JPH0727649Y2 - Printed wiring board with resistor mounted on heat dissipation board - Google Patents

Printed wiring board with resistor mounted on heat dissipation board

Info

Publication number
JPH0727649Y2
JPH0727649Y2 JP1989130135U JP13013589U JPH0727649Y2 JP H0727649 Y2 JPH0727649 Y2 JP H0727649Y2 JP 1989130135 U JP1989130135 U JP 1989130135U JP 13013589 U JP13013589 U JP 13013589U JP H0727649 Y2 JPH0727649 Y2 JP H0727649Y2
Authority
JP
Japan
Prior art keywords
resistor
printed wiring
wiring board
heat dissipation
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989130135U
Other languages
Japanese (ja)
Other versions
JPH0369265U (en
Inventor
忠彦 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1989130135U priority Critical patent/JPH0727649Y2/en
Publication of JPH0369265U publication Critical patent/JPH0369265U/ja
Application granted granted Critical
Publication of JPH0727649Y2 publication Critical patent/JPH0727649Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、回路部品として発熱抵抗体を備えた印刷配線
板に関するものである。特に、混成集積回路に適用した
場合に優れたものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a printed wiring board provided with a heating resistor as a circuit component. In particular, it is excellent when applied to a hybrid integrated circuit.

〔従来の技術〕[Conventional technology]

第4図および第5図を参照しつつ従来例を説明する。第
4図は従来例説明図、第5図は第4図図示A−A′断面
図である。図において、印刷配線板21は、たとえば、ア
ルミナ等の絶縁性および放熱性の良い基板で、その上に
配線パターン22が形成されている。厚膜抵抗体23および
回路部品24は、印刷配線板21上に形成され、配線パター
ン22により接続されて回路を構成する。
A conventional example will be described with reference to FIGS. 4 and 5. FIG. 4 is an explanatory view of a conventional example, and FIG. 5 is a sectional view taken along the line AA ′ shown in FIG. In the figure, a printed wiring board 21 is, for example, a substrate such as alumina having a good insulating property and a good heat dissipation property, and a wiring pattern 22 is formed thereon. The thick film resistor 23 and the circuit component 24 are formed on the printed wiring board 21 and are connected by the wiring pattern 22 to form a circuit.

そして、印刷配線板21の表面は、被覆材25たとえば、ガ
ラス系の放熱特性および絶縁性の良い樹脂等で被覆され
ている。
The surface of the printed wiring board 21 is covered with a coating material 25, for example, a resin such as glass having good heat dissipation characteristics and insulating properties.

このような印刷配線板21上に形成された回路に電力が供
給されると、抵抗体23は発熱して回路の特性およびその
付近に影響を及ぼす。
When power is supplied to the circuit formed on such a printed wiring board 21, the resistor 23 generates heat and affects the characteristics of the circuit and its vicinity.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

近年、印刷配線板21は小型化され、特に混成集積回路上
の回路部品も集積回路(本明細書で言う集積回路は、以
下ICおよびLSI等全ての集積回路を含む)と共に微細化
される傾向にある。
In recent years, the printed wiring board 21 has been miniaturized, and in particular, the circuit components on the hybrid integrated circuit have been miniaturized together with the integrated circuit (the integrated circuit referred to in the present specification includes all integrated circuits such as IC and LSI hereinafter). It is in.

特に抵抗体23を微細化すると、面積当たりの抵抗が高く
なり、大電力のかかる場合には発熱も高くなる。この
時、抵抗体23の発熱は、一時的に抵抗値を大きく変える
ことがある。
In particular, when the resistor 23 is miniaturized, the resistance per area increases, and the heat generation also increases when a large amount of power is applied. At this time, the heat generated by the resistor 23 may temporarily change the resistance value greatly.

また、抵抗体23の長期間ん発熱は、抵抗体23を劣化させ
ることにより抵抗値を変える。したがって、大電力がか
かる抵抗体23の微細化には限度があった。
In addition, the long-term heat generation of the resistor 23 changes the resistance value by deteriorating the resistor 23. Therefore, there is a limit to miniaturization of the resistor 23 that requires a large amount of power.

本考案は、以上のような問題を解決するためのもので、
抵抗体に大電力がかかっても放熱性が良く、常に正確な
抵抗値を示す抵抗体を備えた印刷配線板を提供すること
を目的とする。
The present invention is for solving the above problems,
An object of the present invention is to provide a printed wiring board provided with a resistor that exhibits good heat dissipation even when a large amount of power is applied to the resistor and that always exhibits an accurate resistance value.

〔課題を解決するための手段〕[Means for Solving the Problems]

前記目的を達成するために、本考案の放熱基板に取り付
けられた抵抗体を備えた印刷配線板は、回路部品として
発熱抵抗体を備えており、印刷配線板の少なくとも一方
の幅と同じ長さの放熱基板の少なくとも一方の面に連続
して抵抗膜が形成されている抵抗体と、印刷配線板の表
面と抵抗体との間に空間を形成すると共に、抵抗体の両
接合端子と印刷配線板の外部接続端子とを電気的に接続
するクリップ状の抵抗体支持金具とから構成される。
In order to achieve the above object, a printed wiring board having a resistor attached to a heat dissipation board of the present invention has a heating resistor as a circuit component, and has the same length as at least one width of the printed wiring board. Forming a space between the surface of the printed wiring board and the resistor, the resistor having a resistive film continuously formed on at least one surface of the heat dissipation substrate, and connecting terminals of the resistor and the printed wiring. It is composed of a clip-shaped resistor support metal fitting that electrically connects the external connection terminal of the plate.

〔作用〕[Action]

本出願人は、印刷配線板の上部空間を利用して、発熱抵
抗体のみをその他の回路部品と別にして印刷配線板の外
部接続端子に取り付けることに着目した。また、本出願
人は、印刷配線板の少なくとも一方の幅に等しい長さと
なる放熱基板の少なくとも一方の面に連続して抵抗膜を
形成した抵抗体とすることを考えた。
The applicant of the present invention has focused on using the upper space of the printed wiring board to attach only the heating resistor to the external connection terminals of the printed wiring board separately from other circuit components. Further, the present applicant has considered using a resistor in which a resistance film is continuously formed on at least one surface of a heat dissipation substrate having a length equal to the width of at least one of the printed wiring boards.

すなわち、本考案のような構成にすると、抵抗膜が連続
して形成された放熱基板を印刷配線板から離して十分な
大きさに取れるので、放熱基板からの放熱性を良くする
と共に、抵抗体自体の熱による特性変化がなくなる。
That is, according to the configuration of the present invention, the heat dissipation substrate having the resistance film continuously formed can be separated from the printed wiring board to have a sufficient size, so that the heat dissipation from the heat dissipation substrate is improved and the resistor There is no change in characteristics due to its own heat.

また、抵抗膜を連続して形成している放熱基板は、印刷
配線板の一方の幅と同じだけ大きく取ることができるの
で、抵抗体の表面積を大きくしかも任意に取ることがで
きる。したがって、本考案の抵抗体は、単位面積当たり
の抵抗値の低い材料で高抵抗を得ることができるので、
抵抗値の精度を上げることができると共に、製造時のバ
ラツキをなくす。
Further, since the heat dissipation substrate having the resistance film formed continuously can be made as large as one width of the printed wiring board, the surface area of the resistor can be made large and arbitrary. Therefore, the resistor of the present invention can obtain high resistance with a material having a low resistance value per unit area.
The accuracy of the resistance value can be improved, and variations during manufacturing can be eliminated.

さらに、抵抗体を印刷配線板の少なくとも一方の幅と同
じにしたため、クリップ状の支持金具によって、抵抗体
の接合端子と印刷配線板の外部接続端子とを電気的に接
続することができる。
Furthermore, since the resistor has the same width as at least one side of the printed wiring board, the clip-shaped support metal fitting can electrically connect the joining terminal of the resistor and the external connection terminal of the printed wiring board.

〔実施例〕〔Example〕

第1図は本考案における抵抗体を備えた印刷配線板概略
説明図、第2図は本考案における抵抗体断面図、第3図
は本考案における抵抗体支持金具説明図である。図にお
いて、印刷配線板1は、アルミナ基板等からなり、周知
の印刷技術により配線パターン2が形成されている。そ
して、配線パターン2には、図示されていない集積回路
およびその他の回路部品が載置されている。特に回路部
品の内、抵抗は発熱の少ない低電力負荷のものだけが取
り付けられている。抵抗体4は、放熱基板5、当該基板
5上に形成された抵抗6と、接合端子7と、抵抗6を被
覆する被覆材8とから構成されている。放熱基板5は、
たとえば、窒化アルミ基板からなり、少なくともその一
側面上に形成される抵抗6は、高電力負荷のもので周知
の厚膜形成技術により得られる。抵抗6を被覆している
被覆材8は、放熱性および絶縁性の良いたとえば、ガラ
ス材からなる。そして、このガラス材は、加熱により溶
融されると同時に、ガラス内の溶剤が飛ばされる。ま
た、抵抗体支持金具9は、たとえば、銅やアルミニュウ
ム等の電気良導体からなり、上下部に端子接続部10、11
を備えている。第3図図示の上下部端子接続部10、11
は、クリップ状になっており、上部端子接続部10には抵
抗体4の接合端子7を、下部端子接続部11には、印刷配
線板1の図示されていない端子部に嵌着する。
FIG. 1 is a schematic explanatory view of a printed wiring board provided with a resistor according to the present invention, FIG. 2 is a sectional view of a resistor according to the present invention, and FIG. 3 is an explanatory view of a resistor support metal fitting according to the present invention. In the figure, a printed wiring board 1 is made of an alumina substrate or the like, and a wiring pattern 2 is formed by a known printing technique. Then, on the wiring pattern 2, an integrated circuit (not shown) and other circuit components are placed. In particular, among the circuit components, only those with low power load that generate less heat are attached. The resistor 4 includes a heat dissipation substrate 5, a resistor 6 formed on the substrate 5, a joint terminal 7, and a covering material 8 that covers the resistor 6. The heat dissipation board 5 is
For example, the resistor 6 made of an aluminum nitride substrate and formed on at least one side surface thereof has a high power load and can be obtained by a well-known thick film forming technique. The covering material 8 covering the resistor 6 is made of, for example, a glass material having good heat dissipation and insulating properties. Then, this glass material is melted by heating, and at the same time, the solvent in the glass is removed. The resistor support metal fitting 9 is made of, for example, a good electric conductor such as copper or aluminum, and has upper and lower terminal connecting portions 10 and 11.
Is equipped with. Upper and lower terminal connection parts 10 and 11 shown in FIG.
Has a clip shape, and the joining terminal 7 of the resistor 4 is fitted to the upper terminal connecting portion 10 and the terminal portion (not shown) of the printed wiring board 1 is fitted to the lower terminal connecting portion 11.

その後、たとえば、半田漕を通して上記印刷配線板1お
よび抵抗体4と抵抗体支持金具9とを固定する。
Then, for example, the printed wiring board 1 and the resistor 4 and the resistor support metal fitting 9 are fixed through a solder bath.

以上、本考案の実施例を詳述したが、本考案は、前記実
施例に限定されるものではない。そして、実用新案登録
請求の範囲に記載された本考案を逸脱することがなけれ
ば、種々の設計変更を行うことが可能である。
Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the above embodiment. Various design changes can be made without departing from the present invention described in the claims for utility model registration.

たとえば、印刷配線板の基板および抵抗体の放熱基板の
材料は、必要に応じて変えられる。特に、発熱する抵抗
を全て印刷配線板の上部に形成できれば、印刷配線板の
基板は、必ずしもアルミナ基板を使用せずに、より安価
な基板を使用しても良い。
For example, the materials of the substrate of the printed wiring board and the heat dissipation substrate of the resistor can be changed as needed. In particular, if all the resistors that generate heat can be formed above the printed wiring board, the substrate of the printed wiring board does not necessarily have to be an alumina substrate, but a cheaper substrate may be used.

また、第1図には抵抗体が2個図示されているが、抵抗
体を放熱基板上全面に1個設けることも、数個に分けら
れた抵抗体を設けることもできる。
Although two resistors are shown in FIG. 1, one resistor may be provided on the entire surface of the heat dissipation board, or several resistors may be provided.

この時の抵抗体の表面積を大きくしかも任意に取ること
ができるので、単位面積当たりの抵抗値が低い材料で高
抵抗を形成できる。したがって、本考案の抵抗体の値
は、バラつかずに精度の高いものが得られる。
Since the surface area of the resistor at this time can be made large and arbitrary, high resistance can be formed with a material having a low resistance value per unit area. Therefore, the value of the resistor of the present invention does not vary, and a highly accurate resistor can be obtained.

さらに、抵抗体支持金具は、クリップ状とせずに全体を
断面コ字状にしても良く、支持部の距離を任意に取るこ
ともできる。
Furthermore, the resistor support metal fitting may not have a clip shape, but may have a U-shaped cross section as a whole, and the distance between the support portions can be set arbitrarily.

〔考案の効果〕[Effect of device]

本考案によれば、印刷配線板の少なくとも一方の幅と同
じ長さの放熱基板の少なくとも一方の面上に連続して形
成された抵抗膜からなる抵抗体は、印刷配線板の上部の
空間を利用して取り付けたので、面積を大きく、しかも
任意に取ることができる。
According to the present invention, the resistor formed of the resistance film continuously formed on at least one surface of the heat dissipation substrate having the same length as the width of at least one of the printed wiring boards has a space above the printed wiring board. Since it is attached by using it, it has a large area and can be arbitrarily taken.

本考案によれば、単位面積当たり抵抗値の低い材料で高
抵抗に形成できるため、抵抗体は、熱により特性が変化
しないものを得るだけでなく、製造時にバラつかない精
度の高いものが得られる。
According to the present invention, since a material having a low resistance value per unit area can be formed to have a high resistance, not only a resistor whose characteristics do not change due to heat but also a highly accurate resistor that does not vary during manufacturing can be obtained. To be

本考案によれば、他の回路部品と別にした放熱基板から
のみ抵抗体の発熱を放散するので、印刷配線板から放熱
する必要がなくなるため、安価な印刷配線板を使用でき
る。
According to the present invention, since the heat generated by the resistor is dissipated only from the heat dissipation board separate from other circuit components, there is no need to dissipate heat from the printed wiring board, so that an inexpensive printed wiring board can be used.

本考案によれば、抵抗体の両接合端子と印刷配線板の外
部接続端子とを電気的に接続したため、抵抗体を印刷配
線板の上に設けるための特別な支持金具を必要とせず
に、印刷配線板を積層して取り付ける際に用いるクリッ
プ状のものを使用できる。
According to the present invention, since both the joint terminals of the resistor and the external connection terminal of the printed wiring board are electrically connected, a special support metal fitting for mounting the resistor on the printed wiring board is not required, A clip-shaped object used when the printed wiring boards are laminated and attached can be used.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案における抵抗体を備えた印刷配線板概略
説明図、第2図は本考案における抵抗体断面図、第3図
は本考案における抵抗体支持金具説明図、第4図は従来
例説明図、第5図は第4図図示A−A′断面図である。 1……印刷配線板 2……配線パターン 3……外部端子 4……抵抗体 5……放熱基板 6……抵抗 7……接合端子 8……被覆材 9……抵抗体支持金具 10……上部端子接続部 11……下部端子接続部
FIG. 1 is a schematic explanatory view of a printed wiring board provided with a resistor according to the present invention, FIG. 2 is a sectional view of a resistor according to the present invention, FIG. 3 is an explanatory view of a resistor support metal fitting according to the present invention, and FIG. FIG. 5 is a sectional view taken along the line AA ′ shown in FIG. 1 ...... Printed wiring board 2 ...... Wiring pattern 3 ...... External terminal 4 ...... Resistor 5 ...... Heat dissipation board 6 ...... Resistor 7 ...... Joining terminal 8 ...... Coating material 9 ...... Resistor support metal fitting 10 ...... Upper terminal connection 11 …… Lower terminal connection

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】回路部品として発熱抵抗体を備えた印刷配
線板において、 印刷配線板1の少なくとも一方の幅と同じ長さの放熱基
板5の少なくとも一方の面に連続して抵抗膜6が形成さ
れている抵抗体4と、 印刷配線板1の表面と抵抗体4との間に空間を形成する
と共に、抵抗体4の両接合端子7と印刷配線板1の外部
接続端子とを電気的に接続するクリップ状の抵抗体支持
金具9と、 を備えたことを特徴とする印刷配線板。
1. A printed wiring board having a heating resistor as a circuit component, wherein a resistance film 6 is continuously formed on at least one surface of a heat dissipation substrate 5 having the same width as at least one width of the printed wiring board 1. A space is formed between the resistor 4 and the surface of the printed wiring board 1 and the resistor 4, and the two joint terminals 7 of the resistor 4 and the external connection terminals of the printed wiring board 1 are electrically connected to each other. A printed wiring board comprising: a clip-shaped resistor support fitting 9 to be connected.
JP1989130135U 1989-11-09 1989-11-09 Printed wiring board with resistor mounted on heat dissipation board Expired - Lifetime JPH0727649Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989130135U JPH0727649Y2 (en) 1989-11-09 1989-11-09 Printed wiring board with resistor mounted on heat dissipation board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989130135U JPH0727649Y2 (en) 1989-11-09 1989-11-09 Printed wiring board with resistor mounted on heat dissipation board

Publications (2)

Publication Number Publication Date
JPH0369265U JPH0369265U (en) 1991-07-09
JPH0727649Y2 true JPH0727649Y2 (en) 1995-06-21

Family

ID=31677727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989130135U Expired - Lifetime JPH0727649Y2 (en) 1989-11-09 1989-11-09 Printed wiring board with resistor mounted on heat dissipation board

Country Status (1)

Country Link
JP (1) JPH0727649Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930556U (en) * 1982-08-20 1984-02-25 株式会社ボッシュオートモーティブ システム Fuel injection valve adjustment device

Also Published As

Publication number Publication date
JPH0369265U (en) 1991-07-09

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