JPH01234296A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPH01234296A JPH01234296A JP63060864A JP6086488A JPH01234296A JP H01234296 A JPH01234296 A JP H01234296A JP 63060864 A JP63060864 A JP 63060864A JP 6086488 A JP6086488 A JP 6086488A JP H01234296 A JPH01234296 A JP H01234296A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- flexible printed
- printed circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 14
- 239000011111 cardboard Substances 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣカードに関し、特にＩＣチップを内蔵し表
面に外部接続用端子を備えたＩＣカードに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an IC card, and particularly to an IC card having a built-in IC chip and external connection terminals on its surface.
従来、この種のＩＣカードは、集積回路チップ（以下Ｉ
Ｃチップという）を、外部接続用端子を備えたモジュー
ルに搭載し、このモジュールをカード基板内に組込でい
た。Conventionally, this type of IC card has an integrated circuit chip (hereinafter referred to as I).
C chip) was mounted on a module equipped with external connection terminals, and this module was incorporated into the card board.
次に、図面を参照して従来のＩＣカードの一例を説明す
る。Next, an example of a conventional IC card will be described with reference to the drawings.
第５図はカード基板内に組込まれるモジュールの断面図
である。FIG. 5 is a sectional view of the module incorporated into the card board.
ＩＣチップ２は、モジュール基板７１に形成された窪み
にマウントされ、この窪みの内部に設けられたボンディ
ング用端子５２ａとＩＣチップ２の電極とが金属細線３
によって接続される。The IC chip 2 is mounted in a recess formed in the module substrate 71, and the bonding terminal 52a provided inside the recess and the electrode of the IC chip 2 are connected to the thin metal wire 3.
connected by.
モジュール基板７１の裏面には外部接続端子５１ａが配
置されており、この外部接続端子５１ａはスルーホール
７２によってボンディング用端子５２ａと接続されてい
る。An external connection terminal 51a is arranged on the back surface of the module board 71, and this external connection terminal 51a is connected to a bonding terminal 52a through a through hole 72.
そしてこの窪みが封止樹脂部７３により埋められ、ＩＣ
チップ２等がモジュール基板７１内に封じ込められた構
造となっている。Then, this depression is filled with the sealing resin part 73, and the IC
It has a structure in which the chip 2 and the like are sealed within the module substrate 71.
第６図（ａ）、（ｂ）はこのモジュール７をカード基板
ｌａ内に組込んだ従来のＩＣカードの一例を示す平面図
及び断面図である。FIGS. 6(a) and 6(b) are a plan view and a sectional view showing an example of a conventional IC card in which this module 7 is incorporated into a card board la.
第６図において、モジュール７は第５図に示された状態
に対し、上下を逆にした状態でカード基板ｌａ中に組込
まれている。In FIG. 6, the module 7 is assembled into the card board la in an upside-down state compared to the state shown in FIG.
このモジュール７は、外部接続端子５１ａがカード基板
１ａの表面とほぼ同一面になるように、カード基板１ａ
に窪みが設けられ、この窪みの中に組込まれる構造とな
っている。This module 7 is installed on the card board 1a so that the external connection terminal 51a is on the same surface as the card board 1a.
A recess is provided in the recess, and the structure is such that it is incorporated into the recess.
上述した従来のＩＣカードは、ＩＣチップ２を１旦モジ
ュール７に搭載し、このモジュール７をカード基板１ａ
内に組込むという二重構造となっているので、モジュー
ル７をカード基板１ａに隙間なく組込むためには高い技
術力が必要であり、かつカード基板１ａに内蔵するには
超薄型のモジュールとしなければならないためコストが
高くなるという欠点がある。In the conventional IC card described above, the IC chip 2 is once mounted on the module 7, and this module 7 is mounted on the card substrate 1a.
Since it has a double structure in which the module 7 is built into the card board 1a, high technical skills are required to integrate the module 7 into the card board 1a without any gaps, and the module must be ultra-thin to be built into the card board 1a. The disadvantage is that the cost is high because it has to be carried out.
本発明の目的は、高い技術力がなくても容易にカード基
板の隙間を除去することができ、かつ超薄型のモジュー
ルを使用しなくて済み、コストを低減することができる
ＩＣカードを提供することにある。An object of the present invention is to provide an IC card that can easily remove gaps between card boards without requiring advanced technical skills, eliminates the need for ultra-thin modules, and reduces costs. It's about doing.
本発明のＩＣカードは、所定の機能をもつＩＣチップと
、このＩＣチップの各電極とそれぞれ対応して接続する
ための複数のボンディング用端子とこれら各ボンディン
グ用端子とそれぞれ対応して接続する複数の外部接続端
子とを備えたフレキシブルプリント基板と、前記ＩＣカ
ードを搭載固定すると共にこのＩＣチップと隣接して前
記フレキシブルプリント基板のボンディング用端子側を
固定する窪みを備えたカード基板と、前記ＩＣチップの
各電極と前記フレキシブルプリント基板の各ボンディン
グ用端子とをそれぞれ対応して接続する金属細線と、表
面が前記カード基板の表面とほぼ同一面となるように前
記カード基板の窪みを埋めて前記ＩＣチップ、フレキシ
ブルプリント基板の一部及び各金属細線を封入し、表面
に前記各外部接続端子の表面が外側になるように前記フ
レキシブルプリント基板を固定しな封止樹脂部とを有し
ている。The IC card of the present invention includes an IC chip having a predetermined function, a plurality of bonding terminals for connecting to each electrode of the IC chip in a corresponding manner, and a plurality of bonding terminals for connecting to each of the bonding terminals in a corresponding manner. a flexible printed circuit board having an external connection terminal; a card board having a recess for mounting and fixing the IC card and fixing a bonding terminal side of the flexible printed circuit board adjacent to the IC chip; Thin metal wires respectively connect each electrode of the chip and each bonding terminal of the flexible printed circuit board, and fill the recess of the card board so that the surface thereof is substantially flush with the surface of the card board. The IC chip, a part of the flexible printed circuit board, and each thin metal wire are encapsulated, and the flexible printed circuit board is fixed to the surface so that the surface of each external connection terminal is on the outside. .
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）はそれぞれ本発明の第１の実施例
を示す平面図及びＡ−Ａ’断面図である。FIGS. 1(a) and 1(b) are a plan view and a sectional view taken along the line AA', respectively, showing a first embodiment of the present invention.
カード基板１には、所定の機能をもつＩＣチップ２を搭
載固定すると共に、このＩＣチップ２の各電極とそれぞ
れ対応して接続するための複数のボンディング用端子５
２とこれらボンディング用端子５２とそれぞれ対応して
接続する複数の外部接続端子５１とを備えたフレキシブ
ルプリント基板５のボンディング用端子５２側をＩＣチ
ップ２と隣接して固定する窪みが設けられている。An IC chip 2 having a predetermined function is mounted and fixed on the card board 1, and a plurality of bonding terminals 5 are connected to each electrode of the IC chip 2 in a corresponding manner.
2 and a plurality of external connection terminals 51 connected to these bonding terminals 52 in correspondence with each other, a recess is provided for fixing the bonding terminal 52 side of the flexible printed circuit board 5 adjacent to the IC chip 2. .
このカード基板１の窪みに、ＩＣチップ２を搭載固定し
、またフレキシブルプリント基板５のボンディング用端
子５２側を固定して、ＩＣチップ２の各電極とフレキシ
ブルプリント基板５の各ボンディング用端子５２とをそ
れぞれ対応して金属細線３により接続する。The IC chip 2 is mounted and fixed in the recess of the card board 1, and the bonding terminal 52 side of the flexible printed circuit board 5 is fixed, so that each electrode of the IC chip 2 and each bonding terminal 52 of the flexible printed circuit board 5 are connected. are connected by corresponding thin metal wires 3.
次に、カード基板ｌの窪みを、表面がカード基板１の表
面とほぼ同一面になるように樹脂で埋め、ＩＣカード２
．フレキシブルプリント基板５の一部及び各金属細線３
を封入して封止樹脂部４を形成する。Next, the recess of the card board l is filled with resin so that the surface is almost flush with the surface of the card board 1, and the IC card 2 is filled with resin.
．． Part of the flexible printed circuit board 5 and each thin metal wire 3
is sealed to form the sealing resin part 4.
この封止樹脂部４とカード基板１との表面から突出した
フレキシブルプリント基板５は、これら表面のところで
内側へ折曲げられ、外部接続端子５１の表面を外側にし
て封止樹脂部４の表面に接着固定される。The flexible printed circuit board 5 protruding from the surfaces of the sealing resin part 4 and the card board 1 is bent inward at these surfaces, and is attached to the surface of the sealing resin part 4 with the surface of the external connection terminal 51 outside. Fixed with adhesive.
そして、フレキシブルプリント基板５を除くカード基板
１及び封止樹脂部４の表面にカバーシート６を貼付けて
完成する構造となっている。Then, the structure is completed by pasting the cover sheet 6 on the surfaces of the card board 1 and the sealing resin part 4, excluding the flexible printed circuit board 5.
第２図は上記実施例に使用されるフレキシブルプリント
基板５の平面図及びＢ−Ｂ’断面図である。FIG. 2 is a plan view and a BB' cross-sectional view of the flexible printed circuit board 5 used in the above embodiment.
このフレキシブルプリント基板５は、両端がそれぞれ外
部接続端子５１及びボンディング用端子５２となる接続
銅箔５４を複数枚、薄い絶縁樹脂５３内に埋込み、この
絶縁樹脂５３の外部接続端子５１及びボンディング用端
子５２の部分をエツチングして接続銅箔５４を露出させ
、この露出した部分をそれぞれ外部接続端子５１及びボ
ンディング用端子５２とした構造となっている。This flexible printed circuit board 5 has a plurality of connecting copper foils 54 whose ends serve as external connection terminals 51 and bonding terminals 52, respectively, embedded in a thin insulating resin 53, and the external connection terminals 51 and bonding terminals of the insulating resin 53 The connection copper foil 54 is exposed by etching a portion 52, and the exposed portions are used as an external connection terminal 51 and a bonding terminal 52, respectively.
第２図（ａ）のｃ−ｃ’線の右側の裏面がカード基板１
に接着固定されてこのｃ−ｃ’線で上方に折曲げられ、
更にＤ−Ｄ’線で内側に折曲げられて外部接続端子５１
の表面が外側に露出するようになっている。The back side on the right side of the c-c' line in Fig. 2 (a) is the card board 1.
is fixed with adhesive and bent upward along this c-c' line,
Furthermore, the external connection terminal 51 is bent inward at the D-D' line.
The surface is exposed to the outside.
第３図は、上記実施例の製造時の中間工程における断面
図である。FIG. 3 is a sectional view at an intermediate step in manufacturing the above embodiment.
この断面図は、封止樹脂部４を形成する前の工程のもの
である。This cross-sectional view shows a step before forming the sealing resin part 4.
このように、カード基板１の窪みが樹脂により埋められ
るので、高い技術力がなくても容易にカード基板１の隙
間を埋めることができる。In this way, since the recesses of the card substrate 1 are filled with the resin, the gaps in the card substrate 1 can be easily filled even without high technical ability.
第４図（ａ）、（ｂ）はそれぞれ本発明の第２の実施例
に適用されるフレキシブルプリント基板の平面図及びＥ
−Ｅ’断面図である。FIGS. 4(a) and 4(b) are a plan view and E of a flexible printed circuit board applied to the second embodiment of the present invention, respectively.
-E' sectional view.
この実施例のフレキシブルプリント基板５Ａが第１の実
施例のフレキシブルプリント基板５と相違する点は、第
１の実施例においてはフレキシブルプリント基板５を２
枚必要としたのに対し、第２の実施例ではフレキシブル
プリント基板５Ａ−枚で済むようにした点である。The flexible printed circuit board 5A of this embodiment is different from the flexible printed circuit board 5 of the first embodiment in that the flexible printed circuit board 5A of the first embodiment is different from the flexible printed circuit board 5A of the first embodiment.
The second embodiment requires only 5A flexible printed circuit boards, whereas the second embodiment requires only 5A flexible printed circuit boards.
従って加工工数等が更に低減される。Therefore, the number of processing steps and the like can be further reduced.
以上説明したように本発明は、ＩＣチップをカード基板
の窪みに直接搭載し、フレキシブルプリント基板に外部
接続端子を形成してＩＣチップの電極と接続してＩＣチ
ップ等を樹脂封止する構造とすることにより、高い技術
力がなくても容易にカード基板の隙間を埋めることがで
き、かつ従来のように超薄型のモジュールを使用しなく
ても済むので、コストを低減することができる効果があ
る。As explained above, the present invention has a structure in which an IC chip is directly mounted in a recess of a card substrate, external connection terminals are formed on a flexible printed circuit board, and connected to electrodes of the IC chip, and the IC chip and the like are sealed with resin. By doing so, it is possible to easily fill the gaps in the card board without having high technical skills, and there is no need to use ultra-thin modules as in the past, which has the effect of reducing costs. There is.
第１図（ａ）、（ｂ）はそれぞれ本発明の第１の実施例
を示す平面図及び断面図、第２図（ａ）、（ｂ）はそれ
ぞれ第１図に示された実施例に使用されるフレキシブル
プリント基板の平面図及び断面図、第３図は第１図に示
された実施例の中間工程における断面図、第４図（ａ）
、（ｂ）はそれぞれ本発明の第２の実施例に使用される
フレキシブルプリント基板の平面図及び断面図、第５図
は従来のＩＣカードに使用されるモジュールの断面図、
第６図（ａ＞、（ｂ）はそれぞれ従来のＩＣカードの一
例を示す平面図及び断面図である。
１．１ａ・・・カード基板、２・・・ＩＣチップ、３・
・・金属細線、４・・・封止樹脂部、５，５Ａ・・・フ
レキシブルプリント基板、６，６ａ・・・カバーシート
、７・・・モジュール、５１．５１Ａ、５１ａ・・・外
部接続端子、５２ 、５２ Ａ 、 ５２ ａ・・・ボ
ンディング用端子、５３．’５３Ａ・・・絶縁樹脂、５
４．５４Ａ・・・接続銅箔、５５・・・チップ搭載用穴
、７１・・・モジュール基板、７２・・・スルーホール
、７３・・・封止樹脂部。
代理人 弁理士 内 原 音
第 ２ 図
第４図
第 ５図
第 ６ 図FIGS. 1(a) and (b) are a plan view and a cross-sectional view, respectively, showing the first embodiment of the present invention, and FIGS. 2(a) and (b) are respectively showing the embodiment shown in FIG. A plan view and a sectional view of the flexible printed circuit board used, FIG. 3 is a sectional view at an intermediate step of the embodiment shown in FIG. 1, and FIG. 4(a)
, (b) are respectively a plan view and a sectional view of a flexible printed circuit board used in the second embodiment of the present invention, and FIG. 5 is a sectional view of a module used in a conventional IC card.
6(a) and (b) are a plan view and a cross-sectional view, respectively, showing an example of a conventional IC card. 1.1a...Card board, 2...IC chip, 3.
...Metal thin wire, 4...Sealing resin part, 5,5A...Flexible printed circuit board, 6,6a...Cover sheet, 7...Module, 51.51A, 51a...External connection terminal , 52 , 52 A , 52 a... bonding terminal, 53. '53A...Insulating resin, 5
4.54A... Connection copper foil, 55... Chip mounting hole, 71... Module board, 72... Through hole, 73... Sealing resin part. Agent Patent Attorney Uchihara Oto No. 2 Figure 4 Figure 5 Figure 6
Claims (1)
電極とそれぞれ対応して接続するための複数のボンディ
ング用端子とこれら各ボンディング用端子とそれぞれ対
応して接続する複数の外部接続端子とを備えたフレキシ
ブルプリント基板と、前記ＩＣカードを搭載固定すると
共にこのＩＣチップと隣接して前記フレキシブルプリン
ト基板のボンディング用端子側を固定する窪みを備えた
カード基板と、前記ＩＣチップの各電極と前記フレキシ
ブルプリント基板の各ボンディング用端子とをそれぞれ
対応して接続する金属細線と、表面が前記カード基板の
表面とほぼ同一面となるように前記カード基板の窪みを
埋めて前記ＩＣチップ、フレキシブルプリント基板の一
部及び各金属細線を封入し、表面に前記各外部接続端子
の表面が外側になるように前記フレキシブルプリント基
板を固定した封止樹脂部とを有することを特徴とするＩ
Ｃカード。The device includes an IC chip having a predetermined function, a plurality of bonding terminals for connecting to each electrode of the IC chip, and a plurality of external connection terminals for connecting to each of the bonding terminals, respectively. a card board having a recess for mounting and fixing the IC card and fixing the bonding terminal side of the flexible printed circuit board adjacent to the IC chip; each electrode of the IC chip and the flexible printed circuit board; Thin metal wires are connected to the bonding terminals of the printed circuit board in correspondence with each other, and the recesses of the card board are filled so that the surfaces thereof are almost flush with the surface of the card board. I characterized in that it has a sealing resin part in which a part and each thin metal wire are encapsulated, and the flexible printed circuit board is fixed to the surface so that the surface of each of the external connection terminals is on the outside.
C card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63060864A JP2661115B2 (en) | 1988-03-14 | 1988-03-14 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63060864A JP2661115B2 (en) | 1988-03-14 | 1988-03-14 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01234296A true JPH01234296A (en) | 1989-09-19 |
| JP2661115B2 JP2661115B2 (en) | 1997-10-08 |
Family
ID=13154682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63060864A Expired - Lifetime JP2661115B2 (en) | 1988-03-14 | 1988-03-14 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2661115B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996007985A1 (en) * | 1994-09-09 | 1996-03-14 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
| US8076015B2 (en) | 2003-02-11 | 2011-12-13 | Eveready Battery Company, Inc. | Battery cell with improved pressure relief vent |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61139894A (en) * | 1984-12-13 | 1986-06-27 | Matsushita Electric Ind Co Ltd | Id card and its manufacture |
-
1988
- 1988-03-14 JP JP63060864A patent/JP2661115B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61139894A (en) * | 1984-12-13 | 1986-06-27 | Matsushita Electric Ind Co Ltd | Id card and its manufacture |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996007985A1 (en) * | 1994-09-09 | 1996-03-14 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| EP0855675A3 (en) * | 1994-09-09 | 2000-11-15 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
| US8076015B2 (en) | 2003-02-11 | 2011-12-13 | Eveready Battery Company, Inc. | Battery cell with improved pressure relief vent |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2661115B2 (en) | 1997-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0319703B2 (en) | ||
| JP4859016B2 (en) | Semiconductor package | |
| KR20010070081A (en) | A semiconductor device and a process for producing the same | |
| JPH01234296A (en) | Ic card | |
| JP2001177005A (en) | Semiconductor device and manufacturing method thereof | |
| JP2524482B2 (en) | QFP structure semiconductor device | |
| JPH0230597A (en) | Module for semiconductor card | |
| JP3699271B2 (en) | Semiconductor package and manufacturing method thereof | |
| JP2602834B2 (en) | Semiconductor device | |
| JPH1174421A (en) | Composite semiconductor device | |
| JPH10242381A (en) | Structure of enclosed semiconductor device with a plurality of ic chips | |
| JPH10154766A (en) | Manufacture of semiconductor package and semiconductor package | |
| KR20050024226A (en) | Semiconductor device, and semiconductor module and manufacturing method thereof | |
| JPS6276661A (en) | Resin sealed type semiconductor device | |
| JPH0366150A (en) | Semiconductor integrated circuit device | |
| KR0167288B1 (en) | Chip scale package and method of making the same | |
| KR100476669B1 (en) | Chip on board package and chip card using the same | |
| JPH11219969A (en) | Semiconductor device | |
| JPH0536893A (en) | Hybrid integrated circuit | |
| JPH03274021A (en) | Production of liquid crystal display device | |
| JP2002329806A (en) | Electric circuit component | |
| JP2535573B2 (en) | Method for manufacturing plastic pin grid array | |
| JPH03157961A (en) | Resin sealed type semiconductor device | |
| KR19990003760U (en) | Bonding structure with semiconductor package and printed circuit board | |
| JPH08236928A (en) | Hybrid integrated circuit device |