JP3469227B2 - Manufacturing method of multiple chip electronic components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing three or more multiple chip electronic components such as multiple chip resistors and multiple jumper chips. 2. Description of the Related Art There are various types of multiple-chip electronic components. For example, Japanese Patent Application Laid-Open Nos. Sho 52-135048, 62-256406, and Sho 61-61 show the prior art.
142402, Heikai 1-156509, Shokai 6
No. 3-155270 and Japanese Utility Model Application Laid-Open No. 63-3070. FIG. 5A shows, as an example of a multi-chip electronic component, a multi-chip manufactured by a conventional method (here, 2
3) shows a chip resistor. This chip resistor 2
In 1, resistors 25, 25 are formed on a ceramic substrate 22 and covered with an overcoat layer 26. On the side surface of the ceramic substrate 22, side electrodes 27,..., 27 connected to the resistors 25, 25 are formed. Adjacent side electrodes 27 are separated by cutouts 23 (through holes are divided). The above-mentioned conventional multiple chip electronic component is positioned between a pair of positioning guides 28, 28 as shown in FIG. 5B, and mounted on a printed circuit board. However, since the notch 23 'is located at the corner of the ceramic substrate 22, there is a problem that the notch 23' is sandwiched between the guides 28, 28 in an inclined state as shown in FIG. Further, there is a problem that even if an attempt is made to perform positioning by optical means, for example, a video camera or the like, there is no sharp feature point and positioning is difficult. On the other hand, in the conventional multiple chip electronic component, the area of each side electrode 27 cannot be made large, and thus there is a problem that the adhesion to the printed circuit board is poor. Further, the side electrode 27 is formed by plating solder or nickel, but there is a problem that the plating property is inferior. Such problems are also found in the above prior art, but at present there is no description or suggestion of these problems, and no solution has been taken at present. Of course, the same applies to a multiple chip element of three or more. SUMMARY OF THE INVENTION The present invention has been made in view of the above, and has as its object to facilitate positioning and to improve fixability and plating property. In order to achieve the above object, a method of manufacturing a multiple chip electronic component according to the present invention comprises: disposing three or more side electrodes on a pair of opposing side surfaces; A method for manufacturing a multiple chip electronic component in a rectangular shape obtained by separating a plurality of notches by a notch, wherein, among the vertical and horizontal slits that partition the ceramic substrate into each rectangular electronic component,
Of the through holes positioned at substantially constant intervals including the intersection of the vertical and horizontal slits in a pair of opposed slits, a through hole is formed other than on the intersection of the slits, and this ceramic substrate is formed into a slit formed with a through hole. By dividing the rectangular electronic component into squares by providing side electrodes on the side surfaces of the strip-shaped substrate after the division, and then dividing the rectangular electronic component along other slits. The area of the side electrode located at a position other than the four corners is larger than the area of the side electrode located at the four corners.
According to this manufacturing method, since the corners of the four corners of the multiple-chip electronic component are set to be right angles, the right-angled corners can be recognized as sharp feature points. Part positioning can be facilitated.
In addition, since the area of the side electrodes located at the four corners is large, the fixability and the plating property can be improved. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Here, a triple chip resistor is taken as a multiple chip electronic component, and FIGS. 1A and 1B are external perspective views of the triple chip resistor 1 and Ib-Ib lines, respectively. FIG. The planar shape of the ceramic substrate 2 is rectangular. Two notches 3, 3 are formed on both side surfaces 2c, 2c of the ceramic substrate 2, respectively. Electrodes 4,..., 4 are formed on the surface 2a of the ceramic substrate 2 so as to be in contact with the side surface 2c, and these electrodes 4, 4 are divided by notches 3, 3. A resistor 5 is formed so as to extend between the electrodes 4 and 4. These resistors 5 are covered and protected by an overcoat layer 6. on the other hand,
The side surface 2c of the ceramic substrate 2 has a front surface 2a and a back surface 2b.
The side surface electrode 7 is formed so as to also go around. The side electrode 7 includes a thick-film electrode 7a formed by printing and baking a conductive paste, and a plating layer 7b formed by plating solder or nickel. Since the ceramic substrate 2 is rectangular, the corners of the side electrodes 7 are also right angles. That is, the corners of the four corners of the chip resistor 1 are right angles. The side electrode 7 includes a side surface 2c, a front surface 2a, and a back surface 2a.
Both b are formed up to right angles. As is clear from FIG. 1A, the width of the side electrodes 7 at the four corners in the juxtaposition direction of the side electrodes 7 is the same as that of the side electrodes 7 located at positions other than the four corners (center portion). Wider than width. That is, of the side electrodes 7 formed on the surface 2 a of the ceramic substrate 2, the width in the juxtaposition direction (the cross direction of the resistor 5) of the four corners is the same as that of the center part. The area of the side electrode 7 at the four corners is wider than the width in the installation direction (the transverse direction), and is larger than the area of the other side electrodes 7. Next, a manufacturing process of the triple chip resistor 1 of this embodiment will be described with reference to FIGS. First,
A large ceramic substrate 12 is prepared, and as shown in FIG. 2A, a through hole 13 is formed and slits 14 and 15 are formed to partition the surface of the ceramic substrate 12. Next, a conductive paste is screen-printed in each section and fired to form electrodes 4 and 4. Further, the resistor paste is screen-printed and baked to form the resistor 5 (see FIG. 2B). The resistance of the resistor 5 is adjusted by, for example, laser trimming so that the resistance thereof becomes a predetermined value. A glass paste is screen-printed on the ceramic substrate 12 and baked to form the overcoat layer 6 in each section. In this state, the ceramic substrate 12 is broken along the slit 14 to form a strip-shaped ceramic substrate 12 '(see FIG. 3A). A conductive paste is attached to the side surface 2c of each ceramic substrate 12 ', and the paste is fired to form the thick film electrode 7a. Further, the surface of the thick film electrode 7a is plated with solder or nickel to form a plating layer 7b, which is used as a side electrode 7 (see FIG. 3B). Finally, the triple chip resistor 1 is completed by breaking along the slit 15. As shown in FIG. 1C, the triple chip resistor 1 of this embodiment is sandwiched and positioned between the guides 8, 8, but is held in an inclined state because the corners are right angles. Never. In addition, since a right angle can be recognized as a sharp feature point, positioning can be performed by, for example, optical processing. Also, since the area of the side electrode 7 at the four corners is larger than the area of the other side electrodes 7, the area connected to the soldering pads on the printed circuit board by soldering becomes large, and the adhesion to the printed circuit board is reduced. Get higher. Further, since the area of the side electrode 7 at the four corners is large, the formation of the plating layer 7b is also facilitated. In the above-described embodiment, a triple chip resistor is described. However, the present invention can be applied to a quad chip resistor 1 'as shown in FIG. The present invention is not limited to resistors, but also includes various types of capacitors, jumpers and the like.
It can be applied to multiple chip electronic components of more than two. As described above, according to the method of manufacturing a multiple chip electronic component of the present invention, the corners of the four corners of the multiple chip component are right angles, and the widths of the side electrodes at the four corners are increased. Is wider than the widths of the side electrodes other than the four corners, so that the right-angled corners (ie, the four corners of the electronic component) can be easily recognized, the positioning can be performed accurately and easily, and the printed circuit board can be easily mounted. Can be improved, and the plating property at the time of manufacturing can be improved. Further, when the mounting position of the multiple chip electronic component is recognized by the method of manufacturing a multiple chip electronic component according to the present invention, the corners of the four corners of the electronic component are set to be right angles. The part can be recognized as a sharp feature point, and by recognizing a right angle, positioning of the electronic component can be facilitated. In addition, since the area of the side electrodes located at the four corners is large, the fixability and the plating property can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external perspective view of a triple chip resistor according to an embodiment of the present invention, FIG. 1 (a), a cross-sectional view along line Ib-Ib of FIG. 1 (a), and FIG. FIG. 8C is a diagram illustrating a state where the continuous chip resistor is positioned by the positioning guide. FIG. 2 is a view illustrating a manufacturing process of the triple chip resistor. FIG. 3 is a diagram illustrating a manufacturing process following FIG. 2; FIG. 4 is an external perspective view of a quad chip resistor according to another embodiment. 5A and 5B are an external perspective view of a conventional dual chip resistor according to a conventional example and a diagram illustrating a state in which the conventional dual chip resistor is correctly positioned. FIG. 6 is a diagram illustrating a state in which the dual chip resistor is positioned at an angle. [Description of Signs] 1 Triple chip resistor (multiple chip electronic component) 2 Ceramic substrate 2a Ceramic substrate front surface 2b Ceramic substrate back surface 2c Ceramic substrate side surface 3 Notch 7 Side electrode

Claims (1)

(57) [Claims 1] Each of the pair of opposing side surfaces has three side electrodes.
Arranged above, a method for manufacturing a multiple chip electronic component in a rectangular shape formed by separating adjacent side electrodes by notches, wherein, among the vertical and horizontal slits that partition the ceramic substrate into each rectangular electronic component, Of the through holes positioned at substantially constant intervals including the intersection of the vertical and horizontal slits in a pair of opposed slits, a through hole is formed other than on the intersection of the slits, and this ceramic substrate is formed into a slit formed with a through hole. By dividing the rectangular electronic component into squares by providing side electrodes on the side surfaces of the strip-shaped substrate after the division, and then dividing the rectangular electronic component along other slits. Wherein the area of the side electrode located at a position other than the four corners is larger than the area of the side electrode located at other than the four corners.