JPS61214548A - Tape carrier - Google Patents
Tape carrierInfo
- Publication number
- JPS61214548A JPS61214548A JP5619885A JP5619885A JPS61214548A JP S61214548 A JPS61214548 A JP S61214548A JP 5619885 A JP5619885 A JP 5619885A JP 5619885 A JP5619885 A JP 5619885A JP S61214548 A JPS61214548 A JP S61214548A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- solder
- tape carrier
- outer lead
- solder metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ＬＳＩやＩＣ等の多ビン高密度実装であるテ
ープキャリア実装用のテープキャリアにｇＱｉｊるもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a tape carrier for mounting tape carriers, which is a multi-bin high-density mounting of LSIs, ICs, etc.
従来の技術
テープキャリア実装では、第７図の如くインナーリード
１に半導体チップ２を一括接続した後、アウターリード
フレーム３を例えばプリントボードなどの外部配線基板
４の導体パターン５に対して一括接続を施す。このアウ
ターリードフレーム３と導体パターン５との接合は、導
電性接着剤即ち銀ペースト等の導電性ペースト、あるい
は半田金属などを介在させて両者の電気的、物理的接合
を行なう。なお６はテープキャリアである。In conventional tape carrier mounting, after the semiconductor chips 2 are connected to the inner leads 1 at once as shown in FIG. 7, the outer lead frame 3 is connected at once to the conductor pattern 5 of an external wiring board 4 such as a printed board. give The outer lead frame 3 and the conductor pattern 5 are electrically and physically joined by interposing a conductive adhesive, that is, a conductive paste such as a silver paste, or a solder metal. Note that 6 is a tape carrier.
半田金属を媒体としてアウターリードフレーム３と導体
バタ・−ン５とを接続する場合、従来は、第８図の如く
アウターリードフレーム３上に半田メッキ層７を形成し
たテープキャリア６を使用するか、或は半田メッキ層を
導体パターン５に施した外部配線基板を用いるか、若く
は第９図の様に、アウターリードフレーム３と導体パタ
ーン５との接合部位８に半田金属！ｊ９を形成するか′
、またはこれらを併用する等の方策を施こした後、前記
接合部位８を加熱あるいは圧着加熱し、半田金属を溶融
せしめて両者を接合していた。Conventionally, when connecting the outer lead frame 3 and the conductor batten 5 using solder metal as a medium, a tape carrier 6 with a solder plating layer 7 formed on the outer lead frame 3 as shown in FIG. 8 is used. Alternatively, you can use an external wiring board with a solder plating layer applied to the conductor pattern 5, or alternatively, as shown in FIG. Shall we form j9'?
, or a combination of these methods, the joining portion 8 is heated or compressed and heated to melt the solder metal and join the two.
発明が解決しようとする問題点
上記半田金属を媒体としたアウターリードフレーム３の
接続（以下０ｕｔｅｒ Ｌｅａｄ Ｂ。Problems to be Solved by the Invention Connection of the outer lead frame 3 using the above-mentioned solder metal as a medium (hereinafter referred to as "Outer Lead B").
ｎｄ ｉ ｎｇの略としてｒ ＯＬ、 Ｂ Ｊと称す）
では、接合部の溶融接合後の余剰半田金属が、接合部外
に食出し、隣接リード相互間を短絡させる恐れがある。(referred to as rOL and BJ as abbreviations for nd ing)
In this case, there is a risk that surplus solder metal after fusion bonding of the joint portion may protrude outside the joint portion and cause a short circuit between adjacent leads.
即ち、半田メッキ層７を有するアウターリードフレーム
３あるいは半田メッキ層を形成した導体パターン５を用
いた場合、接合部の加熱処理時に接合部近傍の半田金属
も同時に溶けるため、溶融半田金属は温度のより高い接
合加熱部に引き寄せられ、その接合部位で余剰半田とし
て食出しが生じることになる。That is, when the outer lead frame 3 having the solder plating layer 7 or the conductor pattern 5 having the solder plating layer formed thereon is used, the solder metal near the joint also melts at the same time when the joint is heat-treated, so that the molten solder metal is heated at a high temperature. It is attracted to the higher joining heating area, and excess solder bulges out at that joining area.
また第５図の如く接合部位８のみに半田金属層９を形成
し、圧接加熱により接合を行なった際にも、溶融した半
田金属は同様に接合部のリードフレーム３の側端面に食
出しが生じる。Furthermore, when a solder metal layer 9 is formed only on the joint portion 8 as shown in FIG. 5 and the joint is performed by pressure welding heating, the molten solder metal similarly protrudes on the side end surface of the lead frame 3 at the joint portion. arise.
特に多ピン高密度なテープキャリアの場合、リード幅及
びリードピッチ必然的に小さくなるため、わずかな食出
しでリード間の知略となる。またリード幅が狭いため、
接合部面積が少なくなり、接合強度の低下等の接合信頼
性についても低下する恐れがある。Particularly in the case of a high-density tape carrier with a large number of pins, the lead width and lead pitch are inevitably small, so a slight protrusion becomes a problem between the leads. Also, because the lead width is narrow,
The area of the bonded portion decreases, and bonding reliability such as a decrease in bonding strength may also decrease.
問題点を解決する゛ための手段
上記問題点を解決するため、本発明のテープキャリアは
、外部接続用リード端子としてのアウターリードフレー
ムの接続結合領域部に、接合用半田金属材料を融着捕捉
せしめる空間部位を形成したものである。Means for Solving the Problems In order to solve the above-mentioned problems, the tape carrier of the present invention fuses and captures a solder metal material for bonding in the connecting region of the outer lead frame as a lead terminal for external connection. It forms a space area that allows the
作用
上記構成によればアウターリードフレームに余剰半田金
属の付着部位を設けたので、余剰半田が捕捉され、また
半田金属との接触部位が増加するため、食出し防止と接
着強度の向上とを図ることができる。Effects According to the above configuration, since the outer lead frame is provided with a portion to which excess solder metal adheres, the excess solder is captured and the number of contact portions with the solder metal is increased, thereby preventing bleed-out and improving adhesive strength. be able to.
実施例
以下、本発明の一実施例を第１図〜第６図に基づいて説
明する。EXAMPLE Hereinafter, an example of the present invention will be described based on FIGS. 1 to 6.
第１図は本発明の第１の実施例におけるテープキャリア
の実装状態の斜視図、第２図Ａ、Ｂは各々第１図におけ
るｎ−［線に沿う断面図であり、テープキャリア１１の
アウターリードフレーム１２は、外部配線基板１３の導
体パターン１４との接合部位となるべき部分に、長円形
状の開孔部１５を有している。なおこの開孔部１５の形
状は長円形状に限定されるものではなく、矩形、円形、
或はそれらの形状の開孔部がアウターリードフレーム１
２に複数個形成された構造であっても良い。いづれにし
ても、開孔部１５は、溶融状態の半田金［１１１６が開
孔部１５の壁面金属部１７を濡らし、しかる後開孔１５
内に溶融した半田金属１Ｂが侵入充填されることが可能
な寸法形状を備えていることが肝要である。1 is a perspective view of a mounted state of the tape carrier in the first embodiment of the present invention, and FIGS. 2A and 2B are sectional views taken along the line n-[ in FIG. The lead frame 12 has an oval opening 15 in a portion that is to be joined to the conductor pattern 14 of the external wiring board 13. Note that the shape of this opening 15 is not limited to an oval shape, but may be rectangular, circular, or
Or the openings of those shapes are the outer lead frame 1.
It may be a structure in which a plurality of them are formed in 2. In any case, the molten solder metal [1116] wets the wall metal part 17 of the aperture 15, and then the aperture 15
It is important to have a size and shape that allows the molten solder metal 1B to penetrate and fill inside.
以下の説明は半田金属１６を接合部位に形成し、圧接加
熱による０−ＬＢ法を用いた場合を例にとって行なう。The following description will be made by taking as an example a case where a solder metal 16 is formed at a joint portion and an 0-LB method using pressure contact heating is used.
第２図Ａのように、外部配線基板１３の導体パターン１
４上には、接合用の半田金＠ｉｅが、印刷等の手法によ
り選択的に形成されており、半田金属１６に接して、テ
ープキャリア１１のアウターリードフレーム１２を設置
する。しかる後、アウターリードフレーム１２の接合部
位を圧接加熱装置（図示せず）により上側から圧接して
局部加熱を行なうと、アウターリードフレーム１２を介
して加熱された半田金属１６は溶融し、導体パターン１
４およびアウターリードフレーム１２の底面１２ａと溶
融接合すると共に、溶融中の余剰半田金属１６は、圧接
力及び加熱により加熱源に近い高温度部であるアウター
リードフレーム１２の開孔部１５へ流動注入され、開孔
部１５の壁面金属部１７と半田金属１６とが接合すると
共に、開孔部１５内に充填される。As shown in FIG. 2A, conductor pattern 1 of external wiring board 13
Solder metal @ie for bonding is selectively formed on the solder metal 16 by a method such as printing, and the outer lead frame 12 of the tape carrier 11 is installed in contact with the solder metal 16. Thereafter, when the joint portion of the outer lead frame 12 is pressed from above using a pressure welding heating device (not shown) to perform local heating, the solder metal 16 heated through the outer lead frame 12 melts and forms a conductive pattern. 1
4 and the bottom surface 12a of the outer lead frame 12, and the melted surplus solder metal 16 is fluidly injected into the opening 15 of the outer lead frame 12, which is a high temperature part near the heating source, by pressure welding force and heating. As a result, the wall metal portion 17 of the opening 15 and the solder metal 16 are joined together, and the opening 15 is filled.
したがって、加熱処理後の接合部位の断面形状は、第２
図Ｂの如く、半田金属１６の一部１６ａが若干側壁部へ
食出すこともあるが、余剰半田金属１６ｂはアウターリ
ードフレーム１２の開孔部１５に注入充填され、開孔部
１５の壁面金属部１７との接合により、食出しの低減が
図れると共に、接合強度の向上にも寄与することになる
。Therefore, the cross-sectional shape of the bonded portion after heat treatment is
As shown in FIG. By joining with the portion 17, it is possible to reduce the protrusion and also contribute to improving the joint strength.
なお、アウターリードフレーム１２に形成する開孔部１
５の幅Ｗが微細な場合は、第３図Ａの如く開孔部１５へ
の溶融半田金属１６の侵入が起りにくく、また侵入捕捉
される半田金１１１６ｂの量が少ないため、余剰半田金
属１６ａは接合部側面に食出し、開孔部１５を形成した
効果が少ない。Note that the opening 1 formed in the outer lead frame 12
When the width W of 5 is small, it is difficult for the molten solder metal 16 to enter the opening 15 as shown in FIG. protrudes from the side surface of the joint, and the effect of forming the aperture 15 is small.
一方、開孔部１５の幅Ｗを第７図Ｂの如く広げ過ぎた場
合は、アウターリードフレーム１２自体の強度が低下し
、また余剰半田金１１１６ａの食出しは低減できるが、
開孔部１５に侵入した溶融半田金属９ｂは壁面金属部１
７との溶融接合はするものの開孔部１５内全域に充填さ
せる事ができず、開孔部１５の中央部に非充填空孔１８
を作ることがある。この場合アウターリードフレーム１
２の実質的な接合面面積が減少するため、リード強度、
換言すれば接合強度を下げる恐れがある。On the other hand, if the width W of the opening 15 is made too wide as shown in FIG. 7B, the strength of the outer lead frame 12 itself will decrease, and the protrusion of the excess solder metal 1116a can be reduced;
The molten solder metal 9b that has entered the opening 15 is removed from the wall metal portion 1.
7, but the entire inside of the opening 15 could not be filled, and an unfilled hole 18 was formed in the center of the opening 15.
may be made. In this case, outer lead frame 1
2, lead strength and
In other words, there is a risk of lowering the bonding strength.
したがって、アウターリードフレーム１２に形成する開
孔部１５の幅Ｗは、半田金属１Ｇの材料、圧接加熱条件
等による影響を考慮する必要があるが、概略の目安とし
ては、アウターリードフレーム１２の全幅の１／４〜１
／３＠度とすることが望ましい。Therefore, the width W of the opening 15 formed in the outer lead frame 12 needs to take into account the influence of the material of the solder metal 1G, the pressure welding heating conditions, etc., but as a rough guide, the entire width of the outer lead frame 12 1/4 to 1 of
/3 degrees is desirable.
第４図は半田金属のメッキ処理を施こしたアウターリー
ドフレームを有するテープキャリアを用いた場合のＯＬ
Ｂの実施状態を示した断面図である。即ち、開孔部１５
を有し、かつその表面全域に半田金属のメッキ層１９を
形成したアウターリードフレーム１２を、第４図Ａのよ
うに外部配線基板１３の導体パターン１４上に配設し、
圧接加熱処理を行なうと、第４図Ｂのように溶融余剰半
田金属１６ｂが開孔部１５に流入捕捉され、接合部側壁
２０への食出しを軽減させることができる。Figure 4 shows the OL when using a tape carrier with an outer lead frame plated with solder metal.
It is a sectional view showing the implementation state of B. That is, the opening 15
An outer lead frame 12 having a solder metal plating layer 19 formed on the entire surface thereof is disposed on a conductor pattern 14 of an external wiring board 13 as shown in FIG. 4A,
When the pressure welding heat treatment is performed, the molten excess solder metal 16b flows into the opening 15 and is captured, as shown in FIG.
第５図は本発明の第２の実施例におけるテープキャリア
の実装状態の斜視図、第６図Ａ、Ｂは各々第５図におけ
るＶｌ−Ｖｌ線に沿う断面図で、本実施例のアウターリ
ードフレーム１２は、第５図に示す如く、外部配線基板
１３の導体パターン１４と接する部位のアウターリード
フレーム１２の側面に、鋸歯状の切欠部２１を有する構
造のものである。5 is a perspective view of the mounted state of the tape carrier in the second embodiment of the present invention, and FIGS. 6A and 6B are sectional views taken along the line Vl-Vl in FIG. As shown in FIG. 5, the frame 12 has a structure in which a sawtooth cutout 21 is provided on the side surface of the outer lead frame 12 at a portion that contacts the conductor pattern 14 of the external wiring board 13.
このアウターリードフレーム１２を有するテープキャリ
ア１１を用いたＯＬＢは、第１の実施例と同様に行なう
。即ち第６図Ａの如く、圧接加熱前の切欠部２１には、
圧接加熱により溶融した半田金属１６の余剰半田が切欠
部２１を濡らしながら、切欠溝内を沿達すると共に融着
するため、第６図Ｂのように余剰半田金属１６ｂが切欠
部２１で捕捉され、接合部側面への食出しを阻止するこ
とになる。また第５図から明らかなように、鋸歯状の切
欠部２１が半田金ｊｌ１６と接合するため、接合面の表
面積が増大し、接着強度の向上も同時に図ることができ
る。OLB using the tape carrier 11 having this outer lead frame 12 is performed in the same manner as in the first embodiment. That is, as shown in FIG. 6A, in the notch 21 before pressure contact heating,
Since the surplus solder of the solder metal 16 melted by the pressure welding heat wets the notch 21 and travels along the inside of the notch groove and is fused, the surplus solder metal 16b is captured by the notch 21 as shown in FIG. 6B. This will prevent protrusion to the side of the joint. Further, as is clear from FIG. 5, since the sawtooth-shaped cutout portion 21 is bonded to the solder metal jl 16, the surface area of the bonding surface is increased, and the adhesive strength can be improved at the same time.
発明の効果
以上述へたごとく本発明によれば、アウターリードフレ
ームに余剰半田金属を捕捉する部位を設けたので、接合
部側壁での余剰半田の食出しを阻止できると同時に、接
合強度を向上でき、したがって多ピン高密度なテープキ
ャリアのＯＬＢ実装の高信頼度化を図ることができる。Effects of the Invention As described above, according to the present invention, since the outer lead frame is provided with a portion that captures excess solder metal, it is possible to prevent excess solder from coming out on the side wall of the joint part, and at the same time improve the joint strength. Therefore, it is possible to improve the reliability of OLB mounting of a tape carrier with a large number of pins and high density.
第１図は本発明の第１の実施例におけるテープキャリア
の実装状態の斜視図、第２図Ａ、Ｂは各々第１図におけ
るト」線に沿う断面図、第３図Ａ、Ｂは各々開孔部の幅
と半田金属の食出し状態との関係を説明する断面図、第
４図Ａ、Ｂは各々第１の実施例の変形例を示す新面図、
第５図は本発明の第２の実施例におけるテープキャリア
の実装状態の斜視図、第６図Ａ、Ｂは各々第５図におけ
る■−■線に沿う断面図、第７図は一般的なテープキャ
リアの実装状態の断面図、第８図及び第９図は各々従来
のテープキャリアの実装状態の斜視図である。
１１・・・テープキャリア、１２・・・アウターリード
フレーム、１５・・・開孔部、１６・・・半田金属、２
１・・・切欠部代理人 森 本 義 弘
第２図
（Ａ）
（’１１ン
第３図
（Ｉｎ
（Ｂン
第４図
（Ａ＞
（Ｂン
第す図
（’７１）
第７図
第３図FIG. 1 is a perspective view of the mounting state of the tape carrier in the first embodiment of the present invention, FIGS. 2A and B are sectional views taken along the line T in FIG. 1, and FIGS. 3A and B are 4A and 4B are new views showing a modification of the first embodiment,
FIG. 5 is a perspective view of the mounted state of the tape carrier in the second embodiment of the present invention, FIGS. 6A and B are sectional views taken along the line ■-■ in FIG. 5, and FIG. 7 is a general A cross-sectional view of a tape carrier in a mounted state, and FIGS. 8 and 9 are perspective views of a conventional tape carrier in a mounted state. DESCRIPTION OF SYMBOLS 11... Tape carrier, 12... Outer lead frame, 15... Opening part, 16... Solder metal, 2
1... Notch agent Yoshihiro Morimoto Figure 2 (A) ('11 Figure 3 (In (B Figure 4) (A>('71) Figure 7 Figure 3
Claims (1)
ームの接続結合領域部に、接合用半田金属材料を融着捕
捉せしめる空間部位を形成したテープキャリア。 ２、空間部位として、アウターリードフレームの接続結
合領域部に貫通開孔部を形成した特許請求の範囲第１項
記載のテープキャリア。 ３、空間部位として、アウターリードフレームの接続結
合領域部の側壁面に鋸歯状の切欠部を形成した特許請求
の範囲第１項記載のテープキャリア。[Scope of Claims] 1. A tape carrier in which a space portion is formed in a connecting region of an outer lead frame serving as a lead terminal for external connection, in which a solder metal material for bonding is fused and captured. 2. The tape carrier according to claim 1, wherein a through hole is formed in the connecting region of the outer lead frame as the space portion. 3. The tape carrier according to claim 1, wherein a sawtooth notch is formed on the side wall surface of the connecting region of the outer lead frame as the space portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5619885A JPS61214548A (en) | 1985-03-20 | 1985-03-20 | Tape carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5619885A JPS61214548A (en) | 1985-03-20 | 1985-03-20 | Tape carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61214548A true JPS61214548A (en) | 1986-09-24 |
Family
ID=13020419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5619885A Pending JPS61214548A (en) | 1985-03-20 | 1985-03-20 | Tape carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61214548A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4867715A (en) * | 1988-05-02 | 1989-09-19 | Delco Electronics Corporation | Interconnection lead with redundant bonding regions |
| US4907991A (en) * | 1987-11-25 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper |
| US5062567A (en) * | 1988-12-20 | 1991-11-05 | Schlumberger Technologies, Inc. | Lead design to facilitate post-reflow solder joint quality inspection |
| CN110100355A (en) * | 2016-12-21 | 2019-08-06 | 阿莫技术有限公司 | Functional contact device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113249A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Carrier tape and semiconductor device using it |
| JPS58123742A (en) * | 1982-01-18 | 1983-07-23 | Toshiba Corp | Semiconductor device |
-
1985
- 1985-03-20 JP JP5619885A patent/JPS61214548A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113249A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Carrier tape and semiconductor device using it |
| JPS58123742A (en) * | 1982-01-18 | 1983-07-23 | Toshiba Corp | Semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4907991A (en) * | 1987-11-25 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper |
| US4962585A (en) * | 1987-11-25 | 1990-10-16 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper and method of manufacturing the same |
| US4867715A (en) * | 1988-05-02 | 1989-09-19 | Delco Electronics Corporation | Interconnection lead with redundant bonding regions |
| US5062567A (en) * | 1988-12-20 | 1991-11-05 | Schlumberger Technologies, Inc. | Lead design to facilitate post-reflow solder joint quality inspection |
| CN110100355A (en) * | 2016-12-21 | 2019-08-06 | 阿莫技术有限公司 | Functional contact device |
| CN110100355B (en) * | 2016-12-21 | 2022-01-25 | 阿莫技术有限公司 | Functional contactor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5438478A (en) | Electronic component carriers and method of producing the same as well as electronic devices | |
| JP3536023B2 (en) | COF tape carrier and COF semiconductor device manufactured using the same | |
| KR940006185Y1 (en) | Ic module | |
| JPH04192596A (en) | Mounting structure of electronic component | |
| US5841198A (en) | Ball grid array package employing solid core solder balls | |
| KR100277509B1 (en) | Electronic Component Mounting Board | |
| JPH01319993A (en) | Connecting method for printed circuit board | |
| JPS61214548A (en) | Tape carrier | |
| JPH06125203A (en) | Dielectric resonator device and its mounting structure | |
| JPH09153696A (en) | Electronic component having shield case and manufacture thereof | |
| JPH04280667A (en) | High integrated semiconductor device | |
| JPH0536871U (en) | Flexible board for circuit connection | |
| JPH02172266A (en) | Lead, package and electric circuit device | |
| JP3334958B2 (en) | Semiconductor package and method of manufacturing semiconductor package | |
| JPH0547836A (en) | Mounting structure of semiconductor device | |
| JPH04280696A (en) | High integrated semiconductor device | |
| JPH09312453A (en) | Thermal pressure fixing circuit substrate | |
| JP3084023B1 (en) | Semiconductor device and manufacturing method thereof | |
| JPS58197897A (en) | Solder bonding method | |
| JP2002016330A (en) | Substrate for mounting component and its manufacturing method | |
| JP2526796B2 (en) | Tape carrier package | |
| JP2002043466A (en) | Ball grid array package | |
| JP3696921B2 (en) | Soldering jig and electronic component mounting substrate manufacturing method | |
| JPH09153562A (en) | Method of mounting solder ball on pad area array package | |
| JPH10275965A (en) | Electronic-component assembly and its manufacture |