JPH08236928A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE: To mount a high element on a printed board by bending a metallic substrate in a U-shape and forming hollowed-out sections on the mounting surface of the substrate for separately mounting elements. CONSTITUTION: A metallic substrate 3 is bent in a U-shape and mounted on a printed board 2 in a π-structure. Namely, the substrate 3 is composed of three faces of a left side face 13, right side face 14, and top face 15. Through holes P..., P... are formed in two rows through the printed board 2 for inserting outer leads 8 and chip capacitors and elements are arranged between the two rows. It is also possible to mount elements on the outside of the π-structure. Since the substrate 3 is made of a metal, however, it is difficult to get the contact between the elements mounted on the outside of the π-structure and the inside of the structure in the through holes. Therefore, when hollowed-out sections 16 are formed on the mounting surface of the substrate 3 to electrically connect wires to each other in the sections 16, IC mounting sockets or ICs can be mounted on the outside of the π-structure also.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device which is not affected by components of a printed circuit board when mounted on a printed circuit board or the like.

[0002]

2. Description of the Related Art In general, a hybrid integrated circuit device has been studied for improvement of packaging density and miniaturization of element size due to light, thin, short and small flows. In order to improve the mounting density, as shown on the left side of FIG. 6, two boards are integrated by bringing the non-mounting surfaces into contact with each other, and on the right side, the two boards are mounted on the mounting surface at a predetermined interval. Some of them have been mounted, and although not shown in the drawings, some of them have a plurality of substrates (flexible substrates) further laminated on the substrate to improve the mounting density.

More specifically, referring to FIG. 6, a metal substrate is used as the substrate 1, and for example, Cu or Al is used.
Although not shown in the drawing, a conductive pattern is formed on the surface via an insulating layer. A semiconductor chip such as a transistor chip or an LSI chip, a passive element such as a chip resistor or a chip capacitor is fixed to a predetermined position of the conductive pattern through solder or Ag paste, and wire bonding is performed if necessary.

As a molding method, the left side is sealed with a powder coat 2, and the right side is covered with a case material 3 between substrates and a resin is injected therein.

[0005]

When the hybrid integrated circuit device as described above is mounted on the printed circuit board 5 as shown in FIG. 6, a conductive pattern is formed on the printed circuit board 5. The mounting components such as the capacitor, the resistor, the buzzer, the transformer, and the connector are fixed to each other.

For example, when these mounted components are arranged on a printed circuit board including the mounting surface of the hybrid integrated circuit device, the hybrid integrated circuit device may be mounted immediately below and in the vicinity thereof in order to mount the hybrid integrated circuit device. It was impossible to fix the mounting component, and it was necessary to devise the pattern shape of the printed circuit board. Further, on the mounting surface of the elements constituting the hybrid integrated circuit device of FIG. 6, especially in the device on the right side, the width of the case material 3 is the maximum mounting height of the element, and the element having a height higher than this is mounted. There was a problem I couldn't do.

[0007]

The present invention has been made in view of the above-mentioned problems. First, the metal substrate has a substantially rectangular shape,
In order to mount the element separately on the outside of the mounting surface, the mounting surface of the element is bent in a U shape with the mounting surface inside, at positions that are inside at equal intervals from one side of the metal substrate.
A board corresponding to the mounting surface is provided with a hollow portion, and an insulating sheet provided with a conductive means is attached to the hollow portion and the periphery thereof, and the conductive means and the element mounted outside are electrically connected. This is solved by forming a predetermined circuit including the mounting elements inside, which are connected.

Secondly, a flexible insulating sheet is adhered on almost the entire surface of the metal substrate, and it has a substantially rectangular shape. It is bent in a U-shape on the inside, and in order to mount an element separately on the outside of the mounting surface, a hollow portion is provided on the substrate corresponding to the mounting surface, and the electrode of the flexible insulating sheet provided in this area The problem is solved by electrically connecting the electrodes of the element provided on the outer side.

[0009]

The first effect is that the metal substrate is formed into a U-shape body in which the mounting surface of the element is inside and the metal substrate is bent in a U-shape at positions that are inwardly spaced from the opposite sides. In the direction shown by the arrow in Fig. 1, wiring or elements on the printed circuit board may pass inside the device, and the height of the element on this printed circuit board is up to the height of the U-shaped body. It will be possible. In principle, the height of the element mounted on the outer surface of the hybrid integrated circuit device may be any height. Therefore, a hollow portion is provided, and the element can be mounted on the outside through the electrode on the insulating sheet provided here. Therefore, the device having a relatively high mounting density can be mounted on the printed board, and furthermore, the wiring and the element can be mounted under the device on the printed board side.

Secondly, the metal substrate to which the flexible insulating sheet is attached is bent in a U-shape with the mounting surface of the element facing outward, at positions which are inside at equal intervals from the opposite sides. In addition to the above-described first action, even if the bent portion of the metal substrate is broken, the three surfaces can be maintained as one body. Further, even if the conductive means extends from one surface to the other surface through this bending,
If this conductive means is provided on the flexible sheet, disconnection of the circuit can be prevented. Even when it is provided on the outside, if the through-hole pad is provided on this flexible sheet and is formed beforehand as a predetermined circuit, the connection between the through-hole and the wiring becomes unnecessary.

[0011]

EXAMPLE An example of the present invention will be described with reference to FIG. First, 1 is this device, and 2 is a printed circuit board for mounting this device, for example. The device 1 is composed of a metal substrate 3, and a conductive means is provided via an insulating resin layer 4. The conductive means includes wirings 5 forming a circuit, lands 6 for fixing chips, pads 7 for bonding existing at the tips of wirings, lead terminals 9 for fixing external leads 8, and the like. . In FIG. 1, since these are arranged inside and cannot be illustrated, they are illustrated in FIG. 3 used in the manufacturing method described later.

The metal substrate 3 is, for example, Al or C.
u or the like is considered, and alloy metal or the like may be used. But Al
Can form a stable insulating layer on its surface due to its thermal conductivity, light weight, workability, and anodic oxidation. Cu is inferior to Al in terms of price and weight, but is often used because of its superior thermal conductivity. To be done. Here, the Al plate is about 0.5 to 3 mm, and an anodic oxide film of about 10 μm is formed on both surfaces. The insulating resin layer is an adhesive resin such as polyimide or epoxy having a thickness of about several tens of μm to 100 μm, and is used for thermocompression-bonding the Cu conductive paths of about several tens of μm to 100 μm by hot pressing or the like. It also serves to maintain the insulation between the substrate and the conductive path.

The conductive path formed on the metal substrate 3 has a semiconductor element 1 such as a transistor chip or an IC chip.
Passive elements such as 0, chip resistor 11, chip capacitor, and printing resistor are fixed to form a predetermined circuit. Further, where crossover is required, a thin metal wire 12 is used for electrical connection between an electrode on the surface of the semiconductor element and a predetermined conductive path, and the external lead 8 is soldered to the lead terminal 9. Fixed through. Again, this cannot be disclosed in FIG. 1, so it will be described in FIG.

Further, as is apparent from the drawing, the board 3 is bent in a U-shape, and the board 3 is mounted on the printed board in a π structure. That is, in FIG. 1, the substrate 3 is composed of three surfaces, that is, the left side surface 13, the right side surface 14, and the upper surface 15 connecting these. The point of the present invention lies in this π structure. That is, by adopting a π structure that is bent in a U-shape having a height corresponding to the height of the left and right side surfaces, the wiring and height on the printed circuit board inside the device can be increased in the direction shown by the arrow in FIG. It may pass through a certain element, and the height of the element on the printed circuit board can be up to the height of the π structure.

The holes P ..., P ... Formed in two rows on the printed circuit board 2 side are through holes into which the external leads 8 are inserted, and as described above, between the through holes. Chip capacitors and elements are arranged. Further, the substrate 3 may be mounted with an element outside the π structure. Since it is formed of a metal substrate here, it is difficult to make contact between the element mounted on the outside and the element on the inside by a through hole, but a cutout portion 16 is provided, and a through hole that can be attached at least around this area. By attaching the insulating sheet 18 provided with the pad and electrically connecting the pad and the wiring 5 on the substrate, a socket for mounting the IC on the outside or the IC can be mounted on the outside. .
FIG. 3 shows the mounting surface, and shows the relationship between the insulating sheet 18 and the conductive means attached to the substrate, and it is necessary to connect them with solder, anisotropic conductive resin, thin metal wires, or the like. You will see that. Although not shown here, they are electrically connected by a thin metal wire.

Therefore, this device, which can use both sides of the three side surfaces 13, 14, and 15, can be mounted on a printed circuit board in a relatively high packing density, and the printed circuit board side is wired under the device. A high-height element can be mounted. Therefore, there is flexibility in the wiring on the printed circuit board 2 side and the arrangement of the mounted elements, and the printed circuit board including the mounted elements can be easily designed. Further, since a device having a height cannot be mounted on the substrate for the hybrid IC shown in FIG. 7 which is a conventional example, it has been mounted on the printed circuit board side. However, according to the present invention, it can be mounted on the metal substrate side. The size of the substrate can be reduced.

In FIG. 1, the conductive paths are attached on the insulating resin layer, but as another embodiment, a flexible insulating sheet is attached on the metal substrate 3 via an insulating adhesive. It may be. It can be considered that the insulating resin layer 4 corresponds to this when viewed in FIG. Here, the conductive paths may be patterned in advance on the sheet, or may be patterned after the metal foil is adhered to the substrate.

The present invention has a second feature that it can be bent in a U-shape by using a metal substrate, but on the other hand, cracks are formed at the time of bending and finally cracks are formed along the line L. The surfaces 13, 14, and 15 are individually separated, and the conductive paths may be broken accordingly. However, since the flexible insulating sheet 30 is attached, the conductive paths on the flexible sheet are not broken. It can be prevented.

Although the metal substrate is attached to the entire surface here, it may be attached only to the bent portion and its vicinity as shown in FIG. In this case, the faces 13, 14, 1
Reference numeral 5 constitutes a circuit with a conductive path adhered to the insulating resin layer on the substantially metal substrate, and for connecting the circuit between the surfaces 13, 14 and 15, the conductive path on the partially attached flexible sheet. Can be utilized.

As a third feature, slits 31 and 32 may be formed as shown by solid lines and dotted lines in FIGS. 2 and 3, and the metal substrate may be bent through the slits. This slit realizes the ease of bending the metal substrate 3 and protects the flexible insulating sheet 30. When the flexible insulating sheet is attached to the metal substrate via the adhesive without the slit and is bent, the insulating sheet at the bent portion is also distorted by the metal substrate and the adhesive, but the slit is provided. If you have
This distortion can be eliminated. Also, due to the slit,
The wiring electrically connected to the external leads 8 is not provided directly on the metal substrate, but is provided on the flexible sheet.

Next, the manufacturing method will be briefly described. First, as shown in FIG. 2, a metal substrate 3 is prepared, and the cutout portion 1
6, slits 31 and 32 are formed. This may have the surface anodized as described above. Subsequently, as shown in FIG. 3, a conductive means is thermocompression-bonded onto the insulating resin layer 4, and the insulating sheet 1 is surrounded by the cutout portion 16 and the slit 31.
8 are pasted together. Naturally, the conductive means on the insulating sheet cannot be integrated with the wiring on the metal substrate, so that the conductive means is terminated halfway. On the other hand, FIG. 4 shows another embodiment of FIG.
The flexible insulating sheet 30 is attached to the entire surface with an adhesive. Here, the sheet 30 has a Cu foil formed on the entire surface. Then, the copper foil is etched by a predetermined photolithography process to form a conductive path having a predetermined pattern. Of course, since the flexible sheet is formed on the entire surface, its conductive means is not terminated midway like the insulating sheet of FIG. Therefore, those that are terminated need to be connected by metal wires or the like, but those that have the flexible sheet on the entire surface are not necessary.

Subsequently, as shown in FIG. 5, the semiconductor chip 10
Solder or Ag paste is applied to the fixing area such as by using screen printing to fix these chips. The external leads 8 are also fixed by the same method. Naturally, the slits and the cutout portions 16 are not visible on the flexible sheet, and are therefore shown by dotted lines. Then, as shown by the arrow in FIG. 5, there is a step of bending the metal substrate 3 into a U-shape through the slit. This bent device is mounted as it is on the printed circuit board 2 in a π structure as shown in FIG.

[0023]

As is apparent from the above description, the first
In addition, by bending the metal substrate in a U-shape, it is possible to mount high-level elements on the left side surface, the right side surface, and the upper surface of the hybrid integrated circuit device, and to correspond to the mounting area of the device. A tall element can be mounted on the printed circuit board, and by providing a cutout portion, a tall element can be mounted on the outside. Therefore, it is possible to design the printed circuit board other than the mounting portion of the hybrid integrated circuit without circumventing the high-height elements, which facilitates the design of the printed circuit board including this device. Furthermore, the left side,
Since the right side surface and the upper surface are made of a metal substrate, noises from the outside can be prevented from infiltrating into the circuit inside the device and the circuit of the printed board corresponding thereto, and can serve as a shield.

Secondly, by providing the flexible insulating sheet at least on the bent portion or on the entire surface, it is possible to prevent circuit breakage due to cracks generated when the metal substrate is bent in a U-shape, and to cut out the cutout portion. By providing the flexible insulating sheet with contact means such as through-hole pads, a device having a height can be provided outside without providing additional connecting means as shown in FIG.

Further, by providing the slits at the portions corresponding to the bent portions, it is possible to easily bend the substrate itself in a U-shape, and at the same time, it is possible to remove the strain applied to the flexible insulating sheet.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a hybrid integrated circuit device of the present invention.

FIG. 2 is a diagram illustrating a method of manufacturing the hybrid integrated circuit device of the present invention.

FIG. 3 is a diagram illustrating a method of manufacturing the hybrid integrated circuit device of the present invention.

FIG. 4 is a diagram illustrating a method of manufacturing the hybrid integrated circuit device of the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing the hybrid integrated circuit device of the present invention.

FIG. 6 is a diagram illustrating a conventional hybrid integrated circuit device.

Claims (2)

[Claims] 1. A foldable metal substrate, an insulating layer provided on each of the metal substrates, conductive means such as wiring, land, and pad provided on the insulating layer, and the conductive means and the electrical means. Is a hybrid integrated circuit device having at least a passive element and / or an active element connected to each other to achieve a predetermined circuit, wherein the metal substrate has a substantially rectangular shape, Each of them is placed at an equal interval inside, and is bent in a U shape with the mounting surface of the element inside, and in order to mount another element on the outside of the mounting surface, a cutout portion is provided on the board corresponding to the mounting surface. An insulating sheet provided with a conductive means is attached to the hollowed-out portion and its periphery, and the conductive means and the element mounted on the outside are electrically connected to each other, including the mounting element on the inside. Given times Hybrid integrated circuit device, characterized in that a. 2. A foldable metal substrate, a flexible insulating sheet adhered to each of the metal substrates via an insulating adhesive, and wirings, lands, pads, etc. provided on the flexible insulating sheet. And a passive element and / or an active element electrically connected to the conductive means to achieve a predetermined circuit, wherein the metal substrate has a substantially rectangular shape. The mounting surface of the device is bent into a U shape with the mounting surface of the device facing inward, and the mounting surface of the device is mounted outside the mounting surface. The corresponding substrate is provided with a hollow portion, and the electrode of the flexible insulating sheet provided in this region and the electrode of the element provided outside are electrically connected. Integrated circuit device.