JPH0731556Y2 - Flexible flexible printed wiring board - Google Patents
Flexible flexible printed wiring boardInfo
- Publication number
- JPH0731556Y2 JPH0731556Y2 JP1990084153U JP8415390U JPH0731556Y2 JP H0731556 Y2 JPH0731556 Y2 JP H0731556Y2 JP 1990084153 U JP1990084153 U JP 1990084153U JP 8415390 U JP8415390 U JP 8415390U JP H0731556 Y2 JPH0731556 Y2 JP H0731556Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- flexible
- intermittent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は伸縮可能な可撓性印刷配線板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a flexible printed wiring board that is expandable and contractible.
（従来の技術） 完成した可撓性印刷配線板としては外形寸法が固定して
いるので、特に厚みが薄く、可撓性の高いものであっ
て、基板上に形成される回路パターン集積密度が高く、
さらに組付け回路端子間の累積ピッチ寸法に高い精度が
要求される可撓性印刷配線板にあっては、これらの要求
にそうため、従来は下記の手法を用いて出来る限り、あ
らかじめ決められた外形寸法に近い可撓性印刷配線板を
製造していた。(Prior Art) Since the outer dimensions of the completed flexible printed wiring board are fixed, it is particularly thin and highly flexible, and the circuit pattern integration density formed on the substrate is high. high,
Furthermore, in the case of a flexible printed wiring board that requires high accuracy in the cumulative pitch dimension between the assembled circuit terminals, in order to meet these requirements, conventionally, the following method was used to determine in advance as much as possible. Manufactured flexible printed wiring boards that were close to the external dimensions.
回路パターンの形成を精度の高いプリント法で行な
う。The circuit pattern is formed by a highly accurate printing method.
製造工程中に起きる収縮等の寸法変化を予想して設
計寸法を補正する。Design dimensions are corrected in anticipation of dimensional changes such as shrinkage that occur during the manufacturing process.
出来るだけ寸法変化の小さい材料を使用する。 Use materials with the smallest possible dimensional change.
第３図は従来の可撓性印刷配線板の一例の説明図で、同
図（イ）は上面図、同図（ロ）は（イ）図のＸ−Ｘ断面
図、同図（ハ）は（イ）図の１回路導体群の拡大詳細図
である。FIG. 3 is an explanatory view of an example of a conventional flexible printed wiring board, FIG. 3 (A) is a top view, FIG. 3 (B) is a sectional view taken along line XX of FIG. FIG. 3B is an enlarged detailed view of one circuit conductor group in FIG.
図面において、（１）はベースフイルム、（２）は銅
箔、（３）はカバーレイフイルム、（４）は回路導体、
（５）は回路導体群である。In the drawings, (1) is a base film, (2) is a copper foil, (3) is a coverlay film, (4) is a circuit conductor,
(5) is a circuit conductor group.
本可撓性印刷配線板は、一例として図中（Ｐ）で示され
る寸法が260.5±0.1mmと、寸法精度がきびしく要求され
る製品であって、回路パターンはフォトプリント法によ
っている。製品には全長（Ｌ）270mm、幅（Ｗ）25mm
で、同図（ハ）に示すように、回路幅0.2mmの導体
（４）が0.5mmのピッチで50個平行に並べられた回路導
体群（５）を１ブロックとして、隣のブロックとの間隔
5mmで全部で９ブロック（No.1〜No.9）が配置されてい
る。なお、ベースフイルム（１）及びカバーレイフイル
ム（３）は厚み25μｍのポリイミドフイルム、銅箔
（２）は厚み35μｍ、回路導体（４）は厚み４〜６μｍ
のハンダメッキである。ベースフイルム（１）と銅箔
（２）及び銅箔（２）とカバーレイフイルム（３）との
間には接着剤が存在するが、図では省略してある。This flexible printed wiring board is a product that is strictly required to have a dimensional accuracy of 260.5 ± 0.1 mm as shown by (P) in the figure, and the circuit pattern is formed by a photo printing method. The product has a total length (L) of 270 mm and a width (W) of 25 mm
Then, as shown in (c) of the figure, a circuit conductor group (5) in which 50 conductors (4) having a circuit width of 0.2 mm are arranged in parallel at a pitch of 0.5 mm is defined as one block, interval
A total of 9 blocks (No. 1 to No. 9) are arranged in 5 mm. The base film (1) and the coverlay film (3) are 25 μm thick polyimide film, the copper foil (2) is 35 μm thick, and the circuit conductor (4) is 4 to 6 μm thick.
It is solder plating. Adhesives are present between the base film (1) and the copper foil (2) and between the copper foil (2) and the coverlay film (3), but they are omitted in the figure.
（解決しようとする課題） 一般に、可撓性印刷配線板の製造工程においては、ベー
スフイルムと銅箔の張り合せの際の加熱乾燥、カバーレ
イフイルムの張り合せの際の加圧加熱等の加熱や冷却、
エッチング、導体端子のメッキ等の化学変化による加
工、さらにはドリル孔明けやシェヤー剪断等の大きな外
力を受ける機械加工等の種々の加工工程を経て完成され
るが、ある種の製品においては、可撓性印刷配線板が実
装される装置の方からの制約で、可撓性印刷配線板の各
設計寸法の仕上り精度が上記加工に伴ない生ずるロット
間又はロット内の寸法変化と同一レベル程度にきびしく
要求されるものがある。(Problems to be solved) Generally, in the process of manufacturing a flexible printed wiring board, heating such as heating and drying when laminating the base film and the copper foil, and heating such as pressure heating when laminating the coverlay film are performed. And cooling,
It is completed through various processing steps such as etching, processing due to chemical changes such as plating of conductor terminals, and machining such as drilling and shearing, which are subject to large external forces. Due to the restrictions imposed by the device on which the flexible printed wiring board is mounted, the finishing accuracy of each design dimension of the flexible printed wiring board is at the same level as the dimensional change between lots or within the lot that occurs with the above processing. There are some demands.
このような場合、前述に記載の技術で対応していたが、
なお、不充分な場合には、経験から歩留を考慮して必要
量以上の数量を製作して、製品検査をきびしくすること
により、良品を選別して得ていた。In such a case, the technique described above was used,
In the case of insufficient quality, it was empirically considered that the yield was taken into consideration by manufacturing a quantity larger than the necessary quantity in consideration of the yield and making the product inspection severe.
（課題を解決するための手段） 本考案は上述の問題点を解消した伸縮可能な可撓性印刷
配線板を提供するもので、その特徴は、回路パターンに
なんら影響を及ぼさない位置において、配線板の幅方向
に平行な辺とこれに角度を有する辺により形成したスリ
ットを、それぞれ間隔をおいて平行に相対向せしめて配
置した間欠的なスリットを、基板の内部を通り基板の幅
方向に横断して設けて伸縮性を付与したことにある。(Means for Solving the Problems) The present invention provides an expandable and flexible printed wiring board which solves the above-mentioned problems, and is characterized in that wiring is provided at a position that does not affect the circuit pattern at all. The slits formed by the sides parallel to the width direction of the plate and the sides having an angle to the sides are arranged in parallel with each other, and the intermittent slits are arranged so as to face each other in the width direction of the substrate. The reason for this is that it was provided transversely to give elasticity.
（作用） 上述したように、本考案の可撓性印刷配線板にはおいて
は、基板の内部を通り基板の幅方向に横断する間欠的な
スリットを設けることにより、実装時にわずかな外力を
加えることにより、間欠スリットの方向と直交する方
向、即ち配線板の長手方向に微妙な伸縮が可能となり、
実装される相手部品へ適合することが出来る。(Operation) As described above, in the flexible printed wiring board of the present invention, a slight external force is applied at the time of mounting by providing an intermittent slit that passes through the inside of the substrate and crosses the width direction of the substrate. As a result, it is possible to slightly expand and contract in the direction orthogonal to the direction of the intermittent slit, that is, in the longitudinal direction of the wiring board.
It can be adapted to the mounted counterpart component.
（実施例） 第１図は本考案に係る可撓性印刷配線板の実施例の上面
図であり、第２図は間欠スリットの一例の説明図であ
る。なお、図面において第３図と同一記号は同一部位を
あらわしている。(Embodiment) FIG. 1 is a top view of an embodiment of a flexible printed wiring board according to the present invention, and FIG. 2 is an explanatory view of an example of an intermittent slit. In the drawings, the same symbols as those in FIG. 3 represent the same parts.
図面に示すように、配線板の回路パターンになんら影響
を及ぼさない位置、例えば回路導体群によって構成され
るブロック（５）とブロック（５）の間隔部において、
基板の内部を通って基板の幅方向に横断して間欠的なス
リット（６）を設けてある。As shown in the drawing, at a position that does not have any influence on the circuit pattern of the wiring board, for example, in the space between the block (5) and the block (5) formed by the circuit conductor group,
Intermittent slits (6) are provided through the inside of the substrate and across the width of the substrate.
上記間欠的なスリット（６）は第２図に示すように、配
線板の幅方向に平行な辺（61）と、これに角度（θ）を
有する辺（62）を有するスリットを図のようにそれぞれ
間隔（W1）及び（W2）を平行に相対向して配置して形成
されている。第２図の例においては、W1＝2mm、W2＝1m
m、l1＝4mm、l2＝2.5mm、l3＝1mm、θ＝130°に加工製
作された金型を用いて間欠スリット（６）を形成した。As shown in FIG. 2, the intermittent slit (6) is a slit having a side (61) parallel to the width direction of the wiring board and a side (62) having an angle (θ). At intervals of (W 1 ) and (W 2 ) in parallel with each other. In the example of FIG. 2, W 1 = 2 mm, W 2 = 1 m
Intermittent slits (6) were formed using a mold machined to have m, l 1 = 4 mm, l 2 = 2.5 mm, l 3 = 1 mm and θ = 130 °.
又本実施例では上記のような間欠スリット（６）を第１
図に示すように、回路導体群（５）の第３ブロックと第
４ブロックの間隔部及び第６ブロックと第７ブロックの
間隔部に設け、この２個所の間欠スリットで区切られた
３つのゾーンに等しく３つづつの導体ブロックに分割さ
れるようにした。Further, in this embodiment, the intermittent slit (6) as described above is firstly provided.
As shown in the figure, three zones are provided in the space between the third block and the fourth block and the space between the sixth block and the seventh block of the circuit conductor group (5) and are separated by these two intermittent slits. The conductor block is divided into three conductor blocks.
なお、接合相手部品との位置合わせ作業性の向上のため
に、間欠スリット（６）を施す外側縁部に第１図に示す
ようにＵ字形の切込み（７）を入れたり、配線板を伸ば
した時の耐引裂強度を増すために、第２図に示すように
スリットの加工端に適当な大きさの丸孔（８）を付加す
ると都合がよい。In order to improve the workability of aligning with the mating parts, a U-shaped cut (7) is made on the outer edge of the intermittent slit (6) as shown in FIG. 1 or the wiring board is extended. It is convenient to add a circular hole (8) of an appropriate size to the processed end of the slit as shown in FIG. 2 in order to increase the resistance to tearing.
上述した本実施例は一つの例示であって、本考案の精神
を逸脱しない範囲で、間欠スリットの形状、寸法や間欠
スリットを施す位置や数を適宜変形し得るのは勿論であ
る。The present embodiment described above is merely an example, and it is needless to say that the shape and size of the intermittent slits, the position and the number of the intermittent slits can be appropriately changed without departing from the spirit of the present invention.
（考案の効果） 以上説明したように本考案の可撓性印刷配線板によれ
ば、わずかな力を加えるだけで簡単に微妙な伸縮（実施
例の製品では最大0.5mm程度伸縮可能）が可能となるの
で、これを相手部品に接合する場合、微妙な寸法調整が
出来、従来きびしい寸法公差の厳守が必要であったもの
がかなり緩和される。(Effect of the device) As described above, according to the flexible printed wiring board of the present invention, it is possible to easily make a slight expansion / contraction (it is possible to expand / contract up to about 0.5 mm in the product of the embodiment) with a slight force. Therefore, when this is joined to the mating part, it is possible to make delicate dimension adjustment, and it is possible to relieve what was conventionally required to strictly adhere to strict dimensional tolerances.
その結果、製品の歩留りの向上が図れると共に、検査の
MHの減少も可能ならしめる。又実装の際の位置合わせに
要する時間が短縮され、作業性も向上する。As a result, product yield can be improved and inspection
If possible, reduce MH. In addition, the time required for alignment at the time of mounting is shortened and workability is improved.
第１図は本考案に係る伸縮可能な可撓性印刷配線板の上
面図、第２図は間欠スリットの一例の説明図である。 第３図は従来の可撓性印刷配線板の説明図で、同図
（イ）は上面図、同図（ロ）は（イ）図のＸ−Ｘ断面
図、同図（ハ）は（イ）図の１回路導体群の拡大詳細図
である。 １…ベースフイルム、２…銅箔、３…カバーレイフイル
ム、４…回路導体、５…導体ブロック、６…間欠スリッ
ト、７…切込み、８…スリット端部丸孔。FIG. 1 is a top view of a stretchable flexible printed wiring board according to the present invention, and FIG. 2 is an explanatory view of an example of an intermittent slit. FIG. 3 is an explanatory view of a conventional flexible printed wiring board. FIG. 3 (A) is a top view, FIG. 3 (B) is a cross-sectional view taken along the line XX in (A), and FIG. (A) It is an enlarged detailed view of one circuit conductor group in the figure. 1 ... Base film, 2 ... Copper foil, 3 ... Coverlay film, 4 ... Circuit conductor, 5 ... Conductor block, 6 ... Intermittent slit, 7 ... Notch, 8 ... Slit end round hole.
Claims (1)
置において、配線板の幅方向に平行な辺とこれに角度を
有する辺により形成したスリットを、それぞれ間隔をお
いて平行に相対向せしめて配置した間欠的なスリット
を、基板の内部を通り基板の幅方向に横断して設けて伸
縮性を付与したことを特徴とする伸縮可能な可撓性印刷
配線板。1. A slit formed by a side parallel to a width direction of a wiring board and a side having an angle with the side at a position having no influence on a circuit pattern and arranged in parallel with each other with a space therebetween. A stretchable flexible printed wiring board, characterized in that the intermittent slits are provided so as to pass through the inside of the substrate and cross the width direction of the substrate to impart elasticity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084153U JPH0731556Y2 (en) | 1990-08-08 | 1990-08-08 | Flexible flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084153U JPH0731556Y2 (en) | 1990-08-08 | 1990-08-08 | Flexible flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442763U JPH0442763U (en) | 1992-04-10 |
| JPH0731556Y2 true JPH0731556Y2 (en) | 1995-07-19 |
Family
ID=31632402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990084153U Expired - Fee Related JPH0731556Y2 (en) | 1990-08-08 | 1990-08-08 | Flexible flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731556Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7022345B2 (en) * | 2018-11-22 | 2022-02-18 | 株式会社オートネットワーク技術研究所 | Connection module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593567U (en) * | 1982-06-29 | 1984-01-11 | 松下電器産業株式会社 | Double-sided flexible printed circuit board |
| JPS6163864U (en) * | 1984-09-29 | 1986-04-30 | ||
| JPH02278785A (en) * | 1989-04-19 | 1990-11-15 | Seiko Epson Corp | Flexible circuit board |
-
1990
- 1990-08-08 JP JP1990084153U patent/JPH0731556Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442763U (en) | 1992-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |