JPH01234296A - Ic card - Google Patents

Ic card

Info

Publication number
JPH01234296A
JPH01234296A JP63060864A JP6086488A JPH01234296A JP H01234296 A JPH01234296 A JP H01234296A JP 63060864 A JP63060864 A JP 63060864A JP 6086488 A JP6086488 A JP 6086488A JP H01234296 A JPH01234296 A JP H01234296A
Authority
JP
Japan
Prior art keywords
card substrate
chip
printed board
sealing resin
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63060864A
Other languages
Japanese (ja)
Other versions
JP2661115B2 (en
Inventor
Noboru Kawamata
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP63060864A priority Critical patent/JP2661115B2/en
Publication of JPH01234296A publication Critical patent/JPH01234296A/en
Application granted granted Critical
Publication of JP2661115B2 publication Critical patent/JP2661115B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PURPOSE: To enable gaps in a card substrate to be filled up without need for high technique, by mounting an IC chip directly in a recess in the card substrate, providing a flexible printed board with terminals for external connection, connecting the printed board to electrodes of the IC chip, and sealing the IC chip and the like with a resin.
CONSTITUTION: An IC chip 2 is mounted and fixed in a recess in a card substrate 1. A flexible printed board 5 is fixed on the side of bonding terminals 52 thereof, and electrodes of the IC chip 2 and the bonding terminals 52 of the board 5 are correspondingly connected to each other by small diameter metallic wires 3. The recess in the card substrate 1 is filled with a resin to be substantially flush with the surface of the substrate 1, thereby forming a sealing resin part 4. Of the printed board 5, the parts protruding from the sealing resin part 4 and the card substrate 1 are bent to the inside, and are firmly adhered to the surface of the sealing resin part 4, with the surfaces of terminals 51 for external connection disposed on the outer side. A cover sheet 6 is adhered to the surfaces of the card substrate 1 and the sealing resin part 4, exclusive of the printed board 5.
COPYRIGHT: (C)1989,JPO&Japio
JP63060864A 1988-03-14 1988-03-14 IC card Expired - Lifetime JP2661115B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63060864A JP2661115B2 (en) 1988-03-14 1988-03-14 IC card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63060864A JP2661115B2 (en) 1988-03-14 1988-03-14 IC card

Publications (2)

Publication Number Publication Date
JPH01234296A true JPH01234296A (en) 1989-09-19
JP2661115B2 JP2661115B2 (en) 1997-10-08

Family

ID=13154682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63060864A Expired - Lifetime JP2661115B2 (en) 1988-03-14 1988-03-14 IC card

Country Status (1)

Country Link
JP (1) JP2661115B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996007985A1 (en) * 1994-09-09 1996-03-14 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5786626A (en) * 1996-03-25 1998-07-28 Ibm Corporation Thin radio frequency transponder with leadframe antenna structure
US8076015B2 (en) 2003-02-11 2011-12-13 Eveready Battery Company, Inc. Battery cell with improved pressure relief vent

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61139894A (en) * 1984-12-13 1986-06-27 Matsushita Electric Ind Co Ltd Id card and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61139894A (en) * 1984-12-13 1986-06-27 Matsushita Electric Ind Co Ltd Id card and its manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996007985A1 (en) * 1994-09-09 1996-03-14 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
EP0855675A3 (en) * 1994-09-09 2000-11-15 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5786626A (en) * 1996-03-25 1998-07-28 Ibm Corporation Thin radio frequency transponder with leadframe antenna structure
US8076015B2 (en) 2003-02-11 2011-12-13 Eveready Battery Company, Inc. Battery cell with improved pressure relief vent

Also Published As

Publication number Publication date
JP2661115B2 (en) 1997-10-08

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