JPH01319993A - Connecting method for printed circuit board - Google Patents
Connecting method for printed circuit boardInfo
- Publication number
- JPH01319993A JPH01319993A JP15214788A JP15214788A JPH01319993A JP H01319993 A JPH01319993 A JP H01319993A JP 15214788 A JP15214788 A JP 15214788A JP 15214788 A JP15214788 A JP 15214788A JP H01319993 A JPH01319993 A JP H01319993A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- solder
- circuit board
- terminal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 36
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半田付けによるプリント回路基板の接続方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for connecting printed circuit boards by soldering.
二枚のプリント回路基板を接続する方法として、両プリ
ント回路基板の端子部を重ね合わせて半田付けする方法
が公知である。その−例を図−５および図−６に示す。As a method for connecting two printed circuit boards, a method is known in which the terminal portions of both printed circuit boards are overlapped and soldered. Examples are shown in Figures 5 and 6.
１はガラスエポキシ基板のような剛性のある絶縁基板２
に所要パターンの回路導体（銅箔）３を形成したリジッ
ドプリント回路基板、４は可撓性のある絶縁フィルム５
に所要パターンの回路導体（ｗ４箔）６を形成したフレ
キシブルプリント回路基板である。両回路基板１・４と
も端子部３ａ・６ａを除く部分にソルダーレジスト７・
８が塗布されている。接続は、両回路基板１の端子部３
ａ・６ａを半田９を介して重ね合わせ、フレキシブルプ
リント回路基板４側から熱を加えて半田９を溶融させ、
端子部３ａ・６ａを半田付けするという方法で行われる
。1 is a rigid insulating substrate 2 such as a glass epoxy substrate
A rigid printed circuit board on which a circuit conductor (copper foil) 3 of a required pattern is formed, 4 is a flexible insulating film 5
This is a flexible printed circuit board on which a circuit conductor (W4 foil) 6 of a required pattern is formed. Solder resists 7 and 7 are applied to both circuit boards 1 and 4 except for the terminal parts 3a and 6a.
8 is applied. The connection is made through the terminal section 3 of both circuit boards 1.
a and 6a are stacked together via solder 9, and heat is applied from the flexible printed circuit board 4 side to melt the solder 9.
This is done by soldering the terminal parts 3a and 6a.
しかしこのような接続方法では、絶縁フィルムを介して
半田を加熱することになるため、伝熱性が悪く、半田付
けに時間がかかるだけでなく、半田の溶融が不十分にな
り十分な接合強度が得られない場合が出てくる。また半
田付は部が両回路基板の間に入ってしまうため、半田付
は部の検査が行い難く、信頬性の点でも問題がある。However, in this connection method, the solder is heated through the insulating film, which not only has poor heat conductivity and takes time to solder, but also prevents the solder from melting sufficiently, resulting in insufficient joint strength. There will be cases where you won't get it. Furthermore, since the soldering part gets between the two circuit boards, it is difficult to inspect the soldering part, and there is also a problem in terms of reliability.
これを改良するため、絶縁フィルム５としてポリイミド
のようなエツチング可能なフィルムを用い、図−７に示
すように端子部６ａの裏面の絶縁フィルム５をエツチン
グにより除去した上で、半田付けを行う方法もあるが、
この方法は、絶縁フィルムのエツチング除去が面倒であ
ると共に、絶縁フィルムを除去すると端子部が不安定と
なり、接続作業がやりにくいという問題がある。In order to improve this, a method is used in which an etched film such as polyimide is used as the insulating film 5, and the insulating film 5 on the back side of the terminal portion 6a is removed by etching as shown in Figure 7, and then soldering is performed. There are some, but
This method has the problem that it is troublesome to remove the insulating film by etching, and if the insulating film is removed, the terminal portion becomes unstable, making it difficult to perform the connection work.
本発明は、上記のような課題を解決したプリント回路基
板の接続方法を提供するもので、その構成は、二枚のプ
リント回路基板を、その端子部を重ね合わせて半田付け
することにより接続する方法において、一方のプリント
回路基板の端子部にスルーホールを形成し、少なくとも
そのスルーホールを形成した方のプリント回路基板側か
ら加熱して、両プリント回路基板の端子部を半田付けす
ることを特徴とするものである。The present invention provides a method for connecting printed circuit boards that solves the above-mentioned problems, and the structure is such that two printed circuit boards are connected by overlapping their terminal parts and soldering them. The method is characterized in that a through hole is formed in the terminal section of one printed circuit board, and the terminal sections of both printed circuit boards are soldered by heating at least from the side of the printed circuit board in which the through hole is formed. That is.
このようにすると、一方の端子部のスルーホールを通し
て他方の端子部上の半田を直接加熱でき、その熱が金属
内の熱伝導で両端子部に挟まれた半田に伝達されるため
、伝熱効率がよく、半田を迅速、確実に溶融させること
が可能となる。また半田付は後は、スルーホール内の半
田の状況から半田付は部の良否を確認することが可能と
なる。In this way, the solder on the other terminal can be directly heated through the through hole in one terminal, and the heat is transferred to the solder sandwiched between both terminals by thermal conduction within the metal, resulting in improved heat transfer efficiency. This makes it possible to melt the solder quickly and reliably. Furthermore, after soldering, it is possible to check the quality of the soldered part from the state of the solder in the through-hole.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１および図−２は本発明の一実施例を示す。FIG. 1 and FIG. 2 show an embodiment of the present invention.
先に説明した図−５および図−６と同一部分には同一符
号を付しである。接続に際し、リジンドブリント回路基
板１側は、端子部３ａ以外の部分にソルダーレジスト７
を塗布し、端子部３ａに半田９を付着させる点は従来と
同様である。半田９の付着は、クリーム半田塗布後リフ
ロー仕上げ、溶融半田浴への浸漬などにより行うことが
できる。The same parts as in FIGS. 5 and 6 described above are given the same reference numerals. When connecting, solder resist 7 is applied to the parts other than the terminal parts 3a on the resin printed circuit board 1 side.
The steps of applying solder 9 and adhering solder 9 to the terminal portion 3a are the same as in the conventional method. The solder 9 can be attached by reflow finishing after applying cream solder, dipping in a molten solder bath, or the like.
一方、フレキシブルプリント回路基板４側は、端子部６
ａを絶縁フィルム５の両面に形成すると共に、各端子部
６ａにそれぞれスルーホール１０を形成し、そのスルー
ホールｌＯの内面を含めて端子部６ａ全面に半田９を付
着させる。端子部６ａ以外の面にソルダーレジスト８を
塗布する点は従来と同様である。On the other hand, on the flexible printed circuit board 4 side, the terminal portion 6
A is formed on both sides of the insulating film 5, and a through hole 10 is formed in each terminal portion 6a, respectively, and solder 9 is adhered to the entire surface of the terminal portion 6a including the inner surface of the through hole IO. The point that the solder resist 8 is applied to the surface other than the terminal portion 6a is the same as in the conventional case.
この状態で、両回路基板１・４の端子部３ａと６ａを重
ね合わせ、少なくともフレキシブルプリント回路基板４
側から熱を加えると、端子部６ａの外面側の半田９は勿
論、端子部３ａ上の半田９もスルーホール１０を通して
直接加熱されるため、両端子部３ａ・６ａ間に挟まれた
半田９も金属内の熱伝導により効率よく加熱され、十分
溶融することになる。その結果、半田付は後の状態は図
−３のようになる。すなわち端子部３ａ上の半田は、ス
ルーホール１０の内部と端子部６ａの外端部で、端子部
６ａ外面の半田と一体化された状態となり、半田付は部
の強度が極めて大きくなる。In this state, the terminal parts 3a and 6a of both circuit boards 1 and 4 are overlapped, and at least the flexible printed circuit board 4 is
When heat is applied from the side, not only the solder 9 on the outer surface of the terminal section 6a but also the solder 9 on the terminal section 3a is directly heated through the through hole 10, so that the solder 9 sandwiched between both terminal sections 3a and 6a is heated directly. The metal is heated efficiently by heat conduction within the metal, and is sufficiently melted. As a result, the soldered state will be as shown in Figure 3. That is, the solder on the terminal portion 3a is integrated with the solder on the outer surface of the terminal portion 6a inside the through hole 10 and at the outer end of the terminal portion 6a, and the strength of the soldered portion becomes extremely high.
なお図−１に示すようにスルーホール１０を形成する方
の端子部６ａは、他方の端子部３ａより幅を広く形成し
ておくことが望ましい、このようにするとスルーホール
１０の両側の導体幅を確保することが容易になり、かつ
両端子部を重ね合わせたときの位置ズレを吸収すること
ができる。またスルーホールを形成しない方（下側）の
端子部３ａは、スルーホールを形成した方（上側）の端
子部６ａより長く形成しておくことが望ましい。このよ
うにすると上側の端子部６ａの端部から下側の端子部３
ａの基部が露出するため、両端子部の重なり状態の確認
が容易になると共に、図−３に示すように上側の端子部
６ａの端部から下側の端子部３ａにかけても半田９が盛
られるため、接合強度が大きくなる。As shown in Figure 1, it is desirable that the terminal portion 6a forming the through hole 10 is formed wider than the other terminal portion 3a.In this way, the conductor width on both sides of the through hole 10 is It becomes easy to ensure that the position of the terminal is the same, and it is possible to absorb the positional deviation when the two terminal parts are overlapped. Further, it is desirable that the terminal portion 3a on the side (lower side) in which no through holes are formed is longer than the terminal portion 6a on the side (upper side) in which through holes are formed. In this way, from the end of the upper terminal part 6a to the lower terminal part 3
Since the base of a is exposed, it becomes easy to check the overlapping state of both terminal parts, and the solder 9 also spreads from the end of the upper terminal part 6a to the lower terminal part 3a, as shown in Figure 3. This increases the bonding strength.
図−４は本発明の他の実施例を示す。これはフレキシブ
ルプリント回路基板４の端子部６ａが絶縁フィルム５の
片面のみに形成されている場合である。リジンドブリン
ト回路基板ｌ側は前記実施例と同様である。この場合も
、端子部６ａにスルーホールｌＯを形成し、半田９を付
着させた状態で、両端子部３ａ・６ａを重ね合わせて加
熱すれば、良好な半田付けを行うことができる。FIG. 4 shows another embodiment of the present invention. This is the case where the terminal portion 6a of the flexible printed circuit board 4 is formed only on one side of the insulating film 5. The resin printed circuit board l side is the same as in the previous embodiment. In this case as well, good soldering can be achieved by forming a through hole 1O in the terminal portion 6a and attaching the solder 9 to the terminal portions 3a and 6a, and then heating the two terminal portions 3a and 6a together.
なお上記各実施例では一つの端子部に一つのスルーホー
ルを形成したが、一つの端子部に複数個のスルーホール
を形成することも可能である。In each of the above embodiments, one through hole is formed in one terminal portion, but it is also possible to form a plurality of through holes in one terminal portion.
また上記実施例ではリジンドブリント回路基板とフレキ
シブルプリント回路基板を接続する場合を説明したが、
本発明はフレキシブルプリント回路基板同士を接続する
場合にも適用できるものである。Furthermore, in the above embodiment, a case was explained in which a resin printed circuit board and a flexible printed circuit board were connected.
The present invention can also be applied to connecting flexible printed circuit boards.
以上説明したように本発明によれば、一方のプリント回
路基板の端子部にスルーホールを形成した上で両回路基
板の接続を行うようにしたので、スルーホールを通して
他方の端子部上の半田を直接加熱でき、その熱が金属内
の熱伝導で両端子部に挟まれた半田に伝達されるため、
伝熱効率がよく、半田を迅速、確実に熔融させて良好な
半田付けを行うことができる。また半田付は後は、スル
ーホール内の半田の状況から半田付は部の良否を確認す
ることができ、品質保証も確実に行える利点がある。As explained above, according to the present invention, both circuit boards are connected after forming a through hole in the terminal section of one printed circuit board, so that the solder on the terminal section of the other printed circuit board is connected through the through hole. It can be heated directly, and the heat is transferred to the solder sandwiched between both terminals by thermal conduction within the metal.
It has good heat transfer efficiency and can melt the solder quickly and reliably to perform good soldering. Further, after soldering, the quality of the soldered parts can be confirmed from the condition of the solder in the through-hole, which has the advantage of ensuring quality assurance.
図−１および図−２は本発明の一実施例に係るプリント
回路基板の接続方法を示す要部の拡大平面図および縦断
面図、図−３はその方法によって得られたプリント回路
基板の接続部を示す要部の縦断面図、図−４は本発明の
他の実施例を示す縦断面図、図−５および図−６は従来
のプリント回路基板の接続方法を示す要部の拡大平面図
および縦断面図、図−７は従来の接続方法の他の例を示
す縦断面図である。
ｌ：リジッドプリント回路基板、２：絶縁基板、３；回
路導体、３ａ：端子部、４：フレキシブルプリント回路
基板、５：絶縁フィルム、６：回路導体、６ａ：端子部
、７・８：ソルダーレジスト、９：半田、１０ニスルー
ホール。
ゝ〜１−′
図−１Figures 1 and 2 are enlarged plan views and vertical cross-sectional views of essential parts showing a printed circuit board connection method according to an embodiment of the present invention, and Figure 3 is a printed circuit board connection obtained by the method. FIG. 4 is a vertical sectional view showing another embodiment of the present invention, and FIGS. 5 and 6 are enlarged plane views of the main portion showing a conventional printed circuit board connection method. FIG. 7 is a longitudinal sectional view showing another example of the conventional connection method. l: Rigid printed circuit board, 2: Insulating board, 3: Circuit conductor, 3a: Terminal section, 4: Flexible printed circuit board, 5: Insulating film, 6: Circuit conductor, 6a: Terminal section, 7 and 8: Solder resist , 9: solder, 10 varnish through hole.ゝ〜１−′ Figure-1
Claims (1)
せて半田付けすることにより接続する方法において、一
方のプリント回路基板の端子部にスルーホールを形成し
、少なくともそのスルーホールを形成した方のプリント
回路基板側から加熱して、両プリント回路基板の端子部
を半田付けすることを特徴とするプリント回路基板の接
続方法。1. In a method of connecting two printed circuit boards by overlapping their terminal parts and soldering them, a through hole is formed in the terminal part of one printed circuit board, and at least the printed circuit board on which the through hole is formed is connected. A method for connecting printed circuit boards, characterized in that the terminals of both printed circuit boards are soldered by heating from the circuit board side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15214788A JPH01319993A (en) | 1988-06-22 | 1988-06-22 | Connecting method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15214788A JPH01319993A (en) | 1988-06-22 | 1988-06-22 | Connecting method for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01319993A true JPH01319993A (en) | 1989-12-26 |
Family
ID=15534062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15214788A Pending JPH01319993A (en) | 1988-06-22 | 1988-06-22 | Connecting method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319993A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6126459A (en) * | 1997-03-24 | 2000-10-03 | Ford Motor Company | Substrate and electrical connector assembly |
| JP2007194459A (en) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | Flexible circuit substrate |
| JP2007294561A (en) * | 2006-04-24 | 2007-11-08 | Sumitomo Electric Ind Ltd | Optical module having connecting structure by flexible substrate |
| US8851356B1 (en) * | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US8968006B1 (en) | 2008-03-18 | 2015-03-03 | Metrospec Technology, Llc | Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board |
| US9341355B2 (en) | 2008-03-06 | 2016-05-17 | Metrospec Technology, L.L.C. | Layered structure for use with high power light emitting diode systems |
| JP2016127205A (en) * | 2015-01-07 | 2016-07-11 | Ｎｔｔエレクトロニクス株式会社 | Flexible printed wiring board and packaging method for the same |
| US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
| CN111511100A (en) * | 2019-01-30 | 2020-08-07 | 京东方科技集团股份有限公司 | Flexible circuit board and manufacturing method thereof, electronic device module and electronic device |
| US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
| US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
-
1988
- 1988-06-22 JP JP15214788A patent/JPH01319993A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6126459A (en) * | 1997-03-24 | 2000-10-03 | Ford Motor Company | Substrate and electrical connector assembly |
| JP2007194459A (en) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | Flexible circuit substrate |
| JP4696924B2 (en) * | 2006-01-20 | 2011-06-08 | 住友電気工業株式会社 | Flexible circuit board |
| JP2007294561A (en) * | 2006-04-24 | 2007-11-08 | Sumitomo Electric Ind Ltd | Optical module having connecting structure by flexible substrate |
| US10499511B2 (en) | 2008-02-14 | 2019-12-03 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
| US20150189765A1 (en) * | 2008-02-14 | 2015-07-02 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US11690172B2 (en) | 2008-02-14 | 2023-06-27 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
| US11304308B2 (en) | 2008-02-14 | 2022-04-12 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US9736946B2 (en) | 2008-02-14 | 2017-08-15 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
| US8851356B1 (en) * | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| US9341355B2 (en) | 2008-03-06 | 2016-05-17 | Metrospec Technology, L.L.C. | Layered structure for use with high power light emitting diode systems |
| US9357639B2 (en) | 2008-03-18 | 2016-05-31 | Metrospec Technology, L.L.C. | Circuit board having a plated through hole through a conductive pad |
| US8968006B1 (en) | 2008-03-18 | 2015-03-03 | Metrospec Technology, Llc | Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board |
| JP2016127205A (en) * | 2015-01-07 | 2016-07-11 | Ｎｔｔエレクトロニクス株式会社 | Flexible printed wiring board and packaging method for the same |
| US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
| CN111511100B (en) * | 2019-01-30 | 2021-09-24 | 京东方科技集团股份有限公司 | Flexible circuit board and manufacturing method thereof, electronic device module and electronic device |
| CN111511100A (en) * | 2019-01-30 | 2020-08-07 | 京东方科技集团股份有限公司 | Flexible circuit board and manufacturing method thereof, electronic device module and electronic device |
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