JP2912813B2 - Electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which a lead frame on which a semiconductor element is mounted is resin-sealed.
More specifically, the present invention relates to a position of a lead terminal for surface mounting formed on an electronic component.

[0002]

2. Description of the Related Art Conventional surface mount electronic components are, for example, 3
In the terminal transistor, as shown in FIG. 4, the electronic component 10 includes a semiconductor element 15 mounted on an island portion (not shown) formed on a collector lead 12 made of copper so as to be electrically conductive. The emitter lead 11 and the base lead 13 also made of copper are connected by a well-known wire bonding method using a bonding wire 16 made of gold, and the side of the resin sealing portion 14 is sealed with a sealing resin such as an epoxy resin. It has been manufactured by sealing with a well-known molding method so that the three surface mounting lead terminals are led out facing each other.

The electronic component 10 is mounted using a circuit pattern 17 formed by etching gold or the like on the surface of a substrate 18 made of glass-epoxy resin or the like, and solder (not shown). .

[0004]

In recent years, electronic devices using electronic components have been rapidly required to be miniaturized and highly functional.
2. Description of the Related Art High integration of substrates used for electronic devices has been promoted. In order to reduce the size of a substrate used in an electronic device, electronic components mounted on the substrate tend to be highly integrated, and it is required to reduce the external dimensions of the electronic component.

[0005] In general, substrates used for electronic equipment include:
In addition to two-terminal chip-type electronic components such as resistors and capacitors, three-terminal chip-type electronic components such as transistors and diodes are also mounted. In the conventional three-terminal chip-type electronic component, taking a transistor as an example, as shown in FIG. 4, the collector lead 12, the emitter lead 11, and the base lead 13 of the electronic component 10 are resin-sealed with the electronic component 10. It is derived from the face of the part 14.

Therefore, the hatched portion in FIG. 4 is also an area required for mounting the electronic component 10, and the electronic component 1
In addition to the fact that the size of the substrate 18 cannot be reduced, there is a problem that an empty area where the circuit pattern 17 cannot be arranged is formed on the surface of the substrate 18, so that high-density mounting of the substrate 18 cannot be achieved. Further, as shown in FIG. 5, when the electronic component 10 is mounted on the board 18, a space is generated between the electronic component 10 and the board 18, and an empty area having substantially the same area as the electronic component 10 is formed on the board 18. This causes a problem that high-density mounting of the substrate 18 cannot be achieved.

[0007] The present invention solves the above problems.
It is an object to provide an electronic component capable of high-density mounting.

[0008]

In order to solve the above problems, an electronic component according to the present invention comprises a lead frame on which a semiconductor element is mounted and at least two lead frames electrically connected to the semiconductor element by wires. Electronic component having a lead frame, a resin sealing portion for sealing the semiconductor element and a part of the lead frame, and a surface mounting lead terminal formed by a lead frame derived from the resin sealing portion. A lead terminal for surface mounting formed by a lead frame on which the semiconductor element is mounted is led out from the bottom surface of the resin sealing portion, and the lead terminal for surface mounting and another lead terminal for surface mounting are viewed in plan. It is characterized by being arranged on a substantially straight line.

[0009]

According to the above configuration, the number of lead terminals led out from the side surface of the resin sealing portion of the electronic component is reduced.

As a result, the outer dimensions of the entire electronic component can be reduced, and the electronic component can be mounted on a substrate with a smaller area than in the past. Furthermore, when the lead terminals are led out facing each other, the lead terminals led out of the three-terminal electronic component are arranged substantially in a straight line, and have the same leading direction as the lead terminals of the two-terminal electronic component.

As a result, the circuit patterns on the substrate can be aligned in the same direction, and no free space is generated on the substrate due to the crossing of the circuit patterns. It becomes possible. And
Since the lead terminals are led out from the bottom surface of the electronic component, the electronic component is mounted on the board, so that the area of the board that has been a free space below the electronic component can be used. High-density mounting becomes possible.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view showing an embodiment in which the electronic component of the present invention is mounted on a substrate. In the figure, the electronic component 1 of the present invention is manufactured by the following process. A lead frame (not shown) made of copper has an emitter lead 2 and a base lead 4 formed with a collector lead 3 interposed therebetween. The semiconductor element 6 is connected to the collector lead 3 of the lead frame by a known die bonding method. Is mounted so as to be electrically connected to the collector lead. An electrode (not shown) of the semiconductor element 6 is connected to the emitter lead 2 and the base lead 4 of the lead frame by a bonding wire 7 made of gold by a known wire bonding method. In order to protect the connection portions of the respective lead terminals connected to the semiconductor element 6 and the bonding wires 7, the respective lead terminals are led out to the outside by using a well-known sealing method with, for example, an epoxy-based sealing resin. Thus, the resin sealing portion 5 is formed. After being sealed with the resin, each lead terminal led out from the resin sealing portion 5 is formed by a known method, and each lead terminal is molded to manufacture the electronic component 1.

In the above embodiment, the semiconductor element 6 has one
Although two transistor chips are used, when two diode chips are used, it is possible to manufacture a transistor having two characteristics with one electronic component. Then, on the surface of the substrate 9 made of glass-epoxy resin,
A circuit pattern 8 made of gold is formed by patterning by etching. The circuit pattern 8 is connected to each lead terminal of the electronic component 1 by solder (not shown).

FIG. 2 is a plan view showing another embodiment of the present invention. In the figure, an electronic component 1 is manufactured by a well-known process similarly to the electronic component of the embodiment of FIG. 1, but a lead frame (not shown) made of copper is sandwiched between a collector lead 3 and an emitter lead 2. And the base lead 4 are formed so as to face each other. As a result, as is apparent from FIG. 2, although the electronic component of the present invention has three terminals, the lead-out direction of the two-terminal electronic component is the same as that of the conductor lead terminal. 1
When mounting is performed, it is not necessary to form the bending of the circuit pattern 8 formed by the difference between the lead-out direction of the conductor leads of the electronic component 1 and the drawing direction of the circuit pattern 8,
The free space generated in the substrate 9 due to the bending of the circuit pattern 8 is reduced, and high-density mounting of the substrate is possible.

Further, when forming a circuit pattern on a substrate, the circuit pattern is not affected by the direction in which the lead terminals of the electronic components are led out, so that the circuit pattern can be standardized and a substrate used in electronic equipment can be obtained. Design becomes easier.
Compared with the conventional electronic component, the electronic component of the present invention can reduce the area required for mounting the substrate by about 30% in a plan view.

FIG. 3 is a side view showing an embodiment in which the electronic component of the present invention is mounted on a substrate. In the figure,
Circuit pattern 8 of substrate 9 and resin sealing portion 5 of electronic component 1
Are connected to the emitter lead 2 and the base lead 4 which are led out from the side surfaces by solder (not shown). Further, the collector lead 3 is bent and led out from the bottom surface of the resin sealing portion 5 and is connected to the circuit pattern 8 by solder (not shown).

As a result, the electronic component 1 can be connected to the circuit pattern 8 even on the bottom surface of the electronic component 1. Since it can be used, further high-density mounting of the substrate is possible. Further, in the above embodiment, the collector lead 3 is formed to be bent. However, when the collector lead 3 is led out from the bottom without bending, the length of the collector lead 3 on which the semiconductor element 6 is mounted becomes shorter than in the conventional case. Has the same function as the heat sink, and the heat resistance of the electronic component 1 is also improved.

Furthermore, in the above two embodiments, only one of the lead terminals led out from the resin sealing portion 5 of the electronic component 1 is led out from the back surface. The number of lead terminals to be led out is not limited to one. When all the lead terminals are led out from the back surface of the resin sealing portion 5 so that the lead terminals do not protrude from the back surface, the electronic component 1 The area required for mounting is minimized with respect to the area of the resin sealing portion 5 in plan view.

Although the electronic component of the present invention is formed and mounted with the above configuration, the above embodiment is one embodiment of the present invention, and the present invention is not particularly limited thereto.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a mounted state of an electronic component of the present invention.

FIG. 2 is a plan view showing another embodiment of the mounting state of the electronic component of the present invention.

FIG. 3 is a side view of another embodiment of the mounting state of the electronic component of the present invention.

FIG. 4 is a plan view showing one embodiment of a conventional electronic component mounting state.

FIG. 5 is a side view showing one embodiment of a conventional electronic component mounting state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Emitter lead 3 ... Collector lead 4 ... Base lead 5 ... Resin sealing part 6 ... Semiconductor element 7 ... Bonding Wire 8 Circuit pattern 9 Substrate 10 Electronic component 11 Emitter lead 12 Collector lead 13 Base lead 14 Resin sealing 15 Semiconductor element 16: bonding wire 17: circuit pattern 18: substrate

Claims (1)

(57) [Claims] 1. A lead frame on which a semiconductor element is mounted.
And a small number electrically connected to the semiconductor element by a wire.
At least two lead frames, the semiconductor element and the lead
Resin sealing portion for sealing a part of the frame, and the resin sealing portion
Of the surface formed by the lead frame derived from
An electronic component having a mounting lead terminal;
Table formed by the lead frame on which the body element is mounted
When the lead terminals for surface mounting are derived from the bottom of the resin sealing part
Both the surface mounting lead terminals and other surface mounting leads
Are arranged on a substantially straight line in plan view.
Electronic components.