JPH06824Y2 - Hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to improvement of packaging of a hybrid integrated circuit which is composed of two metal substrates and is suitable for high density integration.

(B) Conventional technology As shown in FIG. 4, a conventional bent board using an insulating film is an insulating film (13) that connects two metal boards (11) and (12) and the boards (11) and (12). ) And a conductive path provided on the film (13)
(14) and a plurality of circuit elements such as a semiconductor integrated circuit fixed on the conductive path (14), a chip resistor or a chip capacitor
(15) and are provided.

The metal substrates (11) and (12) are made of 0.5 to 1.0 mm thick aluminum with good thermal conductivity, and the substrates (11) and (12) are separated by an adhesive such as an epoxy resin only by their respective thicknesses. Connection with an insulating film (13) such as polyimide. Insulating film (13)
Adhere a copper foil to be the conductive path (14) on the opposite main surface,
The copper foil is selectively etched to form a conductive path (14) having a desired shape. As is clear from FIG. 5, the conductive path (14) is provided with pads (17) for soldering the external leads (16) at the end of one substrate (12), and the conductive path (14) is extended from the pad (17). ) On the insulating film (13). Conductive path for fixing circuit element (15)
The part of (14) is designed so as to be located on both boards (11) and (12), and the circuit elements are bent at the separated parts of the boards (11) and (12) for bending.
(15) is not provided.

After assembling the circuit element (15), the insulating film (13) is bent at the space between the substrates (11) and (12), and as shown in FIG.
1) The opposite main surfaces of (12) are just brought into contact with each other, and the whole is molded with the resin (18) except the external leads (16).

The above-mentioned technique is described in Japanese Patent Publication No. 60-11809.

As shown in FIG. 7, a hybrid integrated circuit consisting of two substrates is a hybrid integrated circuit substrate having two circuit elements (20) fixedly attached thereto.
(21) After inserting (21) into the frame-shaped case material (22) and fixing it,
The two hybrid integrated circuit boards (21) and (21) are conducted by the leads (23), and the resin (2) is provided between the boards (21) and (21) and the case material (22).
4) Fill and integrate.

Such a hybrid integrated circuit is described in Japanese Utility Model Publication No. 55-8316.

(C) Problems to be Solved by the Invention However, the conventional hybrid integrated circuit has various problems.

First, the bent board shown in FIG. 4 is originally intended for a miniaturized hybrid integrated circuit, and is not suitable for mounting a circuit element that generates heat because the metal board serving as a heat sink is in close contact. Therefore, there is a problem that a high output type hybrid integrated circuit cannot be provided.

The hybrid integrated circuit shown in FIG. 7 has a structure in which the metal substrate is exposed on the surface, and the above-mentioned problems can be solved.
However, there is a problem in that workability and reliability are deteriorated because the continuity of the two substrates is soldered by the leads.

(D) Means for Solving Problems The present invention has been made in view of the above problems,
As shown in Fig. 1, two metal substrates with insulating film (2)
(1) Separately couple (1) and bend the insulating film (2) between the two metal substrates (1) and (1) to which the circuit element (5) is fixed, and the circuit element (5) faces Arranged so that two metal plates (1)
A frame (3) is provided so that (1) is separated from the insulating film.
Metal board (1) on the side where the (2) is bent (1)
Fix and solve.

(E) Function According to the present invention, the circuit elements provided on two metal substrates are bent and arranged so as to face each other, and the lid body is fixed to the terminal side surface of the metal substrate to expose the metal substrate surface. In addition, the periphery of the metal substrate is covered with the frame and the lid to protect the circuit element.

(F) Embodiment The present invention will be described in detail below based on the embodiment shown in FIG.

As shown in FIG. 1, the hybrid integrated circuit of the present invention includes two metal substrates (1) and (1), an insulating film (2) for separating and coupling the metal substrates (1) and (1), and a metal substrate (1). ) (3) with a frame (1) spaced apart,
It is composed of a metal substrate (1) and a lid body (7) fixed to the terminal side surface of the terminal.

The two metal substrates (1) and (1) are formed of aluminum having good thermal conductivity, and an aluminum oxide film is formed on the surface thereof by anodic oxidation. The metal substrates (1) and (1) are arranged at a predetermined distance, and an insulating film (2) made of polyimide resin or the like is attached on the surface of the two metal substrates (1) and (1) to bond them. Be worn.

The insulating film (2) is pre-integrated with a copper foil for forming the conductive path (4) .As described above, the copper foil is attached to the entire surface of the two metal substrates (1) and (1) to insulate it. The copper foil on the film (2) is selectively etched to form desired conductive paths (4).

At this time, the conductive path (4) is formed so as to extend over the metal substrate (1) (1), and a plurality of circuit elements such as power semiconductor elements, chip resistors or chip capacitors are formed on the conductive path (4).
(5) is fixed, and the external leads (6) are fixed to the pads formed on the peripheral ends of the metal substrates (1) and (1).

The frame (3) is made of insulating resin, etc., and has two metal substrates (1)
Any shape may be used as long as (1) is spaced apart. In this embodiment, the shape is as shown in FIG. As is clear from FIG. 2, the frame body (3) has a sealing portion (8) for sealing the circuit element (5) fixed on the metal substrate (1) (1), and the metal substrate (1) (1). ) And a guide part (9) surrounding the external lead (6) provided at the peripheral end part of (1), and a step part for accommodating the metal substrates (1), (1) is provided. Further, the frame body (3) is provided with a protruding portion (10) for fitting with the cutout portion (10 ') of the lid body (7). An adhesive sheet is provided on the stepped portion of the frame body (3), the insulating film (2) is bent so as to sandwich the frame body (3), and the metal substrate (1) ( Place 1) and place the metal substrate (1) (1) as a frame
Stick to (3). At this time, the bent insulating film (2) has a shape protruding from the frame body (3), and the lid body (7) is attached to the side surface of the metal substrate (1) (1) to protect the insulating film (2). Stick to it.

The lid (7) is made of insulating resin, its shape is plate-like, and its length is the same as the length of the frame (3), and its width is the insulating film (2) at the bent portion. The width corresponding to the protruding width of the
The cross section is formed in a concave shape so as to accommodate (2), and the frame body (3)
A notch (10 ') that fits with the protrusion (10) is provided. The notch (10 ') and the protrusion (10) make the lid (7)
It is possible to prevent the positional deviation when the metal plate (1) is fixed to the terminal side surface of the substrate (1). An adhesive sheet is arranged on the frame body (3) which is in contact with the lid body (7) and on the terminal side surface of the metal substrate (1) (1), and the lid body (7) is fixed.

In this way, the circuit element (5) can be completely shielded from the outside by fixing and integrating the lid body (7) on the side surface of the metal substrate (1) (1).

(G) Effect of the Invention As described in detail above, according to the present invention, the circuit elements provided on the two metal substrates are arranged so as to face each other using the frame body, and the metal substrate on the insulating film side is arranged. By fixing the lid to the end side surface, the surface of the metal substrate can be exposed, so that the heat dissipation effect is improved and the circuit element having heat generation can be fixed.

Further, in the present invention, since the lid is completely sealed, the appearance is good, the handling is good, and the workability is improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.
-I sectional view, FIG. 2 is a side view of this embodiment, and FIG.
FIG. 4 is a plan view and FIGS. 4 to 7 are views showing a conventional example. (1) ... metal substrate, (2) ... insulating film, (3) ... frame, (4) ...
Conductive path, (5) ... Circuit element, (6) ... External lead, (7) ... Lid, (8) ... Sealing space, (9) ... Lead space, (10) ... Projection,
(10 ')… Notch.

Claims (1)

[Scope of utility model registration request] 1. A two-metal substrate, an insulating film that separates and couples the two metal substrates, a conductive path of a desired shape provided on the film, and a plurality of fixed conductive paths on the conductive path. A circuit element, a frame body for bending the insulating film between the metal substrates and arranging the circuit elements so as to face each other, and arranging the metal substrates at a constant distance, and fixing the frame body to a terminal side surface of the metal substrate. A hybrid integrated circuit, comprising: