JP2500773Y2 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JP2500773Y2 JP2500773Y2 JP1989135451U JP13545189U JP2500773Y2 JP 2500773 Y2 JP2500773 Y2 JP 2500773Y2 JP 1989135451 U JP1989135451 U JP 1989135451U JP 13545189 U JP13545189 U JP 13545189U JP 2500773 Y2 JP2500773 Y2 JP 2500773Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal wiring
- resistance element
- current detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案はダイオード，トランジスタ，サイリスタなど
の半導体素子及び回路部品を搭載してなる半導体装置
で、装置内における過電流を検出し、装置を保護する機
能を備えた半導体装置に関する。[Detailed Description of the Invention] [Industrial field of application] The present invention is a semiconductor device including semiconductor elements such as diodes, transistors, and thyristors, and circuit components, and detects overcurrent in the device to protect the device. The present invention relates to a semiconductor device having a function to perform.
複数個のダイオード，トランジスタ，サイリスタなど
の半導体素子及び回路部品を搭載してなる半導体装置
は、例えば、トランジスタモジュールのように、モジュ
ール化して製品化されたものが多い。このような半導体
装置の構造は、容器内のプリント基板上に形成された所
定の金属配線パターンの上に半導体素子及び回路部品を
はんだ等で固着し、金属配線等を用いて必要個所を接続
した後、保護用の樹脂を注入するものが一般的である。
近年、これらの製品は多機能化されつつあり、例えば、
装置内における過電流を検出し、これにより装置を保護
する機能を備えた半導体装置が開発されている。A semiconductor device having a plurality of semiconductor elements such as diodes, transistors, thyristors, and circuit components mounted therein is often manufactured as a module, such as a transistor module. The structure of such a semiconductor device is such that a semiconductor element and a circuit component are fixed by solder or the like on a predetermined metal wiring pattern formed on a printed circuit board in a container, and necessary portions are connected by using metal wiring or the like. After that, it is common to inject a protective resin.
In recent years, these products are becoming multifunctional, for example,
A semiconductor device having a function of detecting an overcurrent in the device and protecting the device by the overcurrent has been developed.
〔考案が解決しようとする課題〕 前述の装置内における過電流を検出し、それにより装
置を保護する機能を備えた半導体装置で、過電流を検出
するために過電流検出用の抵抗素子が必要とされるが、
従来はプリント基板の金属配線パターンの一部分の厚
さ，幅及び長さを調整して所定の抵抗値を得る方法が用
いられている。また、その他の方法としては抵抗素子を
印刷により作成する方法が行われている。しかし、過電
流保護の目的から、一般に検出する電流は比較的大き
く、例えば、10A以上で、前述の前者の方法の場合、金
属配線パターンは他の回路のパターンと共用となるた
め、厚さ選定の自由度が小さく、所定の電流を流す断面
積を得るためには、パターンの線幅を広くせねばなら
ず、また、金属配線パターンは一般に銅、あるいは、ア
ルミニウムなどの電気導電材料からなっているので、そ
の抵抗率が低く所定の抵抗値を得るためには抵抗素子の
長さが長くなり、このため、抵抗形成のためには非常に
大きなプリント基板の面積が必要となる。また後者の方
法の場合は印刷抵抗に流し得る電流値は比較的小さいの
で、大電流を流すためには並列に多くの印刷抵抗を設け
る必要があり、前者と同様、大きなプリント基板の面積
が必要となる。[Problems to be Solved by the Invention] In a semiconductor device having a function of detecting an overcurrent in the device described above and protecting the device accordingly, a resistance element for detecting the overcurrent is required to detect the overcurrent. It is said that
Conventionally, a method of obtaining a predetermined resistance value by adjusting the thickness, width and length of a part of a metal wiring pattern on a printed circuit board has been used. As another method, a method of forming a resistance element by printing is performed. However, for the purpose of overcurrent protection, generally the current to be detected is relatively large, for example, 10 A or more, in the case of the former method described above, the metal wiring pattern is shared with the pattern of other circuits, so the thickness selection The degree of freedom is small, and in order to obtain a cross-sectional area through which a predetermined current flows, the line width of the pattern must be wide, and the metal wiring pattern is generally made of an electrically conductive material such as copper or aluminum. Therefore, the resistance is low and the length of the resistance element becomes long in order to obtain a predetermined resistance value. Therefore, a very large printed circuit board area is required for resistance formation. In the case of the latter method, the current value that can flow to the printing resistor is relatively small, so it is necessary to install many printing resistors in parallel in order to flow a large current, and as in the former case, a large printed circuit board area is required. Becomes
本考案の課題は前述の問題を解決して、比較的大きな
電流、例えば、10A以上の過電流を検出可能で、所要の
プリント基板面積が小さくてよい抵抗素子を備える半導
体装置を提供することにある。An object of the present invention is to solve the above problems and provide a semiconductor device including a resistance element capable of detecting a relatively large current, for example, an overcurrent of 10 A or more, and requiring a small printed circuit board area. is there.
前述の課題を解決するために、本考案の半導体装置に
あっては、半導体素子及び回路部品がプリント基板上で
所定の回路を構成するための金属配線パターン上に搭載
され、かつ金属配線パターンに電流検出用抵抗素子が設
けられ、該電流検出用抵抗素子の両端に電流検出用金属
配線パターンが接続されてなる半導体装置において、前
記電流検出用抵抗素子がマンガニンまたは鉄ニッケル系
の電気抵抗材料からなりコの字形でその両端部に金属配
線パターンへの接続部を有し、プリント基板の前記電流
検出用金属配線間を接続するように固着されるようにす
る。In order to solve the above problems, in a semiconductor device of the present invention, a semiconductor element and a circuit component are mounted on a metal wiring pattern for forming a predetermined circuit on a printed circuit board, and In a semiconductor device in which a resistance element for current detection is provided, and a metal wiring pattern for current detection is connected to both ends of the resistance element for current detection, the resistance element for current detection is made of manganin or an iron-nickel-based electric resistance material. It has a square U-shape and has connecting portions to the metal wiring patterns at both ends thereof, and is fixed so as to connect between the current detecting metal wirings of the printed circuit board.
マンガニン，鉄ニッケル等の電気抵抗材料をコの字形
に形成し、その両端部に接続部を設けた抵抗体を電流検
出用の抵抗素子とし、これをプリント基板の金属配線パ
ターン上に固着し、電流検出用金属配線パターンを接続
するようにした。電気抵抗材料は、通常、その抵抗率が
高いので低抵抗素子はごく短い長さで所定の抵抗値を得
ることが可能である。また、コの字に形成し、その両端
部に接続部を設けた構造により、プリント基板に固着し
た際、この抵抗素子のコの字形部とプリント基板との間
に空間が生じ、この空間によっとその冷却効果が高ま
り、小型で大きな電流を流すことが可能となる。プリン
ト基板に冷却効果のよい金属絶縁プリント基板を用いた
場合は金属絶縁プリント基板に固着された接続部からの
冷却も大きく作用する。これらによって、所要のプリン
ト基板面積が小さくて、比較的大きな、例えば、10A以
上の過電流の検出可能な抵抗素子が得られる。An electric resistance material such as manganin, iron-nickel, etc. is formed in a U shape, and a resistor provided with connection parts at both ends thereof is used as a resistance element for current detection, and this is fixed on a metal wiring pattern of a printed circuit board, The metal wiring pattern for current detection is connected. Since the electric resistance material usually has a high resistivity, the low resistance element can obtain a predetermined resistance value with a very short length. In addition, due to the structure in which it is formed in a U shape and the connection parts are provided at both ends thereof, when it is fixed to the printed board, a space is created between the U-shaped part of this resistance element and the printed board, and this space Therefore, the cooling effect is enhanced, and it becomes possible to pass a large current with a small size. When a metal insulating printed circuit board having a good cooling effect is used for the printed circuit board, cooling from the connection portion fixed to the metal insulating printed circuit board also has a great effect. By these, a required printed circuit board area is small, and a relatively large resistance element capable of detecting an overcurrent of, for example, 10 A or more is obtained.
第１図は本考案の半導体装置の一実施例におけるプリ
ント基板上の半導体素子及び回路部品の配置を示す平面
図で、電流検出用抵抗素子周辺の一部を示している。１
はプリント基板で、通常のプラスチックプリント基板、
セラミック基板あるいは金属基板に絶縁した、所謂、金
属絶縁プリント基板が用いられる。金属絶縁基板は冷却
効果が高い特徴がある。２はプリント基板上の金属配線
パターンで所定の回路に作られる。３は半導体素子基板
で、この例では、トランジスタ素子基板でこの一つの面
のコレクタ電極は一つの金属配線にはんだ等で固着さ
れ、他の面のエミッタ電極及びベース電極は金属細線４
によって、それぞれ異なる金属配線に接続される。６は
本考案にかかわる電流検出用抵抗素子でこの例では、ト
ランジスタ３のエミッタ電流を検出している。トランジ
スタ３のエミッタが接続される金属配線21（これは金属
配線パターン２の一部である）とこの出力端子Ｅに接続
される金属配線22との間に固着され、その両端部の固着
個所からは金属配線23及び24によって電流検出用の電圧
端子P1及びP2が形成されている。第２図は第１図の電流
検出用抵抗素子６の斜視図で、マンガニン，鉄ニッケル
等の電気抵抗材料からなる長方形の平板をコの字形61に
形成し、その両端部を更に外側に折り曲げて接続部62と
したものである。第３図は第１図の電流検出用抵抗素子
６の異なる構造の斜視図で、この例では、長方形の平板
にかえて、丸線が用いられている。第４図は第１図の電
流検出用抵抗素子６の更に異なる構造の斜視図で、この
例ではコの字形の丸線部61とこの両端部に溶接された平
板の接続部62からなっている。いずれもその機能は第２
図のそれと同様である。FIG. 1 is a plan view showing the arrangement of semiconductor elements and circuit components on a printed circuit board in one embodiment of the semiconductor device of the present invention, showing a part of the periphery of a current detecting resistance element. 1
Is a printed circuit board, a normal plastic printed circuit board,
A so-called metal-insulated printed circuit board, which is insulated from a ceramic substrate or a metal substrate, is used. The metal insulating substrate is characterized by a high cooling effect. 2 is a metal wiring pattern on a printed circuit board, which is formed in a predetermined circuit. Reference numeral 3 is a semiconductor element substrate, and in this example, a transistor element substrate has a collector electrode on one surface thereof fixed to one metal wiring by soldering or the like, and an emitter electrode and a base electrode on the other surface are thin metal wires 4
Are connected to different metal wirings. Reference numeral 6 is a resistance element for current detection according to the present invention, which detects the emitter current of the transistor 3 in this example. The metal wire 21 connected to the emitter of the transistor 3 (this is a part of the metal wire pattern 2) and the metal wire 22 connected to the output terminal E are fixed to each other. The metal wirings 23 and 24 form voltage terminals P 1 and P 2 for current detection. FIG. 2 is a perspective view of the resistance element 6 for current detection in FIG. To form the connecting portion 62. FIG. 3 is a perspective view of a different structure of the current detecting resistance element 6 of FIG. 1, and in this example, a round wire is used instead of a rectangular flat plate. FIG. 4 is a perspective view of a different structure of the resistance element 6 for current detection of FIG. 1, and in this example, it comprises a U-shaped round wire portion 61 and flat plate connection portions 62 welded to both ends thereof. There is. The function is the second
It is similar to that of the figure.
本考案においては、マンガニン，鉄ニッケル等の電気
抵抗材料をコの字形に形成し、その両端部に接続部を設
けた抵抗体を電流検出用の抵抗素子とし、これをプリン
ト基板の金属配線パターン上に固着するようにしたの
で、従来のようにこの抵抗素子を形成するためにプリン
ト基板の面積を大きくする必要はなく、通常のプリント
基板の大きさで10A以上の比較的大きな過電流を検出す
る電流検出用抵抗素子の取り付けが可能となり、この種
の半導体装置が小形で低コストで製造できるようになっ
た。In the present invention, an electric resistance material such as manganin and iron-nickel is formed in a U-shape, and a resistor provided with connection portions at both ends thereof is used as a resistance element for current detection, and this is used as a metal wiring pattern of a printed circuit board. Since it is fixed to the top, it is not necessary to increase the area of the printed circuit board to form this resistance element as in the conventional case, and a relatively large overcurrent of 10 A or more can be detected with the size of a normal printed circuit board. It has become possible to attach a resistance element for current detection, which makes it possible to manufacture a semiconductor device of this type in a small size and at low cost.
第１図は本考案の半導体装置の一実施例におけるプリン
ト基板上の半導体素子及び回路部品の配置の要部を示す
平面図、第２図は第１図の電流検出用抵抗素子の斜視
図、第３図は第１図の電流検出用抵抗素子の異なる構造
の斜視図、第４図は第１図の電流検出用抵抗素子の更に
異なる構造の斜視図である。 1:プリント基板、2:金属配線パターン、21,22,23,24:金
属配線（金属配線パターン２の一部分）、3:半導体素
子、6:電流検出用抵抗素子、61:コの字形部、62:接続
部。1 is a plan view showing an essential part of the arrangement of semiconductor elements and circuit components on a printed circuit board in an embodiment of the semiconductor device of the present invention, and FIG. 2 is a perspective view of the current detecting resistance element of FIG. 3 is a perspective view of a different structure of the current detecting resistance element of FIG. 1, and FIG. 4 is a perspective view of a different structure of the current detecting resistance element of FIG. 1: Printed circuit board, 2: Metal wiring pattern, 21, 22, 23, 24: Metal wiring (a part of metal wiring pattern 2), 3: Semiconductor element, 6: Current detection resistance element, 61: U-shaped portion, 62: Connection part.
Claims (1)
で所定の回路を構成するための金属配線パターン上に搭
載され、かつ金属配線パターンに電流検出用抵抗素子が
設けられ、該電流検出用抵抗素子の両端に電流検出用金
属配線パターンが接続されてなる半導体装置において、
前記電流検出用抵抗素子がマンガニンまたは鉄ニッケル
系の電気抵抗材料からなりコの字形でその両端部に金属
配線パターンへの接続部を有し、プリント基板の前記電
流検出用金属配線間を接続するように固着されてなるこ
とを特徴とする半導体装置。1. A semiconductor element and a circuit component are mounted on a metal wiring pattern for forming a predetermined circuit on a printed circuit board, and a resistance element for current detection is provided on the metal wiring pattern. In a semiconductor device in which a current detection metal wiring pattern is connected to both ends of the element,
The current detection resistance element is made of a manganin or iron-nickel-based electric resistance material and has a U-shape and has connection portions to the metal wiring pattern at both ends thereof, and connects between the current detection metal wirings of the printed circuit board. A semiconductor device characterized by being fixed as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135451U JP2500773Y2 (en) | 1989-11-22 | 1989-11-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135451U JP2500773Y2 (en) | 1989-11-22 | 1989-11-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0373465U JPH0373465U (en) | 1991-07-24 |
| JP2500773Y2 true JP2500773Y2 (en) | 1996-06-12 |
Family
ID=31682719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135451U Expired - Fee Related JP2500773Y2 (en) | 1989-11-22 | 1989-11-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2500773Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125513A (en) * | 1996-10-15 | 1998-05-15 | Micron Denki Kk | Device for manufacturing current detecting resistor |
| JP4342232B2 (en) * | 2003-07-11 | 2009-10-14 | 三菱電機株式会社 | Semiconductor power module and main circuit current measuring system for measuring main circuit current value of the module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61102058U (en) * | 1984-12-11 | 1986-06-28 | ||
| JPS61153262U (en) * | 1985-03-14 | 1986-09-22 |
-
1989
- 1989-11-22 JP JP1989135451U patent/JP2500773Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0373465U (en) | 1991-07-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |