JP3211116B2 - Electronic component and its module structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a module structure thereof, and more particularly, to an electronic component in which a semiconductor chip is mounted on a lead frame and the semiconductor chip is molded with a resin.
And a module structure of an electronic component in which an electronic component element is mounted on an electrode portion of the electronic component.

[0002]

2. Description of the Related Art Conventionally, as a mounting method for mounting an electronic component element together with a semiconductor chip, there are a method of directly mounting the semiconductor chip and the electronic component element on a printed board or a ceramic substrate, and a method of mounting the semiconductor chip and the electronic component using a lead frame. A mounting method and the like are known.

Here, recently, depending on the scale of an electronic circuit to be mounted, a method of mounting a semiconductor chip and an electronic component element using a lead frame has attracted attention because it can be easily manufactured and can be manufactured at low cost.

Conventionally, a method for mounting a semiconductor chip 2 and an electronic component element 12 using a lead frame 1 is, as shown in FIG. 1, a mounting pattern 3 for mounting the semiconductor chip 2, a resistor, a capacitor, a transistor, a diode, and the like. Electrode patterns 5a and 5b for mounting the electronic component element 12, the leads 4a and 4b for connecting the semiconductor chip 2 and the electronic component element 12 to an external circuit, and the resin chip for mounting the mounted semiconductor chip 2. The lead frame 1 on which the tie bars 6a, 6b and the like serving to stop the flow of the molding resin 7 are processed, and the semiconductor chip 2 is mounted on the mount pattern 3 of the lead frame 1, that is, die-bonded. Chip 2
A so-called wire bonding is performed to connect the semiconductor chip 2 and the peripheral leads 4a with a plurality of wires 8, and then a portion including the semiconductor chip 2 is transfer-molded. FIG.
Indicates a state after the transfer molding, 9 indicates a molded portion formed by the molding resin 7 formed by the transfer molding, and 10 indicates a molding resin 7 (hatched portion) flowing out of the molding portion 9. Indicates a gap.

In this state, each electronic component 11 is individually separated from the lead frame 1. FIG. 3 shows a state of the separated electronic component 11.

By the way, according to such a method, FIG.
When the electronic component 11 is separated from the lead frame 1 as shown in FIG. 7, the electrode pattern 5a falls off, and the electronic component elements 12 such as resistors, capacitors, transistors, and diodes are mounted using the electrode patterns 5a and 5b. It becomes difficult to do.

Therefore, as shown in Japanese Patent Application No. 62-237797, the electronic component element 12 to be mounted between the electrode patterns 5a and 5b is soldered or electrically conductive adhesive 1.
3, a method has been proposed in which each electronic component 11 is individually cut off from the lead frame 1 to prevent the electrode pattern 5a from falling off. That is, as shown in FIG. 4, the electrodes 16 of the electronic component elements 12 to be mounted on the electrode patterns 5a and 5b are attached by solder or a conductive adhesive 13, and then individually from the lead frame 1 as shown in FIG. Disconnection, lead 4a,
4b is bent and attached to the printed circuit board 14 as shown in FIG.

[0008]

However, in the case of such a configuration, the electrode pattern 5 of the electronic component element 12 is not provided.
Since the mounting strength to the electrode patterns 5a and 5b is low when the electronic component 11 is separated from the lead frame 1,
There are problems such as the deformation of the lead 5b and the removal of the electrode patterns 5a and 5b from the electronic component element 12 when the leads 4a and 4b are bent.

Therefore, the applicant of the present invention is to die-bond the semiconductor chip 2 on the mount pattern 3 of the lead frame 1 and wire-bond the semiconductor chip 2 and the plurality of leads 4a to form a portion including the semiconductor chip 2 When transfer molding with the resin 7, the molding resin 7 is also poured between the electrode patterns 5 a and 5 b for mounting the electronic component elements 12 such as chip resistors and chip capacitors, and the electrode patterns 5 a for mounting the electronic component elements 12. , 5b (unpublished) has been previously proposed.

However, in the invention according to the above proposal, the electrode pattern 5 for mounting the electronic component element 12 is not provided.
The molding resin 7 was merely buried between a and 5b. Therefore, when the lead 15 passes between the electrode patterns 5a and 5b on which the electronic component element 12 is to be mounted, the lead 1 is used as shown in FIGS.
8 is exposed from the molding resin 7, and the electronic component 12 is placed between the exposed electrode patterns 5a and 5b as shown in FIGS. It was joined to the patterns 5a and 5b with solder or a conductive adhesive 13. For this reason, if the position of the electronic component element 12 is displaced, or if the amount of the solder or the conductive adhesive 13 is too large and protrudes from the electrode patterns 5a and 5b, the electrodes 16 of the electronic component element 12 touch or protrude from the leads 15. There is a possibility that the solder or the conductive adhesive 13 may adhere to the leads 15 and cause a short circuit. In addition, since the lead 15 is exposed on the surface, there has been a problem that the lead 15 is corroded or the insulation property is deteriorated due to long-term use.

The present invention has been made in view of the above technical background, and an object of the present invention is to prevent a drop of an electrode pattern for mounting an electronic component element with a simple structure, and furthermore, a lead frame. It is an object of the present invention to provide an electronic component and a module structure thereof, which do not cause deformation or dropout of an electrode pattern at the time of separation from a lead and bending of a lead. Another object of the present invention is to prevent the electronic component element and the lead from being short-circuited and the lead from being corroded even when the lead passes under the electronic component element.

[0012]

According to an electronic component of the present invention, an electronic component in which a semiconductor chip is mounted on a lead frame and the semiconductor chip is molded with a resin is provided on a lead portion located outside the resin molded portion. at least the with the electrode portion for mounting the component devices formed with a space from each other, by pouring the resin used for the resin molding between the electrode portions, connecting holding the electrode portion
The surface of the lead portion other than the electrode portion is covered with the resin used for the resin molding at a portion passing between the electrode portions.

In the first module structure of an electronic component according to the present invention, an electronic component element is mounted on the electrode portion of the electronic component, and an electrode of the electronic component element is joined to the electrode portion by a conductive substance. It is characterized by:

Further, a second module structure of an electronic component according to the present invention is characterized in that a plurality of the electronic components having electronic component elements mounted on the electrode portions are mounted on a substrate.

Further, a third module structure of an electronic component according to the present invention is characterized in that the electronic component having an electronic component element mounted on the electrode portion is sealed in a resin.

[0016]

In the module structure of the first electronic component of the electronic component and the invention of the present invention, by pouring the resin used for the resin molding between the electrode portions for mounting an electronic component element, between electrode portions Is connected and held, the strength of the electrode portion on which the electronic component is mounted is increased, and it is possible to prevent the electrode portion from being deformed or dropped when the lead portion is bent.

In addition, it passes at least between the electrodes.
Since the surface of the lead portion other than the electrode portion is covered with the resin used for resin molding at the location, the lead portion at a position overlapping the electronic component element is insulated from the electronic component element by the resin, and the mounting position of the electronic component element is slightly shifted. Even if the amount of the conductive material for connection such as solder is too large, a short circuit between the electronic component element and the electrode portion can be prevented.
Further , since the lead portion is covered with the molding resin at the above-mentioned location, there is no possibility that the lead portion is corroded by moisture, corrosive gas or the like. Furthermore, since the lead part is covered with molding resin, even if the flux in the solder remains,
It is possible to prevent a decrease in reliability such as corrosion due to flux residue and a decrease in leak current due to long-term use.

Further, in the module structure of the second electronic component of the present invention, since a plurality of electronic components each having the electronic component element mounted on the electrode portion are mounted on the substrate, the mounting area of the electronic component element is reduced. It is possible to improve the mounting density on the substrate without taking it up.

Further, in the module structure of the third electronic component of the present invention, the electronic component on which the electronic component element is mounted is sealed in the resin, so that the operating life can be extended, and There is an advantage that there is no danger of electric shock even when touched by a person, and no short circuit occurs even when a conductive material such as metal contacts.

[0020]

Embodiments of the present invention will be described below in detail. In the description of the present invention, the same reference numerals are applied to portions having the same functions as those of the conventional example shown in FIGS. 1 to 6 and the previously proposed examples shown in FIGS.

FIGS. 9A and 9B are a plan view and a sectional view showing an electronic component 21 according to an embodiment of the present invention. In this electronic component 21, a plurality of leads 4 a, 4 b, 15, etc. emerge from a molded part 9 in which a semiconductor chip 2 die-bonded on a mount pattern 3 is sealed with a molding resin 7. That is, 4a and 4b are leads for mounting the electronic component 21 on a circuit board or the like, 5a and 5b are electrode patterns for mounting an electronic component element 12 such as a chip resistor or a chip capacitor, and 15 is an electrode pattern 5a or 5b. Leads routed between them. In a region including a space between the electrode patterns 5a and 5b near the electrode patterns 5a and 5b for mounting the electronic component element 12, the same molding resin 7 as the molding portion 9 is filled at the same time when the molding portion 9 is molded. The leads 15 between the electrode patterns 5a, 5b and the molded portion 9 are entirely covered with the molding resin 7 in the vicinity of the electrode patterns 5a, 5b. In particular, in this embodiment, as shown in FIG. 9B, the thickness of the lead 15 is thin, and the surface of the lead 15 is
The thickness of the molding resin 7 is larger than the surface of the lead 15 because the molding resin 7 is recessed from the surfaces of the leads a and 4b.

FIG. 10 shows a module 22 composed of the electronic component 21 and the chip-shaped electronic component 12.
And the exposed electrode pattern 5 of the electronic component 21
The electronic component element 12 is placed between the electrodes a and 5b, and each electrode 16 of the electronic component element 12 is connected and fixed to the electrode patterns 5a and 5b with a conductive substance such as solder or a conductive adhesive 13.

Accordingly, since the electrode patterns 5a and 5b for mounting the electronic component elements 12 are connected and held by the molding resin 7, the strength of the electrode patterns 5a and 5b for mounting the electronic component elements 12 is increased, and the leads are formed. 4a, 4b
It is possible to prevent the electrode patterns 5a, 5b from being deformed or falling off during the bending process. In addition, the leads 15 wired under the electronic component element 12 are covered with the molding resin 7, and the lower surface of the electronic component element 12 and the leads 15 are insulated by the molding resin 7.
Even if the mounting position of the electronic component element 12 is slightly shifted, there is no possibility that the electrode 16 of the electronic component element 12 and the lead 15 are short-circuited. Also, even if the amount of the solder or the conductive adhesive 13 is too large, the solder or the conductive adhesive 13 does not go around the leads 15 and the electronic component element 12 can be formed without subjecting the lead frame 1 to a special shape processing. And the lead 15 can be prevented from being short-circuited. Further, since the leads 15 are covered with the molding resin 7, there is no possibility that the leads 15 are corroded by moisture, corrosive gas or the like. Further, even if flux is left after soldering using a solder containing flux, the lead 15 is covered with the molding resin 7 so that corrosion due to the flux residue and reduction in leak current due to long-term use are reduced. Such a decrease in reliability can be prevented. Further, since the thickness of the molding resin 7 on the surface of the lead 15 on the side of the electronic component element 12 is increased, the withstand voltage between the electronic component element 12 and the lead 15 is increased.

FIGS. 11A and 11B are views showing steps for manufacturing the electronic component 21 as shown in FIG. FIG.
(A) is a lead frame 41 for obtaining the electronic component 21. The diver 6 a allows the molding resin 7 to flow out of the gap 10 to the electrode patterns 5 a, 5 b and the leads 15 during molding of the molding portion 9. A notch 42 is provided. The thickness of the lead 15 passing between the electrode patterns 5a and 5b is small as described above. Then, after the semiconductor chip 2 is die-bonded on the mount pattern 3 and the wire 8 is bonded between the semiconductor chip 2 and the lead 4a, the lead frame 41 is placed in a mold and the semiconductor chip 2 is sealed. When the molding part 9 is molded with the molding resin 7 in such a manner, the molding resin 7 flows between the divers 6a and 6b, and as shown in FIG.
The molding resin 7 flows out from the notch 42 and is filled between the electrode patterns 5a and 5b, and the molding resin 7 connects and holds the electrode patterns 5a and 5b. At the same time,
The leads 15 are entirely covered with the flowing molding resin 7. Thereafter, the diver 6 connecting the leads 4a
The electronic component 21 as shown in FIG. 9 is manufactured by cutting the a and the leads 4a and 4b by punching and cutting the excess molding resin 7.

FIG. 12A is a cross-sectional view (a plan view is the same as FIG. 1A) of an electronic component 23 according to another embodiment of the present invention, and FIG. It is sectional drawing which shows the module product 24. In this embodiment, the lead 15 passing between the electrode patterns 5a and 5b for mounting the electronic component element 12 is made thinner, and the front and back surfaces of the lead 15 are recessed from the other leads 4a and 4b. Is formed with a thick layer of the molding resin 7. In the module product 24 configured using such an electronic component 23, the electronic component element 12 can be mounted on both the front and back surfaces of the electrode patterns 5a and 5b as shown in FIG.

FIGS. 13A and 13B are sectional views showing an electronic component 25 and a module product 26 according to still another embodiment of the present invention. In this embodiment, the thickness of the lead 15 passing between the electrode patterns 5a and 5b for mounting the electronic component element 12 is the same as that of the other leads 4a and 4b. The thickness is made larger than the thickness of the lead frame 1 so that the entire front and back surfaces of the leads 15 are covered with the molding resin 7 and a layer of the molding resin 7 having a large thickness is formed on the surface side of the leads 15. Therefore, as shown in FIG. 13B, the module component 26 can be formed by mounting the electronic component element 12 on one side of the electronic component 25.

FIGS. 14A and 14B are cross-sectional views showing an electronic component 27 and a module product 28 according to still another embodiment of the present invention. Also in this embodiment, the thickness of the lead 15 is made equal to the thickness of the other leads 4a, 4b, and the molding thickness of the molding resin 7 on both the front and back sides of the lead 15 is made larger than the thickness of the lead frame 1. In this case, a layer of the molding resin 7 having a large thickness is formed. Therefore, as shown in FIG.
The electronic component element 12 can be mounted on both sides to form a module product 28. Also, by increasing the thickness of the layer of the molding resin 7 on both the front and back surfaces of the lead 15 in this manner,
The dielectric strength voltage can be improved even in a use atmosphere with a lot of water.

FIG. 15 shows a module product 29 (for example, FIG. 14) in which the electronic component element 12 is mounted on the electrode patterns 5a and 5b.
The module product 28) shown in (b) is put in a case 30 made of metal, plastic, or the like, and the module product 29 and the case 3 are put together.
This is a module product 32 with a case that is filled with a mold resin 31 and integrated. Thus, the case 30
Module product 32 which is put in
Has the advantages that the operating life can be extended, there is no danger of electric shock even if anyone touches it, and there is no short circuit even if it comes into contact with a conductive material.

Although not shown, the module product 29 can be placed in a mold and molded with the molding resin 31 to obtain a resin-molded module product in which the case 30 is omitted.

FIG. 16 shows a module product 33 of still another electronic component. The leads 4a and 4b of the module product 29 are passed through through holes 35 of the module board 34, and the plurality of module products 29 are connected to the module board. 34
The leads 4a and 4b are joined by solder 36, and a predetermined wiring is provided between the module products 29 by a wiring pattern (not shown) of the module substrate 34. Module product 29 on which electronic component element 12 is mounted as described above.
Is mounted vertically on the module substrate 34, the electronic component element 12 does not need to be mounted on the module substrate 34, so that the mounting area can be reduced, and a high-density mounting type module product 33 is obtained. be able to. In addition, since it is not necessary to bend the leads 4a and 4b of the module product 29, the mounting operation becomes easy and the leads 4a and 4b
When the electronic component element 12 is bent in bending the electrode pattern 5b,
Also, it does not fall off from a and 5b.

FIG. 17 shows still another module product 37. The module product 33 shown in FIG.
8, the space between the module 33 and the case 38 is filled with a mold resin 39 and integrated. This embodiment also has the advantages that the operating life can be extended, there is no danger of electric shock even if anyone touches it, and there is no short circuit even if it comes into contact with a conductive material. Also in this embodiment, the case 38 may be omitted and the resin molding may be performed only with the molding resin 39.

[0032]

According to the electronic component and the module structure of the electronic component of the present invention, since the connection between the electrode portions is held by the resin, the strength of the electrode portion on which the electronic component element is mounted increases, and the bending of the lead portion is increased. It is possible to prevent the electrode portion from being deformed or falling off during processing.

Further, since the surface of the lead portion other than the electrode portion is covered with the resin used for resin molding in the vicinity of the electrode portion, the lead portion at a position overlapping the electronic component element is insulated from the electronic component element by the resin, and Even if the mounting position of the element is slightly shifted or the amount of the conductive material for connection such as solder is too large, short circuit between the electronic component element and the lead portion can be prevented. Further, there is no possibility that the lead portion is corroded by moisture, corrosive gas, and the like, and further, corrosion due to the residue of the solder flux and a decrease in leak current due to long-term use can be prevented.

In the module structure of an electronic component in which a plurality of electronic components are mounted on a substrate, a plurality of electronic components in which the electronic component is mounted on the electrode portions are mounted on the substrate. The mounting density on the substrate can be improved without requiring a mounting area on the substrate.

In the module structure of an electronic component in which an electronic component is sealed with a resin together with an electronic component element, the electronic component on which the electronic component element is mounted is sealed in a resin, so that the operating life can be extended. There is an advantage that there is no danger of electric shock even if anyone touches, and there is no short circuit even if a conductive material comes into contact.

[Brief description of the drawings]

FIG. 1 is a plan view showing a structure of a conventional electronic component, showing a state where a semiconductor chip is mounted on a lead frame.

FIG. 2 is a plan view showing a state after a molding section has been transfer-molded from the state shown in FIG. 1;

FIG. 3 is a plan view showing a state after the electronic components are individually separated from the lead frame in a state where the transfer molding is performed in FIG. 2;

FIG. 4 is a plan view showing another structure of a conventional electronic component, showing a state after transfer molding.

FIG. 5 is a plan view showing a state in which electronic components are individually separated from the lead frame in a state where the transfer molding of FIG. 4 is performed.

6 is a side view showing a state where the electronic component shown in FIG. 5 is mounted on a substrate.

FIGS. 7A and 7B are a plan view and a cross-sectional view showing a structure of an electronic component proposed prior to the present invention.

FIGS. 8A and 8B are a plan view and a cross-sectional view showing a state where an electronic component element is mounted on the electronic component of FIG. 7;

FIGS. 9A and 9B are a plan view and a cross-sectional view of an electronic component according to an embodiment of the present invention.

FIG. 10 is a cross-sectional view illustrating a module product in which an electronic component element is mounted on the electronic component according to the first embodiment.

11A is a plan view showing a lead frame for obtaining the electronic component, and FIG. 11B is a plan view showing a state in which a molded portion is formed by transfer-molding a semiconductor chip mounted on the lead frame. It is.

12A is a cross-sectional view illustrating an electronic component according to another embodiment of the present invention, and FIG. 12B is a cross-sectional view illustrating a module product in which an electronic component element is mounted on the electronic component.

13A is a cross-sectional view illustrating an electronic component according to still another embodiment of the present invention, and FIG. 13B is a cross-sectional view illustrating a module product in which an electronic component element is mounted on the electronic component.

14A is a cross-sectional view illustrating an electronic component according to still another embodiment of the present invention, and FIG. 14B is a cross-sectional view illustrating a module product in which an electronic component element is mounted on the electronic component.

FIG. 15 is a sectional view showing a module product of an electronic component according to still another embodiment of the present invention.

FIG. 16 is a sectional view showing a module product of an electronic component according to still another embodiment of the present invention.

FIG. 17 is a sectional view showing a module product of an electronic component according to still another embodiment of the present invention.

[Explanation of symbols]

 2 Semiconductor chip 4a, 4b, 15 Lead 5a, 5b Electrode pattern 7 Molding resin 9 Molding part 12 Electronic component element 13 Solder or conductive adhesive 31 Mold resin 34 Module substrate 41 Lead frame

────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Eiichi Omura 10 Okado Dodocho, Ukyo-ku, Kyoto-shi, Kyoto Omron Corporation (56) References JP-A-59-197157 (JP, A) JP-A-63 -273340 (JP, A) JP-A-61-147559 (JP, A) JP-A-55-42350 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/28, 23 / 50,21 / 56

Claims (4)

(57) [Claims] 1. A mounting a semiconductor chip on a lead frame, the semiconductor chip electronic components were molded, the electrode portion for mounting the electronic component element to the lead portion located outside the resin molded parts each other A space is formed, and the resin used for the resin molding is poured between the electrode portions, thereby connecting and holding the electrode portions and at least a portion passing between the electrode portions, except for the electrode portions. An electronic component, wherein a surface of a lead portion is covered with a resin used for the resin molding. 2. The electronic component according to claim 1, wherein an electronic component element is mounted on the electrode portion of the electronic component, and an electrode of the electronic component element is joined to the electrode portion by a conductive material. Module structure. 3. A module structure for an electronic component, wherein a plurality of electronic components according to claim 1, wherein an electronic component element is mounted on said electrode portion, are mounted on a substrate. 4. A module structure for an electronic component, wherein the electronic component according to claim 1, wherein an electronic component element is mounted on the electrode portion, is sealed in a resin.