JPS6331409Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit, and particularly to the structure of a hybrid integrated circuit in which a pair of circuit boards are used to form one airtight space.

Conventionally, a plurality of circuit elements are formed and mounted on one surface of an insulating substrate, a plurality of lead terminals are attached to the edge of the substrate, and the main circuit area is housed using the substrate. The hybrid integrated circuits that make up the hermetic space are of the DIP (dual inline package) type and the SIP (single inline package) type.
There is a package (package) type.

FIG. 1 is a perspective view of a DIP type hybrid integrated circuit, FIG. 2 is a schematic side sectional view thereof, and FIG. 3 is a schematic side sectional view of a SIP type hybrid integrated circuit.

1 and 2, a conventional DIP type hybrid integrated circuit 1 includes a substrate 2 made of ceramics,
A board comprising a plurality of circuit elements 3, a cover 4 made of ceramics, and a plurality of five lead terminals attached to the left and right opposing ends of the board 2, on which the elements 3 are formed and mounted. The main circuit area above 2 is an airtight space 6 formed by the board 2 and the cover 4.
is stored in.

In Figure 3, a conventional SIP type hybrid integrated circuit 1
1 is formed of a substrate 12 made of ceramics, a plurality of circuit elements 13, a cover 14 made of ceramics, a plurality of lead terminals 15 attached to one end of the substrate 12, etc. The main circuit area on the substrate 12 on which the elements 13 are formed and mounted is housed in an airtight space 16 formed by the substrate 12 and the cover 14.

In this way, hybrid integrated circuits with conventional configurations are
The circuit board and cover correspond one-to-one to form an airtight space in the main circuit area, and while the integration density of the circuit is addressed by miniaturizing each circuit element and improving mounting technology, the circuit is printed. The density of mounting on boards has been addressed by downsizing circuit boards and covers. However, the above solution has technical difficulties and limitations including the manufacturing equipment, and the limits have now been reached.

The purpose of the present invention is to provide a hybrid integrated circuit structure that overcomes the above-mentioned limitations.The purpose of this invention is to provide a hybrid integrated circuit structure in which a pair of insulating frames made of ceramics or the like are stacked and the joints with the frame are hermetically sealed. The main circuit areas formed on one side of each board face each other within the enclosure of the frame, and a plurality of lead terminals are attached to the ends of the board extending outward from the frame. , 1 connected to the ends of each of the pair of substrates.
This is achieved by a hybrid integrated circuit characterized by integrally forming a pair of sandwiched insertion parts.

The present invention will be explained below with reference to the drawings.

FIG. 4 is a schematic side sectional view of a hybrid integrated circuit according to an embodiment of the present invention, FIG. 5 is a perspective view of an insulating frame used in the hybrid integrated circuit, and FIG. 6 is a schematic side sectional view of a hybrid integrated circuit according to an embodiment of the present invention. FIG. 3 is an enlarged perspective view of a portion of the lead terminal.

In FIG. 4, a pair of ceramic substrates 52 and 53 and a pair of ceramic substrates 52 and 5 are connected to a hybrid integrated circuit 51.
3, a ceramic frame 26, and a plurality of lead terminals 56 commonly attached to opposing extended ends of substrates 52 and 53.

The fifth substrates 52 and 53 are made of ceramics.
Boards 5 are stacked with square frames 26 in between as shown in the figure, each connection surface of which is hermetically sealed with an epoxy resin adhesive, etc., and circuit elements 54 or 55 are formed and mounted thereon.
The main circuit areas 2 and 53 are arranged to face each other inside an airtight space 57 formed by the substrates 52 and 53 and the frame 26.

On the other hand, each lead terminal 56 is as shown in FIG.
A fork-shaped clamping part 56' for attaching to the end of the board 52 and a fork-shaped clamping part 56'' for attaching to the end of the board 53 are integrally formed by cutting and bending processing means. That is, the hybrid integrated circuit 51 in which each lead terminal 56 protrudes in the same direction is obtained by integrating two hybrid integrated circuits 1 of the conventional configuration shown in FIG. It is a DIP type configuration with electrical common connections via.

Although the frame made of ceramics is used in the above embodiment, the frame may be made of insulating plastic or the like.
Furthermore, in order to improve the cooling performance of the hybrid integrated circuit according to the present invention, a heat sink or a heat sink may be bonded to the back surface of one or the other side of the circuit board.

As explained above, according to the present invention, a hybrid integrated circuit comprising a pair of circuit boards, an insulating frame, and lead terminals for interconnecting the circuits of the pair of circuit boards, unlike the conventional two integrated circuits, is constructed. The space required to mount the circuit on a printer board, etc., is approximately equal to that of one hybrid integrated circuit in the conventional configuration.
This has the practical effect of realizing a hybrid integrated circuit that has high density in terms of storage and requires small mounting space. In particular, conventional integrated circuits that have become large and include bare chips that cannot be mounted on both sides of a circuit board can now be divided into two circuit boards facing each other without changing the circuits, making it possible to create a compact circuit. In addition to the structure, the effect that the mounting space is small is extremely large.

[Brief explanation of drawings]

Figure 1 is a perspective view of a DIP type hybrid integrated circuit with a conventional configuration, Figure 2 is a schematic side sectional view of the DIP type hybrid integrated circuit, and Figure 3 is a schematic side sectional view of a SIP type hybrid integrated circuit with a conventional configuration. 4 is a schematic side sectional view of a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 5 is a perspective view of an insulating frame used in the hybrid integrated circuit.
FIG. 6 is an enlarged perspective view of a portion of the lead terminal used in the hybrid integrated circuit. In the figure, 1, 11, 51 are hybrid integrated circuits, 2, 12, 52, 53 are circuit boards, 3, 1
3, 54, 55 are circuit elements, 5, 15, 56 are lead terminals, 6, 57 are airtight spaces, 26 is a frame body,
Reference numerals 56' and 56'' indicate fork-shaped insertion portions of the lead terminals 56.

Claims (1)

[Scope of utility model registration request] In a hybrid integrated circuit in which a main circuit area in which a plurality of circuit elements are formed and mounted on a substrate is housed in an airtight space, and a plurality of lead terminals are attached to the ends of the substrate, ceramic A pair of substrates are stacked with an insulating frame made of materials such as the like and hermetically sealed at each junction with the frame, and the main circuit areas formed on one side of each substrate face each other within the framework of the frame. and a plurality of lead terminals attached to the ends of the substrates extending outward from the frame integrally connect a pair of clamping portions connected to the ends of each of the pair of substrates. A hybrid integrated circuit characterized by being formed by forming.