JPH0680891B2 - Flexible printed circuit connection method - Google Patents
Flexible printed circuit connection methodInfo
- Publication number
- JPH0680891B2 JPH0680891B2 JP60165791A JP16579185A JPH0680891B2 JP H0680891 B2 JPH0680891 B2 JP H0680891B2 JP 60165791 A JP60165791 A JP 60165791A JP 16579185 A JP16579185 A JP 16579185A JP H0680891 B2 JPH0680891 B2 JP H0680891B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- substrate
- lead pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明はフレキシブルプリント回路（以下FPCという）
を熱膨張係数の異なる基板に接続するのに好適なFPCの
接続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Application of the Invention The present invention is a flexible printed circuit (hereinafter referred to as FPC).
The present invention relates to an FPC connecting method suitable for connecting substrates to substrates having different thermal expansion coefficients.
従来、FPCを熱膨張係数の異なる基板に半田で接続する
場合には、たとえば第２図に示す如きものが実施されて
いる。すなわち、同図において、１はFPCにして、耐熱
樹脂フイルム２上に銅箔と、その上に半田メッキしたリ
ードパターン３を形成している。４は基板にして、上記
耐熱樹脂フイルム２と熱膨張係数の異なるたとえばセラ
ミックのように硬質からなる基板５上に銅箔とその上に
半田メッキしたリードパター６を形成している。而して
上記FPC1と基板４とを半田で接続する場合には、FPC1の
リードパターン３を基板４のリードパターン６とを位置
合せしたのち、耐熱樹脂フイルム２上から棒状の半田ゴ
テ（図示せず）を押し当てることにより両リードパター
ンの半田メッキを溶融して接続している。しかるに上記
の構成では、耐熱樹脂フイルム２は半田ゴテにより熱せ
られて膨張し、冷却過程で収縮するので、常温状態では
同図に示す矢印方向に熱応力が作動し、且つFPC1と基板
４との半田接続部の周囲温度が変化すると、熱応力が重
量して加わるため、熱応力により半田接続部が剥離する
ことがある。Conventionally, when connecting an FPC to a substrate having a different thermal expansion coefficient by soldering, for example, the one shown in FIG. 2 has been implemented. That is, in the figure, reference numeral 1 is an FPC, and a copper foil is formed on a heat-resistant resin film 2 and a lead pattern 3 solder-plated thereon is formed. A substrate 4 is formed by forming a copper foil and a solder-plated lead putter 6 on a substrate 5 made of a hard material such as ceramic, which has a different thermal expansion coefficient from the heat resistant resin film 2. When connecting the FPC1 and the substrate 4 with solder, after aligning the lead pattern 3 of the FPC1 with the lead pattern 6 of the substrate 4, a rod-shaped soldering iron (not shown) is placed on the heat-resistant resin film 2. No.) is pressed to melt and connect the solder plating of both lead patterns. However, in the above structure, the heat-resistant resin film 2 is heated by the soldering iron and expands, and contracts in the cooling process. Therefore, at normal temperature, thermal stress acts in the direction of the arrow shown in FIG. When the ambient temperature of the solder connection portion changes, thermal stress is added to the weight, and the solder connection portion may be peeled off due to the thermal stress.
そこで、上記の対策として従来はたとえば特公昭52-954
2号公報に記載されているように、FPCにスリットを切り
込み、これによって熱応力の発生させる方法が提案され
ている。しかるに上記の方法では、セラミック基板のよ
うにFPCに対して熱膨張係数差および温度変化の大きい
基板の場合には、上記スリットを切り込んだのみでは不
十分である。Therefore, as a countermeasure against the above, for example, Japanese Patent Publication No.
As described in Japanese Unexamined Patent Publication No. 2 (1994), a method has been proposed in which a slit is cut in an FPC to generate thermal stress. However, in the above method, in the case of a substrate such as a ceramic substrate which has a large difference in thermal expansion coefficient and a large temperature change with respect to FPC, it is not sufficient to cut the slit.
本発明は前記従来の問題点を解決しFPCを熱膨張係数の
異なる基板に接続する場合、半田接続部に発生する熱応
力を低減することができ、さらにFPC半田接続部の寿命
を考えた場合、装置動作中の周囲環境の温度差及び装置
のON-OFF時における温度差による熱応力も低減でき、温
度サイクルに対して信頼度の高いFPCの接続方法を提供
することにある。The present invention solves the above conventional problems, when connecting the FPC to a substrate having a different coefficient of thermal expansion, it is possible to reduce the thermal stress generated in the solder joint, further considering the life of the FPC solder joint Another object of the present invention is to provide a method of connecting an FPC that can reduce the thermal stress due to the temperature difference of the ambient environment during the operation of the device and the temperature difference at the time of turning the device on and off, and has high reliability with respect to the temperature cycle.
本発明は前記の目的を達成するため、FPCを熱膨張係数
の異なる基板に半田接続する方法において、FPCのリー
ドパターン中、基板との接続部をそれ以外よりも幅を広
くして接続面積を大きくし、かつ接続部以外のリードパ
ターンの幅を狭くしてFPCの剛性力を弱くし、かつリー
ドパターンが密で剛性力の強い部分を接続部から遠ざけ
て配置し、これによって接続部の熱応力を低減させるこ
とを特徴とするものである。The present invention, in order to achieve the above-mentioned object, in a method of soldering FPC to a substrate having a different thermal expansion coefficient, in the lead pattern of the FPC, the connecting portion with the substrate has a wider connection area than that of the other, and a connection area The FPC rigidity is weakened by increasing the width and narrowing the width of the lead pattern other than the connection part, and the part with dense lead pattern and high rigidity is placed away from the connection part. It is characterized by reducing stress.
以下本発明の実施例を示す第１図について説明する。同
図に示す如く、FPC1の耐熱樹脂フイルム２上に形成され
た銅箔のリードパターン７のうち、基板（図示せず）と
の半田接続部８のパターン幅W1を広く形成し、この半田
接続部８の延長軸線上に配置されたリードパターン９の
幅W2を狭く形成すなわち銅箔を少なくして剛性力を弱く
し、銅箔を多くして剛性力の強い部分を基板との接続部
分より遠ざけて配置している。An embodiment of the present invention will be described below with reference to FIG. As shown in the figure, in the copper foil lead pattern 7 formed on the heat-resistant resin film 2 of the FPC 1 , the pattern width W 1 of the solder connection portion 8 with the substrate (not shown) is widened, and this solder is used. The width W 2 of the lead pattern 9 arranged on the extension axis of the connecting portion 8 is formed to be narrow, that is, the copper foil is reduced to weaken the rigidity, and the copper foil is increased to connect the portion having high rigidity to the substrate. It is placed away from the part.
したがって本発明においては、FPC1のリードパターン７
のうち半田接続部分８の接触面積を大きくしているの
で、熱応力を低減することができる。またFPC1の剛性の
強い部分と基板との熱膨張係数の差および剛性力によっ
て発生する熱応力歪をFPC1の剛性力の弱い部分で変形、
吸収させ、その結果としてFPC1と基板との半田接続部に
加わる荷重を低減することができる。Therefore, in the present invention, the lead pattern 7 of FPC1 is used.
Of these, since the contact area of the solder connection portion 8 is large, thermal stress can be reduced. In addition, the thermal stress strain generated by the difference in thermal expansion coefficient between the FPC1 strong part and the substrate and the rigidity force is deformed in the weak part of the FPC1.
It can be absorbed, and as a result, the load applied to the solder connection portion between the FPC 1 and the substrate can be reduced.
本発明は以上述べたる如くであるから、FPCを熱膨張係
数の異なる基板と半田接続する場合に発生する熱応力を
低減させることができ、これによって信頼度を向上する
ことができる効果を有する。Since the present invention is as described above, it is possible to reduce the thermal stress generated when the FPC is solder-connected to the substrate having a different thermal expansion coefficient, which has the effect of improving the reliability.
第１図は本発明の実施例を示すFPCのリードパターンの
平面図、第２図は本発明が適用されるFPCと基板との接
続部を示す断面図である。 １…フレキシブルプリント回路（FPC）、２…耐熱樹脂
フイルム、３、７…FPC用リードパターン、４、５…基
板、６…基板用リードパターン、８…半田接続部。FIG. 1 is a plan view of a lead pattern of an FPC showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a connecting portion between an FPC and a substrate to which the present invention is applied. 1 ... Flexible printed circuit (FPC), 2 ... Heat resistant resin film, 3, 7 ... FPC lead pattern, 4, 5 ... Board, 6 ... Board lead pattern, 8 ... Solder connection part.
Claims (1)
フレキシブルプリント回路のリードパターンを、該フレ
キシブルプリント基板と熱膨張係数を異にする基板上に
形成されたリードパターンに接続するフレキシブルプリ
ント回路の接続方法において、上記フレキシブルプリン
ト基板上のフレキシブルプリント回路が、パターン幅が
広く接続面積が大きく形成され、上記熱膨張係数を異に
する基板のリードパターンに半田接続される基板接続部
と、パターンが密に形成された剛性の強い部分のリード
パターン部と、パターン幅が該基板接続部のパターン幅
より狭く形成され、上記基板接続部と剛性の強い部分と
を接続する剛性の弱い部分のリードパターン部とから構
成され、上記剛性の強い部分のリードパターン部を上記
基板接続部より遠ざけて配置し、該基板接続部の熱応力
を低減させることを特徴とするフレキシブルプリント回
路の接続方法。1. A method of connecting a flexible printed circuit, wherein a lead pattern of a flexible printed circuit formed on a flexible printed circuit board is connected to a lead pattern formed on a substrate having a coefficient of thermal expansion different from that of the flexible printed circuit board. In the flexible printed circuit on the flexible printed circuit board, the pattern width is wide and the connection area is formed to be large, and the pattern is densely formed with the board connecting portion solder-connected to the lead pattern of the board having the different thermal expansion coefficient. A lead pattern portion of a formed portion having a high rigidity, and a lead pattern portion of a portion having a low rigidity, which has a pattern width narrower than the pattern width of the substrate connecting portion and connects the substrate connecting portion and the portion having a high rigidity. The lead pattern part of the high rigidity part is farther from the board connecting part. Only by arranging the connection method of a flexible printed circuit, characterized in that to reduce the thermal stress of the substrate connection portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60165791A JPH0680891B2 (en) | 1985-07-29 | 1985-07-29 | Flexible printed circuit connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60165791A JPH0680891B2 (en) | 1985-07-29 | 1985-07-29 | Flexible printed circuit connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226894A JPS6226894A (en) | 1987-02-04 |
| JPH0680891B2 true JPH0680891B2 (en) | 1994-10-12 |
Family
ID=15819060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60165791A Expired - Lifetime JPH0680891B2 (en) | 1985-07-29 | 1985-07-29 | Flexible printed circuit connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680891B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08303376A (en) * | 1995-04-11 | 1996-11-19 | Lg Electronics Inc | Vane side-face discharger for rotary compressor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104342B2 (en) * | 1988-04-01 | 1994-12-21 | 三菱化成株式会社 | Manufacturing method of anti-slip synthetic resin moldings |
| JP6274130B2 (en) * | 2015-02-27 | 2018-02-07 | 株式会社Ｊｖｃケンウッド | Reflective liquid crystal panel device and reflective liquid crystal panel device body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950464U (en) * | 1983-08-05 | 1984-04-03 | シャープ株式会社 | Board connection structure |
-
1985
- 1985-07-29 JP JP60165791A patent/JPH0680891B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08303376A (en) * | 1995-04-11 | 1996-11-19 | Lg Electronics Inc | Vane side-face discharger for rotary compressor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226894A (en) | 1987-02-04 |
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