.

Further, as shown in FIG. 5 of Prior Art 2, a large-sized semiconductor chip 23 (hereinafter referred to as a large chip 23) and a small-sized semiconductor chip 27 (hereinafter referred to as a small chip 27) to be stacked are arranged. , Conductors 24 and 26, respectively
However, since the conductor 24 connected to the large chip 23 is formed on the circuit board 25, when the substrate and the semiconductor chip are connected by thermocompression bonding, the large chip 23 and the small chip 27 are connected to each other. Since it is not possible to stack and arrange the upper and lower parts, it is not possible to arrange a large chip in the window provided on the circuit board, and the mounting size is restricted by the size of the chip.

Not only that, when connecting the large chip 23 to the conductor 24, it is necessary to heat the connection portion through the circuit board 25, so that the circuit board is low in temperature so as not to be affected by warping or expansion. Must be heated at temperature. Therefore, when such a mounting structure is used, it takes a long time to manufacture the semiconductor device, and the semiconductor device cannot be manufactured efficiently.

It is an object of the present invention to provide a semiconductor device that solves the above conventional problems.

(D) Means for Solving the Problem In order to achieve the above object, in the present invention, a semiconductor device in which a semiconductor chip is attached to each of a front surface and a back surface of a film carrier, The semiconductor chips mounted on the front surface and the back surface of the film carrier have different sizes, and correspond to the semiconductor chip having the smallest size among the semiconductor chips on the same plane in a single mounting hole of the film carrier. A finger lead and a finger lead having a shorter length than the finger lead corresponding to a semiconductor chip having a large size among the semiconductor chips are extended, and the electrode portion of each semiconductor chip and the semiconductor chip corresponding to each of the semiconductor chips are provided. The end of each finger lead was thermocompression bonded.

(E) Action and effect As described above, in order to connect to semiconductor chips having different sizes on the front surface and the back surface, finger leads having different lengths are formed on the same plane corresponding to the respective semiconductor chips. Since it is not necessary to stack the finger leads, it is not necessary to interpose an insulating layer such as a film between the finger leads on the front side and the back side when the finger leads are arranged. Therefore, it is possible to prevent the semiconductor device from being broken by peeling the finger leads and the insulating layer due to the difference in the thermal expansion coefficients thereof.

And since there is no problem of peeling between the finger leads and the insulating layer and the finger leads can be bent,
It is also possible to prevent the finger lead from restricting the usage pattern of the semiconductor device.

Furthermore, by forming the finger leads on the same plane, it is not necessary to stack the finger leads, so that the thickness of the semiconductor device can be reduced.

Moreover, since the finger leads are formed on the same plane, when the semiconductor device is mounted on other electronic components such as a substrate by the finger leads, the front surface lead and the back surface lead are separately connected once. Can be connected to, and the mounting efficiency is improved.

Also, in order to connect to semiconductor chips of different sizes on the front and back sides, finger leads of different lengths corresponding to the respective semiconductor chips are extended on the same plane within a single mounting hole of the film carrier. Therefore, the finger leads corresponding to the respective size semiconductor chips are arranged on the same plane, and for example, the surface on which the small size semiconductor chip is mounted can be the front surface or the back surface of the finger leads. Therefore, the size of the semiconductor chip does not limit the surface on which the semiconductor chip is mounted on the finger leads, and the shape of the semiconductor device is not restricted.

Then, since the end portions of the finger leads and the electrode portions of the semiconductor chip are thermocompression bonded, the heater can be directly pressed against the finger leads at the time of the thermocompression bonding, and heat can be directly applied to the portion to be bonded. Therefore, it becomes possible to perform thermocompression bonding at a higher temperature than before in a short time.

(F) Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an embodiment of the present invention.

In this figure, two semiconductor chips are attached, and the two semiconductor chips 1 and 2 are substantially rectangular plate-shaped and have different planar sizes.

The film carrier 3 is a rectangular frame-shaped base film 3a.
And the inside of the frame is a mounting hole 4. Finger leads 5 and 6 corresponding to the electrodes 1a and 2a on the back surfaces of the two semiconductor chips 1 and 2 are provided on the back surfaces of the four sides of the base film 3a. Each finger lead 5, 6
Inner end portions 5a and 6a of the are extended into the mounting hole 4. The amount of extension is larger for the lead 5 corresponding to the smaller (upper side in the drawing) semiconductor chip 1, and for the lead 6 corresponding to the larger (lower side in the drawing) semiconductor chip 2. Is getting smaller. Also, the outer ends 5b of the leads 5 and 6,
6b is bent for soldering to a wiring pattern on the circuit board 7 described later.

2 is a partially cutaway side view of the assembled state of FIG. 1,
FIG. 3 is a plan view of FIG. In these figures,
The small semiconductor chip 1 and the large semiconductor chip 2 have the film carrier 3 with the electrodes 1a and 2a inside.
Are placed inside the mounting hole 4 from the front side and the back side of
They face each other. That is, the two semiconductor chips 1 and 2 are stacked on the one film carrier 3 in the front-back direction of the film carrier and three-dimensionally arranged. The electrode 1a of the small-sized semiconductor chip 1 is on the inner end portion 5a of the finger lead 5 extending inwardly, and the electrode 2a of the large-sized semiconductor chip 2 is on the other side of the finger lead 6. The bumps 8 are connected and fixed to the end portions 6a by thermocompression bonding, respectively. At this time, when the large-sized semiconductor chip 2 is thermocompression-bonded to the corresponding finger lead 6 first, the inner end portion 5 of the other finger lead 5 is then formed.
Since it becomes impossible to perform thermocompression bonding while supporting a, the small-sized semiconductor chip 1 is attached first.

Although the semiconductor chips 1 and 2 have a substantially rectangular plate shape in this embodiment, if the semiconductor chips 1 and 2 have different sizes, the shape is not particularly limited to a rectangular plate shape. Absent.

[Brief description of drawings]

1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a partially cutaway side view of the assembled state of FIG. 1, and FIG. 3 is a plan view of FIG. 1, 2 ... Semiconductor chip 1a, 2a ... Electrode 3 ... Film carrier 3a ... Base film 4 ... Mounting hole 5, 6 ... Finger leads 5a, 6a ... Inner end

Claims (1)

[Scope of utility model registration request] 1. A semiconductor device comprising semiconductor chips mounted on the front and back surfaces of a film carrier, wherein the semiconductor chips mounted on the front and back surfaces of the film carrier have different sizes. Finger leads corresponding to the smaller semiconductor chip of the semiconductor chips on the same plane within a single mounting hole of the film carrier, and finger leads corresponding to the larger semiconductor chip of the semiconductor chips A semiconductor device in which a finger lead having a shorter length is extended, and an electrode portion of each semiconductor chip and an end portion of each finger lead corresponding to each semiconductor chip are thermocompression bonded.